JPH04253172A - Board connecting device - Google Patents
Board connecting deviceInfo
- Publication number
- JPH04253172A JPH04253172A JP3008784A JP878491A JPH04253172A JP H04253172 A JPH04253172 A JP H04253172A JP 3008784 A JP3008784 A JP 3008784A JP 878491 A JP878491 A JP 878491A JP H04253172 A JPH04253172 A JP H04253172A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- pitch
- chip
- board
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 15
- 238000000465 moulding Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】この発明は基板間を電気的に接続
する基板接続装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board connecting device for electrically connecting boards.
【0002】0002
【従来の技術】図4において、1はフレキシブル基板4
を接続するためのコネクタであり、2はリードピンであ
る。このコネクタ1は、それとフレキシブル基板4の接
触部を補強するために、モールドにて全体が囲われてい
る。[Prior Art] In FIG. 4, reference numeral 1 indicates a flexible substrate 4.
2 is a lead pin. This connector 1 is entirely surrounded by a mold in order to reinforce the contact portion between it and the flexible substrate 4.
【0003】0003
【発明が解決しようとする課題】ところで、上述構成の
コネクタ1では、モールドで全体が囲われているため、
接続可能な端子数および各端子間のピッチが決まってい
る。そのため、フレキシブル基板4の端子部の端子数お
よびピッチが変更されると、コネクタ1を新規に起こす
ことが必要となり、高価なものとなる。また、モールド
で全体が囲われているため、電子機器の薄型化をはかる
ための支障となっている。[Problem to be Solved by the Invention] By the way, in the connector 1 having the above-mentioned structure, since the whole is surrounded by a mold,
The number of connectable terminals and the pitch between each terminal are determined. Therefore, if the number of terminals and the pitch of the terminal portion of the flexible substrate 4 are changed, it becomes necessary to newly raise the connector 1, which becomes expensive. Furthermore, since the entire structure is surrounded by a mold, it is an obstacle to making electronic devices thinner.
【0004】そこで、この発明では、端子部の端子数お
よびピッチの変更に容易に対処できると共に、電子機器
の薄型化に寄与できるようにするものである。[0004] Accordingly, the present invention makes it possible to easily deal with changes in the number of terminals and the pitch of the terminal portion, and to contribute to making electronic equipment thinner.
【0005】[0005]
【課題を解決するための手段】この発明は、基板間を電
気的に接続する装置において、基板間の接続箇所毎にコ
ネクタチップが配され、このコネクタチップを利用して
基板間を電気的に接続するものである。[Means for Solving the Problems] The present invention provides a device for electrically connecting boards, in which a connector chip is arranged at each connection point between the boards, and the connector chip is used to electrically connect the boards. It is something that connects.
【0006】[0006]
【作用】基板間の接続箇所ごとにコネクタチップが配さ
れて基板間の接続が行われる。例えばリジット基板12
にフレキシブル基板4を接続する際には、フレキシブル
基板4の端子部4aの端子数およびピッチに合わせてコ
ネクタチップ10をリジット基板12上に設けることで
接続が行われる。そのため、フレキシブル基板4の端子
部4aの端子数およびピッチに変更があっても、新規に
コネクタを起こす等の必要がなく、容易に対処すること
ができる。また、コネクタチップ10の全体をモールド
するものでなく、電子機器の薄型化が可能となる。[Operation] A connector chip is arranged at each connection point between the boards, and the connections between the boards are made. For example, rigid board 12
When connecting the flexible substrate 4 to the flexible substrate 4, the connection is made by providing the connector chips 10 on the rigid substrate 12 in accordance with the number and pitch of the terminals 4a of the flexible substrate 4. Therefore, even if there is a change in the number of terminals and the pitch of the terminal portion 4a of the flexible substrate 4, there is no need to raise a new connector, and this can be easily handled. Furthermore, the entire connector chip 10 is not molded, and it is possible to make the electronic device thinner.
【0007】[0007]
【実施例】以下、図1を参照しながらこの発明の一実施
例について説明する。同図において、12はリジット基
板であり、このリジット基板12には、接続されるフレ
キシブル基板4の端子部4aの端子数およびピッチに対
応して複数のランド11が設けられる。そして、これら
複数のランド11のそれぞれに、上部および下部が平坦
とされた縦断面略C字状のコネクタチップ10が配され
て半田付けされる(11aは半田)。これらコネクタチ
ップ10は導電性を有する金属部材で構成される。これ
らコネクタチップ10を、例えば他のチップ部品(図示
せず)と同様に、自動機(ロボット)によってランド1
1にマウントし、リフロー半田付けをして実装してもよ
い。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. In the figure, 12 is a rigid board, and this rigid board 12 is provided with a plurality of lands 11 corresponding to the number and pitch of the terminals of the terminal portions 4a of the flexible board 4 to be connected. Then, a connector chip 10 having a substantially C-shaped longitudinal section with flat upper and lower portions is arranged and soldered to each of the plurality of lands 11 (11a is solder). These connector chips 10 are made of a conductive metal member. These connector chips 10 are placed on the land 1 by an automatic machine (robot), for example, like other chip parts (not shown).
1 and may be mounted by reflow soldering.
【0008】このようにコネクタチップ10が配された
リジット基板12にフレキシブル基板4を接続する際に
は、複数のコネクタチップ10の溝10aに端子部4a
のそれぞれの端子を対応させて挿入し(図2に図示)、
各コネクタチップ10の上部を押圧して端子部4aが挟
持されるようにする(図2に矢印で押圧方向を図示)。
これにより電気的に接続されると共に、フレキシブル基
板4の固定が行われる。ここで、押圧は、例えば電子機
器のリアキャビネット(裏蓋)を装着する際に行われる
ようにしてもよい。なお、押圧する代わりに、コネクタ
チップ10の溝10a間に半田を流し込み、フレキシブ
ル基板4の端子部4aの各端子とコネクタチップ10と
を半田付けするようにしてもよい。When connecting the flexible substrate 4 to the rigid substrate 12 on which the connector chips 10 are disposed in this way, the terminal portions 4a are inserted into the grooves 10a of the plurality of connector chips 10.
Insert the corresponding terminals of each (as shown in Figure 2),
The upper part of each connector chip 10 is pressed so that the terminal portion 4a is clamped (the pressing direction is shown by an arrow in FIG. 2). This establishes an electrical connection and also fixes the flexible substrate 4. Here, the pressing may be performed, for example, when attaching a rear cabinet (back cover) of an electronic device. Note that instead of pressing, solder may be poured between the grooves 10a of the connector chip 10, and each terminal of the terminal portion 4a of the flexible substrate 4 and the connector chip 10 may be soldered.
【0009】このように本例によれば、フレキシブル基
板4の端子部4aの端子数およびピッチに合わせてコネ
クタチップ10をリジット基板12上に設けることで、
リジット基板12とフレキシブル基板4との接続が行わ
れる。そのため、端子部4aの端子数およびピッチに変
更があっても、従来のように新規にコネクタを起こす等
の必要がなく、容易に対処することができる。As described above, according to the present example, by providing the connector chips 10 on the rigid substrate 12 in accordance with the number and pitch of the terminals of the terminal portion 4a of the flexible substrate 4,
The rigid board 12 and the flexible board 4 are connected. Therefore, even if there is a change in the number of terminals and the pitch of the terminal portion 4a, there is no need to raise a new connector as in the conventional case, and the change can be easily handled.
【0010】また、各コネクタチップ10をモールドす
るものでなく、その分のスペースが不要となり、電子機
器の薄型化に寄与することができる。Furthermore, since each connector chip 10 is not molded, the corresponding space is not required, and this can contribute to making electronic equipment thinner.
【0011】さらに、コネクタチップ10はリジット基
板12に他のチップ部品と共に自動実装できるので、生
産性および品質を上げることができる。新規にコネクタ
を起こすことが不要、モールドが不要などの理由とも相
俟って、安価に製造できる利益もある。Furthermore, since the connector chip 10 can be automatically mounted on the rigid board 12 together with other chip components, productivity and quality can be improved. Coupled with the fact that there is no need to create a new connector or a mold, there is also the advantage of being able to manufacture it at a low cost.
【0012】なお、上述実施例におけるコネクタチップ
10の溝10aの両側を平坦にしているが、図3に示す
ように一側に爪10bを設け、他側に爪10bの嵌合部
10cを設けることにより、押圧挟持した際の電気的お
よび機械的接続を安定にすることができる。Although both sides of the groove 10a of the connector chip 10 in the above embodiment are flat, as shown in FIG. 3, a claw 10b is provided on one side and a fitting portion 10c of the claw 10b is provided on the other side. This makes it possible to stabilize the electrical and mechanical connection when pressing and clamping.
【0013】[0013]
【発明の効果】この発明によれば、基板間の接続箇所ご
とにコネクタチップが配され、このコネクタチップを利
用して基板間の接続が行われるので、端子部の端子数お
よびピッチに変更があっても新規にコネクタを起こす等
の必要がなく、容易に対処できる。また、コネクタチッ
プの全体をモールドするものでもなく、従来のコネクタ
に比べて厚みを少なく抑えることができ、電子機器の薄
型化に寄与することができる。さらに、コネクタチップ
を自動実装できるので、生産性および品質を上げること
ができ、新規コネクタ不要、モールド不要等とも相俟っ
て、従来のコネクタに比べて安価に製造できる利益があ
る。[Effects of the Invention] According to the present invention, a connector chip is arranged at each connection point between boards, and the connections between boards are made using this connector chip, so the number of terminals and the pitch of the terminals can be changed. Even if there is, there is no need to create a new connector, and it can be easily dealt with. Furthermore, the entire connector chip is not molded, and the thickness can be kept smaller than that of conventional connectors, contributing to thinning of electronic devices. Furthermore, since the connector chip can be automatically mounted, productivity and quality can be improved, and together with no need for new connectors or molds, there is an advantage that the connector can be manufactured at a lower cost than conventional connectors.
【図1】この発明の一実施例を示す構成図である。FIG. 1 is a configuration diagram showing an embodiment of the present invention.
【図2】基板の接続状態を示す図である。FIG. 2 is a diagram showing a connection state of a board.
【図3】この発明の他の実施例を示す構成図である。FIG. 3 is a configuration diagram showing another embodiment of the invention.
【図4】従来例の構成を示す図である。FIG. 4 is a diagram showing the configuration of a conventional example.
4 フレキシブル基板 10 コネクタチップ 11 ランド 12 リジット基板 4 Flexible board 10 Connector chip 11 Land 12 Rigid board
Claims (1)
上記基板間の接続箇所毎にコネクタチップが配され、こ
のコネクタチップを利用して上記基板間を電気的に接続
することを特徴とする基板接続装置。Claim 1: A device for electrically connecting substrates,
A board connecting device characterized in that a connector chip is arranged at each connection point between the boards, and the connector chips are used to electrically connect the boards.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3008784A JP2873101B2 (en) | 1991-01-29 | 1991-01-29 | Board connection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3008784A JP2873101B2 (en) | 1991-01-29 | 1991-01-29 | Board connection device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04253172A true JPH04253172A (en) | 1992-09-08 |
JP2873101B2 JP2873101B2 (en) | 1999-03-24 |
Family
ID=11702498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3008784A Expired - Fee Related JP2873101B2 (en) | 1991-01-29 | 1991-01-29 | Board connection device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2873101B2 (en) |
-
1991
- 1991-01-29 JP JP3008784A patent/JP2873101B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2873101B2 (en) | 1999-03-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |