JPH0425299B2 - - Google Patents
Info
- Publication number
- JPH0425299B2 JPH0425299B2 JP58038204A JP3820483A JPH0425299B2 JP H0425299 B2 JPH0425299 B2 JP H0425299B2 JP 58038204 A JP58038204 A JP 58038204A JP 3820483 A JP3820483 A JP 3820483A JP H0425299 B2 JPH0425299 B2 JP H0425299B2
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- processing
- processed
- objects
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012545 processing Methods 0.000 claims description 49
- 238000000034 method Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- -1 polypropylene Polymers 0.000 description 7
- 238000009832 plasma treatment Methods 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 230000036470 plasma concentration Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
- B05D3/141—Plasma treatment
- B05D3/142—Pretreatment
- B05D3/144—Pretreatment of polymeric substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Description
【発明の詳細な説明】
本発明は、プラズマ処理技術に関し、さらに詳
しく述べると、例えばポリプロピレン、ポリエチ
レン等の合成樹脂材料からなる製品の表面を改質
するためにその表面を例えばマイクロ波放電プラ
ズマでプラズマ処理する装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plasma treatment technique, and more specifically, the present invention relates to a plasma treatment technique, and more specifically, in order to modify the surface of a product made of a synthetic resin material such as polypropylene or polyethylene, the surface of the product is treated with, for example, microwave discharge plasma. The present invention relates to an apparatus for plasma processing.
自動車製造工業において、近年、自動車部品の
材料が軽量でかつ意匠性に優れた合成樹脂材料に
移行しつつあることは周知の通りである。ところ
で、比較的安価で容易に入手可能なポリプロピレ
ン、ポリエチレン等の樹脂材料は、それらを例え
ば車両外板に使用した場合、材料表面とその上に
施される塗膜との密着性が悪いので、この技術分
野において不所望な層間剥離を発生することが屡
屡である。一般には、かかる層間剥離を防止する
ため、樹脂材料の表面を改質して塗膜の密着性を
良好ならしめる技術、例えば、樹脂材料の表面を
グロー放電、コロナ放電、ラジオ波放電、マイク
ロ波放電等に曝してその表面を酸化（極性基の導
入）するかもしくはエツチング（いわゆるアンカ
ー効果の向上）する技術が多用されている。この
ような技術はプラズマ処理技術と呼ばれている。 It is well known that in the automobile manufacturing industry, in recent years, the materials for automobile parts have been shifting to synthetic resin materials that are lightweight and have excellent designs. By the way, when relatively inexpensive and easily available resin materials such as polypropylene and polyethylene are used, for example, in the outer panel of a vehicle, the adhesion between the material surface and the coating film applied thereon is poor. Undesirable delamination often occurs in this technical field. Generally, in order to prevent such delamination, techniques are used to modify the surface of the resin material to improve the adhesion of the coating film, such as glow discharge, corona discharge, radio wave discharge, microwave Techniques are often used to oxidize (introduce polar groups) or etch (improve the so-called anchor effect) the surface by exposing it to electric discharge or the like. Such technology is called plasma processing technology.
プラズマ処理技術を大物でかつ複雑形状の樹脂
材料部品を同時に多数個表面処理しなければなら
ない工程、例えば自動車製造という量産工程に導
入する場合、いくつかの問題が発生してくる。第
１に、プラズマ処理を行なう場合、処理効果の向
上、すなわち、プラズマ寿命の延長を目的として
処理容器を減圧下もしくは真空下で保持しなけれ
ばならないので、当然のことながらハツチ処理が
主流となつてくる。第２に、処理容器内のプラズ
マ濃度の分布が一様でないので処理効果に差が生
じ、よつて、被処理物を均一に処理することがで
きない。第１の問題点であるハツチ処理は本発明
で今問題としているような工程では、それを例え
ば連続処理に変換することが実質的に難かしいと
いうものの、第２の問題点である不均一な処理
は、短期間で減圧もしくは真空状態を得かつ１回
の処理でより多数個の大物被処理物を均一に処理
しなければならないという必要性を考慮した場
合、どうしても解消しなければならない。 When plasma processing technology is introduced into a process that requires simultaneous surface treatment of many large, complex-shaped resin material parts, for example, a mass production process such as automobile manufacturing, several problems arise. First, when performing plasma processing, the processing container must be maintained under reduced pressure or vacuum for the purpose of improving the processing effect, that is, extending the plasma life, so hatch processing has naturally become the mainstream. It's coming. Second, since the distribution of plasma concentration within the processing container is not uniform, there are differences in processing effects, and therefore the object to be processed cannot be processed uniformly. Although the first problem, hatch processing, is substantially difficult to convert into continuous processing in the process currently being considered in the present invention, the second problem is non-uniform processing. In consideration of the need to obtain a reduced pressure or vacuum state in a short period of time and to uniformly process a larger number of large objects in a single process, this problem must be overcome.
本発明者らは、このたび、内部が円筒形のプラ
ズマ処理容器内において複数個の被処理物を処理
するに際して、それらの被処理物を先ず１個もし
くはそれ以上の回転中心を中心にして回転移動さ
せかつ、同時に、個々の被処理物を自由に回転さ
せることによつて上記第２の問題点を解消し得る
ということを見い出した。すなわち、本発明は、
複数個の被処理物をプラズマで同時に処理する装
置であつて、その処理容器内に、下記の手段：
各１個の被処理物を、その処理面を常にプラズ
マの照射方向に対向させて自由に回転可能に支承
した複数個の自由回転軸、そして
前記自由回転軸を治具を介して装備しておりか
つ前記自由回転軸に支承された被処理物の全数を
円軌跡を描いて同時に回転移動可能である１個も
しくは２個以上の回転移動軸、
を含んでなることを特徴とするプラズマ処理装置
にある。本発明の装置では、個々の被処理物は互
いに独立させて自由に回転可能であり、また、複
数個の被処理物は互いに関連させて回転移動可能
である。 The present inventors recently discovered that when processing a plurality of workpieces in a plasma processing vessel having a cylindrical interior, the workpieces are first rotated around one or more rotation centers. It has been found that the second problem can be solved by moving and at the same time freely rotating the individual objects to be processed. That is, the present invention
An apparatus for simultaneously treating multiple objects to be processed with plasma, in which each object to be processed is placed freely in a processing container with its processing surface always facing the direction of plasma irradiation. a plurality of free rotation shafts rotatably supported on the shaft, and the free rotation shafts are equipped via a jig, and all the workpieces supported on the free rotation shafts are simultaneously rotated in a circular trajectory. A plasma processing apparatus is characterized in that it includes one or more movable rotary movement axes. In the apparatus of the present invention, each workpiece can freely rotate independently of each other, and a plurality of workpieces can rotate relative to each other.
ここで、“互いに関連させて回転移動させる”
とは、回転中心が１個であつて全被処理物に共通
である場合にはそれらの被処理物の全数を同時に
回転移動させることを、また、回転中心が２個で
ある場合には一方の回転中心に係る被処理物の全
数を同時に回転移動させること（この場合、他方
の回転中心に係る被処理物の回転移動と同期させ
ても同期させなくてもよい）を指す。 Here, "rotate and move in relation to each other"
means that if the center of rotation is one and common to all the objects to be processed, all the objects to be processed are rotated at the same time, and if there are two centers of rotation, it is rotational movement of all objects at the same time. Refers to simultaneous rotational movement of all the objects to be processed related to the rotation center (in this case, it may or may not be synchronized with the rotational movement of the objects to be processed related to the other rotation center).
“互いに独立させて自由に回転させる”とは、
他の被処理物の回転とは無関係に被処理物そのも
のを回転させることを、例えば、自由回転軸に被
処理物を載せた時にその軸が自由回転し、よつ
て、軸に対して被処理物を自由回転させ得ること
を、指す。 “Let them rotate freely and independently of each other” means
For example, when a workpiece is placed on a free-rotating shaft, the shaft rotates freely, and the workpiece rotates independently of the rotation of other workpieces. Refers to the ability of objects to rotate freely.
次に、添付の図面を参照しながらさらに詳しく
本発明を説明する。なお、以下、特にマイクロ波
放電プラズマを利用した処理技術に関して本発明
を説明するけれども、本発明はこの技術のみに限
定されるものではないことを理解されたい。 The invention will now be described in more detail with reference to the accompanying drawings. Although the present invention will be described below with particular reference to a processing technique utilizing microwave discharge plasma, it should be understood that the present invention is not limited to only this technique.
従来のマイクロ波放電プラズマ処理装置の典型
例を第１図及び第２図に見ることができる。処理
容器１の内部、すなわち、処理室１２は円筒形で
あつて、室の上部にプラズマ噴射用ガラス管１０
が、そして室の下部に排気口１１がそれぞれ取り
付けられている。ガラス管１０を介してその処理
室１２へのプラズマの導入は、図示される通り、
次のようにして行なわれる：発振器２で発生した
マイクロ波は、アンソレータ３、パワーモニタ
４、スリースタブチユーナ５を経て、導波管１９
を介してプラズマ発生炉６に導かれる。一方、バ
ルブ１４を装備したポンベ１５内のプラズマ用ガ
スは、配管１３を介してプラズマ発生炉６に供給
される。プラズマ発生炉６と後続のプラズマ発生
管７で発生したプラズマは、石英管８を経て、処
理容器１のプラズマ導入口９に導入される。導入
口９に導入されたプラズマは、それに接続するプ
ラズマ噴射用ガラス管１０を介して、処理室１２
に噴射される。処理室１２は、ブラズマ処理中で
もその内部を減圧もしくは真空下に保持するた
め、処理室排気用ポンプ（図示せず）に接続され
た排気口１１から連続的に排気される。なお、図
示の処理装置は、２個のプラズマ導入口９−１及
び９−２、２個のプラズマ噴射用ガラス管１０−
１及び１０−２、そして２個の排気口１１−１及
び１１−２を有する（第２図を参照されたい）。 A typical example of a conventional microwave discharge plasma processing apparatus can be seen in FIGS. 1 and 2. The inside of the processing container 1, that is, the processing chamber 12 is cylindrical, and a glass tube 10 for plasma injection is installed in the upper part of the chamber.
However, an exhaust port 11 is installed at the bottom of each chamber. The plasma is introduced into the processing chamber 12 through the glass tube 10 as shown in the figure.
The microwave generated by the oscillator 2 passes through the ansolator 3, the power monitor 4, and the three-stub tuner 5, and then passes through the waveguide 19.
The plasma is guided to the plasma generating furnace 6 via the plasma generating furnace 6. On the other hand, plasma gas in a pump 15 equipped with a valve 14 is supplied to the plasma generation furnace 6 via a pipe 13. Plasma generated in the plasma generation furnace 6 and the subsequent plasma generation tube 7 is introduced into the plasma introduction port 9 of the processing container 1 via the quartz tube 8. The plasma introduced into the inlet 9 is transferred to the processing chamber 12 via the plasma injection glass tube 10 connected thereto.
is injected into. The processing chamber 12 is continuously evacuated from an exhaust port 11 connected to a processing chamber exhaust pump (not shown) in order to maintain its interior under reduced pressure or vacuum even during plasma processing. The illustrated processing apparatus has two plasma introduction ports 9-1 and 9-2 and two plasma injection glass tubes 10-.
1 and 10-2, and two exhaust ports 11-1 and 11-2 (see FIG. 2).
上気したマイクロ波放電プラズマ処理装置を使
用して被処理物（ポリプロピレン製自動車用バン
パ）をブラズマ処理した。適用した処理条件の主
たるものを列挙すると、次の通りである：
反応室の寸法：φ2000×2000Lmm
反応室の圧力：0.5Torr
処理時間：30秒間
出力：1000W
処理ガス：O2（５／分で）
処理後、達成された処理効果の程度を処理室内
に配置したバンパ表面の接触角（水ヌレ性）を基
準にして評価したところ、反応室１２の領域Ａ
（第１図及び第２図から）に配置した被処理物は
同じく図示せる領域Ｂに配置したそれに比較して
著しく処理効果に劣るということが判明した。本
発明者らは、研究の結果、処理効果に差が生じる
のには次のような理由があるとの知見を得、これ
をベースとして本発明を完成するに至つた。 The object to be treated (a polypropylene automobile bumper) was subjected to plasma treatment using an air-cooled microwave discharge plasma treatment apparatus. The main processing conditions applied are as follows: Reaction chamber dimensions: φ2000 x 2000 L mm Reaction chamber pressure: 0.5Torr Processing time: 30 seconds Output: 1000W Processing gas: O 2 (5/ After the treatment, the degree of the treatment effect achieved was evaluated based on the contact angle (water wettability) of the bumper surface placed in the treatment chamber.
It has been found that the processing effect of the object placed in the area (from FIGS. 1 and 2) is significantly inferior to that placed in area B, which is also shown. As a result of research, the present inventors found that there are the following reasons for differences in treatment effects, and based on this knowledge, they completed the present invention.
（） プラズマ噴射用ガラス管１０−１及び１
０−２と被処理物との距離が異なるので、領域
Ａと領域Ｂとでは自ずとプラズマ濃度に差が出
てくる。() Glass tubes 10-1 and 1 for plasma injection
Since the distance between 0-2 and the object to be processed is different, a difference in plasma concentration naturally appears between region A and region B.
（） 領域Ｂに配置した被処理物がプラズマを
遮蔽するので、領域Ａにプラズマが到達しにく
い。() Since the object to be processed placed in region B shields the plasma, it is difficult for the plasma to reach region A.
本発明は、例えば、第３図及び第４図に図示さ
れるようにして実施することができる。なお、本
発明によるプラズマ処理装置の構成は処理室１２
内に構成の相違を除いて基本的に第１図及び第２
図のそれに同じであるので、プラズマ導入系統及
び排気系統に係る詳しい説明をここでは省略する
こととする。 The present invention can be implemented, for example, as illustrated in FIGS. 3 and 4. Note that the configuration of the plasma processing apparatus according to the present invention includes a processing chamber 12.
Basically the same as Figures 1 and 2 except for differences in configuration.
Since they are the same as those shown in the figure, detailed explanations regarding the plasma introduction system and exhaust system will be omitted here.
図示のプラズマ処理装置の場合、４個の被処理
物Ｓ−１〜Ｓ−４を同時に処理するように構成さ
れている。これらの被処理物はそれぞれ自由回転
軸１７−１〜１７−７により支承されておりかつ
それぞれ対応する自由回転軸を中心にして自由に
回転可能である。詳しくは。被処理物Ｓ−１〜Ｓ
−４はそれぞれ治具１８−１〜１８−４に積載さ
れており、また、これらの治具は治具受け用台車
の垂直円盤面１９−１及び１９−２に、それぞ
れ、自由回転軸１７−１〜１７−４で取り付けら
れている。被処理物を積載した治具１８−１〜１
８−４はそれぞれ対応する軸１７−１〜１７−４
を中心にして自由に回転可能である。 In the case of the illustrated plasma processing apparatus, it is configured to simultaneously process four objects to be processed S-1 to S-4. These objects to be processed are supported by free rotation shafts 17-1 to 17-7, respectively, and are freely rotatable about the corresponding free rotation shafts. For more information. Processed objects S-1 to S
-4 are loaded on the jigs 18-1 to 18-4, respectively, and these jigs are mounted on the free rotation shafts 17 on the vertical disk surfaces 19-1 and 19-2 of the jig receiving trolley, respectively. -1 to 17-4 are installed. Jigs 18-1 to 1 loaded with objects to be processed
8-4 are the corresponding axes 17-1 to 17-4, respectively.
It can be freely rotated around.
図示の処理装置の場合、治具受け用台車の垂直
円盤面１９−１及び１９−２のそれぞれにそれら
の中心を通る１個の回転移動軸（治具受け用台車
回転軸）１６が取り付けられている。この回転移
動軸１６の延長軸２３は接合器２４を介してモー
タ２７の軸２６に接続されている。ここで、参照
番号２５は処理容器の真空シール部を指す。 In the case of the processing apparatus shown in the figure, one rotary movement shaft (jig receiving cart rotating shaft) 16 passing through the center of each of the vertical disc surfaces 19-1 and 19-2 of the jig receiving cart is attached. ing. An extension shaft 23 of this rotary movement shaft 16 is connected to a shaft 26 of a motor 27 via a connector 24 . Here, reference numeral 25 refers to a vacuum seal portion of the processing container.
モータ２７の駆動により回転移動軸１６を回転
させる。すると、治具受け用台車の垂直円盤面１
９−１及び１９−２が回転移動し、また、その回
転移動とともに，被処理物Ｓ−１〜Ｓ−４を支承
した軸１７−１〜１７−４がそれぞれ円軌跡２０
を描いて同時に回転移動する。この回転移動の過
程において、被処理物Ｓ−１〜Ｓ−４は、それぞ
れ、自由回転軸１７−１〜１７−４を中心に、設
置方向の修正を行なう。例えば、被処理物Ｓ−３
は、被処理物Ｓ−４の位置に移動する時、軌跡２
１を描いて移動し、その間に位置の修正を行な
う。 The rotary movement shaft 16 is rotated by driving the motor 27 . Then, the vertical disk surface 1 of the jig receiving trolley
9-1 and 19-2 rotate, and along with the rotation, the shafts 17-1 to 17-4 supporting the objects to be processed S-1 to S-4 move along circular loci 20, respectively.
Draw and rotate at the same time. In the process of this rotational movement, the objects to be processed S-1 to S-4 correct their installation directions around the free rotation axes 17-1 to 17-4, respectively. For example, the object to be processed S-3
is the trajectory 2 when moving to the position of the workpiece S-4.
Draw and move 1, and correct the position in the meantime.
図中の３０−１及び３０−２はそれぞれ治具積
載用台車の出入用レールであり、そして２８はレ
ール３０−１及び３０−２上を治具積載用台車が
移動するための車輪である。台車が所定の位置に
固定された時、すなわち、延長軸２３と接合器２
４とがかみ合つた時、レール３０−１及び３０−
２は、それぞれ、エアシリンダ２９を介して、治
具積載用台車の垂直円盤１９−１，２の回転に支
承とならない位置まで下げられる。その後、処理
容器１の扉２１−１を閉塞して一連のプラズマ処
理操作が開始される。 In the figure, 30-1 and 30-2 are rails for entering and exiting the jig loading cart, respectively, and 28 is a wheel for moving the jig loading cart on the rails 30-1 and 30-2. . When the trolley is fixed in place, i.e. the extension shaft 23 and the connector 2
4 are engaged, rails 30-1 and 30-
2 are lowered via air cylinders 29 to positions where they do not support the rotation of the vertical disks 19-1 and 2 of the jig loading cart. Thereafter, the door 21-1 of the processing container 1 is closed and a series of plasma processing operations is started.
第３図及び第４図においては１個の回転移動軸
１６を配設する例を示したけれども、これに代え
て２個もしくはそれ以上の回転移動軸を配設しか
つモータ２７を増設することも可能である。さら
に、必要に応じて、モータ２７を処理容器１の内
部に配設することも可能である。 Although FIGS. 3 and 4 show an example in which one rotational movement axis 16 is provided, it is possible to provide two or more rotational movement axes and add a motor 27 instead. is also possible. Furthermore, it is also possible to arrange the motor 27 inside the processing container 1, if necessary.
上気した本発明によるプラズマ処理送致を使用
して、前記従来の装置と同一の処理条件の下でポ
リプロピレン製自動車用バンパをプラズマ処理し
た。なお、この装置の場合、回転移動軸を10〜
20rpmの回転数で回転させた。得られた処理効果
はどの被処理物をとつても、また、１個の被処理
物のどの部分をとつても、ほぼ均一であつた。こ
の点を、以下、第５図及び第６図を参照しながら
説明する。 A polypropylene automotive bumper was plasma treated using the plasma treatment system of the present invention under the same process conditions as the conventional apparatus. In addition, in the case of this device, the rotational movement axis is 10~
It was rotated at a rotation speed of 20 rpm. The treatment effect obtained was almost uniform no matter what object was treated or which part of a single object was treated. This point will be explained below with reference to FIGS. 5 and 6.
第５図は、被処理物であるポリプロピレン製自
動車用バンパの略示図であり、処理効果に関して
の評価部位が１，２，３及び４で示されている。
処理効果は、先にも述べた通り、バンパ表面の接
触角で評価した。すなわち、5μの脱イオン水
をプラズマ処理後のバンパ表面に滴下して、その
時の接触角を協和化学（株）製CA−Ａ型接触角
測定器で20℃及び50〜60％RH（相対湿度）で測
定した。 FIG. 5 is a schematic diagram of a polypropylene automobile bumper, which is an object to be treated, and the evaluation parts regarding the treatment effect are indicated by 1, 2, 3, and 4.
As mentioned above, the treatment effect was evaluated by the contact angle on the bumper surface. That is, 5μ of deionized water was dropped onto the bumper surface after plasma treatment, and the contact angle was measured using a CA-A type contact angle measuring device manufactured by Kyowa Kagaku Co., Ltd. at 20℃ and 50 to 60% RH (relative humidity). ) was measured.
得られた測定結果を第１図及び第２図の装置を
使用した従来技術と第３図及び第４図の装置を使
用した本発明とに区別して第６図に示す。図中の
黒丸のグラフ１が従来技術を、そして白丸のグラ
フ２が本発明を表わす。これらの結果から、本発
明では、被処理物がS1，S2，S3及びS4と変化して
も、また、処理部位が１，２，３及び４と変化し
ても、良好かつ一定な処理効果が得られるという
ことが理解されるであろう。 The measurement results obtained are shown in FIG. 6, distinguishing between the conventional technique using the devices shown in FIGS. 1 and 2 and the present invention using the devices shown in FIGS. 3 and 4. In the figure, graph 1 with black circles represents the prior art, and graph 2 with white circles represents the present invention. From these results, in the present invention, even if the object to be treated changes to S 1 , S 2 , S 3 and S 4 , and even if the treated area changes to 1, 2, 3 and 4, the process can be performed satisfactorily. It will be appreciated that certain treatment effects are obtained.
本発明に従うと、被処理物そのものを自由に回
転させることと被処理物の全数を同時に円軌跡を
描くように回転移動させることとを組み合わせた
ので、被処理物表面に照射されるプラズマ量を一
定にすることができ、よつて、被処理物を均一に
処理することができる。さらに、本発明に従うと
処理室内の雰囲気の攪拌を好条件の下で行なうこ
とができるので、より均一なプラズマ分布を達成
することができる。さらに、本発明に従うと、処
理容器の構造が簡単で、しかも、被処理物の出入
が容易であるので、より大物の被処理物も、より
複雑な形状の被処理物も、そしてより多数個の被
処理物も、難なくかつ均一に処理することができ
る。 According to the present invention, the amount of plasma irradiated onto the surface of the workpiece can be reduced by combining freely rotating the workpiece itself and simultaneously rotating and moving all the workpieces in a circular trajectory. It can be kept constant, and therefore the object to be processed can be processed uniformly. Furthermore, according to the present invention, since the atmosphere within the processing chamber can be stirred under favorable conditions, a more uniform plasma distribution can be achieved. Furthermore, according to the present invention, the structure of the processing container is simple, and the objects to be processed can be taken in and out easily, so that larger objects, objects with more complicated shapes, and a larger number of objects can be processed. Objects to be processed can be processed uniformly and without difficulty.
第１図は、従来のマイクロ波放電ブラズマ処理
装置の一例を示した縦断面図、第２図は、第１図
に示した装置の長手方向断面図、第３図は、本発
明によるマイクロ波放電プラズマ処理装置の一例
を示した縦断面図、第４図は、第３図に示した装
置の長手方向断面図、第５図は、被処理物の評価
部位を示した自動車用バンパの略示図、そして第
６図は、従来技術と本発明の処理効果の違いを示
した図表である。
図中、１は反応容器、１２は処理室、Ｓ−１〜
Ｓ−４は被処理物、１７−１〜１７−４は自由回
転軸、そして１６は回転移動軸である。
FIG. 1 is a longitudinal sectional view showing an example of a conventional microwave discharge plasma processing apparatus, FIG. 2 is a longitudinal sectional view of the apparatus shown in FIG. FIG. 4 is a longitudinal sectional view showing an example of a discharge plasma processing apparatus; FIG. 4 is a longitudinal sectional view of the apparatus shown in FIG. 3; FIG. FIG. 6 is a chart showing the difference in processing effects between the prior art and the present invention. In the figure, 1 is a reaction container, 12 is a processing chamber, S-1~
S-4 is an object to be processed, 17-1 to 17-4 are free rotation axes, and 16 is a rotational movement axis.
Claims (1)
る装置であつて、その処理容器内に、下記の手
段： 各１個の被処理物を、その処理面を常にプラズ
マの照射方向に対向させて自由に回転可能に支承
した複数個の自由回転軸、そして 前記自由回転軸を治具を介して装備しておりか
つ前記自由回転軸に支承された被処理物の全数を
円軌跡を描いて同時に回転移動可能である１個も
しくは２個以上の回転移動軸、 を含んでなることを特徴とするプラズマ処理装
置。[Scope of Claims] 1. An apparatus for simultaneously treating a plurality of objects to be processed with plasma, which includes the following means in a processing container: One object to be processed is placed in such a way that its processing surface is constantly exposed to plasma. a plurality of free rotation shafts that are freely rotatably supported so as to face each other in the irradiation direction; and the free rotation shafts are equipped via a jig, and the total number of workpieces supported on the free rotation shafts is 1. A plasma processing apparatus comprising: one or more rotational movement axes that can be rotated simultaneously while drawing a circular locus.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3820483A JPS59164340A (en) | 1983-03-10 | 1983-03-10 | Method and apparatus for carrying out plasma treatment |
| AU24672/84A AU548915B2 (en) | 1983-02-25 | 1984-02-16 | Plasma treatment |
| EP19890105490 EP0326191A3 (en) | 1983-02-25 | 1984-02-23 | Apparatus and method for plasma treatment of resin material |
| EP84101935A EP0117541B1 (en) | 1983-02-25 | 1984-02-23 | Apparatus for plasma treatment of resin material |
| DE8484101935T DE3482155D1 (en) | 1983-02-25 | 1984-02-23 | DEVICE FOR PLASMA PROCESSING OF RESIN MATERIALS. |
| US06/772,208 US4595570A (en) | 1983-02-25 | 1985-09-05 | Apparatus and method for plasma treatment of resin material |
| AU49368/85A AU578499B2 (en) | 1983-02-25 | 1985-11-05 | Apparatus and method for plasma treatment of resin material |
| US06/817,115 US4874453A (en) | 1983-02-25 | 1986-01-08 | Apparatus and method for plasma treatment of resin material |
| US07/307,509 US4919745A (en) | 1983-02-25 | 1989-02-08 | Apparatus and method for plasma treatment of resin material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3820483A JPS59164340A (en) | 1983-03-10 | 1983-03-10 | Method and apparatus for carrying out plasma treatment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59164340A JPS59164340A (en) | 1984-09-17 |
| JPH0425299B2 true JPH0425299B2 (en) | 1992-04-30 |
Family
ID=12518799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3820483A Granted JPS59164340A (en) | 1983-02-25 | 1983-03-10 | Method and apparatus for carrying out plasma treatment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59164340A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020159918A (en) * | 2019-03-27 | 2020-10-01 | 日本電産コパル電子株式会社 | Pressure sensor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61206649U (en) * | 1985-06-13 | 1986-12-27 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165924A (en) * | 1979-06-12 | 1980-12-24 | Sekisui Chem Co Ltd | Surface-treating apparatus for plastic molding |
-
1983
- 1983-03-10 JP JP3820483A patent/JPS59164340A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165924A (en) * | 1979-06-12 | 1980-12-24 | Sekisui Chem Co Ltd | Surface-treating apparatus for plastic molding |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020159918A (en) * | 2019-03-27 | 2020-10-01 | 日本電産コパル電子株式会社 | Pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59164340A (en) | 1984-09-17 |
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