JPH04252021A - Evacuation system for semiconductor manufacturing apparatus - Google Patents

Evacuation system for semiconductor manufacturing apparatus

Info

Publication number
JPH04252021A
JPH04252021A JP137091A JP137091A JPH04252021A JP H04252021 A JPH04252021 A JP H04252021A JP 137091 A JP137091 A JP 137091A JP 137091 A JP137091 A JP 137091A JP H04252021 A JPH04252021 A JP H04252021A
Authority
JP
Japan
Prior art keywords
valve
degassing
semiconductor manufacturing
pressure control
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP137091A
Other languages
Japanese (ja)
Inventor
Yoji Otsuka
大塚 洋司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP137091A priority Critical patent/JPH04252021A/en
Publication of JPH04252021A publication Critical patent/JPH04252021A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To shorten the degassing time by a method wherein an exclusive evacuation line for degassing use is installed separately form an evacuation line for pressure control. CONSTITUTION:During a chamber process, a valve 5 is opened, and a vacuum is evacuated by using a pump 3 from a pressure control line 2 via a butterfly valve 4. When a chamber 1 is degassed after the process has been finished, the valve 5 is closed and a valve 7 is opened. Then, the vacuum is evacuated by using the pump 3 via an evacuation line 6 for degassing use without using the butterfly valve 4.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は半導体製造装置の排気シ
ステムに関し、特にプロセスチャンバーの真空排気シス
テムに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust system for semiconductor manufacturing equipment, and more particularly to a vacuum exhaust system for a process chamber.

【0002】0002

【従来の技術】従来この種の排気システムは、図2に示
すように、プロセスチャンバー1の真空排気を行なう際
、排気ライン8を通してポンプ3にて排気を行なう構成
になっていた。
2. Description of the Related Art Conventionally, this type of evacuation system has a structure in which a pump 3 is used to evacuate a process chamber 1 through an evacuation line 8, as shown in FIG.

【0003】0003

【発明が解決しようとする課題】この従来の排気システ
ムでは、プロセスチャンバーより圧力制御用排気ライン
をそのまま使用してポンプにて排気を行なっている。こ
の圧力制御用排気ラインの途中にはバタフライバルブが
介在しているため、プロセス終了後のガス抜きに時間が
かかるという問題点があった。
In this conventional exhaust system, exhaust is performed by a pump using the pressure control exhaust line from the process chamber. Since a butterfly valve is interposed in the middle of this pressure control exhaust line, there is a problem in that it takes time to vent gas after the process is completed.

【0004】0004

【課題を解決するための手段】本発明の排気システムは
、プロセスチャンバーの圧力制御を行なう真空排気ライ
ンとは別にガス抜き用の真空排気ラインを備えている。
[Means for Solving the Problems] The exhaust system of the present invention includes a vacuum exhaust line for degassing, separate from the vacuum exhaust line for controlling the pressure of the process chamber.

【0005】[0005]

【実施例】次に本発明について図面を参照して説明する
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.

【0006】図1は本発明の一実施例の排気システム図
である。チャンバープロセス中はバルブ5を開け、バタ
フライバルブ4を介して圧力制御ライン2よりポンプ3
にて真空排気を行なう。また、プロセス終了後にチャン
バー1のガス抜きを行なう場合は、バルブ5を閉め、バ
ルブ7を開ける事によりバタフライバルブ4を介さずガ
ス抜き用排気ライン6を介してポンプ6により真空排気
を行なう。
FIG. 1 is a diagram of an exhaust system according to an embodiment of the present invention. During the chamber process, valve 5 is opened and pump 3 is supplied from pressure control line 2 through butterfly valve 4.
Perform vacuum evacuation. Further, when degassing the chamber 1 after the process is completed, the valve 5 is closed and the valve 7 is opened to perform vacuum evacuation by the pump 6 through the gas degassing exhaust line 6 without using the butterfly valve 4.

【0007】[0007]

【発明の効果】以上説明したように本発明は、圧力制御
用排気ラインとは別に専用のガス抜き用排気ラインを設
置する事により、バタフライバルブを介さなくて済むた
めガス抜き時間を短縮できるという効果を有する。
[Effects of the Invention] As explained above, the present invention is capable of shortening the degassing time by installing a dedicated degassing exhaust line separately from the pressure control exhaust line, thereby eliminating the need for a butterfly valve. have an effect.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の一実施例の排気システム図である。FIG. 1 is a diagram of an exhaust system according to an embodiment of the present invention.

【図2】従来の排気システム図である。FIG. 2 is a diagram of a conventional exhaust system.

【符号の説明】[Explanation of symbols]

1    チャンバー 2    圧力制御用排気ライン 3    ポンプ 4    バタフライバルブ 5    バルブ 6    ガス抜き用排気ライン 7    バルブ 8    排気ライン 1 Chamber 2   Pressure control exhaust line 3 Pump 4 Butterfly valve 5 Valve 6 Exhaust line for degassing 7 Valve 8 Exhaust line

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  真空排気システムを有する半導体製造
装置の排気システムにおいて、プロセスチャンバーに圧
力制御用排気ラインとは別にガス抜き用排気ラインを設
けた事を特徴とする半導体製造装置の排気システム。
1. An exhaust system for semiconductor manufacturing equipment having a vacuum evacuation system, characterized in that a process chamber is provided with an exhaust line for degassing in addition to an exhaust line for pressure control.
JP137091A 1991-01-10 1991-01-10 Evacuation system for semiconductor manufacturing apparatus Pending JPH04252021A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP137091A JPH04252021A (en) 1991-01-10 1991-01-10 Evacuation system for semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP137091A JPH04252021A (en) 1991-01-10 1991-01-10 Evacuation system for semiconductor manufacturing apparatus

Publications (1)

Publication Number Publication Date
JPH04252021A true JPH04252021A (en) 1992-09-08

Family

ID=11499613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP137091A Pending JPH04252021A (en) 1991-01-10 1991-01-10 Evacuation system for semiconductor manufacturing apparatus

Country Status (1)

Country Link
JP (1) JPH04252021A (en)

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