JPH0425139A - Molding device for lead frame - Google Patents

Abstract

PURPOSE:To make it possible to conduct reliably a mold release of a molded article by a method wherein a lead frame is moved in pushing as a whole using eject frames and the molded article is made to mold-release. CONSTITUTION:With the extent of the external shape of a lead frame 10 covered on the sides of the mold openings of metal molds 28 and 30, the extent to be resin-sealed of the frame 10 and a resin flow passing extent are notched, are formed into an integral annular body shape and eject frames 40 and 42, which are moved in pushing in parallel to a parting face between the metal molds at the time of clamping and at the time of mold opening, are provided. Moreover, housing recessed parts 22a and 24a for housing the frame 4O without making the frame 44 project from the parting face at the time of clamping are provided. At the time of mold opening, the frame 10 is moved in pushing by the frame 40 and resin-sealed parts 14 are made to mold-release from the metal molds 28 and 30 by a moving-in-pushing means. Thereby, a molded article can be made to reliably mold-release without deforming.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a lead frame molding device.

(Prior Art) 1. In a lance-force molding machine, after resin molding, the molded product is ejected from the mold using an ejector bin and released from the mold.

FIG. 6 is a conventional example showing the arrangement of ejector pins for releasing the molded product after the lead fly 1110 is sealed with resin. As shown in the figure, the ejector bins 12 are installed with appropriate amounts of water at positions that contact the outer surfaces of the respective resin sealing parts 14. The ejector pin 12 is supported by the ejector pin play 1-16, and the ejector pin play 16 is supported by the retainer brakes 1-18, and the ejector pin 12 is inserted into the mold into the cellar 1.

Note that some molding machines do not provide ejector bins in individual resin-sealed parts, but instead dispose ejector bins in the site rail portion of the lead frame, and release the mold by protruding the site rails. This is because the number of pins of the ejector bin can be reduced compared to arranging the ejector bin in each resin sealing part, and the arrangement of the ejector bin can be made easier in terms of installation.

(Problem to be Solved by the Invention) By the way, as lead frames, multi-frame frames in which resin-sealed portions are arranged in a 71-rix shape, and those in which the size of resin-sealed portions is made considerably smaller, have come to be used. It's here. If ejector pins were to be placed in each resin sealing part for such a lead frame as described above, the ejector pins would have to be placed within an extremely narrow range, making it extremely difficult to install the ejector pins. become. Furthermore, since a large number of ejector pins are handled, there is a problem in that the ejector pins do not return to their normal positions, causing mold flash.

In addition, in recent years, resins with high adhesion have been used to improve the adhesion between the resin sealing part and the lead frame, making it difficult for molded products to release from the mold. In the method of releasing the mold by protruding the site rail portion of the frame, the lead frame cannot be effectively released from the mold, and there arises a problem that the lead frame is deformed during demolding.

Therefore, the present invention has been made to solve the problem mentioned above, and its purpose is to provide a lead that can reliably release the molded product without deforming the molded product without using an ejector pin. To provide frame molding equipment.

(Means for Solving the Problems) The present invention has the following configuration to achieve the above object [1].

That is, in a lead frame molding device that presses and molds a lead frame between a pair of molds in which a predetermined cavity is formed, a resin sealing hole is placed on the mold opening side of each mold. Covers the external range of the frame, and the resin-sealed area of the lead frame and the resin passage area that connects to the sealing part are cut out and formed into an integral plate shape. An eject frame is provided which is pushed parallel to the parting surface of the mold by a pushing means when opened, and the mold has a storage recess for storing the NijiF L-frame without protruding from the parting surface when the mold is clamped. It is characterized by having been established.

(Function) When the mold is opened, the lead frame is placed in a predetermined position of the mold with the cellar 1 and the mold is clamped. When the mold is clamped, the eject frame is stored in the storage recess of the mold, and the cavity is filled with resin. When opening the mold, the eject frame pushes the lead frame by the pushing means to release the resin sealing part from the mold.

(Embodiments) Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

1 and 2 are explanatory diagrams showing a lead frame molding apparatus and its operation according to the present invention. 11
The figure is a view of the lead frame product from the longitudinal side.
FIG. 2 is a view seen from the lateral direction. In the apparatus of the embodiment, as shown in FIG. 2, two lead frames 1110 are soldered in rows with a hole 20 sandwiched between them.

In the figure, reference numeral 22 indicates an IU-shaped insert 1 to 1 having a cavity 26 formed therein. 24 is to the lower mold inserter 1. ``The type 1 inserter 1-22 and the lower type inserter 1-24 are supported by the upper mold 28 and -F mold 30, respectively, and the upper mold 28 and the lower mold 30 are supported by the chase block 32, respectively.''
; Mold mold base 34 and lower mold base 36
will be permanently installed.

Reference numerals 40 and 42 designate eject frames that are provided at intermediate positions between the upper mold inserter 1-22 and the lower mold inserter 1-24 and supported movably in the mold opening/closing direction. Nizhiev 1 ~ Frey 1
140.42 is made of a plate with a predetermined thickness, installed in the same direction as the lead frame A JO, and cut out the cavity 26 part and runner flow path part of 24 between the upper mold insert 22 and the lower mold insert 1. Form as a single piece.

FIG. 3 shows a perspective view of the Nizief 1 Hefley 1142 in its installed state. 42a corresponds to the cavity portion, and [uJ missing, 421) corresponds to the runner flow path. As shown in the figure, the ejector 1 node 1142 is set by forming a lead frame and a recess for introducing a runner on the opposite side.

When clamping the mold, insert the upper mold insert 1~ into the lead frame zXlo.
22 and the lower mold inserter 1-24 come into contact with each other to form a cavity portion to be filled with resin. Mold inserter 1~2
Storage recesses 22a and 24a each having the same depth as the plate thickness of the Nijief H frame 1140.42 are provided in each of the holes 40 and 42 to allow the eject frame 40.42 to escape during tightening. Storage recesses 22a, 24. Due to the provision of the ejector I-frames 40 and 42, a ridge corresponding to the thickness of the eject I-frame 40, 42 is provided at the peripheral edge of the cavity 26 of the upper mold inserters 1 to 22 and the lower mold inserters 1 to 24.

The eject frames 40 and 42 are each supported by two pins 44 at both ends thereof in the longitudinal direction. Nijiev h bin 44 is Nijiev 1 to Ru-11.
40.To guide the moving direction of 42 in the mold opening/closing direction"1
It is inserted through the mold 28 and the lower mold 30, and is assembled and fixed to the base beam of the bottle 44 for NJF 1-44 and the retainer brake l-46 and support plate 1-48.

A spring 50 is provided between the gluing retainer plate 1-46 on the mold 2 side and the mold base 34 of the mold 2 to constantly bias the girder retainer brake l-46 downward. Reference numeral 52 denotes a pin fixed to the retainer plates 1 to 46 and installed in the cellar 1 passing through the mold 28 and with its tip facing the lower mold 30. The set bin 52 comes into contact with the lower mold 30 during mold clamping and moves 46 by 1" to the retainer plate 1 to eject the eject I to the frame 4.
It acts to pull 0 back to its normal position.

In addition, at the lower mold side glue retainer plate 1 46, an elastic spring 5 is inserted between the support plate 1-48 and the back surface of the lower mold 30.
4 is provided, and the spring force of this elastic spring 54 constantly moves the frame 42 to the lower mold inserter 1~
It is biased in the direction of contacting 24.

Next, the operation of the molding apparatus according to the embodiment will be described.

First, in the mold opening state where the lead frame is placed on the mold 2, the eject frame 40 on the mold side is moved by the biasing force of the spring 50 until the support plate 1-48 comes into contact with the back surface of the upper mold 28. is being pushed down,
It is in a state separated from the upper mold inserter 1-22. On the other hand, on the lower mold side, the elastic spring 54
The frame 42 abuts the lower mold inserter 1-24, and the storage recess 24. The Ejiek I-frame 42 is housed in a.

When the two lead frames]0 are positioned and set in the predetermined position of the lower mold inserter 1-24.1 with the bolt 20 in between, the chase block 32
8 and the lower mold 30 are stamped and the molds are clamped. When the set bin 52 comes into contact with the lower mold 30 during this mold clamping, the NIJF 1 to FRAY 1140 is pushed up, and when the mold is finally clamped, the NIJF 1 to FRAY As 30 are stored in the storage recess 22a. and lead frame 1
0 is clamped by the mold inserter l-22 and the lower mold inserter 24.

Next, the upper mold inserter 1 is transferred to the upper mold inserter 1 22 and the lower mold inserter 1 to 24
The cavity is filled with resin.

When the mold is opened, the upper mold 28 is first moved slightly, and at this time, the spring force of the spring 50 pushes down the Nijief 1-flay 1140, pushing down the lead frame 10 and releasing it from the second mold inserts 1 to 22. The resin sealing part 1-4 is released from the mold.

Subsequently, when the lower die is lowered, the lower surfaces of the retainer plates 1 to 46 come into contact with an ejector rod (fixed bottle) provided on the press, and the retainer plates 1 to 46 are pushed relatively.
Niziev 1 Hefley 11 via eject bin 44
Push up 42. The ejector I-flay 1142 presses the lower surface of the lead flake As l-0, thereby releasing the resin sealing portion 14 from the lower mold inserter 1-24.

In this way, the upper mold inserter i~22 and the lower mold inserter l
The molded product is released from -24.

The molding apparatus of this embodiment is characterized in that the molded product is released by pushing the lead frame 10 by the frame members Ago and 42 as described above. As shown in FIG. 3, the eject frames 40 and 42 push the parts of the lead frame 10 other than the resin sealing part and the runner flow path, so that the mold release force is applied to the lead frame as a whole. Therefore, effective mold release can be performed.

Furthermore, since the conventional ejector bin is eliminated by using the eject frame, the difficulty of installing a large number of ejector bins in the mold is eliminated, and the work of setting the mold can be facilitated. Further, by eliminating the ejector bin, it is possible to eliminate the occurrence of mold flash caused by the installation of the ejector bin.

FIGS. 4 and 5 are explanatory diagrams showing examples of eject frames used for 71-lead frames.

The eject frame 60 shown in FIG. 4 is used for a mold in which a bifurcated runner 62 is extended from the bod 1- to both side gluing frames tX1-0, and the eject frame 60 shown in FIG. This is used in a mold in which runners 62 are alternately extended from 1- to lead frames 10 on both sides. In either example, the resin sealing portion 14 and the runner 62 are cut out. 66 is Cal.

The present invention has been variously explained above using preferred embodiments, but the present invention is not limited to these embodiments.
It goes without saying that the present invention can be similarly applied to molding various types of lead frames, and that many modifications can be made without departing from the spirit of the invention.

(Effects of the Invention) According to the molding apparatus according to the present invention, the molded product can be reliably released because the eject frame is used to push the entire lead frame to release the molded product. Also,
By not using an ejector bin, it is possible to prevent mold flash from occurring when an ejector bin is used, simplify the mold configuration, and form a resin sealing part with higher density. It has such remarkable effects that it can be suitably used for resin sealing of lead frames.

[Brief explanation of drawings]

1 and 2 are front and side views of a lead frame molding apparatus according to the present invention, FIG. 3 is a perspective view showing the eject frame installed, and FIGS. 4 and 5 are explanatory views of the lead frame molding apparatus according to the present invention. FIG. 6, which shows another example of the frame, is a perspective view showing the arrangement of a conventional ejector bin. 10...Lead frame, 14...Resin sealing part, 22...To upper mold insert 1, 22a, 24a
...Storage recess, 24...Lower mold inserter 1-1 2
6... Cavity, 28... Upper mold, 30.
・・Lower mold, 32・・Chase block, 34・
..." Type 2 mold base, 36... Lower mold base, 40.42.60.62... Play to Nizhiev 1 1-144... Bin for Nizhiev 1, 46...
- To retainer play 1, 48...support play 1~.
50...Spring, 52...Cera 1~pin,
54...Bounce spring, 62...Run. ([3) 1, ON dimension LJOψ−

Claims (1)

[Scope of Claims] 1. In a lead frame molding device that presses and molds a lead frame between a pair of molds each having a predetermined cavity formed therein, the opening side of each of the molds is sealed with resin. In addition to covering the external range of the lead frame, the resin-sealed area of the lead frame and the passage area of the resin flow path that connects to the resin sealing part are cut out to form an integrated plate shape, and are An eject frame is provided that is pushed parallel to the parting surface of the mold by a pushing means when the mold is opened, and a storage recess is provided in the mold to store the eject frame without protruding from the parting surface when the mold is clamped. A lead frame molding device characterized by: