JPH04250346A - Inspecting device for soldering - Google Patents
Inspecting device for solderingInfo
- Publication number
- JPH04250346A JPH04250346A JP2381291A JP2381291A JPH04250346A JP H04250346 A JPH04250346 A JP H04250346A JP 2381291 A JP2381291 A JP 2381291A JP 2381291 A JP2381291 A JP 2381291A JP H04250346 A JPH04250346 A JP H04250346A
- Authority
- JP
- Japan
- Prior art keywords
- light
- soldering
- reflected
- soldered portion
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 35
- 239000013307 optical fiber Substances 0.000 claims abstract description 16
- 238000007689 inspection Methods 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract 3
- 238000005286 illumination Methods 0.000 abstract 2
- 230000001788 irregular Effects 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 8
- 230000002950 deficient Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、部品の半田付状態を検
査するための半田付検査装置に係り、詳しくは、部品を
実装した部品実装基板の半田付部分の半田付状態を検査
するための半田付検査装置に関する。[Industrial Application Field] The present invention relates to a soldering inspection device for inspecting the soldering condition of components, and more specifically, for inspecting the soldering condition of the soldered portion of a component mounting board on which components are mounted. This invention relates to a soldering inspection device.
【0002】0002
【従来の技術】従来、部品を実装した部品実装基板の半
田付部分の半田付状態を検査する場合、拡大レンズを使
用した肉眼による検査方法が採られているのが普通であ
る。2. Description of the Related Art Conventionally, when inspecting the soldered state of a soldered portion of a component mounting board on which components are mounted, an inspection method using the naked eye using a magnifying lens has generally been adopted.
【0003】0003
【発明が解決しようとする課題】しかし、この検査方法
は、1個の部品実装基板を検査するのに多大の時間がか
かる上、検査者の肉眼に検査性能が依存されるので、検
査性能にバラツキが生じる問題があった。[Problems to be Solved by the Invention] However, this inspection method takes a lot of time to inspect one component-mounted board, and the inspection performance is dependent on the naked eye of the inspector, so the inspection performance is There was a problem with variations.
【0004】そこで本発明の目的は、短時間での検査が
行え、しかも検査性能にバラツキが生じない半田付検査
装置を提供することを目的とするものである。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a soldering inspection device that can perform inspection in a short time and that does not cause variations in inspection performance.
【0005】[0005]
【課題を解決するための手段】本発明は、上記目的を達
成するため、例えば図1を参照して示すと、部品を実装
した部品実装基板(7)の半田付部分(8)の半田付状
態を検査するための半田付検査装置に係る。[Means for Solving the Problems] In order to achieve the above object, the present invention, as shown for example with reference to FIG. It relates to a soldering inspection device for inspecting the condition.
【0006】そして、本発明は、前記部品実装基板(7
)の半田付部分(8)へ光源が発光した光(10)を透
過させて照射する光透過照射板(1)と、前記部品実装
基板(7)の半田付部分(8)から反射された反射光(
10)を前記光透過照射板(1)の板面(11)上にお
いて入光し、かつ、板面(12)下に導く光ファイバー
(2,3)と、この光ファイバー(2,3)に導かれた
半田付部分反射光(10)の光量を検出する光量検出手
段(4)と、この光量検出手段(4)にて検出された光
量状態を表示する光量状態表示手段(5,6)とを備え
たことを特徴とするものである。[0006] The present invention also provides the component mounting board (7).
) and a light transmitting irradiation plate (1) that transmits and irradiates the light (10) emitted by a light source to the soldered part (8) of the component mounting board (7), and the light reflected from the soldered part (8) of the component mounting board (7). reflected light(
10) is incident on the plate surface (11) of the light transmission and irradiation plate (1) and is guided to the optical fibers (2, 3) and guided to the optical fibers (2, 3) below the plate surface (12). a light amount detection means (4) for detecting the amount of the partially reflected soldering light (10); and a light amount state display means (5, 6) for displaying the light amount state detected by the light amount detection means (4). It is characterized by having the following.
【0007】[0007]
【作用】上記構成によれば、光透過照射板(1)を透過
した光(9)が部品実装基板(7)の半田付部分(8)
に照射されると、半田付部分(8)はその半田付状態に
応じて光(9)を反射する。半田付状態が良好である場
合は光量の多い反射光(10)を反射し、半田付状態が
不良である場合は光量の少ない反射光(10)を反射す
る。この反射光(10)は光ファイバー(2,3)を介
して光量検出手段(4)に導かれる。ここでどの程度の
光量があるのかが検出され、その光量状態が光量状態表
示手段(5,6)で表示される。[Operation] According to the above configuration, the light (9) transmitted through the light transmission irradiation plate (1) is transmitted to the soldered portion (8) of the component mounting board (7).
When illuminated with light, the soldered part (8) reflects the light (9) depending on its soldering state. When the soldering condition is good, the reflected light (10) with a large amount of light is reflected, and when the soldering condition is poor, the reflected light (10) with a small amount of light is reflected. This reflected light (10) is guided to the light amount detection means (4) via optical fibers (2, 3). Here, the amount of light is detected, and the state of the light amount is displayed on the light amount state display means (5, 6).
【0008】従って、検査者は、光(9)を部品実装基
板(7)の半田付部分(8)に照射し、光量状態表示手
段(5,6)で表示された光量状態を確認するだけで半
田付部分(8)の半田付状態の検査ができる。この場合
、光量状態表示手段(5,6)は、半田付部分反射光(
10)の光量が多いと光量状態が多いことを表示し、光
量が少ないと光量状態が少ないことを表示する。光量状
態が少ないと半田付不良である。Therefore, the inspector simply irradiates the soldered portion (8) of the component mounting board (7) with the light (9) and confirms the light amount status displayed on the light amount status display means (5, 6). The soldering condition of the soldered part (8) can be inspected. In this case, the light amount status display means (5, 6) displays the soldering partially reflected light (
10) When the amount of light is high, it is displayed that the light amount state is high, and when the light amount is low, it is displayed that the light amount state is low. If the light intensity is low, soldering is defective.
【0009】これにより、半田付状態の検査が短時間に
行え、しかも半田付部分(8)に照射した光(9)の反
射光(10)の光量状態により半田付状態を検査するの
で、検査性能にバラツキが生じない。[0009] With this, the soldering state can be inspected in a short time, and the soldering state is inspected based on the amount of light (10) reflected from the light (9) irradiated on the soldered part (8). There is no variation in performance.
【0010】なお、上記カッコ内の符号は、図面を参照
するためのものであって、何等構成を限定するものでは
ない。[0010] The above reference numerals in parentheses are used to refer to the drawings and are not intended to limit the structure in any way.
【0011】[0011]
【実施例】以下、本発明の一実施例を図1に基づいて説
明する。[Embodiment] An embodiment of the present invention will be described below with reference to FIG.
【0012】本半田付検査装置は、光透過照射板1と、
光ファイバー2,3と、光量検出器4と、表示器5,6
とを備えて構成されている。[0012] This soldering inspection device includes a light transmission irradiation plate 1,
Optical fibers 2 and 3, light amount detector 4, and indicators 5 and 6
It is composed of:
【0013】光透過照射板1は、部品(不図示)を実装
した部品実装基板7の半田付部分8へ光源(不図示)が
発光した光9を透過させて照射するためのものである。
ここにおいて、この光透過照射板1は透明プラスチック
板である。The light transmitting and irradiating plate 1 is used to transmit and irradiate light 9 emitted from a light source (not shown) onto a soldered portion 8 of a component mounting board 7 on which components (not shown) are mounted. Here, the light transmitting and irradiating plate 1 is a transparent plastic plate.
【0014】光ファイバー2,3は、部品実装基板7の
半田付部分8から反射された反射光10を光透過照射板
1の板面11上において入光し、かつ、板面12下に導
くためのものである。この光ファイバー2,3の入光側
端13,14は、光透過照射板1に通されて部品実装基
板7の板面11上に突出している。この各入光側端13
,14間に部品実装基板7の半田付部分8を位置させる
。光ファイバー2,3の光導出側端15,16には光量
検出器4が接続されている。The optical fibers 2 and 3 allow the reflected light 10 reflected from the soldered portion 8 of the component mounting board 7 to enter on the plate surface 11 of the light transmission and irradiation plate 1 and guide it below the plate surface 12. belongs to. The light incident side ends 13 and 14 of the optical fibers 2 and 3 are passed through the light transmission and irradiation plate 1 and protrude above the plate surface 11 of the component mounting board 7. Each light incident side end 13
, 14, the soldering portion 8 of the component mounting board 7 is positioned between them. A light amount detector 4 is connected to the light output side ends 15 and 16 of the optical fibers 2 and 3.
【0015】光量検出器4は、光ファイバー2,3に導
かれた半田付部分反射光10の光量を検出するためのも
のである。この光量検出器4は各光ファイバー2,3に
導かれた半田付反射光10の光量が一定量以下であると
き、表示器(ここでは表示灯)5,6を駆動する。The light amount detector 4 is for detecting the amount of soldering partially reflected light 10 guided to the optical fibers 2 and 3. This light amount detector 4 drives indicators (hereindicating lights) 5 and 6 when the amount of soldering reflected light 10 guided to each optical fiber 2 and 3 is less than a certain amount.
【0016】この半田付検査装置を用いて部品実装基板
7の半田付部分8の半田付状態を検査する場合、まず、
図示のように、各光ファイバー2,3の入光側端13,
14の間に部品実装基板7の検査しようとする半田付部
分8を配置する。この場合、部品実装基板7は不図示の
支持部材を用いて光透過照射板1上に載置される。そし
て、次に、その半田付部分8に光透過照射板1を透過し
た光9を照射する。このようにすると、半田付部分8の
両側で反射した光10,10が光ファイバー2,3によ
って光量検出器4に導かれ、この光量検出器4で各光フ
ァイバー2,3に導かれた半田付部分8の両側からの反
射光10,10の光量を検出する。その結果、光量が半
田付不良のレベル(一定量以下)であるとき、表示器5
,6が点灯する。従って、各表示器5,6の表示状態を
見ることにより、半田付部分8の半田付状態が検査(判
定)できる。この場合、少なくとも何れかの表示器5,
6が点灯すると半田付部分8は半田付不良ということに
なる。When inspecting the soldering condition of the soldered portion 8 of the component mounting board 7 using this soldering inspection device, first,
As shown in the figure, the light input side end 13 of each optical fiber 2, 3,
The soldered portion 8 of the component mounting board 7 to be inspected is placed between the parts 14 and 14. In this case, the component mounting board 7 is placed on the light transmission and irradiation plate 1 using a support member (not shown). Then, the soldered portion 8 is irradiated with light 9 that has passed through the light transmission irradiation plate 1. In this way, the lights 10, 10 reflected on both sides of the soldered part 8 are guided to the light quantity detector 4 by the optical fibers 2, 3, and the light quantity detector 4 guides the lights 10, 10 to each optical fiber 2, 3 to the soldered part. The amount of reflected light 10, 10 from both sides of 8 is detected. As a result, when the amount of light is at the level of poor soldering (below a certain amount), the indicator 5
, 6 lights up. Therefore, by looking at the display status of each display 5, 6, the soldering status of the soldered portion 8 can be inspected (determined). In this case, at least one of the indicators 5,
When 6 lights up, it means that the soldered portion 8 is defective in soldering.
【0017】なお、本実施例の光透過照射板1は透明プ
ラスチック板を用いたが、透明ガラス板としてもよい。Although a transparent plastic plate is used as the light transmitting and irradiating plate 1 in this embodiment, a transparent glass plate may also be used.
【0018】また、本実施例の表示器5,6は表示灯を
用いたが、ブザーや光量を数値で表わす表示器としても
よい。Furthermore, although indicator lights are used as the indicators 5 and 6 in this embodiment, they may also be a buzzer or an indicator that numerically indicates the amount of light.
【0019】[0019]
【発明の効果】以上説明したように、本発明の半田付検
査装置は、部品実装基板の半田付部分に光を照射し、半
田付部分から反射した光の光量を検出してその光量状態
を表示するようにしたので、半田付状態の検査を短時間
で行うことができる上、検査性能にバラツキが生じない
。As explained above, the soldering inspection device of the present invention irradiates light onto the soldered portion of a component mounting board, detects the amount of light reflected from the soldered portion, and determines the state of the light amount. Since it is displayed, the soldering state can be inspected in a short time, and there is no variation in inspection performance.
【図1】本発明の一実施例による半田付検査装置の構成
図である。FIG. 1 is a configuration diagram of a soldering inspection device according to an embodiment of the present invention.
1 光透過照射板
2,3 光ファイバー
4 光量検出器
5,6 表示器(光量状態表示手段)7 部品実装
基板
8 半田付部分
10 光源が発光した光
11,12 板面1 Light transmission irradiation plate 2, 3 Optical fiber 4 Light amount detector 5, 6 Display device (light amount status display means) 7 Component mounting board 8 Soldering part 10 Light emitted by the light source 11, 12 Board surface
Claims (1)
の半田付状態を検査するための半田付検査装置において
、前記部品実装基板の半田付部分へ光源が発光した光を
透過させて照射する光透過照射板と、前記部品実装基板
の半田付部分から反射された反射光を前記光透過照射板
の板面上において入光し、かつ、板面下に導く光ファイ
バーと、この光ファイバーに導かれた半田付部分反射光
の光量を検出する光量検出手段と、この光量検出手段に
て検出された光量状態を表示する光量状態表示手段とを
備えたことを特徴とする半田付検査装置。1. A soldering inspection device for inspecting the soldering state of a soldered portion of a component mounting board on which components are mounted, wherein light emitted by a light source is transmitted and irradiated onto the soldered portion of the component mounting board. a light transmitting and irradiating plate for transmitting light, an optical fiber that allows the reflected light reflected from the soldered portion of the component mounting board to enter on the plate surface of the light transmitting and irradiating plate and guide it below the plate surface; 1. A soldering inspection device comprising: a light amount detection means for detecting the amount of reflected light from a partially reflected solder joint; and a light amount state display means for displaying a light amount state detected by the light amount detection means.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2381291A JPH04250346A (en) | 1991-01-25 | 1991-01-25 | Inspecting device for soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2381291A JPH04250346A (en) | 1991-01-25 | 1991-01-25 | Inspecting device for soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04250346A true JPH04250346A (en) | 1992-09-07 |
Family
ID=12120755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2381291A Pending JPH04250346A (en) | 1991-01-25 | 1991-01-25 | Inspecting device for soldering |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04250346A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101877592B1 (en) * | 2011-02-11 | 2018-07-11 | 나고야덴키코교 가부시키가이샤 | Inspection device |
-
1991
- 1991-01-25 JP JP2381291A patent/JPH04250346A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101877592B1 (en) * | 2011-02-11 | 2018-07-11 | 나고야덴키코교 가부시키가이샤 | Inspection device |
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