JPH04250308A - Pattern width measuring method for printed wiring board - Google Patents
Pattern width measuring method for printed wiring boardInfo
- Publication number
- JPH04250308A JPH04250308A JP3008138A JP813891A JPH04250308A JP H04250308 A JPH04250308 A JP H04250308A JP 3008138 A JP3008138 A JP 3008138A JP 813891 A JP813891 A JP 813891A JP H04250308 A JPH04250308 A JP H04250308A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- measured
- width
- wiring board
- foil pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000011889 copper foil Substances 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000012545 processing Methods 0.000 abstract description 13
- 238000005259 measurement Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、プリント配線板のパタ
ーン幅測定方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring pattern widths of printed wiring boards.
【０００２】0002
【従来の技術】従来、プリント配線板上の銅箔パターン
の幅及び銅箔パターン間のショート、断線、太り、細り
等の欠点を測定する方法では、単なる反射光を用いた２
値化画像処理によって行っていた。[Prior Art] Conventionally, methods for measuring the width of copper foil patterns on printed wiring boards and defects such as short circuits, disconnections, thickening, thinning, etc. between copper foil patterns have only used reflected light.
This was done using digitized image processing.
【０００３】0003
【発明が解決しようとする課題】ところが上記の従来例
方法では、銅箔パターンのサイドウォール部の角度が不
定で、しかも銅面が粗化されており、そのため乱反射等
でプリント配線基板の基材と銅箔パターンとの境界線が
不明瞭となって高精度の測定が不可能であった。本発明
は、上述の問題点に鑑みて為されたもので、その目的と
するところは銅箔パターンの基部の幅、銅箔パターン間
の幅、銅箔パターンの頂上部の幅等を高精度に測定する
ことができるプリント配線板のパターン幅測定方法を提
供するにある。[Problems to be Solved by the Invention] However, in the above-mentioned conventional method, the angle of the sidewall portion of the copper foil pattern is not fixed, and the copper surface is roughened. The boundary line between the copper foil pattern and the copper foil pattern became unclear, making it impossible to measure with high precision. The present invention has been made in view of the above-mentioned problems, and its purpose is to accurately measure the width of the base of a copper foil pattern, the width between copper foil patterns, the width of the top of a copper foil pattern, etc. The purpose of the present invention is to provide a method for measuring the pattern width of a printed wiring board.
【０００４】0004
【課題を解決するための手段】本発明は、上述の目的を
達成するために、被測定プリント配線板の銅箔パターン
側表面にレーザ光を照射するとともに、蛍光Ｘ線を放出
させる所定波長の電磁波を照射し、被測定プリント配線
板の基材から放出される蛍光Ｘ線により銅箔パターンと
基材との境界を検知して銅箔パターンの基部の幅を測定
し、レーザ光の反射光により銅箔パターンの頂上部の幅
を測定するものである。[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention irradiates the copper foil pattern side surface of a printed wiring board to be measured with a laser beam and emits fluorescent X-rays at a predetermined wavelength. The boundary between the copper foil pattern and the base material is detected by irradiating electromagnetic waves and fluorescent X-rays emitted from the base material of the printed wiring board to be measured, and the width of the base of the copper foil pattern is measured, and the reflected light of the laser beam is detected. This method measures the width of the top of the copper foil pattern.
【０００５】[0005]
【作用】而して本発明によれば、被測定プリント配線板
の銅箔パターン側表面にレーザ光を照射するとともに、
蛍光Ｘ線を放出させる所定波長の電磁波を照射するため
、被測定プリント配線板の基材からは蛍光Ｘ線が放出さ
れ、一方レーザ光が被測定面で反射することになる。
ここで両者の波長が異なるため、基材と銅箔パターンの
境界を検知することができ、この境界検知により銅箔パ
ターンの幅が測定できる。[Operation] According to the present invention, a laser beam is irradiated onto the copper foil pattern side surface of the printed wiring board to be measured, and
Since electromagnetic waves of a predetermined wavelength that cause fluorescent X-rays to be emitted are irradiated, fluorescent X-rays are emitted from the base material of the printed wiring board to be measured, while laser light is reflected by the surface to be measured. Since the wavelengths of both are different, the boundary between the base material and the copper foil pattern can be detected, and the width of the copper foil pattern can be measured by detecting this boundary.
【０００６】更にレーザ光の直進性によって傾きを持つ
銅箔パターンのサイドウォール部と、略平坦な面である
頂上面とでは反射光の受光量が異なり、受光量の相違か
ら２値化画像処理等の処理を行えば頂上面の幅の測定が
できる。Furthermore, the amount of reflected light received differs between the sidewall part of the copper foil pattern, which has an inclination due to the straightness of the laser beam, and the top surface, which is a substantially flat surface. By performing the above processing, the width of the top surface can be measured.
【０００７】[0007]
【実施例】以下本発明方法を用いた装置により実施例を
説明する。図２は幅測定装置の全体構成を示しており、
この装置では予め同じパターンを形成したプリント配線
板１のパターン幅測定を繰り返して行うため、基準とな
るプリント配線板１の基準点を測定し、その基準点に基
づいて測定点及び位置ずれ修正のデータをマイクロコン
ピュータからなる信号処理部２の内蔵記憶部に記憶させ
ておき、被測定プリント配線板１をＸ−Ｙテーブル３の
所定位置に置き、Ｘ−Ｙテーブル３を上記記憶データに
基づいて信号処理部２の制御の下で動かすことにより、
被測定プリント配線板１の測定部位を所定の測定点に移
動させることができるようになっている。EXAMPLES Examples will be explained below using an apparatus using the method of the present invention. Figure 2 shows the overall configuration of the width measuring device.
Since this device repeatedly measures the pattern width of the printed wiring board 1 on which the same pattern has been formed in advance, a reference point on the printed wiring board 1 that serves as a reference is measured, and the measurement points and positional deviation correction are performed based on the reference point. The data is stored in the built-in storage section of the signal processing section 2 consisting of a microcomputer, the printed wiring board 1 to be measured is placed at a predetermined position on the X-Y table 3, and the X-Y table 3 is moved based on the stored data. By operating under the control of the signal processing section 2,
The measurement portion of the printed wiring board 1 to be measured can be moved to a predetermined measurement point.
【０００８】レーザ光発振器４及び蛍光Ｘ線を被測定プ
リント配線板２の被測定部位より放出させるために所定
波長の電磁波を被測定部位に照射する電磁波発振器５と
は上記信号処理部２の制御の下で動作するもので、上記
のように被測定プリント配線板１の被測定部位を測定点
にセットした後、これらレーザ光発振器４及び電磁波発
振器５は駆動される。The laser beam oscillator 4 and the electromagnetic wave oscillator 5 that irradiates an electromagnetic wave of a predetermined wavelength to a portion to be measured in order to emit fluorescent X-rays from the portion to be measured of the printed wiring board 2 to be measured are controlled by the signal processing section 2 described above. The laser beam oscillator 4 and the electromagnetic wave oscillator 5 are driven after the portion to be measured of the printed wiring board 1 to be measured is set at the measurement point as described above.
【０００９】レーザ光発振器４から出たレーザ光はハー
フミラー６により反射されレンズ７を介して被測定部位
に照射される。この照射されたレーザ光は被測定部位で
反射してレンズ７、ハーフミラー６を通過した後、ミラ
ー８で反射され、フィルタ９を介してセンサ１０に受光
される。この受光信号はアンプ１１で増幅された後信号
処理部２に取り込まれて画像処理が為される。The laser beam emitted from the laser beam oscillator 4 is reflected by a half mirror 6 and is irradiated onto the part to be measured via a lens 7. The irradiated laser beam is reflected at the measurement target site, passes through a lens 7 and a half mirror 6, is reflected by a mirror 8, and is received by a sensor 10 via a filter 9. This light reception signal is amplified by an amplifier 11 and then taken into a signal processing section 2 where it is subjected to image processing.
【００１０】一方電磁波発振器５から発射された電磁波
はミラー８、ハーフミラー６、レンズ７を透過した後、
被測定部位に照射される。この照射により被測定部位か
らは素材特有の波長を持つ蛍光Ｘ線が放出される。この
放出された蛍光Ｘ線の内プリント配線板１の基材１Ａか
ら放出される波長の蛍光Ｘ線をフィルタ１２により抽出
して検出器１３で検出する。この検出器１３の検出信号
はアンプ１４で増幅された後、信号処理部２に取り込ま
れて画像処理が為される。On the other hand, after the electromagnetic wave emitted from the electromagnetic wave oscillator 5 passes through the mirror 8, the half mirror 6, and the lens 7,
Irradiates the area to be measured. As a result of this irradiation, fluorescent X-rays having a wavelength unique to the material are emitted from the part to be measured. Among these emitted fluorescent X-rays, fluorescent X-rays having a wavelength emitted from the base material 1A of the printed wiring board 1 are extracted by a filter 12 and detected by a detector 13. The detection signal from the detector 13 is amplified by an amplifier 14, and then taken into the signal processing section 2 and subjected to image processing.
【００１１】ここで図１に示すように被測定プリント配
線板１の被測定部位では、銅箔パターン１Ｂと、基材１
Ａとの境界部位は基材１Ａの蛍光Ｘ線により検知するこ
とができ、この蛍光Ｘ線ａが放出される部分におけるレ
ーザ光ｂの反射光ｃによる画像部位をキャンセルすれば
、銅箔パターン１Ｂの基部の幅の部分の画像が得られ、
この画像より基部の幅を測定する。Here, as shown in FIG. 1, in the part to be measured of the printed wiring board 1 to be measured, there is a copper foil pattern 1B and a base material 1.
The boundary region with A can be detected by the fluorescent X-rays of the base material 1A, and if the image region caused by the reflected light c of the laser beam b in the region where the fluorescent X-rays a are emitted is canceled, the copper foil pattern 1B can be detected. An image of the width of the base of is obtained,
Measure the width of the base from this image.
【００１２】また銅箔パターン１Ｂにおけるレーザ光ｂ
の反射光ｃの受光レベルは銅箔パターン１Ｂのサイドウ
ォール部による受光量に比べて平坦な頂上面の方が大き
いため、２値化処理を行った場合には、頂上面の画像を
抽出することができ、結果頂上面の幅が測定できるので
ある。また基材１Ａ部分が検知できるため、隣接する銅
箔パターン１Ｂ間の幅も測定できる。[0012] Also, the laser beam b on the copper foil pattern 1B
Since the received level of the reflected light c is larger on the flat top surface than the amount of light received by the sidewall portion of the copper foil pattern 1B, when binarization processing is performed, an image of the top surface is extracted. As a result, the width of the top surface can be measured. Furthermore, since the base material 1A portion can be detected, the width between adjacent copper foil patterns 1B can also be measured.
【００１３】尚画像処理された画像はディスプレィ１５
で出力表示される。The processed image is displayed on the display 15.
The output is displayed in .
【００１４】[0014]
【発明の効果】本発明は、被測定プリント配線板の銅箔
パターン側表面にレーザ光を照射するとともに、蛍光Ｘ
線を放出させる所定波長の電磁波を照射するため、被測
定プリント配線板の基材からは蛍光Ｘ線が放出され、一
方レーザ光が被測定面で反射することになる。ここで両
者の波長が異なるため、基材と銅箔パターンの境界を検
知することができ、この境界検知により銅箔パターンの
幅が測定でき、また隣接する銅箔パターン間の幅も測定
できるという効果を奏する。Effects of the Invention The present invention irradiates the copper foil pattern side surface of the printed wiring board to be measured with laser light and
In order to irradiate electromagnetic waves of a predetermined wavelength that cause radiation to be emitted, fluorescent X-rays are emitted from the base material of the printed wiring board to be measured, while laser light is reflected by the surface to be measured. Since the wavelengths of the two are different, it is possible to detect the boundary between the base material and the copper foil pattern, and by detecting this boundary, the width of the copper foil pattern can be measured, as well as the width between adjacent copper foil patterns. be effective.
【００１５】更にレーザ光の直進性によって傾きを持つ
銅箔パターンのサイドウォール部と、略平坦な面である
頂上面とでは反射光の受光量が異なり、受光量の相違か
ら２値化画像処理等の処理を行えば頂上面の幅も高い精
度で測定ができるという効果がある。Furthermore, the amount of reflected light received differs between the sidewall part of the copper foil pattern, which has an inclination due to the straightness of the laser beam, and the top surface, which is a substantially flat surface. If such processing is performed, the width of the top surface can also be measured with high precision.
【図１】本発明方法の実施例による被測定プリント配線
板の被測定部位の拡大断面図である。FIG. 1 is an enlarged sectional view of a portion to be measured of a printed wiring board to be measured according to an embodiment of the method of the present invention.
【図２】本発明方法を用いた装置の構成を示すブロック
図である。FIG. 2 is a block diagram showing the configuration of an apparatus using the method of the present invention.
１ 被測定プリント配線板 １Ａ 基材 １Ｂ 銅箔パターン ａ 蛍光Ｘ線 ｂ レーザ光 ｃ 反射光 1 Printed wiring board to be measured 1A Base material 1B Copper foil pattern a Fluorescent X-ray b Laser light c Reflected light
Claims (1)
面にレーザ光を照射するとともに、蛍光Ｘ線を放出させ
る所定波長の電磁波を照射し、被測定プリント配線板の
基材から放出される蛍光Ｘ線により銅箔パターンと基材
との境界を検知して銅箔パターンの基部の幅を測定し、
レーザ光の反射光により銅箔パターンの頂上部の幅を測
定することを特徴とするプリント配線板のパターン幅測
定方法。Claim 1: A laser beam is irradiated onto the copper foil pattern side surface of the printed wiring board to be measured, and an electromagnetic wave of a predetermined wavelength that causes fluorescent X-rays to be emitted is emitted from the base material of the printed wiring board to be measured. The boundary between the copper foil pattern and the base material is detected using fluorescent X-rays, and the width of the base of the copper foil pattern is measured.
A method for measuring the pattern width of a printed wiring board, comprising measuring the width of the top of a copper foil pattern using reflected laser light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3008138A JPH07104138B2 (en) | 1991-01-28 | 1991-01-28 | Pattern width measurement method for printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3008138A JPH07104138B2 (en) | 1991-01-28 | 1991-01-28 | Pattern width measurement method for printed wiring boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04250308A true JPH04250308A (en) | 1992-09-07 |
| JPH07104138B2 JPH07104138B2 (en) | 1995-11-13 |
Family
ID=11684941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3008138A Expired - Lifetime JPH07104138B2 (en) | 1991-01-28 | 1991-01-28 | Pattern width measurement method for printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07104138B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021044468A (en) * | 2019-09-13 | 2021-03-18 | シチズンファインデバイス株式会社 | Submount |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125009A (en) * | 1982-12-29 | 1984-07-19 | Fujitsu Ltd | Pattern detecting method |
| JPS6239707A (en) * | 1985-08-15 | 1987-02-20 | Furukawa Electric Co Ltd:The | Method for detecting width of composite metal material |
-
1991
- 1991-01-28 JP JP3008138A patent/JPH07104138B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125009A (en) * | 1982-12-29 | 1984-07-19 | Fujitsu Ltd | Pattern detecting method |
| JPS6239707A (en) * | 1985-08-15 | 1987-02-20 | Furukawa Electric Co Ltd:The | Method for detecting width of composite metal material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021044468A (en) * | 2019-09-13 | 2021-03-18 | シチズンファインデバイス株式会社 | Submount |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07104138B2 (en) | 1995-11-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960604 |