JP2968106B2 - Via hole inspection equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a via hole inspection apparatus, and more particularly, to a via hole used for detecting defects such as resin residues generated in via holes formed in a resin thin film layer on a ceramic substrate. It relates to improvement of a hall inspection device. In recent years, via-hole inspection systems have been able to perform via-hole inspections that can respond to complex inspection regulations, and to improve the efficiency of fluorescence detection without being affected by warpage of the inspection target or vertical movement of the mounting stage. There is a demand for a device which can improve the light emission, can collect a large amount of fluorescence, and can easily perform binarization by improving the S / N ratio of the detection signal.

[0002]

2. Description of the Related Art A conventional technique will be described below. First, FIG. 13 is a diagram showing an outline of an inspection target. As shown in FIG. 13, the inspection target is a via hole 103 having a diameter of about 100 μm or less formed in a resin thin film layer 102 such as a polyimide resin on an opaque object 101 such as a multilayer ceramic substrate.

FIG. 14 is a view showing an example of a defect generated in a via hole in a thin film layer. 14, the same reference numerals as those in FIG. 13 denote the same or corresponding parts, 104 denotes a metal wiring, 1
05 is a polyimide residue. FIG. 14A shows a normal via hole, while FIGS. 14B to 14G show defective via holes. FIG. 14B shows the case where the polyimide remains in a part of the via hole, and FIG. 14C shows the case where the polyimide remains in the entire via hole. 14 (e) shows the case where the via hole diameter is smaller than the allowable value, FIG. 14 (e) shows the case where the via hole diameter is larger than the allowable value, and FIG. 14 (f) shows the case where the via hole does not exist at the intended position. FIG. 14 (g) shows a case where there is a via hole at a position that is not originally present.

Next, FIGS. 15 to 17 are views for explaining the outline of a detection optical system used in an inspection apparatus for detecting a defect generated in a thin film layer via hole as shown in FIG.
15 is a schematic diagram showing the configuration of the via hole inspection device,
16 is a diagram for explaining the principle of via hole detection by fluorescence when using the via hole inspection device shown in FIG. 15, and FIG. 17 is a diagram showing wavelength characteristics when the via hole inspection device shown in FIG. 15 is used. .

[0005] First, as shown in FIG.
Laser light (laser wavelength is ultraviolet to blue)
Is expanded using a beam expander 111, and the expanded laser light is scanned using a rotating polygon mirror 112, and then, on a test object 115 placed on a moving stage 114 by a scan lens 113 and a mirror 116. Into a spot. The inspection target 115 is set on the moving stage 114 and can be moved in the X direction and the Y direction. Here, as shown in FIG. 16, the polyimide resin thin film layer 102 and the via hole 103 are distinguished by using the fluorescence generated from the polyimide resin and do not occur even when the metal wiring 104 is irradiated. To detect via holes. Then, the emitted laser light and the generated fluorescence are separated by using a wavelength filter as shown in FIG. 17, and only the fluorescent component is detected by an optical sensor 117 such as a photomultiplier tube as shown in FIG. In FIG. 15,
Reference numeral 118 denotes a wavelength filter disposed immediately below the optical sensor 117.

FIG. 18 is a diagram showing an example of a via hole detection signal when the via hole inspection apparatus shown in FIG. 15 is used. As shown in FIG. 18, when there is a polyimide residue 105 in the via hole 103, a fluorescence detection signal as shown in FIG. 18 is obtained. This fluorescence detection signal is binarized at two slice levels (slice level 1 and slice level 2). FIG. 19 is a diagram showing an example of this fluorescence detection signal binarization circuit. The detection pattern at slice level 1 is usually a circular pattern, while the detection pattern at slice level 2 is usually a circular pattern when no defect exists.
When there is a part of the polyimide residue 105 in 03, a pattern in which a part of a circle is missing is obtained.

[0007] As described above, the fluorescent component generated by irradiating the inspection object 115 with laser light is subjected to the wavelength filter.
When the light is separated using 118 and detected by the optical sensor 117, the signal intensity increases due to the generation of fluorescence on the polyimide residue 104, but does not occur at the metal wiring 104, so that the signal intensity decreases. However, at this time, if there is a polyimide residue 105 on the metal wiring 104, the signal level is slightly increased due to the slight generation of fluorescent light (FIG. 18). This signal is binarized at slice level 1 to check the presence or absence and size of via holes, and then binarized at slice level 2 to check for polyimide residue (FIG. 19).

Next, FIG. 20 is a diagram showing an example of the conventional via hole inspection logic. As shown in FIG.
Then, a defect / normal judgment is performed using the pattern 2. The inspection logic circuit includes a via hole presence / absence determination circuit 120, a shape inspection logic circuit 121, and an area determination circuit 122. The via hole presence / absence determination circuit 120 here uses the pattern 1, the via hole position data (design data), and the stage position data as shown in FIG.
Defects as shown in (f) and (g) are detected. Then
The shape inspection logic circuit 121 uses, for example, a radial matching inspection logic, and determines whether the shape of the pattern 1 (usually a circle) is good or not, thereby obtaining the pattern shown in FIG.
A defect as shown in (e) is detected. Then, the area determination circuit 122 performs a comparison between the area measurement value S ₂ and the set value of the pattern 2 (maximum area value S _max and the minimum area value S _min), with S _2> S _max or S ₂ <S _min If there is a defect, it is determined as a defect, and a defect as shown in FIGS. 14B and 14C is detected.

More specifically, first, using a pattern binarized by slice level 1, a via hole, and stage position information, a via hole presence / absence determining circuit 120 determines whether an excessive pattern or an unpenetrated via hole exists. Perform an inspection. Also, the shape inspection logic circuit checks whether the diameter of the via hole is larger or smaller than the reference size. Next, the pattern binarized by the slice level 2 is input to the area measuring circuit, and the area (the number of pixels) is measured. Next, the area determination circuit 122 detects a defect by comparing the measured via hole area with a preset maximum / minimum area value.

[0010]

In the conventional via-hole inspection apparatus using the above-described via-hole inspection logic, the quality of the pattern 1 is determined, but the area of the pattern 1 is not measured. since the area of only the pattern 2 is measured, it has been performed determination of defect / normal based on a comparison between the area measurement value S ₂ and the set value (maximum area value S _{ma x} and a minimum area value S _min), 14 If the inspection rule for polyimide residue defects as shown in (b) is, for example, “if the residue is at least の of the entire area of the via hole, it is determined to be a defect”, the determination is made using both pattern 1 and pattern 2. Although it is necessary, there is a problem that the conventional inspection theory cannot cope.

Further, in the above-mentioned conventional via hole inspection apparatus, there is a problem that the efficiency of fluorescence detection is reduced when the inspection object is warped or the mounting stage is vertically moved.
Further, in the above-described conventional via hole inspection apparatus, since the amount of fluorescence generated when the inspection object is irradiated with laser light is weak, the fluorescence detection signal is small, and as a result, the detection signal S / N becomes small. There is a problem that binarization becomes difficult.

Accordingly, the present invention has been made in view of the above problems,
Via hole inspection that can respond to more complicated inspection rules can be performed, and the efficiency of fluorescence detection can be improved with almost no influence from the warpage of the inspection target or the vertical movement of the mounting stage. It is another object of the present invention to provide a via hole inspection apparatus that can collect a large amount of fluorescent light, improve the S / N ratio of a detection signal, and easily perform binarization.

[0013]

According to the first aspect of the present invention, there is provided a detection signal acquiring means for acquiring a detection signal due to fluorescence generated from an inspection object having a via hole, and the fluorescence detection signal. A first pattern information acquiring unit for binarizing the fluorescence detection signal to obtain first pattern information corresponding to the outer shape of the via hole, and a second pattern information including a residue information in the via hole for binarizing the fluorescence detection signal. Second pattern information acquiring means for acquiring, area measuring means for measuring the area of the first pattern, and area of the second pattern; and means for measuring the area of the first pattern and the area of the second pattern. Area relation calculating means for calculating an arbitrary relation of the above, a defect presence / absence determining means for comparing the calculation result with a preset reference value to determine the presence or absence of a defect, and a defect output means for outputting information on the detected defect. And information output means those having at least.

In the via hole inspection apparatus according to the present invention, the area relation calculating means may calculate an area ratio between the first pattern area and the second pattern area. The area relationship calculating means may calculate an area difference between the first pattern area and the second pattern surface. The invention according to claim 4 is
A via-hole inspection apparatus that scans an inspection target using a laser beam and detects the fluorescence generated from the inspection target with an optical sensor to perform the inspection. Imaging means for imaging the scanning laser light on the object from a direction different from the irradiation angle of the laser light, fluorescence component extracting means for extracting only the fluorescent component from the imaging light, and laser light scanning on the imaging surface A light position detecting means for detecting the position of the line, a height / luminance signal obtaining means for calculating an output of the light position detecting means to obtain a height signal and a luminance signal, and an intensity of the obtained luminance signal A height signal output means for outputting the height signal when the intensity is equal to or higher than a predetermined intensity, and the mounting so that the vertical position of the inspection object is always kept substantially constant based on the height signal output; Stage that controls the stage Those having a control unit at least.

In the present invention, the light position detecting means for detecting the position of the laser beam scanning line may be constituted by a light position detecting element (PSD), or a linear light position detecting element. (PSD).
It may be constituted by a line-shaped light position detection element (PSD) and provided with a circuit for synthesizing a luminance signal obtained as a result of the calculation and a fluorescence detection signal detected by the optical sensor.

According to a fifth aspect of the present invention, in order to attain the above object, a scanning means for converging a laser beam in a spot shape and scanning the object to be inspected, and irradiating the scanning laser beam with the scanning means so as to remove the object from the object to be inspected. In a via hole inspection apparatus including defect detection means for detecting generated fluorescence to detect a defect in a via hole, first fluorescence detection for detecting fluorescence from both ends (scanning direction) of a scanning laser beam using an optical sensor. Means, second fluorescence detection means for detecting fluorescence from the side of the scanning laser light using an optical sensor, each output of the optical sensor disposed at both ends of the scanning laser light, and the side of the scanning laser light Output synthesizing means for synthesizing each output of the arranged optical sensors.

According to a sixth aspect of the present invention, there is provided a scanning means for converging a laser beam into a spot and scanning the object to be inspected, and irradiating the scanning laser beam to detect fluorescence generated from the object to be inspected. In a via hole inspection apparatus comprising:
It has at least fluorescence detection means for detecting fluorescence from the side of the scanning laser light using an optical sensor, and fluorescence introduction means for installing an elliptical reflector at a position relative to the optical sensor and guiding the fluorescence to the optical sensor.

[0018]

According to the first aspect of the present invention, an arbitrary operation is performed on the area of the pattern 1 and the pattern 2 and the result of the operation is compared with a reference value to determine the presence or absence of a defect. The presence / absence of a defect can be determined by the correlation between the patterns. In this case, the determination can be made when the presence / absence of a defect is to be determined based on the area relationship between two types of patterns that cannot be divided in the conventional case.

According to the second aspect of the present invention, the area ratio between the pattern 1 and the pattern 2 is calculated, and the calculated area ratio is compared with a predetermined area ratio set in advance. Because it is determined whether there is a defect,
When the area of only the conventional pattern 2 is measured, it is possible to determine the presence / absence of a defect based on the correlation between the two types of undivided patterns as in the case of the invention described in claim 1 above. Can be determined when it is desired to determine.

According to the third aspect of the present invention, the area difference between the pattern 1 and the pattern 2 is calculated, and the calculated area difference is compared with a predetermined area difference, and based on the comparison data. Because it is determined whether there is a defect,
As in the first and second aspects of the present invention, it is possible to determine the presence or absence of a defect based on the correlation between two types of patterns. can do.

According to the fourth aspect of the present invention, since luminance information can be obtained in addition to the height information by the PSD, there is almost no influence from the warpage of the inspection object and the vertical movement of the mounting stage. Also, by combining (adding) the luminance signal and the signal of the optical sensor, the efficiency of fluorescence detection can be improved. In the invention according to claim 5,
Since the optical sensors are provided at both ends (scanning direction) of the laser beam to be scanned, more fluorescence can be collected, and the S / N ratio of the detection signal is improved to achieve binarization. It can be done easily.

According to the sixth aspect of the present invention, since the elliptical reflector is arranged on the side surface (sub-scanning direction) of the scanning laser beam, more generated fluorescence can be collected and the S / S of the detection signal can be improved. Binarization can be easily performed by improving the N ratio.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. (First Embodiment) FIGS. 1 and 2 are schematic diagrams showing a configuration of a via hole inspection apparatus according to a first embodiment of the present invention. In FIGS. 1 and 2, reference numeral 1 denotes a via hole presence / absence determination circuit. The via hole presence / absence determination circuit 1 receives via hole position data and stage position data as detection signals due to fluorescence generated from an inspection object having via holes. Reference numeral 2 denotes a shape inspection logic circuit which binarizes the fluorescence detection signal and inputs pattern information corresponding to the via hole outer shape. Next, reference numerals 3 and 4 denote area measuring circuits for measuring the areas of the patterns 1 and 2 respectively, and reference numeral 5 denotes an area determining circuit provided via the area measuring circuit 4. Is binarized to obtain information on pattern 2 including information on the resist residue in the via hole. Then, 6 is the area ratio calculating circuit for calculating the area ratio S _R of S ₂ of the area S ₁ and the pattern 2 of the pattern 1, 7 preset predetermined reference value and the computed area ratio S _R Is a defect determination circuit for comparing the area ratio S _Rmin (here, the minimum area ratio) to determine the presence or absence of a defect. _{Reference numeral} 8 denotes a defect information output unit that outputs information on the detected defect.

In this embodiment, as shown in FIGS. 1 and 2, first, the area (number of pixels) S ₁ of pattern ₁ and the area (number of pixels) S ₂ of pattern ₂ are measured, and then the area S _{1 of} pattern 1 is measured.
And the area S _{2 of the} pattern 2 to the area ratio calculation circuit 6,
Next, the area ratio S _R (= S ₂ / S ₁ ) is calculated, and the calculated area ratio S _R is compared with a preset minimum area ratio S _Rmin, and S _R <S _Rmin In this case, defect information is output, while if S _R > S _Rmin , no defect information is output. Therefore, when the area of only the conventional pattern 2 is measured, it is possible to determine the presence or absence of a defect based on the correlation between the two types of patterns that cannot be divided, and to determine the presence or absence of the defect based on the area ratio. it can.

In the above embodiment, the pattern 1 and the pattern
To determine the presence or absence of a defect by calculating the area ratio of area 2
However, the present invention is not limited to this.
Instead, as shown in FIG.
In addition to the defect determination circuit 7, the surface of the pattern 1 and the pattern 2
Product difference S_DAnd an area calculation circuit 9 for calculating
Area difference S_DAnd the predetermined area difference S which is a predetermined reference
_Dmax(In this case, the maximum area difference)
Even if the determination is made by providing the defect determination circuit 10
Good. In this case, the performance of the area difference between pattern 1 and pattern 2
Is calculated, and the calculated area difference S_DPreset
Predetermined maximum area difference S_DmaxAnd S _D> S_DmaxPlace
Output defect information, while S_D≤S_Dmax Place
In this case, no defect information is output. For this reason, the first implementation
As in the example, the determination of the presence or absence of a defect based on the correlation between the two types of patterns is performed.
Surface that could not be handled in the conventional case
If you want to determine the presence / absence of a defect based on the area difference in addition to the product ratio,
Can be specified. Moreover, even here the area ratio is defective.
Is determined, the line ratio is determined by the area ratio of the first embodiment.
Inspection with better accuracy than in the case of
Can be.

(Second Embodiment) FIG. 4 shows a second embodiment of the present invention.
It is the schematic which shows the structure of the via-hole inspection apparatus based on an Example. Here, the inspection object 12 is
Is scanned, and the fluorescence generated from the inspection object 12 is scanned by the optical sensor 13.
This is a via-hole inspection device that detects and inspects with a. Then, a mounting stage 14 capable of moving the inspection target 11 in the vertical direction, and a scanning laser beam on the inspection target 11
Imaging lens 15 that forms an image from a direction different from the irradiation angle of
And a wavelength filter that extracts only the fluorescent component from the imaging light
16, a PSD 17 for detecting the position of the laser beam scanning line on the image plane, means for calculating the output of the PSD 17 to obtain a height signal and a luminance signal, and the intensity of the obtained luminance signal is preset. Height signal output means for outputting the height signal when the intensity is equal to or higher than the predetermined intensity, and a mounting stage 14 for maintaining the vertical position of the inspection object 12 always substantially constant based on the output of the height signal. And a stage controller 18 for controlling the operation. In this case, since the PSD 17 can obtain luminance information in addition to the height information, the PSD 17 is hardly affected by the warpage of the inspection object 12 and the vertical movement of the mounting stage 14. Further, by combining (adding) the luminance signal and the signal of the optical sensor 13, the efficiency of fluorescence detection can be improved (see FIG. 5).

The PSD for detecting the height of the inspection object 12
As shown in FIG. 6, a linear PSD 19 having a length of about the scanning length of the laser beam 11 or longer may be used. (Third Embodiment) Next, FIG. 7 is a schematic diagram showing a configuration of a via hole inspection apparatus according to a third embodiment of the present invention. In FIG. 7, reference numeral 21 denotes a laser light source. A scanning means for converging a laser light 22 from the laser light source 21 in a spot shape and scanning an inspection target 23 set on a moving stage 24, and a scanning laser light And a defect detecting means for detecting the fluorescence generated from the inspection target 23 and detecting a defect in the via hole. Next, fluorescence detection means for detecting fluorescence from both ends (scanning direction) of the scanning laser light using the optical sensor 25, fluorescence detection means for detecting fluorescence from the side of the scanning laser light using the optical sensor 25, It has an output synthesizing means for synthesizing each output of the optical sensors 25 arranged at both ends of the light and the outputs of the optical sensors 25 arranged on the side surfaces of the scanning laser light. Reference numerals 26, 27, 28, and 29 denote a beam expander, a rotating polygon mirror, an fθ lens, and a wavelength filter, respectively.

Next, the operation of the via hole inspection apparatus will be briefly described. First, the laser beam 22 from the laser light source 21 is enlarged by the beam expander 26 and scanned by using the rotating polygon mirror 27. Laser beam 22 is fθ lens 2
8.Condensed into a spot by a scanning lens and inspected 2
3 is scanned in the direction shown in the figure. By arranging the generated fluorescent light at both ends (scanning direction) of the laser scanning the optical sensor 25, more fluorescent light can be collected than in the conventional via hole inspection apparatus. Therefore, the S / N ratio of the detection signal can be improved, and the binarization can be easily performed. However, since the optical sensors 25 are installed on the left and right sides, as shown in FIG. 8, the fluorescent light far from the optical sensor is weak, and the fluorescent light near the optical sensor is strongly output. In this case, since the slice level is less likely to be applied during patterning, the left and right outputs are added using the addition circuit as shown in FIG. 9 and the front output is added at the same time to make the whole uniform. .

(Fourth Embodiment) Next, FIGS. 10 and 11 are schematic views showing the structure of a via hole inspection apparatus according to a fourth embodiment of the present invention. 10 and 11, the same reference numerals as those in FIG. 7 indicate the same or corresponding parts. Here, a scanning unit that focuses the laser beam 22 in a spot shape and scans the inspection target 23, and irradiates the scanning laser beam,
Defect detecting means for detecting the fluorescence generated from 23 and detecting a defect in the via hole. Next, a fluorescent light detecting means for detecting the fluorescent light using the light laser 25 from the side surface (sub-scanning direction) of the scanning laser light, and an elliptical reflector 31 at a position relative to the light sensor 25 are provided.
It has a fluorescence introducing means leading to 25.

Next, the operation of the via hole inspection apparatus will be briefly described. Applying the principle of the elliptical reflector 31 that the light collected at the focal point 1 always reflects at the focal point 2, the fluorescent light is collected on the optical sensor 25 on the side surface (sub-scanning direction). Figure
Figure 12 shows an overview of the signal processing system of the via hole inspection system.
The check logic is the same as the conventional logic and will not be described. As described above, in the present embodiment, since the elliptical reflector 31 is configured to be installed on the side surface (sub-scanning direction) of the scanning laser light, it is possible to collect more generated fluorescence,
Binarization can be easily performed by improving the S / N ratio of the detection signal.

[0031]

According to the present invention, it is possible to perform a via hole inspection which can cope with a more complicated inspection rule, and is hardly affected by the warpage of the inspection object and the vertical fluctuation of the mounting stage. The efficiency of fluorescence detection can be improved, more fluorescence can be collected, the S / N ratio of the detection signal can be improved, and binarization can be easily performed.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of a via hole inspection apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram showing a configuration of a via hole inspection apparatus according to a first embodiment of the present invention.

FIG. 3 is a schematic diagram showing a configuration of a via hole inspection apparatus applicable to the present invention.

FIG. 4 is a schematic diagram showing a configuration of a via hole inspection apparatus according to a second embodiment of the present invention.

FIG. 5 is a diagram illustrating the effect of the via hole inspection device shown in FIG.

FIG. 6 is a schematic diagram showing a configuration of a via hole inspection apparatus applicable to the present invention.

FIG. 7 is a schematic diagram showing a configuration of a via hole inspection apparatus according to a third embodiment of the present invention.

8 is a diagram illustrating the output relationship between left and right optical sensors of the via hole inspection device shown in FIG.

FIG. 9 is a diagram illustrating a configuration of an adder circuit according to a third embodiment of the present invention.

FIG. 10 is a schematic diagram showing a configuration of a via hole inspection device according to a fourth embodiment of the present invention.

FIG. 11 is a schematic diagram illustrating a configuration of a via hole inspection device according to a fourth embodiment of the present invention.

FIG. 12 is a diagram illustrating an outline of a signal processing system of the via hole inspection device illustrated in FIGS. 10 and 11;

FIG. 13 is a diagram illustrating an outline of an inspection target.

FIG. 14 is a diagram illustrating an example of a defect generated in a via hole of a thin film layer.

FIG. 15 is a schematic diagram showing a configuration of a conventional via hole inspection device for detecting a defect generated in a thin film layer via hole as shown in FIG.

16 is a diagram illustrating the principle of via hole detection using fluorescence when the via hole inspection device shown in FIG. 15 is used.

17 is a diagram illustrating wavelength characteristics when the via hole inspection device illustrated in FIG. 15 is used.

18 is a diagram illustrating an example of a via-hole detection signal when the via-hole inspection device illustrated in FIG. 15 is used.

19 is a diagram illustrating an example of a fluorescence detection signal binarization circuit when the via hole inspection device illustrated in FIG. 15 is used.

FIG. 20 is a diagram illustrating an example of a conventional via-hole inspection logic.

[Explanation of symbols]

 Reference Signs List 1 via hole presence / absence judgment circuit 2 shape inspection logic circuit 3, 4 area measurement circuit 5 area judgment circuit 6 area ratio calculation circuit 7 defect judgment circuit 8 defect information output means 9 area calculation circuit 10 defect judgment circuit 11 laser beam 12 inspection target 13 Optical sensor 14 Mounting stage 15 Imaging lens 16 Wavelength filter 17 PSD 18 Stage controller 19 Linear PSD 21 Laser light source 22 Laser light 23 Inspection object 24 Moving stage 25 Optical sensor 26 Beam expander 27 Rotating polygon mirror 28 fθ lens 29 Wavelength Filter 30 Mirror 31 Elliptical reflector

Continuation of front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/66

Claims (6)

(57) [Claims] 1. A detection signal acquisition means (1) for acquiring a detection signal due to fluorescence generated from an inspection object having a via hole, and binarizing the fluorescence detection signal to generate first pattern information corresponding to an outer shape of the via hole. A first pattern information acquisition unit (2) for acquiring, and a second pattern information acquisition unit (5) for binarizing the fluorescence detection signal to acquire second pattern information including information on a residue in the via hole. An area measuring means (3, 4) for measuring the area of the first pattern and the area of the second pattern; and determining an arbitrary relationship between the area of the first pattern and the area of the second pattern. Area relation calculating means (6, 9) for calculating; a defect presence / absence determining means (7) for comparing the calculation result with a preset reference value to determine the presence / absence of a defect; Defect information output method to output A via hole inspection device, comprising at least a step (8). 2. The via hole inspection according to claim 1, wherein said area relation calculating means calculates an area ratio between said first pattern area and said second pattern area. apparatus. 3. The via according to claim 1, wherein said area relation calculating means (9) calculates an area difference between said first pattern area and said second pattern area. Hall inspection equipment. 4. An inspection object (1) using a laser beam (11).
In the via-hole inspection device which scans 2) and detects the fluorescent light generated from the inspection target (12) with the optical sensor (13) to perform the inspection, the inspection target (12) can also be moved in the vertical direction. A mounting stage (14), imaging means (15) for imaging the scanning laser light on the inspection object (12) from a direction different from the irradiation angle of the laser light, and only a fluorescent component from the imaging light. A fluorescent component extracting means (16) for extracting, a light position detecting means (17) for detecting a position of a laser beam scanning line on an image forming plane, and a height calculated by calculating an output of the light position detecting means (17) Height / luminance signal acquisition means for acquiring a signal and a luminance signal; height signal output means for outputting the height signal when the acquired intensity of the luminance signal is equal to or higher than a predetermined intensity. The vertical position of the inspection target (12) is always kept substantially constant based on the height signal output. And a stage control means (18) for controlling the mounting stage. 5. Scanning means for converging a laser beam (22) into a spot and scanning the object to be inspected (23), and irradiating the scanning laser beam to generate the light from the object to be inspected (23). A via hole inspection apparatus comprising: defect detection means for detecting fluorescence to detect a defect in a via hole; first fluorescence detection means for detecting fluorescence from both ends of a scanning laser beam using an optical sensor (25); Second fluorescence detection means for detecting fluorescence from the side of the scanning laser light using an optical sensor (25), and optical sensors (25) arranged at both ends of the scanning laser light
A via hole inspection apparatus, comprising: at least output synthesizing means for synthesizing each output of the scanning laser beam and each output of an optical sensor (25) arranged on a side surface of the scanning laser beam. 6. A scanning means for converging a laser beam (22) into a spot and scanning the object to be inspected (23), and irradiating the scanning laser beam to the object to be inspected (2).
3) In a via hole inspection apparatus comprising a defect detection means for detecting a defect in a via hole by detecting fluorescence generated from 3), a fluorescence detection means for detecting the fluorescence from the side of the scanning laser beam using an optical sensor (25). And the elliptical reflector (3
A via hole inspection device, comprising: a fluorescence introducing means for introducing fluorescence to the optical sensor (25) by installing 1).