JPH04248277A - Elastic connector with support layer - Google Patents

Abstract

PURPOSE:To prevent a generation of a poor skew yield and a meandering of an S type layer in the formation work, and to increase the resolution of an obtained connector extremely, by providing an adhesive layer between the S type layer and a support layer. CONSTITUTION:Between an S type layer which consists of conductive elastomer layers 1 and insulating elastomer layers 2, and a support layer 5, an adhesive layer 4 is provided. And as the material of the layer 4, silicone adding type adhesive is used, and as its composition, a substance in the scope of the mol ratio between the Si atom combining hydrogen atom in an organohydrogen polysiloxane and the Si atom combining alkenyl group in an organopolysiloxane including at least two alkenyl groups in a molecule is 0.8/1 to 6/1 is used. As a result, While a poor skew yield in the formation work is prevented, the layer 3 generates no meandering, and the resolution of the obtained connector can be increased extremely.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an elastic connector with a support layer.

0002

BACKGROUND OF THE INVENTION In conventional elastic connectors, a support layer is vulcanized and bonded by press molding to a so-called S-shaped layer made of laminated conductive and insulating elastomers.

0003

[Problems to be Solved by the Invention] In this case, press strain may occur in the S-shaped layer, causing disturbance in the linearity of each layer, resulting in a so-called skew yield defect, and press strain during molding may cause
The mold layer meandered. For this reason, the pitch of the S-type layer is lowered, for example, 5
Even if an attempt was made to achieve a high resolution of 0.1 to 0.6 mm, particularly 0.3 to 0.5 mm by setting the resolution to 500 μm, particularly 30 to 100 μm, this poor skew yield was an obstacle and could not be achieved.

0004

[Means for Solving the Problems] The present invention solves the above-mentioned problems in the prior art, and is based on the present invention, which includes an adhesive layer between a laminate of a conductive elastomer layer and an insulating elastomer layer and a support layer. This is an elastic connector with a special support layer.

That is, instead of press-molding the support layer on the S-type layer and vulcanizing and adhering it, this problem was solved by providing an adhesive layer between the S-type layer and the support layer. The S-type layer, the adhesive layer, the support layer, and the adhesion method will be explained below in sequence with reference to the drawings.

(1) S-type layer As shown in FIGS. 1 and 2, an S-type layer 3 is formed by laminating a conductive elastomer layer 1 and an insulating elastomer layer 2. As the conductive elastomer layer, an elastomer having a volume resistivity of 6 Ω·cm or less, which is made by disposing carbon black and silica filler on silicone rubber, is particularly preferable. As the insulating elastomer, an elastomer made of silicone rubber and silica filler is particularly good, but polyurethane, nitrile rubber and thermoplastic elastomer can also be used.

(2) As the adhesive layer material, condensation type silicone R. T. V. , silicone adhesive varnish, acrylic adhesive (pressure-sensitive adhesive), and other known adhesives and pressure-sensitive adhesives can be used.However, silicone-added adhesives are suitable for the connector of the present invention, and their composition is composed of organohydrogenpolysiloxane. The molar ratio of Si atom-bonded hydrogen atoms and Si atom-bonded anikenyl groups in the organopolysiloxane having at least two alkenyl groups in one molecule is within the range of 0.8/1 to 6/1, or , especially when increasing adhesive strength, 6/1
Use one within the range of 10/1.

[0008] Generally, it is applied by a known method such as roll coating, spraying, or brush coating, but since the S-type layer has irregularities of about 30 μm, the adhesive layer needs to have a thickness of 5 to 10 μm, resulting in poor workability. Considering this, the thickness is preferably 20 to 40 μm. In this way, when the object to be coated is not a continuous body but a rubber plate, screen printing is preferable. The surface on which the adhesive layer is applied may be either the S-type layer or the support layer, but in particular when distortion of the S-type layer is to be avoided, the adhesive layer is applied on the support layer.

(3) Support layer Sponge or solid elastomer is used, preferably silicone rubber, which has excellent compression set characteristics, but generally thermoplastic elastomer can also be used. The thickness of the support layer is 0.1 to 20.0 mm, particularly 1.0 to 5.0 mm.
0 mm is preferred, and the support layer may have a multilayer structure. Considering the distortion of the support layer when applying the adhesive layer and adhering it to the S-shaped layer, the opposite side of the adhesive layer should be covered with a metal plate, plastic plate, steel belt, plastic belt, metal film, plastic film, etc. As such, it is preferable to use a material that is difficult to deform in the direction parallel to the adhesive surface and that can be easily detached from the support layer after bonding the S-type layer and the support layer. In particular, polyester with a thickness of 0.03 to 0.1 mm The support layer, which is held on one side by a film, has excellent workability and removability.

(4) Adhesion method It is necessary to avoid applying pressure as much as possible when bonding and adhering the S-type layer coated with the adhesive layer and the support layer. At normal pressure (760mmHg) 100g/cm2
If more pressure is applied, the S-type layer will deform, so especially 10
It is desirable to bond with a pressure of less than g/cm2. In addition, the S-type layer and support layer are bonded together in a vacuum state (10-1
Torr or less) is desirable in order to prevent air entrainment and deformation, but in consideration of workability, air may be removed in a vacuum after bonding. In this case 1
Air is removed by applying a surface pressure of 10 g/cm2 or less in a vacuum of 0-1 torr or less. After bonding, the adhesive layer is cured under normal pressure or at a temperature of 150° C. or less and a pressure of 10 g/cm 2 or less.

[0011]

[Example] (1) Support layer KE1978A/B “Product name manufactured by Shin-Etsu Chemical Co., Ltd.” (
hardness 20°H), length 350mm, width 300mm
, make a rubber plate with a thickness of 0.97 mm, and one side is 0.1 m thick.
It was held with a polyester film of m thickness.

(2) Application of adhesive to support layer K
E1800TA/TB "Product name manufactured by Shin-Etsu Chemical Co., Ltd."
The adhesive made from
manufactured by Mino Group Co., Ltd., and was coated to a thickness of 30 μm on the surface (350 mm long and 300 mm wide) not supported by the polyester film of the support layer by screen printing. At this time, a 150 mesh stainless steel screen was used. In order to maintain a long pot life, 0.2 part of X-93-500 "trade name manufactured by Shin-Etsu Chemical Co., Ltd." is added to KE1800TA/TB.

(3) Attaching support layer and S-type layer Adhesive was applied to the S-type layer "manufactured by Shin-Etsu Polymer Co., Ltd." with an adhesive pitch of 0.1 mm, length of 290 mm, width of 340 mm, and thickness of 0.3 mm. Paste the support layers from above and below,
Air is removed in a vacuum of -1 torr or less under a surface pressure of 10 g/cm2, followed by 10 g/cm2 and 100 g/cm2.
The adhesive layer was cured by applying pressure for 70 seconds at .degree.

(4) Secondary vulcanization, product size cutting The polyester film holding the support layer is peeled off, secondary vulcanization is performed at 225° C. for 2 hours, the product is cut to a predetermined size, and an adhesive layer is formed. Pitch 0.1mm, length 200
An SS type connector with a support layer "manufactured by Shin-Etsu Polymer Co., Ltd." having a diameter of 5 mm, a height of 5 mm, and a width of 2.3 mm was obtained.

[0015]

[Comparative Example] As a comparative example, a method for manufacturing an elastic connector with a support layer without an adhesive layer is shown below. (1) Support layer
Product name manufactured by Silicone Co., Ltd. (both solid hardness 2)
2.0 parts of a peroxide type vulcanizing agent C-8 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) was added and kneaded. This was spread onto a polyester film with a width of 300 mm and a thickness of 0.1 mm using a calendar roll to a thickness of 1.0 mm.
Sheet it and cut it to a size of 300 mm in length and 350 mm in width.

(2) Attaching the support layer and the S-type layer The support layer was attached to the top and bottom of the S-type layer "manufactured by Shin-Etsu Polymer Co., Ltd." with an adhesive pitch of 0.1 mm, a length of 290 mm, a width of 340 mm, and a thickness of 0.3 mm. Attach from the direction. 300mm
The support layer was vulcanized and the S-shaped layer and the support layer were vulcanized and bonded under the conditions of 200° C. and 2 minutes by setting it in a mold with a cavity size of ×350 mm ×2.3 mm.

(3) Secondary vulcanization, product size cutting The polyester film holding the support layer was peeled off, secondary vulcanization was performed at 225° C. for 2 hours, and the product was cut into predetermined dimensions with a pitch of 0.1 mm. , length 200mm, height 5m
An SS type connector with a support layer "manufactured by Shin-Etsu Polymer Co., Ltd." having a width of 2.3 mm and a width of 2.3 mm was obtained. Sample 10 shows the skew yield and zebra meandering yield in the above examples and comparative examples.
0 and shown in Table 1.

[0018]

[Table 1]

[0019]

[Method for measuring skew yield] When the cut of the predetermined size is made correctly along the conductive elastomer layer,
As shown in a), the conductive layer is not graded. However, when cut obliquely, the cut surface appears slanted as shown in (b), so the dimensions T1 and T2 are measured and θ is calculated according to Equation 1. θ is 1.0° or more.
The skew yield is the percentage of non-defective products expressed as a percentage.

[0020]

[Formula 1]

[0021]

[Method for measuring zebra meandering yield] As shown in Figure 4, the meandering width W of the sheet was measured using an optical microscope, and the meandering width W of 0.15 mm or more was judged as NG. rate.

[0022]

[Effects of the Invention] By providing an adhesive layer between the S-type layer and the support layer as in the above embodiment, the obtained connector can be manufactured without causing poor skew yield or meandering of the S-type layer during molding. It was possible to have extremely high resolution.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a connector of the present invention.

FIG. 2 is a partially enlarged plan view of FIG. 1;

FIG. 3 is an explanatory diagram of the skew yield measuring method, in which (a) shows the case where the yield is 100, and (b) shows the case where the yield is 100 or less.

FIG. 4 is an explanatory diagram of a meandering yield measurement method.

[Explanation of symbols]

1 Conductive elastomer layer, 2 Insulating elastomer layer, 3 S-type layer, 4 Adhesive layer, 5 Support layer.

Claims (1)

[Claims] 1. An elastic connector with a support layer, comprising an adhesive layer between the laminate of a conductive elastomer layer and an insulating elastomer layer and the support layer.