JPH04245657A - Tab tape - Google Patents

Abstract

PURPOSE:To provide a TAB tape for preventing short-circuit between leads due to contact between lead and semiconductor element. CONSTITUTION:A TAB tape is composed of a base film 2, a lead 3 formed on a base film 2 and a semiconductor element 1 and the semiconductor element 1 is joined with a lead 3 through a bump 4. The base film 2 is formed between the semiconductor element 1 and lead 3 up to the proximity of the bump 4 as shown in Fig. 1. This base film 2 prevents contactness between the semiconductor element 1 and lead 3.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB tape in which leads formed on a base film are bonded to electrodes of a semiconductor element via bumps.

0002

[Prior Art] Compared to other mounting methods, TAB tape has
For example, it has excellent features such as being able to cope with increasing the number of pins in semiconductor devices and reducing the electrode pitch. Figures 6 and 7
FIG. 2 is a schematic partial side view for explaining a conventional TAB tape. TAB tape has leads 3 formed in the form of extremely thin foil, so for example, ILB (ILB).
During lead bonding), the leads 3 may be deformed, causing the leads 3 and the semiconductor element 1 to come into contact as shown in FIG. 6, resulting in a short circuit between the leads 3. Therefore, in the conventional TAB tape, when the semiconductor element 1 and the leads 3 are bonded via the bumps 4, the leads 3 are simultaneously formed mechanically as shown in FIG. 7, or when the two come into contact. By applying an insulating material to the likely part of the semiconductor element 1 or lead 3,
contact with the semiconductor element 1 was prevented.

0003

[Problems to be Solved by the Invention] However, the former method of mechanically forming the leads 3 has a problem in that the leads are damaged during forming, and the latter method of applying an insulating material However, a new process is required to apply the insulating material, which not only increases costs but also reduces yield.

The present invention has been made based on the above circumstances, and an object of the present invention is to provide a TAB tape that can prevent short circuits between leads due to contact between the leads and a semiconductor element.

[0005]

[Means for Solving the Problems] To achieve the above object, the present invention includes a base film, a lead formed on the base film, and a semiconductor element bonded to the lead via a bump. The TAB tape is characterized in that the base film is interposed between the semiconductor element and the lead. Further, it is preferable that cutouts be formed at the four corners of the base film facing the semiconductor element so that the four corners of the semiconductor element do not face the base film.

[0006]

[Function] The present invention has the above-described structure, and by interposing a base film between the semiconductor element and the leads,
Since the base film serves as an insulating material, it prevents short circuits between the leads due to contact between the semiconductor element and the leads, and also prevents deterioration in the strength of the leads. Furthermore, cutouts are formed at the four corners of the base film facing the semiconductor element so that the four corners of the semiconductor element do not face the base film, so that the four corners of the semiconductor element do not come into contact with the base film. Therefore, stress generated between the semiconductor element and the base film can be alleviated.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic partial side view of a TAB tape that is an embodiment of the present invention. The TAB tape shown in FIG. 1 includes a base film 2, leads 3 formed on the base film 2, and a semiconductor element 1, and the semiconductor element 1 and the leads 3 are bonded via bumps 4. Also,
A base film 2 is formed between the semiconductor element 1 and the leads 3 up to the bumps 4, as shown in FIG. That is, in this embodiment, the device hole 5 is formed so that the edge portion along the four sides of the device hole 5 of the base film 2 is located above the edge portion of the four sides of the semiconductor element 1 in FIG.

[0008] This embodiment has the above configuration, so that
Since the base film 2 is interposed between the semiconductor element 1 and the leads 3, contact between the semiconductor element 1 and the leads 3 can be prevented, and short circuit between the leads 3 due to contact between the two can be prevented. . Further, since no deformation is applied to the leads 3 themselves, there is no fear that the leads 3 will be damaged. Furthermore, in this embodiment, the shape of the device hose 5 can be formed to be slightly smaller than that of the conventional one in the process of forming the base film 2, and no special process or equipment is required. Therefore, the TAB tape of this embodiment can be realized at a lower cost and more easily than the conventional tape.

FIGS. 2 and 3 are diagrams showing a modification of this embodiment. In the above embodiment, if the thickness of the base film 2 is the same or smaller than the distance between the semiconductor element 1 and the lead 3 (the size of the pump 4), There is no problem, but if the thickness of the base film 2 is larger than the distance, if the semiconductor element 1 and the leads 3 are bonded as they are, extra stress will be applied to the leads 3, and the leads 3 may break. There is a possibility that Therefore, if the thickness of the base film 2 is greater than the distance between the semiconductor element 1 and the lead 3, as shown in FIG.
As shown in FIG. 2, the edge of the base film 2 on the side of the device hole 5 is formed to be inclined, and the base film 2 is formed such that the inclined edge is located on the edge of the semiconductor element 1. Alternatively, as shown in FIG. 3, a step is formed on the edge of the base film 2 on the side of the device hole 5, and the base film 2 is placed so that the edge with the step formed is located above the edge of the semiconductor element 1. form. By forming the leads 3 as shown in FIG. 2 or 3, even when the thickness of the base film 2 is larger than the distance between the semiconductor element 1 and the leads 3, the leads 3 can be prevented from being disconnected or stressed. The base film 2 can be interposed between the semiconductor element 1 and the leads 3 to bond them. Therefore, even in such a case, bonding between the two becomes easy and high reliability is also improved.

FIG. 4 is a schematic partial plan view showing one corner of the device hole of the TAB tape according to this embodiment, and FIG. 5 is a schematic partial side view thereof. As shown in FIGS. 4 and 5, by forming cutouts 6 at the four corners of the device hole 5 of the TAB tape, the semiconductor element 1 and the base film 2 are
Unnecessary contact with the person can be prevented. therefore,
Even when the semiconductor element 1 and the base film 2 are in contact with each other, stress generated at the four corners of both can be alleviated.

[0011] In the above embodiment, a case has been described in which cutouts 6 are formed at the four corners of the base film 2, but the present invention is not limited to this, and the cutouts 6 are formed at the four corners of the semiconductor element 1. By forming a cutout or a recess, the four corners of the semiconductor element may be prevented from coming into contact with the base film.

0012

[Effects of the Invention] As explained above, according to the present invention, contact between the semiconductor element and the leads can be prevented by interposing the base film between the semiconductor element and the leads. It is possible to improve reliability and workability compared to TAB tape, and to provide inexpensive TAB tape.

[Brief explanation of the drawing]

FIG. 1 is a schematic partial side view of a TAB tape that is an embodiment of the present invention.

FIG. 2 is a diagram showing a modified example of the TAB tape, which is an embodiment of the present invention.

FIG. 3 is a diagram showing another modification of the TAB tape which is an embodiment of the present invention.

FIG. 4 is a schematic partial plan view showing one corner of the device hole of the TAB tape according to this embodiment.

FIG. 5 is a schematic partial side view showing one corner of the device hole of the TAB tape according to this embodiment.

FIG. 6 is a schematic partial side view showing contact between a lead and a semiconductor element in a conventional TAB tape.

FIG. 7 is a diagram showing a state in which leads are mechanically formed in a conventional TAB tape.

[Explanation of symbols]

1 Semiconductor device 2 Base film 3 Lead 4 Bump 5 Device hole 6 Notch

Claims (2)

[Claims] 1. A TAB tape comprising a base film, a lead formed on the base film, and a semiconductor element bonded to the lead via a bump, wherein the A TAB tape characterized by having a structure in which a base film is interposed. 2. The semiconductor device according to claim 1, wherein notches are formed at four corners of the base film facing the semiconductor element, and the four corners of the semiconductor element are configured not to face the base film. TAB tape.