JPH04244280A - Washing treatment of rosin type solder flux using non-halogen type rosin type solder flux detergent - Google Patents
Washing treatment of rosin type solder flux using non-halogen type rosin type solder flux detergentInfo
- Publication number
- JPH04244280A JPH04244280A JP1380691A JP1380691A JPH04244280A JP H04244280 A JPH04244280 A JP H04244280A JP 1380691 A JP1380691 A JP 1380691A JP 1380691 A JP1380691 A JP 1380691A JP H04244280 A JPH04244280 A JP H04244280A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- rosin
- solder flux
- halogen
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims abstract description 46
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 24
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 title claims abstract description 21
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 title claims abstract description 21
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229910052736 halogen Inorganic materials 0.000 title claims abstract description 18
- 150000002367 halogens Chemical class 0.000 title claims abstract description 18
- 239000003599 detergent Substances 0.000 title abstract description 9
- 238000005406 washing Methods 0.000 title abstract description 6
- 238000011282 treatment Methods 0.000 title abstract description 4
- 238000000034 method Methods 0.000 claims abstract description 33
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000012459 cleaning agent Substances 0.000 claims description 43
- 238000004140 cleaning Methods 0.000 claims description 26
- -1 glycol ether compound Chemical class 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000002736 nonionic surfactant Substances 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 12
- 239000004094 surface-active agent Substances 0.000 claims description 9
- 229910019142 PO4 Inorganic materials 0.000 claims description 6
- 239000010452 phosphate Substances 0.000 claims description 6
- 239000004480 active ingredient Substances 0.000 claims description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical group CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 13
- 238000001035 drying Methods 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 238000004065 wastewater treatment Methods 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 7
- 229920001223 polyethylene glycol Polymers 0.000 description 7
- 239000002202 Polyethylene glycol Substances 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000003945 anionic surfactant Substances 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 238000010835 comparative analysis Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000007127 saponification reaction Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- ROVMKEZVKFJNBD-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,5,5,5-undecafluoro-4-(trifluoromethyl)pentane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(C(F)(F)F)C(F)(F)F ROVMKEZVKFJNBD-UHFFFAOYSA-N 0.000 description 1
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 1
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- RKIMETXDACNTIE-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6-dodecafluorocyclohexane Chemical compound FC1(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C1(F)F RKIMETXDACNTIE-UHFFFAOYSA-N 0.000 description 1
- QIROQPWSJUXOJC-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6-undecafluoro-6-(trifluoromethyl)cyclohexane Chemical compound FC(F)(F)C1(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C1(F)F QIROQPWSJUXOJC-UHFFFAOYSA-N 0.000 description 1
- QCNZRFLQCBZYMO-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCCCC QCNZRFLQCBZYMO-UHFFFAOYSA-N 0.000 description 1
- VXVGKMGIPAWMJC-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCC VXVGKMGIPAWMJC-UHFFFAOYSA-N 0.000 description 1
- HQDGQKLBDFTNEM-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCC HQDGQKLBDFTNEM-UHFFFAOYSA-N 0.000 description 1
- PXQCQQARRAYIFS-UHFFFAOYSA-N 1-[2-(2-ethoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCC PXQCQQARRAYIFS-UHFFFAOYSA-N 0.000 description 1
- HYLLZXPMJRMUHH-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOC HYLLZXPMJRMUHH-UHFFFAOYSA-N 0.000 description 1
- YXOUPUFJBBFWNL-UHFFFAOYSA-N 1-[2-(2-pentoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCCCCC YXOUPUFJBBFWNL-UHFFFAOYSA-N 0.000 description 1
- GNVFCWJZMJINCS-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCC GNVFCWJZMJINCS-UHFFFAOYSA-N 0.000 description 1
- CWXNQBGBKAMLPP-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]pentane Chemical compound CCCCCOCCOCCOCCC CWXNQBGBKAMLPP-UHFFFAOYSA-N 0.000 description 1
- BOGFHOWTVGAYFK-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCCC BOGFHOWTVGAYFK-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- PSQZJKGXDGNDFP-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropan-1-ol Chemical compound OCC(F)(F)C(F)(F)F PSQZJKGXDGNDFP-UHFFFAOYSA-N 0.000 description 1
- JUGSKHLZINSXPQ-UHFFFAOYSA-N 2,2,3,3,4,4,5,5-octafluoropentan-1-ol Chemical compound OCC(F)(F)C(F)(F)C(F)(F)C(F)F JUGSKHLZINSXPQ-UHFFFAOYSA-N 0.000 description 1
- NBUKAOOFKZFCGD-UHFFFAOYSA-N 2,2,3,3-tetrafluoropropan-1-ol Chemical compound OCC(F)(F)C(F)F NBUKAOOFKZFCGD-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- PWTNRNHDJZLBCD-UHFFFAOYSA-N 2-(2-pentoxyethoxy)ethanol Chemical compound CCCCCOCCOCCO PWTNRNHDJZLBCD-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- LSCNICLUNGUIRB-SNVBAGLBSA-N 2-[2-[(2R)-2-methylpentoxy]ethoxy]ethanol Chemical compound CCC[C@@H](C)COCCOCCO LSCNICLUNGUIRB-SNVBAGLBSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- LOQGSOTUHASIHI-UHFFFAOYSA-N perfluoro-1,3-dimethylcyclohexane Chemical compound FC(F)(F)C1(F)C(F)(F)C(F)(F)C(F)(F)C(F)(C(F)(F)F)C1(F)F LOQGSOTUHASIHI-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000012487 rinsing solution Substances 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、非ハロゲン系のロジン
系ハンダフラックス洗浄剤を用いた該フラックスの洗浄
処理方法に関する。更に詳しくは、該洗浄剤および特定
のすすぎ剤を用いてなることを特徴とする洗浄性に優れ
しかも加熱乾燥工程や排水処理工程を省略しうるロジン
系ハンダフラックスについての新規な洗浄処理方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cleaning flux using a non-halogen rosin solder flux cleaning agent. More specifically, the present invention relates to a novel cleaning method for rosin-based solder flux that uses the cleaning agent and a specific rinsing agent and has excellent cleaning properties and can omit a heating drying step and a wastewater treatment step.
【0002】0002
【従来の技術】ロジン系ハンダフラックスはプリント回
路板やプリント配線基板などのモジュールの製作にあた
って使用される。ハンダ処理の目的は、一般は基板と入
出力ピンとの接着強度を高めたり、接点の酸化を防止し
て導電性を維持するためであり、かかるハンダ処理の実
効を図らんとしてハンダ付けに際してロジン系ハンダフ
ラックスが使用される。ハンダ付け終了後は、基板面か
らフラックスのみを選択的にしかも完全に除去すべく洗
浄剤が使用される。すなわち、フラックスの洗浄が不充
分である場合には、残留フラックスによる悪影響として
、回路腐食が起こったり、あるいは基板表面の電気絶縁
性が低下し、最終的には回路破損につながるという不利
がある。そのため、洗浄剤を使用して、残留フラックス
、特にそれに含有されている活性剤成分を除去すること
により、前記不利を解消している。2. Description of the Related Art Rosin-based solder flux is used in the production of modules such as printed circuit boards and printed wiring boards. The purpose of soldering is generally to increase the adhesive strength between the board and the input/output pins, and to prevent oxidation of the contacts and maintain conductivity.In order to make the soldering process more effective, rosin-based Solder flux is used. After soldering, a cleaning agent is used to selectively and completely remove flux from the board surface. That is, if the cleaning of the flux is insufficient, there is a disadvantage that the residual flux causes circuit corrosion, or the electrical insulation of the substrate surface decreases, which ultimately leads to circuit damage. Therefore, the above-mentioned disadvantages are overcome by using detergents to remove the residual flux, especially the activator components contained therein.
【0003】従来、ロジン系ハンダフラックスの洗浄剤
としてはトリクロロエチレン、トリクロロトリフルオロ
エタン等のいわゆるフロン等のハロゲン化炭化水素溶剤
が使用されている。該ハロゲン系の洗浄剤については、
それ自体不燃性でありかつ乾燥性に優れるという利点を
有するものの、オゾン層破壊などの環境汚染の問題から
、それらの使用規制が本格化されつつあり、電機業界に
おいてもいわゆるフロン代替のハンダフラックスの洗浄
剤の開発が急務となってきた。Conventionally, halogenated hydrocarbon solvents such as so-called chlorofluorocarbons such as trichlorethylene and trichlorotrifluoroethane have been used as cleaning agents for rosin-based solder flux. Regarding the halogen-based cleaning agent,
Although they themselves have the advantage of being nonflammable and having excellent drying properties, due to environmental pollution problems such as ozone layer depletion, their use is being strictly regulated. The development of cleaning agents has become an urgent need.
【0004】かかる状況を受けて近時、非ハロゲン系の
ハンダフラックス洗浄剤、例えばケン化型、炭化水素溶
剤型、高級アルコール型など種々のものが開発され上市
されつつあるが、従来のフロンなどに比べて一長一短が
ある。例えば、アルカリケン化型の場合には、水溶液タ
イプであるため引火性の問題はないが、洗浄に際し加熱
下に長時間の液接触せしめることが必要となり洗浄効率
が低いこと、更には基板の金属部の腐食が懸念されるな
どの不利がある。一方、炭化水素溶剤型、高級アルコー
ル型などの洗浄剤の場合には、洗浄力、毒性、臭気、引
火性などのすべての要求性能を完全に満足しうるものは
いまだ見い出されていないのが現状である。In response to this situation, various non-halogen solder flux cleaning agents, such as saponification type, hydrocarbon solvent type, and higher alcohol type, have recently been developed and are being put on the market. There are advantages and disadvantages compared to . For example, in the case of alkaline saponification type, there is no problem of flammability because it is an aqueous solution type, but when cleaning, it is necessary to contact the liquid for a long time under heating, resulting in low cleaning efficiency. There are disadvantages such as concerns about corrosion of the parts. On the other hand, in the case of cleaning agents such as hydrocarbon solvent type and higher alcohol type, no one has yet been found that completely satisfies all required performance such as cleaning power, toxicity, odor, and flammability. It is.
【0005】ところで、本発明者らは前記問題を解決す
べく鋭意検討を重ねた結果、特定のグリコールエーテル
系化合物とノニオン性界面活性剤および水を必須成分と
してなる混合物、更にはこれら成分に加えてポリオキシ
アルキレンリン酸エステル系界面活性剤を必須成分とし
てなる混合物を使用した場合には、前記課題を解決しう
ることを見出した。すなわち、洗浄力に優れ、しかも環
境特性、臭気、引火性などの点でも実質上満足しうる非
ハロゲン系のハンダフラックス洗浄剤、ならびに該洗浄
剤を用いる洗浄方法に係る発明を完成し、すでに特許出
願を行った。By the way, the inventors of the present invention have made extensive studies to solve the above problem, and have found that a mixture containing a specific glycol ether compound, a nonionic surfactant, and water as essential components, and a mixture containing a specific glycol ether compound, a nonionic surfactant, and water as essential components, It has been found that the above problems can be solved when a mixture containing a polyoxyalkylene phosphate surfactant as an essential component is used. That is, we have completed an invention related to a non-halogen solder flux cleaning agent that has excellent cleaning power and is substantially satisfactory in terms of environmental characteristics, odor, flammability, etc., as well as a cleaning method using the cleaning agent, and have already obtained a patent. I filed an application.
【0006】しかし、これら各種のフロン代替洗浄剤は
、いずれも水すすぎの工程が必須となる。水すすぎ処理
により優れた清浄度の被洗浄物が収得されるものの、反
面では既存の洗浄装置をそのままでは採用し難いという
課題がある。すなわち、水すすぎ工程に付随して、引き
続き加熱乾燥工程や排水処理工程が必要となるため洗浄
装置の仕様変更を伴う。[0006] However, all of these various fluorocarbon alternative cleaning agents require a water rinsing step. Although the water rinsing process yields objects to be cleaned with excellent cleanliness, there is a problem in that it is difficult to use existing cleaning equipment as is. That is, in addition to the water rinsing process, a heating drying process and a waste water treatment process are required, which necessitates a change in the specifications of the cleaning device.
【0007】[0007]
【発明が解決しようとする課題】本発明は、フロン代替
の新規洗浄剤である非ハロゲン系のロジン系ハンダフラ
ックス洗浄剤を使用して該フラックスの洗浄を行うに当
たり、高度の洗浄性を維持し、しかも従来の洗浄装置を
そのまま使用しうる洗浄処理方法を提供することを目的
とする。すなわち、非ハロゲン系のロジン系ハンダフラ
ックス洗浄剤の使用を前提としつつ、しかも水すすぎ操
作に由来する付着水除去のための加熱乾燥工程や排水処
理工程を省略することのできる新規な洗浄処理方法を提
供することを目的とする。[Problems to be Solved by the Invention] The present invention maintains a high level of cleaning performance when cleaning flux using a non-halogen-based rosin-based solder flux cleaning agent, which is a new cleaning agent that replaces fluorocarbons. Moreover, it is an object of the present invention to provide a cleaning processing method that can use conventional cleaning equipment as is. In other words, this is a new cleaning method that is based on the use of a non-halogen rosin solder flux cleaning agent, and which can omit the heating drying process and waste water treatment process for removing adhered water resulting from the water rinsing operation. The purpose is to provide
【0008】[0008]
【課題を解決するための手段】本発明者らは前記目的を
達成すべく鋭意検討を重ねた結果、フロン代替の新規洗
浄剤である非ハロゲン系のロジン系ハンダフラックス洗
浄剤と特定のすすぎ剤を併用する洗浄およびすすぎ処理
方法を適用することにより、前記課題をことごとく解決
しうることを見出し、本発明を完成するに至った。[Means for Solving the Problem] As a result of intensive studies to achieve the above object, the present inventors have developed a non-halogen rosin-based solder flux cleaning agent, which is a new cleaning agent that replaces fluorocarbons, and a specific rinsing agent. The present inventors have discovered that all of the above problems can be solved by applying a cleaning and rinsing method that uses the above methods in combination, and have completed the present invention.
【0009】すなわち本発明は、ロジン系ハンダフラッ
クスが付着した被処理物に非ハロゲン系の該フラックス
洗浄剤を洗浄槽内で接触せしめ被処理物より該フラック
スを洗浄除去し、次いですすぎ槽内においてフルオロカ
ーボンを被処理物に接触せしめることを特徴とする非ハ
ロゲン系のロジン系ハンダフラックス洗浄剤を用いてな
る該フラックスの洗浄処理方法に係る。That is, in the present invention, a non-halogenated flux cleaning agent is brought into contact with a workpiece to which rosin-based solder flux has adhered in a cleaning tank to wash and remove the flux from the workpiece, and then the flux is removed in a rinsing tank. The present invention relates to a flux cleaning method using a non-halogen rosin solder flux cleaning agent, which is characterized by bringing fluorocarbon into contact with an object to be treated.
【0010】本発明においてロジン系ハンダフラックス
の洗浄剤としては、特に制限されず従来公知の非ハロゲ
ン系洗浄剤を使用できる。例えばリモネン、テトラリン
、デカン、ドデカンなどの炭化水素系溶剤と各種界面活
性剤との混合物、グリコールエーテル系化合物と界面活
性剤との混合物、これら混合物と水との混合物などを種
々例示できる。好ましい組成としては、例えばグリコー
ルエーテル系化合物、ノニオン性界面活性剤および水か
らなる混合物、あるいはグリコールエーテル系化合物、
ノニオン性界面活性剤、ポリオキシアルキレンリン酸エ
ステル系界面活性剤および水からなる非引火性かつ非ハ
ロゲン系洗浄剤が該当する。In the present invention, the cleaning agent for the rosin solder flux is not particularly limited, and conventionally known non-halogen cleaning agents can be used. For example, various examples include mixtures of hydrocarbon solvents such as limonene, tetralin, decane, and dodecane and various surfactants, mixtures of glycol ether compounds and surfactants, and mixtures of these mixtures and water. Preferred compositions include, for example, a mixture of a glycol ether compound, a nonionic surfactant and water, or a glycol ether compound,
This includes non-flammable and non-halogen cleaning agents consisting of a nonionic surfactant, a polyoxyalkylene phosphate surfactant, and water.
【0011】以下、前記の好適洗浄剤を代表させて該洗
浄剤の成分につき以下詳述する。前記一般式(1)で表
されるグリコールエーテル系化合物としては、ジエチレ
ングリコールモノメチルエーテル、ジエチレングリコー
ルジメチルエーテル、ジエチレングリコールモノエチル
エーテル、ジエチレングリコールジエチルエーテル、ジ
エチレングリコールメチルエチルエーテル、ジエチレン
グリコールモノプロピルエーテル、ジエチレングリコー
ルジプロピルエーテル、ジエチレングリコールメチルプ
ロピルエーテル、ジエチレングリコールエチルプロピル
エーテル、ジエチレングリコールモノブチルエーテル、
ジエチレングリコールジブチルエーテル、ジエチレング
リコールメチルブチルエーテル、ジエチレングリコール
エチルブチルエーテル、ジエチレングリコールプロピル
ブチルエーテル、ジエチレングリコールモノペンチルエ
ーテル、ジエチレングリコールジペンチルエーテル、ジ
エチレングリコールメチルペンチルエーテル、ジエチレ
ングリコールエチルペンチルエーテル、ジエチレングリ
コールプロピルペンチルエーテル、ジエチレングリコー
ルブチルペンチルエーテル;これらに対応するトリ−も
しくはテトラエチレングリコールエーテル類;これらに
対応するジ−、トリ−もしくはテトラプロピレングリコ
ールエーテル類を例示できる。これら化合物は単独でま
たは2種以上を適宜組み合せて使用できる。[0011] Hereinafter, the components of the above-mentioned preferred cleaning agent will be explained in detail as representative examples. Examples of the glycol ether compounds represented by the general formula (1) include diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol monopropyl ether, diethylene glycol dipropyl ether, and diethylene glycol methyl. Propyl ether, diethylene glycol ethyl propyl ether, diethylene glycol monobutyl ether,
Diethylene glycol dibutyl ether, diethylene glycol methyl butyl ether, diethylene glycol ethyl butyl ether, diethylene glycol propyl butyl ether, diethylene glycol monopentyl ether, diethylene glycol dipentyl ether, diethylene glycol methyl pentyl ether, diethylene glycol ethyl pentyl ether, diethylene glycol propyl pentyl ether, diethylene glycol butyl pentyl ether; - or tetraethylene glycol ethers; di-, tri-, or tetrapropylene glycol ethers corresponding to these can be exemplified. These compounds can be used alone or in an appropriate combination of two or more.
【0012】前記好適洗浄剤の成分のうち、ノニオン性
界面活性剤としては、そのイオン性がノニオン性である
限り特に制限はなく、各種公知のものを採用しうる。そ
の具体例としては、ポリオキシエチレンアルキル(C6
<)エーテル、ポリオキシエチレンフェノールエーテル
、ポリオキシエチレンアルキルフェノールエーテルなど
のポリエチレングリコールエーテル型ノニオン性界面活
性剤;ポリエチレングリコールモノエステル、ポリエチ
レングリコールジエステルなどのポリエチレングリコー
ルエステル型ノニオン性界面活性剤;高級脂肪族アミン
のエチレンオキサイド付加物;脂肪酸アミドのエチレン
オキサイド付加物;ソルビタン脂肪酸エステル、ショ糖
脂肪酸エステルなどの多価アルコール型ノニオン性界面
活性剤;脂肪酸アルカノールアミドなど、更にはこれら
に対応するポリオキシプロピレン系ノニオン性界面活性
剤およびポリオキシエチレンポリオキシプロピレン共重
合型ノニオン性界面活性剤をあげることができる。これ
らノニオン性界面活性剤は1種単独でまたは2種以上組
合せて使用できる。これらのうち、洗浄力の点から好ま
しいものとしては、ポリエチレングリコールエーテル型
ノニオン性界面活性剤であり、更に好ましいものとして
は下記一般式(2)で表されるものが該当する。Among the components of the preferred detergent, the nonionic surfactant is not particularly limited as long as its ionicity is nonionic, and various known surfactants may be used. A specific example is polyoxyethylene alkyl (C6
<) Polyethylene glycol ether type nonionic surfactants such as ether, polyoxyethylene phenol ether, and polyoxyethylene alkyl phenol ether; Polyethylene glycol ester type nonionic surfactants such as polyethylene glycol monoester and polyethylene glycol diester; Higher aliphatic Ethylene oxide adducts of amines; ethylene oxide adducts of fatty acid amides; polyhydric alcohol-type nonionic surfactants such as sorbitan fatty acid esters and sucrose fatty acid esters; fatty acid alkanolamides, etc., and polyoxypropylene-based products corresponding to these. Examples include nonionic surfactants and polyoxyethylene polyoxypropylene copolymer type nonionic surfactants. These nonionic surfactants can be used alone or in combination of two or more. Among these, polyethylene glycol ether type nonionic surfactants are preferred from the viewpoint of detergency, and those represented by the following general formula (2) are more preferred.
【0013】[0013]
【化2】[Case 2]
【0014】前記リン酸エステル系アニオン性界面活性
剤としては各種公知のリン酸エステル系アニオン性界面
活性剤を制限なく使用しうるが、好ましくは下記一般式
(3)で表されるものが該当する。[0014] As the phosphate ester type anionic surfactant, various known phosphate ester type anionic surfactants can be used without limitation, but those represented by the following general formula (3) are preferable. do.
【0015】[0015]
【化3】
で表される界面活性剤またはその塩である。かかる塩と
してはナトリウム塩、カリウム塩などの金属塩、アンモ
ニウム塩、アルカノールアミン塩などを例示できる。な
お、前記一般式(3)で表されるリン酸エステル系アニ
オン性界面活性剤またはその塩としては、各種市販品が
あり、例えば第一工業製薬株式会社製の「プライサーフ
」シリーズ、日本乳化剤株式会社製の「N−1000F
CP」、「RA−574」、「RA−579」などが例
示できる。It is a surfactant represented by the following formula or a salt thereof. Examples of such salts include metal salts such as sodium salts and potassium salts, ammonium salts, and alkanolamine salts. There are various commercially available phosphoric acid ester-based anionic surfactants represented by the general formula (3) or their salts, such as the "Plysurf" series manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd., Nippon Nyukazai, etc. "N-1000F" manufactured by Co., Ltd.
Examples include "CP", "RA-574", and "RA-579".
【0016】前記グリコールエーテル系化合物とノニオ
ン性界面活性剤とポリオキシリン酸エステル系界面活性
剤との使用割合は、特に制限はされないが、通常は順に
10〜95重量% 程度: 5〜90重量% 程度:
0.1〜90重量% 程度であり、好ましくは順に50
〜90重量% 程度:10〜60重量% 程度:0.5
〜60重量% 程度である。The proportions of the glycol ether compound, nonionic surfactant, and polyoxyphosphate ester surfactant used are not particularly limited, but are usually about 10 to 95% by weight: about 5 to 90% by weight. :
About 0.1 to 90% by weight, preferably 50% by weight
~90% by weight: 10-60% by weight: 0.5
It is about 60% by weight.
【0017】本発明において、すすぎ剤であるフルオロ
カーボンとしては各種公知のフルオロカーボンを制限な
く使用でき、例えば2,2,3,3−テトラフルオロ−
1−プロパノール、パーフルオロ−2−メチルペンタン
、パーフルオロシクロヘキサン、パーフルオロメチルシ
クロヘキサン、パーフルオロ−1,3−ジメチルシクロ
ヘキサン、2,2,3,3,4,4,5,5−オクタフ
ルオロ−1−ペンタノール、1,1,1,3,3,3−
ヘキサフルオロ−2−プロパノール、2,2,3,3,
4,4−ヘキサフルオロブタノール、5−フッ化プロパ
ノール(ペンタフルオロプロピルアルコール)を例示で
きる。これらのうち、非引火性、環境特性面からは5−
フッ化プロパノールが最適である。なお、5−フッ化プ
ロパノールの市販品としてはダイキン工業株式会社製の
「ペフォールTM5P」を例示できる。[0017] In the present invention, various known fluorocarbons can be used without limitation as the fluorocarbon rinsing agent, such as 2,2,3,3-tetrafluoro-
1-propanol, perfluoro-2-methylpentane, perfluorocyclohexane, perfluoromethylcyclohexane, perfluoro-1,3-dimethylcyclohexane, 2,2,3,3,4,4,5,5-octafluoro- 1-pentanol, 1,1,1,3,3,3-
Hexafluoro-2-propanol, 2,2,3,3,
Examples include 4,4-hexafluorobutanol and 5-fluorinated propanol (pentafluoropropyl alcohol). Among these, 5-
Fluorinated propanol is best. In addition, as a commercial product of 5-fluorinated propanol, "Pefol TM5P" manufactured by Daikin Industries, Ltd. can be exemplified.
【0018】本発明の洗浄剤を基板上のロジンフラック
スに接触させるには以下の手段を採用しうる。例えば、
グリコールエーテル系化合物、ノニオン性界面活性剤、
およびポリオキシリン酸エステル系界面活性剤からなる
洗浄剤を使用する場合には、該洗浄剤をそのままでまた
は水で溶解して、有効成分の濃度が通常100〜10重
量% 程度となるよう調整する。かくして得られた水溶
液または有効成分そのものに被処理剤である例えば基板
を直接浸漬して洗浄する方法、該水溶液をスプレー装置
を使用してフラッシュする方法、機械的手段によりブラ
ッシングする方法、超音波洗浄方法などの各種方法から
適宜に選択して採用することができる。The following means can be employed to bring the cleaning agent of the present invention into contact with the rosin flux on the substrate. for example,
Glycol ether compounds, nonionic surfactants,
When using a cleaning agent comprising a polyoxyphosphate surfactant, the cleaning agent is adjusted as it is or dissolved in water so that the concentration of the active ingredient is usually about 100 to 10% by weight. A method of directly immersing the treated agent, for example, a substrate, in the thus obtained aqueous solution or the active ingredient itself for cleaning, a method of flushing the aqueous solution using a spray device, a method of brushing by mechanical means, and an ultrasonic cleaning method. It is possible to appropriately select and employ various methods such as the above method.
【0019】本発明において洗浄剤を適用する際の条件
としては、洗浄剤中の有効成分の濃度、該成分の使用比
率、除去すべきフラックスの種類等により適宜選択すれ
ば良く、一般に除去すべきフラックスを洗浄除去するの
に有効な温度と時間で洗浄剤をフラックスに接触させる
。洗浄剤の使用時の温度は室温程度から80℃程度であ
り、通常、50〜70℃程度とするのが好ましい。基板
上のハンダフラックスを、例えば60℃程度の温度にお
いて浸漬法により除去する場合、一般には本発明の洗浄
剤にハンダフラックスを有する基板を約1〜5分程度浸
漬すれば、良好に除去することができる。Conditions for applying the cleaning agent in the present invention may be appropriately selected depending on the concentration of the active ingredient in the cleaning agent, the usage ratio of the ingredient, the type of flux to be removed, etc. The cleaning agent is contacted with the flux at a temperature and time effective to wash away the flux. The temperature during use of the cleaning agent is about room temperature to about 80°C, and usually preferably about 50 to 70°C. When removing solder flux on a substrate by a dipping method at a temperature of about 60° C., for example, the solder flux can be removed satisfactorily by immersing the substrate with solder flux in the cleaning agent of the present invention for about 1 to 5 minutes. Can be done.
【0020】こうしてフラックスを除去された基板は、
次いですすぎ剤であるフルオロカーボンと接触させるこ
とにより、残留している可能性のある洗浄剤を完全除去
する。すすぎ剤を使用する際の条件としては、基板を直
接浸漬する方法あるいは、すすぎ剤をスプレー装置を用
いてフラッシュする方法、超音波を照射する方法、すす
ぎ剤の蒸気を用いる方法等のうち少なくとも一つの方法
を採用することにより有効にすすぎ処理を行うことがで
きる。すすぎ剤を使用する際の温度としては室温程度か
ら80℃程度であり、通常浸漬、あるいはスプレー等の
方法を使用するのであれば室温から50℃程度とするの
が好ましい。例えば40℃程度の温度において浸漬法に
よりすすぎ処理を行うのであれば、一般には基板を30
秒〜3分程度浸漬すれば、良好にすすぎ処理を行うこと
ができる。すすぎ処理に際しては単一のすすぎ槽を使用
する場合のほか、複数のすすぎ槽を使用することも出来
、処理コスト、処理時間、すすぎ液寿命などを勘案して
適宜仕様を決定すれば足りる。なお、すすぎ剤を使用す
る前に水洗を行い、次いですすぎ剤により水切りを行う
ことも可能である。The substrate from which the flux has been removed in this way is
Any remaining cleaning agent is then completely removed by contacting it with a fluorocarbon rinsing agent. The conditions for using the rinsing agent include at least one of the following methods: directly immersing the substrate, flashing the rinsing agent using a spray device, irradiating ultrasonic waves, and using vapor from the rinsing agent. By adopting two methods, rinsing treatment can be performed effectively. The temperature when using the rinsing agent is from about room temperature to about 80°C, and if a method such as dipping or spraying is used, it is preferably from room temperature to about 50°C. For example, if rinsing is performed by dipping at a temperature of about 40°C, the substrate is generally rinsed at 30°C.
If immersed for about 2 to 3 minutes, the rinsing process can be performed satisfactorily. For rinsing, in addition to using a single rinsing tank, multiple rinsing tanks can be used, and it is sufficient to determine the specifications as appropriate, taking into account processing costs, processing time, rinsing solution life, etc. In addition, it is also possible to perform washing with water before using the rinsing agent, and then drain the water with the rinsing agent.
【0021】[0021]
【発明の効果】非ハロゲン系洗浄剤を用いて洗浄され、
ついでフルオロカーボンによりすすぎ処理を施された基
板の清浄度は非常に高いことはもちろん、オゾン層破壊
の問題も解消される。加えて、該すすぎ剤の揮発性に起
因して、加熱乾燥工程が不必要となり、排水処理につい
ても省略または大幅な負担軽減が可能となるなど種々の
効果が奏せられる。[Effect of the invention] Cleaned using a non-halogen cleaning agent,
The cleanliness of the substrate that is then rinsed with fluorocarbon is extremely high, and the problem of ozone layer depletion is also eliminated. In addition, due to the volatility of the rinsing agent, there is no need for a heating and drying process, and various effects can be achieved, such as making it possible to omit or significantly reduce the burden of wastewater treatment.
【0022】[0022]
【実施例】以下、実施例を挙げ、本発明を更に詳しく説
明するが、本発明はこれらの実施例のみに限定されるも
のではない。[Examples] The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited to these Examples.
【0023】参考例1
ジエチレングリコールジメチルエーテル65重量部とポ
リエチレングリコールアルキルエーテル型ノニオン性界
面活性剤(第一工業製薬株式会社製、商品名「ノイゲン
ET−135」、一般式(2)においてR4 は炭素数
12〜14の分岐鎖アルキル基、mが9のものである)
20重量部および純水15重量部を混合して洗浄剤Aを
調製した。Reference Example 1 65 parts by weight of diethylene glycol dimethyl ether and a polyethylene glycol alkyl ether type nonionic surfactant (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd., trade name "Neugen ET-135", in general formula (2), R4 is the number of carbon atoms 12-14 branched alkyl group, m is 9)
Cleaning agent A was prepared by mixing 20 parts by weight and 15 parts by weight of pure water.
【0024】参考例2〜7
参考例1において、洗浄剤の組成を表1に示すように変
化させた他は同様にして評価を行った。Reference Examples 2 to 7 Evaluations were carried out in the same manner as in Reference Example 1, except that the composition of the cleaning agent was changed as shown in Table 1.
【0025】
表1中、DEGDME:ジエチレングリコールジメ
チルエーテル、DEGMBE:ジエチレングリコールモ
ノブチルエーテル、DEGDEE:ジエチレングリコー
ルジエチルエーテル、POEAPE:リン酸エステル系
アニオン性界面活性剤であり、一般式(3)においてR
5 は炭素数12の直鎖アルキル基、nは10、Xは水
酸基と一般式(4)(R6 は炭素数12の直鎖アルキ
ル基)の混合物である。In Table 1, DEGDME: diethylene glycol dimethyl ether, DEGMBE: diethylene glycol monobutyl ether, DEGDEE: diethylene glycol diethyl ether, POEAPE: phosphate ester-based anionic surfactant, and in the general formula (3), R
5 is a straight-chain alkyl group having 12 carbon atoms, n is 10, and X is a mixture of a hydroxyl group and general formula (4) (R6 is a straight-chain alkyl group having 12 carbon atoms).
【0026】実施例1
プリント配線基板(銅張積層板)の全面に、ロジン系フ
ラックス(LONCO社製、商品名「Resin Fl
ux #77−25 」)を塗布し、130℃で2分間
乾燥した後、260℃で5秒間、ハンダフローを行い供
試基板を調整した。
この基板を室温下に、上記洗浄剤Aに浸漬し洗浄し、次
いで室温下で5−フッ化プロパノール(以下、5FPと
略す;ダイキン工業株式会社製、商品名「ペフォールT
M5P」)に約30秒間浸漬して、すすぎ処理を1回行
なった。更にこれを室温で放置乾燥後、フラックスの除
去の度合を以下の判定基準に基づき目視判定した。結果
は表2に示す。
○ 良好に除去できる
△ 若干残存する
× かなり残存する
次いで、上記基板をオメガメーター600SE(KEN
KO社製、商品名)を用いて、基板の清浄度(残留イオ
ン濃度)を測定した。結果は第2表に示す。Example 1 A rosin-based flux (manufactured by LONCO, trade name: "Resin Fl") was applied to the entire surface of a printed wiring board (copper-clad laminate).
ux #77-25'') was applied, dried at 130°C for 2 minutes, and solder flowed at 260°C for 5 seconds to prepare a test board. This substrate was immersed in the above-mentioned cleaning agent A at room temperature to clean it, and then 5-fluorinated propanol (hereinafter abbreviated as 5FP; manufactured by Daikin Industries, Ltd., product name "Pefol T") was washed at room temperature.
M5P") for about 30 seconds and rinsed once. Further, this was left to dry at room temperature, and the degree of flux removal was visually judged based on the following criteria. The results are shown in Table 2. ○ Can be removed well △ Slightly remaining × Significantly remaining Next, the above board was washed with an Omegameter 600SE
The cleanliness (residual ion concentration) of the substrate was measured using KO Co., Ltd. (trade name). The results are shown in Table 2.
【0027】実施例2〜9
実施例1において、洗浄剤の種類を表2に示すものに変
化させた他は同様にして洗浄、すすぎ処理を行い、フラ
ックスの除去の度合を評価した。結果は表2に示す。Examples 2 to 9 Cleaning and rinsing treatments were carried out in the same manner as in Example 1, except that the type of cleaning agent was changed to those shown in Table 2, and the degree of flux removal was evaluated. The results are shown in Table 2.
【0028】実施例10〜16
実施例1において洗浄剤種類を表2に示すものに変化さ
せるとともに、5FPによるすすぎ処理を1回から2回
に変化させた他は同様にして評価を行った。結果は表2
に示す。Examples 10 to 16 Evaluations were carried out in the same manner as in Example 1, except that the type of cleaning agent was changed to that shown in Table 2, and the 5FP rinsing process was changed from once to twice. The results are in Table 2
Shown below.
【0029】実施例17〜23
実施例1において洗浄剤種類を第2表に示すものに変化
させるとともに、すすぎ処理を最初に水、次いで5FP
で行った他は同様にして評価を行った。結果は表2に示
す。Examples 17 to 23 In Example 1, the type of cleaning agent was changed to those shown in Table 2, and the rinsing process was performed using water first and then 5FP.
The evaluation was carried out in the same manner except that The results are shown in Table 2.
【0030】比較例1
実施例2において、すすぎを水で行った場合の比較評価
を行った。結果は表2に示す。Comparative Example 1 In Example 2, a comparative evaluation was conducted when rinsing was performed with water. The results are shown in Table 2.
【0031】比較例2
比較例1において、洗浄剤種類を表2に示すものに変化
させた他は同様にして比較評価を行った。結果は表2に
示す。Comparative Example 2 Comparative evaluation was carried out in the same manner as in Comparative Example 1, except that the type of cleaning agent was changed to those shown in Table 2. The results are shown in Table 2.
【0032】[0032]
【表2】[Table 2]
Claims (4)
被処理物に非ハロゲン系の該フラックス洗浄剤を洗浄槽
内で接触せしめ被処理物より該フラックスを洗浄除去し
、次いですすぎ槽内においてフルオロカーボンを被処理
物に接触せしめることを特徴とする非ハロゲン系のロジ
ン系ハンダフラックス洗浄剤を用いてなる該フラックス
の洗浄処理方法。Claim 1: A non-halogen flux cleaning agent is brought into contact with a workpiece to which rosin-based solder flux has adhered in a cleaning tank to wash and remove the flux from the workpiece, and then fluorocarbon is coated in a rinse tank. A method for cleaning flux using a halogen-free rosin-based solder flux cleaning agent that is brought into contact with an object to be treated.
ラックス洗浄剤が、一般式(1): 【化1】 で表されるグリコールエーテル系化合物のうちの少なく
とも一種、ノニオン性界面活性剤ならびに必要により水
および/またはポリオキシアルキレンリン酸エステル系
界面活性剤からなる混合物を有効成分として含有する非
引火性かつ非ハロゲン系洗浄剤である請求項1記載の洗
浄処理方法。2. The non-halogen rosin solder flux cleaning agent comprises at least one glycol ether compound represented by the general formula (1): [Chemical 1], a nonionic surfactant, and optionally The cleaning method according to claim 1, which is a non-flammable and non-halogen cleaning agent containing a mixture of water and/or a polyoxyalkylene phosphate surfactant as an active ingredient.
ーボンである請求項1記載の洗浄処理方法。3. The cleaning method according to claim 1, wherein the rinsing agent is a non-flammable fluorocarbon.
ルである請求項3記載の洗浄処理方法。4. The cleaning method according to claim 3, wherein the rinsing agent is 5-fluorinated propanol.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1380691A JPH04244280A (en) | 1991-01-10 | 1991-01-10 | Washing treatment of rosin type solder flux using non-halogen type rosin type solder flux detergent |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1380691A JPH04244280A (en) | 1991-01-10 | 1991-01-10 | Washing treatment of rosin type solder flux using non-halogen type rosin type solder flux detergent |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04244280A true JPH04244280A (en) | 1992-09-01 |
Family
ID=11843514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1380691A Pending JPH04244280A (en) | 1991-01-10 | 1991-01-10 | Washing treatment of rosin type solder flux using non-halogen type rosin type solder flux detergent |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04244280A (en) |
-
1991
- 1991-01-10 JP JP1380691A patent/JPH04244280A/en active Pending
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