JPH04243112A - Manufacture of metallized organic film capacitor - Google Patents

Abstract

PURPOSE:To facilitate accurate alignment when a metallized organic film is wound or laminated by a method wherein margins and deposited electrode blank parts are formed accurately on the metallized organic film. CONSTITUTION:Laser beam radiation and the movement of a metal mask are controlled in accordance with the feed of a metallized organic film to form margins and deposited electrode blank parts simultaneously in a same process, so that manufacturing man-hours can be reduced. Moreover, a positional deviation created by the winding turns of the metallized organic film can be automatically corrected in accordance with the film thickness so as to have the margins and the deposited electrode blank parts aligned with each other accurately, so that the safety to a capacitor can be improved.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention has a split electrode structure,
The present invention relates to a method for manufacturing a metallized organic film capacitor in which electrodes are formed by metallicon treatment.

0002

2. Description of the Related Art Conventionally, in order to ensure the safety of film capacitors, various capacitors having split electrode structures have been devised and put into practical use. One of them is the multilayer capacitor, and also the wound capacitor.
A capacitor having a split electrode structure as disclosed in Japanese Patent No. 1-4271 is known.

However, when a high voltage is applied to these capacitors or when they are used at high temperatures, the capacitors may break down and emit smoke, or in the worst case, may even catch fire. Therefore, in recent years, capacitors that do not cause smoke or fire due to capacitor destruction as described above have been devised and put into practical use. One of them is Tokuho 1-
A capacitor as disclosed in Japanese Patent No. 21613 is known in which a blank portion of a vapor deposited electrode is formed and each of a plurality of divided electrodes has a specific current value fuse function (self-protection function).

[0004] In general, in the manufacturing method of such a metallized organic film capacitor with a self-protection function, when forming a vapor-deposited electrode on an organic film, the area that will become the margin of the capacitor is covered with a masking material, and then metal vapor deposition is performed. do the
A single-sided or double-sided metalized organic film with a margin is created, and then a laser beam is irradiated to evaporate the deposited layer using a device as shown in FIG. 4 to form the margin part 1 of the counter electrode.
3 and when the fuse part 14 becomes a capacitor element,
Vapor deposition electrode blank portions 9 are formed so as to overlap.

[0005] After that, when forming a multilayer capacitor using this single-sided metallized organic film, a method shown in FIG.
The single-sided metallized organic film was cut along line A', and metalized organic films of type A 15 and type B 16 were alternately wound and laminated. Thereafter, electrodes were formed on both ends by metallicon treatment, and the base capacitor was cut to the required electrode length to create a laminated metallized organic film capacitor. Here, in order to obtain good contact between the evaporated electrode and the metallicon electrode, currently, a
When type and b type metallized organic films are alternately wound and laminated, a method is generally used in which they are wound and laminated while alternately providing "staggers" 17, as shown in FIG. However, recently, without this "shift",
After the a-type and b-type metallized organic films are alternately wound and laminated, the electrode extraction end face of the organic film serving as a dielectric is selectively removed by chemical means, resulting in an end face shape as shown in Fig. 7. A method has also been developed in which electrodes are formed using metallicon treatment to obtain good contact.

[0006]

[Problems to be Solved by the Invention] The conventional method for manufacturing a metallized organic film capacitor with a self-protection function includes a step of forming a margin 13 as a capacitor on a metallized organic film, and a step of forming a margin 13 for a capacitor at a specific current value. A process of forming a vapor deposition electrode blank portion 9 to provide a fuse function for the evaporation electrode is required. Further, in the case of a wound type capacitor, it is necessary to further form a part without a vapor deposited film along a dividing line A-A' of the vapor deposited film to constitute a divided electrode. Conventionally, these steps had to be performed separately, resulting in low productivity.

[0007] When the metallized organic film obtained by the above process is rolled and laminated, the positional alignment between the margin 13 and the vapor-deposited electrode blank portion 9 when laminated or wound, that is, the capacitor element is formed. If the layers are not wound and laminated accurately so that they overlap each other, the self-security function cannot be fully demonstrated. For this purpose, the metallized organic film must be accurately wound and laminated using a precisely controlled device, which increases the production cost. Particularly in recent years, there has been a strong demand for miniaturization of electronic components, and there has also been a strong demand for miniaturization of metallized organic film capacitors with self-protection functions, regardless of whether they are of the laminated type or the wound type. To this end, stricter precision is required than ever before when winding and laminating metallized organic films.

[0008] The present invention solves these problems by accurately forming margins and vapor deposition electrode blank areas on a metallized organic film in one step, and also correcting positional deviations due to the number of windings. The object of the present invention is to provide a method for manufacturing a metallized organic film capacitor in which the margin and the blank portion of the deposited electrode can be laminated accurately during winding and lamination.

[0009]

[Means for Solving the Problems] In order to solve this problem, the present invention controls the laser beam irradiation and the movement of the metal mask according to the film feed amount, thereby improving the margin and the blank area of the vapor deposition electrode in the same process. are formed at the same time. Also,
When the metallized organic film is wound, the laser beam irradiation device is equipped with a function that automatically corrects the positional deviation caused by the number of turns according to the film thickness.

0010

[Function] This manufacturing method allows the margin of the vapor-deposited electrode to
By controlling the laser beam irradiation device and controlling the position of the metal mask, it becomes possible to form the blank portion of the vapor deposition electrode to provide a specific current value fuse function in the same process, greatly improving production efficiency. Furthermore, it is possible to easily stack or wind the electrodes with high precision so that the margin and the blank portion of the vapor deposition electrode overlap accurately. As a result, it is possible to manufacture a metallized organic film capacitor with a self-safety function that has a sufficient self-safety function and is inexpensive to manufacture and can sufficiently meet the demand for miniaturization of devices.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

[0012] As the organic film, a polyethylene terephthalate (hereinafter abbreviated as PET) film is used.
An aluminum vapor-deposited electrode was formed on the entire surface of one side of the film using a vacuum evaporation apparatus to create a single-sided metallized organic film.

This single-sided metallized organic film was used to form a margin 8 of the vapor deposited electrode and a blank area 9 of the vapor deposited electrode to provide a specific current value fuse function using an apparatus as shown in FIG. Transfer the film to a flat bobbin 10
I wound it up.

FIG. 2 shows the operation of the irradiation device shown in FIG. 1 during laser beam irradiation. As shown in the figure, fθ for laser beam focusing
The lens group 6 is fixed, and the laser beam is pulsed from a Q-switching YAG laser that can continuously form the margin 8 at the feeding speed of the metallized organic film 1. The laser beam is focused, and the thermal energy generated by the irradiation of the focused laser beam 11 scatters the deposited electrode to form the margin 8 . The blank part 9 of the vapor deposition electrode is also irradiated with laser light.
The evaporation electrode is adjusted to have an arbitrary shape that has a current fuse function. Laser light is transmitted through fθ lens group 6
The metal mask 2 allows the margin 8 of the evaporation electrode and the blank portion 9 of the evaporation electrode to provide a specific current value fuse function to be precisely formed. As shown in FIG. 2, each time the flat bobbin 10 rotates once, the metal mask driving device 5 performs a reciprocating motion that moves the metal mask 2 by a length d in a direction perpendicular to the direction of travel of the film 1. , pattern switching as shown in FIG. 1 is possible. In addition, the flat bobbin 10
The film feed length l per one rotation is determined by the circumferential length lo of the flat bobbin 10 itself plus the increased thickness l' of the wound film, and the length l is determined by the amount of film wound. It changes every moment and becomes l=lo+l'. Therefore, the timing of pattern switching of the metal mask must be changed moment by moment, and the thickness increase l'
The laser beam irradiation device is controlled to correspond to the following. Further, the pattern switching end 12 of the film is also controlled to coincide with the end surface of the flat bobbin 10.

A film produced by the apparatus shown in FIG. 1 and wound around a flat bobbin has a cross-sectional structure shown in FIG. As shown in the figure, margins 8 and vapor deposition electrode blank areas 9 are alternately formed above and below the margin 8 so that vapor deposition electrode blank areas 9 for providing a specific current value fuse function overlap.

This wound film is shown as A1-A in FIG.
1', A2-A2', . . . An-An' lines, and this cut surface becomes the end surface from which the electrode is taken out. The end of the organic film as a dielectric material exposed at the end of the electrode is chemically and selectively removed, processed into the shape of the end as shown in Figure 7, and a metal such as zinc is thermally sprayed to form an electrode. to form a base capacitor element. This base capacitor element is cut into appropriate electrode lengths to obtain a desired capacitor element.

(Comparative Example) A single-sided metallized organic film with a margin was obtained by covering the PET film with a masking material and performing aluminum vapor deposition. After this, the laser beam 1 is
1, the margin part 13 and fuse part 14 of the counter electrode
Vapor deposition electrode blank portions 9 are formed so that they overlap when they become capacitor elements. Thereafter, the metallized organic film 1 was cut along the line A-A' shown in FIG.
After obtaining a type 16 metallized organic film, the A type 15 and B type 16 metallized organic films were laminated with alternating "staggers" 17 to form the structure shown in Figure 6, and the electrodes were taken out. Electrodes are formed on the end faces by metallicon treatment to form a base capacitor element, and this base element is cut into appropriate electrode lengths to complete the capacitor element.

Table 1 shows the results of a dimensional comparison between the multilayer capacitor obtained in the example of the present invention and the capacitor of the comparative example at the same capacity.

[0019]

[Table 1]

In order for the capacitor of the comparative example to exhibit a sufficient self-protection function, a sufficient margin width is required. Therefore, the inter-electrode pitch 24 shown in FIGS. 6 and 7 is 5.0
mm, the opposing width 23 effective for capacitance as a capacitor is only about 2.0 mm in the comparative example, and 3. mm in the example.
Compared to 4 mm, this is significantly disadvantageous for downsizing. In addition, the "shift" amount shown in (Table 1), metallic contact width, margin width,
The opposing widths are shown at 17, 21, 22, and 23 in FIGS. 6 and 7.

[0021] In this example, a metallized organic film made of PET film and aluminum vapor-deposited was used, but the effects of the present invention can also be obtained using organic films or metals that are generally used in metallized organic film capacitors. It is clear that there is no difference.

Further, in the present invention, Q-switching YAG
Although pulsed laser light is used, the present invention is not limited to this laser light source, and any pulsed laser light source may be used as long as it can process and form a blank area on the vapor deposition electrode. Alternatively, a galvanometer mirror can be used to generate a continuous or pulsed focused laser beam as shown in Figure 1.
The laser beam 11 may be used instead of the laser beam 11 and scanned along the vapor deposition electrode blank portion forming hole 3 and the margin forming hole 4 of the metal mask 2 to form the vapor deposition electrode blank portion and the margin.

Further, the shape of the blank portion of the vapor deposition electrode need not be the dotted line shape as in this embodiment, but may be any shape as long as it functions as a current fuse.

[0024]

Effects of the Invention As is clear from the above description of the embodiments, according to the method of manufacturing a metallized organic film capacitor of the present invention, the margin and the blank area of the vapor-deposited electrode can be reduced by controlling the laser beam and moving the metal mask. can be formed in the same process, and production efficiency can be improved. Further, it is possible to easily and accurately wind and stack the layers so that the margin and the blank portion of the vapor deposition electrode overlap accurately. As a result, it is possible to manufacture a metallized organic film capacitor with a self-safety function that has a sufficient self-safety function and is inexpensive to manufacture and can fully meet the demand for miniaturization of devices.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the configuration of a manufacturing apparatus for a metallized organic film capacitor according to an embodiment of the present invention.

[Figure 2] Configuration diagram showing the operation of the manufacturing equipment

[Figure 3] Cross-sectional view of the same laminate

[Figure 4] A perspective view showing a conventional method for manufacturing a metallized organic film capacitor.

[Figure 5] Enlarged plan view of the main parts

[Figure 6] Cross-sectional view of a capacitor laminated using the same “shifting” method

[Figure 7] Cross-sectional view of a capacitor with chemically etched terminals of the same laminate

[Explanation of symbols]

1 Single-sided metallized organic film 2 Metal mask 3 Vapor deposition electrode blank part formation hole 4 Margin forming hole 5 Metal mask drive device 6 fθ lens group 7 Laser light source 8 Margin 9 Vapor deposition electrode blank area 10　Flat bobbin 11 Laser beam

Claims (1)

[Claims] 1. A metallized organic film capacitor having a plurality of divided electrode structures, which are formed by forming a margin of a vapor deposited electrode and a blank part of the vapor deposited electrode on a metallized organic film, and then winding and laminating the film to have a plurality of divided electrode structures set to a specific fuse current value. A method for manufacturing a metallized organic film capacitor, in which the margin of the vapor deposition electrode and the blank area of the vapor deposition electrode are formed in the same process by moving a metal mask and controlling a laser light source.