JPH04240740A - Bonder - Google Patents

Abstract

PURPOSE:To accurately perform bonding at a center of an electrode pad and not generate are recognitive error even if there is a dispersion in a size of a package by a method wherein a camera lens for a pattern recognition with 2 species or more of different magnification and for a self-teaching input is provided at a bonding head or the like. CONSTITUTION:Camera lens 7, 8 for a pattern recognition with at least 2 species or more of different magnification and for a self-teaching(ST) input are provided at a bonding head 9, and at the pattern recognition and the ST input at wire- bonding, a recognitive magnification is variable on the IC chip and package sides of a bonding sample 16. For instance, 2 pieces of camera lens barrels A36 and B37 are provided at a camera lens barrel part 21, and lenses A7 and B8 with different magnifications are respectively set. Then, the lens A7 is used for the recognition on the inner lead side of an IC package and the ST input with magnification of 5.6, and the lens B8 is used for the recognition on the IC chip side and the ST input with magnification of 10.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to a bonding device using a wire bonding method, and particularly to an I/O device for pattern recognition and self-teach input (hereinafter referred to as ST input).
The present invention relates to a bonding device that can change recognition and ST input magnification between the C chip side and the package side.

0002

[Prior Art] A conventional bonding device is shown in FIG. 1(A).
As shown in the configuration diagram, there is a heater block 18 on which a bonding sample 16 is placed and whose temperature is adjusted by a temperature controller 20, and a heater block 18 which is controlled by an encoder 19.
8, a bonding head 9 that supplies the bonding wire 14 to the bonding sample 16 and is equipped with a camera unit 6;
A C servo drive unit 13 drives a Z-axis servo motor 10, a Y-axis servo motor 11, an X-axis servo motor 12, a monitor 5 for pattern recognition and ST input, and an X-axis drive unit that controls the DC servo drive unit 13. , Y, Z control circuit, a camera control unit 1 that controls the camera unit 6, a pattern recognition unit 2 that controls the monitor 5, and a microscope 15 for the operator, which are integrated into a control box with a built-in microcomputer. 3 to constitute an automatic bonding device.

[0003] In this conventional bonding apparatus, as shown in FIG.
As shown in A) and its partially enlarged view in FIG. 8B, only one camera barrel for pattern recognition and ST input is attached to the camera barrel section 21 of the bonding head 9. The magnification of the lens 42 inside the lens barrel was fixed to one type. Therefore, in a bonding apparatus using the conventional wire bonding method, as shown in the diagram of the bonding sample in FIG.
7 and the pattern recognition of the alignment point 22 on the package side and S
T input was performed at the same magnification. FIG. 9 is a monitor screen diagram when performing ST input to the IC electrode pad 24.

0004

[Problems to be Solved by the Invention] As the technology for highly integrating IC chips progresses, the logic circuits inside the IC chips are becoming more and more highly integrated, and the area of the logic circuit portion of the IC chip is being reduced. Along with this, the IC chip itself is being reduced in size, and the pitch between electrode pads located around the IC chip is also being reduced. In addition, even if the size of the IC chip is the same as before, as IC chips become more highly integrated, the number of circuits within the IC chip has increased compared to before, and the number of electrodes will also be greater than before. Therefore, the pitch between electrode pads tends to be reduced. When reducing the pitch between electrode pads, in the case of gold wire ball bonding, etc., if the gold ball is not accurately bonded almost at the center of the electrode pad, the gold balls 34 will be adjacent to each other, as shown in the plan view of FIG. There is a risk that contact will occur at the short-circuit location 35 with the pad, resulting in a short-circuit failure.

In order to accurately bond to the center of the electrode pad 24 of the IC chip 33, it is necessary for the operator to accurately input the bonding point to the center of the electrode pad 24 using ST. For this purpose, the magnification of the camera lens 42 for recognition and ST input may be increased. However, when the magnification of the camera lens 42 is increased, the field of view of the camera itself becomes narrower than when the lens magnification is low. For example, in the case of ceramic packages, the size of individual packages varies to some extent, so if the field of view of the camera itself becomes narrow, even if the packages are set in the same position, the recognition point on the package side will initially be ST. There was a problem that the input may not fit within the recognition area, resulting in a recognition error.

[0006]

[Means for Solving the Problems] In contrast to the conventional bonding apparatus using the wire bonding method described above, the bonding apparatus of the present invention has a camera for pattern recognition and ST input that uses two or more types of lenses with different magnifications. It has a system that can change the magnification between the IC electrode pad side and the package side of the bonding sample during pattern recognition and ST input during wire bonding.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1(A) is a configuration diagram showing a system of a bonding apparatus according to the first embodiment, and FIG. 1(B) is an enlarged view of the camera lens barrel. The bonding apparatus of this embodiment has two camera barrels A, 36 and B, 37, and lenses A, 7 and B, 8 having different magnifications are set in each camera barrel. Lenses A, 7 are attached to the inner leads 25 of the IC package 26 shown in FIG.
For side recognition and ST input, the magnification is 5.6 times. Lenses B and 8 are for recognition on the IC chip 33 side and for ST input, and have a magnification of 10 times.

Next, alignment pattern recognition and ST input in this embodiment will be explained. First, in pattern recognition of the alignment point 22 on the IC package 26 side, the device recognizes it on the monitor 5 on the camera barrel A, 36 side (5.6x lens A, 7 side) (see Fig. 2 (A)). . Next, I.C.
In recognition of the alignment point 23 on the chip 33 side, the camera lens barrel B
, 37 side (10x lens B, 8 side) through the monitor 5 (see FIG. 2(B)). It is assumed that switching between the camera barrels A, 36 and B, 37 is automatically performed by the control box 3 of the device.

Next, the ST input of the bonding point will be explained. This is also similar to pattern recognition of alignment points, and IC
In the ST input of the bonding point on the electrode pad 24, the device is made to recognize it by the monitor 5 on the camera barrel B, 37 side (10x lens B, 8 side) (see FIG. 3(A)). IC
In the ST input of the bonding point of the inner lead 25 of the package 26, the device is made to recognize it on the monitor 5 on the camera barrel A, 36 side (5.6x lens A, 7 side) (see FIG. 3(B)). As described above, ST input is performed for all the bonding points on the IC electrode pad side and the package inner lead portion, and after the input, fully automatic bonding is performed.

FIG. 4 is a block diagram showing a system of a bonding apparatus according to a second embodiment of the present invention. In the second embodiment, two types of lenses with different magnifications are used, as shown in the cross-sectional configuration diagram of the camera barrel section in FIG.
By using the half mirror 31, the camera lens barrel 38
is one piece. Changing the magnification of the camera during recognition and ST input between the IC electrode pad side and the package inner lead side is the same as in the previous embodiment, and its operation will be explained below.

First, for recognition and ST input on the package inner lead side, as shown in FIG. 5, an image 32 of the bonding sample 16 is multiplied by 5 by the lens C, 29 and reflected by a half mirror 31. The reflected image A, 41 is captured into the main body of the apparatus by operating the camera unit B, 39. Next, when recognizing the alignment point on the IC electrode pad side and inputting ST, the image 32 of the sample is transferred to the lens C, 2
9, the image is multiplied by 5, and the image passing through the half mirror 31 is further multiplied by 2 by the lens D, 30, and finally 10 times. The image B, 40, which is 10 times larger than the sample, is captured into the main body of the apparatus by operating the camera unit A, 28. This embodiment has the advantage that, compared to the previous embodiments, since there is only one camera barrel, correction between the camera and the tool during bonding is easier.

0012

Effects of the Invention In the bonding apparatus of the present invention described above, the magnification of the camera during pattern recognition and ST input is
Since it can be automatically changed between the C electrode pad side and the package side, the IC chip side has about 1
．． The ST input of the bonding point is performed with eight times the precision, allowing accurate bonding to the center of the electrode pad, and especially when the pitch between the pad centers is less than 110 μm, the gold ball will short-circuit with the adjacent wire (see Figure 7). can be prevented. In addition, the recognition magnification of the alignment point on the package side can be approximately 0.56 times that on the IC chip side, and the recognition area on the IC package side is approximately 3.2 times that on the IC chip side. In the case of packages, even packages of the same type have some variation in size, and even if the packages are set in the same position on the bonding device, the alignment point on the package side does not fall within the recognition area, resulting in recognition errors. This has the effect of preventing this.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a system according to a first embodiment of a bonding apparatus of the present invention, in which FIG. 1A is a configuration diagram and FIG. 1B is an enlarged view of a camera barrel section thereof.

FIG. 2 is a monitor screen diagram in Example 1;
) is a monitor screen diagram when recognizing the alignment point on the package side, and (B) is a monitor screen diagram when recognizing the alignment point on the IC chip side.

FIG. 3 is a diagram of the monitor screen in Example 1;
) is a monitor screen diagram when ST inputting a bonding point to the IC electrode pad side, and (B) is a monitor screen diagram when ST inputting a bonding point to the inner lead part of the package side.

FIG. 4 is a configuration diagram of a system according to a second embodiment of the present invention.

5 is a sectional view showing the internal configuration of the camera barrel section in FIG. 4. FIG.

FIG. 6 is a diagram showing a bonding sample, showing an IC chip and an I
It is a figure showing the alignment point of C package.

FIG. 7 is a plan view showing a state in which a gold ball contacts an adjacent pad and short-circuits.

8A and 8B are diagrams showing a conventional bonding apparatus system, in which FIG. 8A is a configuration diagram and FIG. 8B is an enlarged view of the camera lens barrel.

FIG. 9 is a monitor screen diagram when performing ST input on the IC electrode pad side in a conventional bonding apparatus.

[Explanation of symbols]

1 Camera control unit 2 Pattern recognition unit 3 Control box 4 X, Y, Z control circuit 5 Monitor 6 Camera unit 7 Lens A 8 Lens B 9 Bonding head 10 Z-axis servo motor 11 Y-axis servo motor 12 X-axis servo motor 13 DC Servo drive unit 14
Bonding wire 15 Microscope 16 Bonding sample 17 X-Y manipulator 18 Heater block 19 Encoder 20 Temperature controller 21 Camera barrel section 22 Package side alignment point 23 IC chip side alignment point 24 IC electrode pad 25 Package inner lead 26 I
C package 27 IC chip side alignment point position 28
Camera unit A 29 Lens C 30 Lens D 31 Half mirror 32 Sample image 33 IC chip 34 Gold ball 35 Short spot with adjacent pad 36
Camera barrel A 37 Camera barrel B 38 Camera barrel 39 Camera unit B 40 Image B 41 Image A 42 Lens

Claims (1)

[Claims] 1. A bonding device for semiconductor manufacturing equipment, which has a bonding head portion having at least two camera lenses with different magnifications for pattern recognition and self-teach input, and has a camera lens for pattern recognition and self-teach input during wire bonding. A bonding apparatus characterized in that the recognition magnification is made variable between the IC chip side and the package side of the bonding sample during input.