JPH04237197A - Electronic component mounting device - Google Patents

Abstract

PURPOSE:To prevent an electronic component mounting device from deteriorating in mounting efficiency by a method wherein two detector are separately operated according to the type of an electronic component. CONSTITUTION:A first detector 31 is fixed to a mounting section 33 provided to the lower part of a mounting head 11, where the detector 31 is composed of a video camera whose lens is so arranged as to pick up an image of a printed board 15 located below and detects an electronic component A sucked by the mounting head 11 through the intermediary of an optical system which constitutes a light path. A second detector 32 which is used for detecting an electronic component B of large size is mounted on a frame 42 of an XY robot 16, and when a suction nozzle 13 sucks the electronic component B of large size from a component feed section 12B and is made to ascend to be located above the second detector 32, and the second detector 32 detects the electronic component B from below. At this point, a movable mirror 36 of the optical system concerned is made to recede to a cylinder 38, whereby it does not impede the detecting operation of the second detector 32.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a drive mechanism for an optical system of a detector that recognizes electronic components mounted on a mounting head of an electronic component mounting apparatus.

0002

[Prior Art] In a conventional electronic component mounting apparatus, when recognizing electronic components held in a mounting head, (1) all components are viewed from below with a fixed camera regardless of their dimensions; (2) all components are viewed from below regardless of their dimensions; The structure was such that the product was viewed with a camera fixed to the head.

0003

In the above-mentioned prior art, in the configuration (1), after all parts are held, they are moved to a fixed camera and temporarily stopped, which increases the takt time. Furthermore, in the configuration (2), since it is necessary to see large parts, the camera inevitably becomes large, and there is a drawback that the head is not fast enough to move.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus that is capable of suctioning large electronic components even if it is intended to be a small electronic component.

[0005]

[Means for Solving the Problems] In order to achieve the above object, a first detector that moves together with the mounting head, a second detector that is fixed to the main body of the device, and an optical path of the first detector when detecting a component are provided. The apparatus has an optical system for forming the part, and is configured to detect the position of the first type component in the held state with a first detector, and detect the position of the second type part in the held state with a second detector. .

Furthermore, in order to achieve the above object, in the present invention, in addition to a drive system that synchronizes the operations of the suction nozzle and the reflecting mirror, a drive system that operates only the reflecting mirror is provided.

[0007]

[Function] The amount of movement of the reflector is set to target large electronic components, and the drive system that synchronizes the operation of the suction nozzle and the reflector is set to the amount of movement of the reflector that targets small electronic components. In addition to this, a drive system for controlling the amount of movement of the reflecting mirror for large electronic components is provided, and the drive system is selected in accordance with the size of the electronic component. As a result, even if the electronic component mounting apparatus is intended for large electronic components, it can operate without affecting the moving speed of the reflector when mounting small electronic components.

[0008]

Embodiments Examples of the present invention will be described below with reference to FIGS. 1 to 7. In the electronic component mounting apparatus, as shown in FIG. 2, the mounting head 11 moves to a component supply section 12A, and the electronic component A is mounted by sucking one electronic component A from the component supply section 12A with a suction nozzle 13. Alternatively, the mounting head 13 moves to another component supply section 12B, and the mounting head 13 moves to another component supply section 12B.
A large electronic component B is attached from B by suction with a suction nozzle 13. Then, the mounting head 11 transfers the electronic component A (or the electronic component B) to the board transport section 14 with the electronic component A (or electronic component B) mounted thereon.
The printed circuit board 15 is moved onto the printed circuit board 15, which has been positioned in advance, and is mounted at a desired position on the printed circuit board 15. The mounting head 11 is configured to be movable in orthogonal directions (XY directions) as shown in FIG.
It is attached to the robot 16, and the suction nozzle 1 is attached to its tip.
3 is installed so that it can be raised and lowered (in the Z direction). The suction nozzle 13 is attached to a support shaft 17 provided on the mounting head 11.
The drive motor 18 (Fig. 3) raises and lowers the suction nozzle drive cam 19 and the suction nozzle drive link 20, and when the rotary motor 21 is driven, the support shaft 17 rotates around the axis through the pulley 22 and belt 23. By rotating, the rotation of the suction nozzle 13 can be changed, and moreover, the electronic components A and B can be suctioned to the suction opening at the tip.

In this electronic component mounting apparatus, as shown in FIG.
A component detection mechanism is provided for detecting the position, orientation, etc. of each of electronic components A and B until they are mounted.

Broadly speaking, this component detection mechanism includes a first detector 31 and a second detector 32. As shown in FIG. 1, the first detector 31 is fixed to a mounting part 33 provided at the bottom of the mounting head 11, and is arranged so that its lens surface can show the lower part where the printed circuit board 15 is located. It is configured to detect one of the electronic components A attracted to the mounting head 11 through an optical system that forms an optical path, which will be described later.

This optical system is attached to a mounting portion 33 at the bottom of the suction nozzle 13 so as to be movable in a direction perpendicular to the axial direction of the suction nozzle 13, and is driven by a drive motor 18 that is the same as the motor that moves the suction nozzle 13 up and down. As a result, the movable mirror 36 that operates via the suction nozzle drive cam 19, the mirror drive cam 34 mounted coaxially with the suction nozzle drive link 20, and the mirror drive link 35, and the movable mirror 36 are retracted from below the suction nozzle 13. A spring 37 that pulls the movable mirror 36 in the opposite direction, a cylinder 38 that operates via the mirror drive link 35 in a direction that retracts the movable mirror 36 from below the suction nozzle 13, and a cylinder 38 that is attached to the mounting portion 33 and that is attached to the movable mirror 36. and a fixed mirror 39 that guides the captured image to the first detector 31.

Suction nozzle 1 when sucking electronic component A
3 and the operation of the movable mirror 36, as shown in the cam operation diagram in FIG. The movable mirror 36 is retracted to a position that avoids the electronic component A (see FIG. 6). And the electronic component A
When imprinting with the detector 31 of 1, the suction nozzle 13 moves upward from the origin position 40, and in conjunction with this movement, the moving mirror 36 moves below the suction nozzle 13, and after imprinting, the suction nozzle 13 moves upward from the origin position 40. When the nozzle 13 descends, the movable mirror 36 retreats from below (see FIG. 5).

The relationship between the operations of the suction nozzle 13 and the movable mirror 36 when suctioning another electronic component B is as follows:
3 is at the origin position 40, the cylinder 38 advances in response to a command from the control device 41 indicating that it is the electronic component B, and the moving mirror 36 is moved to the suction nozzle 1 via the mirror drive link 35.
3. Evacuate from below (see Figure 7).

On the other hand, the second detector 32 is for detecting a large electronic component B, and although not shown in detail in FIG. 2, it is attached to the frame 42 of the XY robot 16 and When the electronic component B picks up a large electronic component B from another component supply section 12B and rises to be above the second detector 32, the electronic component B is captured from below and detected. In this case, the movable mirror 36 in the optical system is retracted by the cylinder 38 and does not interfere with the detection by the second detector 32.

[0015] Therefore, this detection mechanism is suitable for small electronic parts A.
The first detector 31 and the second detector 32 are controlled to be used properly depending on the size of the electronic component B and the large electronic component B, and the control means is used to operate the electronic component mounting device according to the program. It is incorporated into the control device 41 of.

Since the component detection mechanism of the embodiment has the above-described configuration, its operation will be described in relation to the operation of the electronic component mounting apparatus.

The mounting head 11 is, for example, a component supply section 12A.
, the suction nozzle 13 descends and the parts supply section 12
It picks up a small electronic component A from A and ascends while it is still sucked. During the ascent, the movable mirror 36 moves below the suction nozzle 13 while the suction nozzle 13 passes through the origin position 40 and ascends to the recognition position. By being imaged on the first detector 31, the first detector 31
31 detects electronic component A.

Thereafter, when the first detector 31 detects the electronic component A, the suction nozzle 13 begins to descend, and at the same time, the movable mirror 36 retreats from below the suction nozzle 13, and the suction nozzle 13 returns to the origin position 40. . Further, at this time, the XY robot 16 moves to the mounting position of the printed circuit board 15 while sucking the electronic component A based on the result of the detection of the electronic component A by the first detector 31. When the XY robot 16 moves to the printed circuit board 15 mounting position, the suction nozzle 13 descends and mounts the electronic component A on the printed circuit board 15. On the other hand, when the mounting head 11 moves to another component supply section B and its suction nozzle 13 is at the origin position 40 when the suction nozzle 13 is at the origin position 40, the control device 41 The cylinder 38 advances in response to a command that the electronic component B is the electronic component B from the component supply section B, and the moving mirror 36 is retracted from below the suction nozzle 13 via the mirror drive link 35. The electronic component B does not interfere with the detection by the second detector 32 because the electronic component B rises while adsorbing the electronic component B.

As described above, in the optical system drive mechanism of the embodiment, the detection mechanism of the first detector 31 is used when mounting the small electronic component A, and the detection mechanism of the first detector 31 is used when mounting the small electronic component A. When mounting a small electronic component A, the detection mechanism of the second detector 32 is used, so compared to the conventional technology, when mounting a small electronic component A, the detection mechanism of the first detector 31 is used instead of a large electronic component. There is no need to adjust to B, the detector mechanism can be made smaller, and the installation time can be shortened. It goes without saying that the movable mirror and suction nozzle can be operated in the same manner as described above by providing separate drive motors and driving the motors synchronously with a control device, or by driving them separately.

[0020]

[Effects of the Invention] As described above, according to the present invention,
Since the configuration is such that two detectors are used depending on the type of electronic component, it does not take a long time to mount the electronic component on the printed circuit board, and a drop in mounting efficiency can be prevented.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of a component detection optical system drive mechanism according to an embodiment of the present invention.

FIG. 2 is an overall perspective view of an electronic component mounting device of a component detection optical system according to an embodiment of the present invention.

FIG. 3 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 4 is an operational diagram of the waist portion of the component detection optical system drive mechanism according to the embodiment of the present invention.

FIG. 5 is an explanatory diagram when small parts are detected according to the embodiment of the present invention.

FIG. 6 is an explanatory view of holding and mounting small parts according to the embodiment of the present invention.

FIG. 7 is an explanatory diagram when large parts are detected according to the embodiment of the present invention.

[Explanation of symbols]

1...Adsorption nozzle, 2...Lever (A), 3...Reflector, 4...
Lever (b), 5-6...Fully point, 7-8...Drive cam, 11
... Mounting head, 12... Component supply section, 13... Suction nozzle,
14...Substrate transport unit, 15...Printed circuit board, 16...XY robot, 17...support shaft, 18...drive motor, 19...suction nozzle drive cam, 20...suction nozzle drive link, 21...
Rotating motor, 22... Pulley, 23... Belt, 31... First detector, 32... Second detector, 33... Mounting part, 34... Mirror drive cam, 35... Mirror drive link, 36... Moving mirror, 37... Spring , 38... cylinder, 39 fixed mirror,
40... Origin position, 41... Control device.

Claims (2)

[Claims] Claims: 1. An electronic component mounting apparatus in which a mounting head takes out one of at least two types of electronic components from a component supply section, holds the electronic component, moves while holding the electronic component, and mounts the electronic component on a printed circuit board; It has a moving first detector, a second detector fixed to the main body of the apparatus, and an optical system that forms an optical path for the first detector when detecting the held parts, and the first type of held parts. An electronic component mounting apparatus configured to detect the position of a component with the first detector, and detect the position of a second type of component held with the second detector. 2. An electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply section, holds the electronic component, moves while holding the electronic component, and mounts the electronic component on a printed circuit board, wherein the mounting head holds the electronic component. A synchronous drive system that synchronizes a nozzle and an optical system of a detector for recognizing a held electronic component to move it to a component recognition position, and a drive system that moves the optical system of the detector asynchronously with the holding nozzle. An electronic component mounting device characterized by being provided with.