JPH0423326Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a semiconductor device transport device.

Conventionally, to transport ICs, LSIs, etc. to the measuring section for testing, a vertical transport device is used to transport semiconductor devices one by one using their own weight, as shown in the cross-sectional view in Figure 1. It is being That is, in FIG. 1, 1 is a transport path, 2 is a lowermost semiconductor element,
2' is the nearest upper semiconductor element, 3 is the stopper pin,
4 is a presser pin. In this vertical transport device, the lowermost semiconductor element 2 is held by a stopper pin 3, and in this state a large number of semiconductor elements are stacked in the transport path 1. In this state, when the measurement of the semiconductor device in the measurement section in the next step is completed and the measurement section becomes vacant, the presser pin 4 presses and fixes the semiconductor device 2' in the uppermost step, and the stopper pin 3 is retracted to remove the semiconductor device 2' in the lowermost step. and then proceed to the measurement section for the next process. When the lowest stage semiconductor device 2 falls and proceeds to the next process, the stopper pin 3 is again projected into the conveyance path 1, the presser pin 4 is retracted, and the nearest upper stage semiconductor device 2' is dropped to the stopper pin 3, and the next step is carried out one by one. Proceed to the part. Semiconductor elements are automatically transported by repeating the same steps one after another.

However, semiconductor elements used in this type of transport device are generally molded with resin. Moreover, since this resin mold is sandwiched between molds that can be separated into an upper mold and a lower mold and the resin is sealed and solidified, burrs are likely to form in the mating parts of the molds, that is, the center parts 21 and 22 of the semiconductor element, making them less smooth. ing. Therefore, when a large number of these semiconductor devices are stacked one on top of the other in succession using the conventional vertical conveyance device described above, the burrs in the center portions 21 of the nearest upper semiconductor device 2' and the lowest semiconductor device 2 become entangled, and the nearest upper semiconductor device Even when the semiconductor element 2' is pressed and fixed by the presser pin 4 and the stopper pin 3 is retracted, the lowermost semiconductor element 2 does not fall downward, resulting in a so-called "clog" phenomenon and the automatic process being interrupted. When this "clog" phenomenon occurs, it is necessary to manually impact the conveyor to cause it to fall, which requires the deployment of personnel, and furthermore, the process is interrupted, wasting time and increasing costs. It also causes process failure.

When we measured the number of "clogs" and interruption times caused by "clogs" in a conventional vertical conveyor, we obtained the following data. This data is the sum of the number of "clogs" in one day's operating hours and the time required to restore and restart the process after interruption.

Date Number of "clogs" Interruption time (minutes) a 186 41 b 130 27 c 168 28 d 175 26 e 134 24 Average 159 29 In other words, according to the above data, a "clog" occurs once every 2.6 minutes on average, and all 6.9% of the operating time was non-operating time, which resulted in a decrease in operating rate and efficiency, as well as the need to allocate personnel.

The present invention was devised in view of these drawbacks, and it is an object of the present invention to provide a conveying device that is less likely to cause clogging and can significantly reduce interruption time.

This will be explained in detail below with reference to the drawings. FIG. 2 is a sectional view showing an embodiment of the conveying device according to the present invention. The drawer symbols 1 to 4 and 21, 22 are the same as in FIG. 1, but the difference is that a tapered part 31 is provided at the tip of the stopper pin 3, and a separation pin 5 is provided at the bottom of the presser pin 4. The device is different. This separation pin 5 moves in conjunction with the holding pin 4, and when the holding pin 4 presses and fixes the immediately upper semiconductor element 2', it is inserted into the part where the lowermost semiconductor element 2 and the immediately upper semiconductor element 2' contact each other. It is arranged so that When the separation pin 5 is protruded and inserted between the lowermost semiconductor element 2 and the immediately upper semiconductor element 2', the lowermost semiconductor element 2 is pushed down slightly, but the external shape of the semiconductor element is Due to the resin molding, the semiconductor element has a slight taper shape from the center parts 21 and 22 toward the ends, and this taper and the taper part 31 provided at the tip of the stopper pin 3 form a relief part to close the upper semiconductor element 2. ' and the lowermost semiconductor element 2 can be completely separated. Further, even if the stopper pin 3 does not have a tapered portion, complete separation can be achieved in the same way if a relief portion is provided at the rear portion of the semiconductor element 2 in the transport path 1. In this state, when the measurement process of the semiconductor element in the measurement section of the next process is completed and the semiconductor element is transferred to another place and a vacant seat becomes available, the stopper pin 3 is retracted to drop the lowest semiconductor element 2 and send it to the measurement section of the next process. After that, as before, when the stopper pin 3 is inserted into the conveyance path 1 and the presser pin 4 and separation pin 5 are retracted, the semiconductor elements fall one by one, and the same process is repeated one after another.

That is, according to the present invention, the separation pin 5 attached to the presser pin 3 and the tapered part 31 provided at the tip of the stopper pin 3 are relatively simple additional configurations, and since the separation pin 5 is interlocked with the presser pin 4, the process is simplified. Effectively, it is possible to completely separate the entanglements between semiconductor elements without increasing the number of semiconductor elements, and the wasted time caused by process interruptions can be greatly reduced.

The following is data obtained by measuring the apparatus according to this embodiment using the same method as the data on the number of "clogs" and the interruption time required for treatment recovery after process interruption in the conventional apparatus described above.

Date Number of "clogs" Interruption time (seconds) a 11 33 b 13 56 c 6 18 d 13 52 e 6 13 f 8 19 Average 9.5 32 In other words, according to the device according to the present invention, it is possible to eliminate the phenomenon of "clogs". Although it is not possible, wasted time has been significantly reduced compared to the past, and "clogs" occur once every 44 minutes.
The decline in occupancy rate was only 0.1%. The fact that the interruption time has significantly decreased compared to the decrease in the number of "clogs" indicates that even if a "clog" phenomenon occurs, the semiconductor element immediately separates and falls and is immediately restored. It can be seen from the surface that the effect is remarkable.

In the above embodiment, the tip of the stopper pin 3 is tapered, but the object of the present invention can be achieved even if the stopper pin 3 is not tapered.
Furthermore, although the above embodiments have been described using a vertical conveyance device, it goes without saying that similar effects can be obtained with a conveyance device having an inclined conveyance path.

As explained above, according to the present invention, even if there is a burr caused by the resin mold in the equipment that transports semiconductor elements, the equipment can be transported to the next process without interrupting the line, so wasted time can be greatly reduced. This results in savings and improved operating efficiency, lowering the cost of semiconductor devices and making it possible to obtain products with stable quality.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a conventional vertical conveyance device, and FIG. 2 is a sectional view of a vertical conveyance device which is an embodiment of the present invention. 1... Conveyance path, 2... Lowermost semiconductor element, 2'
...immediate upper semiconductor element, 3...stopper pin,
4... Presser pin, 5... Separation pin, 21, 22...
...center part, 31...tapered part.

Claims (1)

[Scope of utility model registration request] Conveyance path 1 that allows semiconductor devices to continuously fall naturally
, a stopper pin 3 for locking the lowermost semiconductor element 2 in the transport path 1, and a presser pin for pressing the immediately upper semiconductor element 2' overlapping the upper part of the lowermost semiconductor element 2 locked by the stopper pin 3. 4
and a separation pin 5 that protrudes into the transport path 1 in conjunction with the holding pin 4. The transport path 1 is provided with an escape portion in the portion of the lowermost semiconductor element 2, and the separation pin 5 is arranged at a position that protrudes from the tip of the holding pin 4 and is inserted so as to separate the lowermost semiconductor element 2 and the nearest semiconductor element 2' when the holding pin 4 presses the nearest semiconductor element 2'. A conveying device characterized by: