JPH04225243A - Manufacture of semiconductor device, and tape clamping plate - Google Patents

Abstract

PURPOSE:To set the position of a tape clamping plate to a normal position by bringing the shape of a tape clamping hole of the plate into coincidence with that of the corner of a device hole. CONSTITUTION:In a manufacturing method for a tape carrier type semiconductor device, extensions 13 of four corners of a tape clamping hole 12 of a tape clamping plate 11 for securing a tape carrier are formed, and a device hole formed on the carrier is aligned with the hole 12 of the plate 11 at the four corners of the hole.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device using a tape carrier method for mounting semiconductor elements, and a jig used therefor.

0002

[Prior Art] Conventionally, technologies in this field include:
For example, there were the following. As is widely known, the tape carrier type connection method with a semiconductor element (hereinafter referred to as an IC chip) is to form an inner lead for connection with an IC chip on a tape carrier, and then to connect it to a pad part of the IC chip. The metal protruding electrodes (hereinafter referred to as bump electrodes) are aligned accurately, and a jig called a bonding tool is used to apply heat and pressure from the top of the inner lead to remove tin, solder, or gold plated onto the inner lead. and the metal of the bump electrode (gold is widely used). Such a method is called inner lead bonding (hereinafter referred to as ILB).

FIG. 3 is a schematic diagram of a structure for fixing a tape carrier of a bonding apparatus for performing such conventional ILB. As shown in this figure, when fixing the tape carrier, the tape carrier 2 is sandwiched between the tape guide plate 1 and the tape clamp plate 3. The tape clamp plate 3 moves up and down and clamps and fixes the tape carrier 2 when necessary. When transporting the tape carrier 2, the tape clamp plate 3 is lowered and transports the tape carrier 2 with an interval from the tape guide plate 1.

FIG. 4 is a plan view of this tape clamp plate. Usually, the thickness of the tape clamp plate 3 is 1.0 mm ~
The thickness is selected within the range of 0.1 mm, and the material used is stainless steel with low thermal expansion. On the tape clamp plate 3,
As shown in FIG. 5, a tape clamp plate is arranged so as to surround a hole called a device hole 6, which is provided in the tape carrier 2 for ILBing an IC chip, at a certain distance. No. 3 tape clamp hole 7 is drilled.

FIG. 5 shows the device hole and the tape clamp hole 7 of the tape clamp plate as seen from the top surface of the tape carrier.
It shows the positional relationship with As shown in this figure, the position of the tape clamp hole 7 of the tape clamp plate is indicated by a dotted line because it is hidden under the tape carrier 2 and cannot be seen from the top. By aligning the device hole 6 and the tape clamp plate 3, the tape carrier 2 is held uniformly, the positioning at the time of ILB is accurate, and the lead forming shape is stabilized. The reason why the dimensions of the tape clamp hole 7 on the tape clamp board are made larger than the dimensions of the device hole 6 to some extent is that even if a positional shift occurs between the tape clamp hole 7 on the tape clamp board and the device hole 6, the tape clamp To prevent the plate 3 from protruding into the device hole 6 and obstructing the ILB, and to prevent volatile components generated from the tape carrier 2 from being heated during ILB to the tape clamp plate 3.
This is to prevent it from adhering to the surface.

[0006]

However, in the apparatus having the above structure, as shown in FIG. However, since the position of the tape clamp hole 7 of the tape clamp plate 3 is hidden under the tape carrier 2 and cannot be seen from the top, there is a problem that the tape clamp hole 7 may be ILBed without being set in the correct position. there were.

[0007] As described above, if the device hole 6 and the tape clamp plate 3 are not aligned, the tape carrier 2 will not be held uniformly during ILB, resulting in problems such as lead peeling and lead misalignment after ILB. There was a point. According to the present invention, when the device hole described above and the tape clamp hole of the tape clamp plate are misaligned, the IL
At B, the pressure of the tape carrier becomes uneven and ILB
In order to eliminate problems such as subsequent lead peeling, lead misalignment, and inability to obtain stable lead forming, the shape of the tape clamp hole on the tape clamp plate matches the corner of the device hole, and The purpose of the present invention is to provide a method for manufacturing a semiconductor device using a tape carrier method that stabilizes the quality of an ILB and has a high quality and high yield by making it easy to set the position to a regular position, and to provide a tape clamp plate for the same. shall be.

[0008]

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a method for manufacturing a semiconductor device using a tape carrier, in which projecting portions are provided at the four corners of a tape clamp hole of a tape clamp plate for fixing a tape carrier. form,
The device hole provided on the tape carrier and the tape clamp hole of the tape clamp plate are aligned at the four corners of the device hole.

Furthermore, in the tape clamp plate used for this purpose, projecting portions are formed at the four corners of the tape clamp hole for alignment with the four corners of the device hole formed on the tape carrier.

0010

[Operation] According to the present invention, as described above, projecting portions are formed at the four corners of the tape clamp hole of the tape clamp plate for fixing the tape carrier, and the device hole provided on the tape carrier and the tape clamp plate Since the tape clamp holes of the tape carrier are aligned with the four corners of the device hole, the top of the projecting portion coincides with each corner of the device hole of the tape carrier, or comes out to some extent within the device hole.

Therefore, the displacement of the position of the clamp hole of the clamp plate can be immediately detected from the upper surface of the tape carrier, and the direction of the displacement can be easily determined, and the position can be corrected accurately. I can do it.

0012

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a tape clamp plate showing an embodiment of the present invention, and FIG. 2 is a plan view of a tape carrier showing an embodiment of the present invention, as seen from the top surface of the tape carrier, showing a state in which the device hole and the tape clamp plate are aligned in their normal positions. FIG. Here, the thickness and material of the tape clamp plate 11 can be the same as those of the conventional ones.

As shown in these figures, the tape clamp hole 12 of the tape clamp plate 11 has projecting portions 1 at the four corners.
3 are formed so that each corner portion of the device hole 6 formed in the tape carrier 2 substantially coincides with, or a projecting portion 13 comes out into the device hole 6 to some extent. With this configuration, whether the position of the tape clamp hole 12 of the tape clamp plate 11 is accurately aligned with the position of the device hole 6 can be easily determined from the top surface.

With the shape of the tape clamp hole 12 of the tape clamp plate 11 constructed as described above, if the position of the device hole of the tape carrier 2 is misaligned, the shape of the tape clamp plate 11 will change when viewed from the top surface of the tape carrier. Depending on the direction in which the projecting portions 13 at the four corners of the tape clamp hole 12 are shifted, each corner of the device hole 6 can be seen, so the shift and the direction of the shift can be immediately determined from the top surface of the tape carrier. Correction work can be easily performed.

Overhanging portions 13 at the four corners of the tape clamp hole
Even if the inner leads are located at each corner of the device hole, the inner leads are usually not located near these corners, so they do not pose an obstacle during ILB. Note that the present invention is not limited to the above-mentioned embodiments, and various modifications can be made based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

[0016]

As described above in detail, according to the present invention, overhanging portions are provided at the four corners of the tape clamp hole of the tape clamp plate, and the tops of the overhanging portions are arranged at each corner of the device hole of the tape carrier. The position of the clamp hole on the clamp plate can be detected immediately from the top surface of the tape carrier by matching the position of the clamp hole or slightly coming out of the device hole, and the direction of the displacement can be easily determined. The position can be corrected accurately.

Therefore, it is possible to eliminate defects such as lead peeling and lead displacement after ILB due to non-uniform holding of the tape carrier during ILB due to misalignment of the clamp plate as in the prior art.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a tape clamp plate showing an embodiment of the present invention.

FIG. 2 is a plan view showing a state in which a device hole and a tape clamp plate are aligned at regular positions, as seen from the top surface of a tape carrier showing an embodiment of the present invention.

FIG. 3 is a schematic diagram of a structure for fixing a tape carrier of a bonding apparatus that performs conventional ILB.

FIG. 4 is a plan view of a conventional tape clamp plate.

FIG. 5 is a plan view of a conventional tape carrier, viewed from the top surface, showing a state in which a device hole and a tape clamp plate are aligned at regular positions.

FIG. 6 is a plan view showing a state in which a conventional device hole and a tape clamp plate are misaligned.

[Explanation of symbols]

2 Tape carrier 6 Device hole 11 Tape clamp plate 12 Tape clamp hole 13 Overhang part

Claims (2)

[Claims] 1. A method for manufacturing a semiconductor device using a tape carrier method, which includes: (a) forming projecting portions at the four corners of a tape clamp hole of a tape clamp plate for fixing the tape carrier, and (b) forming overhangs on the tape carrier. A method of manufacturing a semiconductor device, the method comprising: aligning a device hole formed on the tape clamp plate with a tape clamp hole of the tape clamp plate at four corners of the device hole. 2. A tape clamp plate in which overhangs are formed at the four corners of a tape clamp hole for alignment with the four corners of a device hole formed on a tape carrier.