JPH04225180A - Test head of measuring device for semiconductor - Google Patents

Abstract

PURPOSE:To contrive very accurate measurement including the simplification of an application board, the development to a CAT and the calibration. CONSTITUTION:An application board and a calibration board are separated from a test head body, and to this test head body, the switching matrix of an alternating applying signal for measurement to an IC to be tested (on the application board), the switching matrix of an alternating measuring signal from the IC, an AC/DC pin card, a switching board of calibration and a contact pin (to make spring action) are arranged.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention is applicable to televisions, VTRs, etc.
, relates to a test head for a semiconductor measuring device suitable for measuring DC parameters, AC parameters, etc. of analog devices such as communication equipment (IC/LSI devices).

0002

2. Description of the Related Art A conventional example of this type is shown in FIG. Here, 101 is an automatic tester, 102 is a relay matrix, and 10
3 to 106 are DC parameter measuring devices connected to the relay matrix 102, 107 to 109 are signal sources for AC parameter measurement, 110 to 112 are voltmeters for AC parameter measurement, 113 is an application board, 114 is a connection connector, 115 to 120 is a coaxial cable for connection, 12
1 is the device under test (IC to be measured), 122 to 127 are DC/
AC (DC/AC) measurement parameter measurement switching relays, 128 and 129 are attenuators, 130 and 131 are terminator resistors, 132 and 133 are condition circuits according to measurement standards, 134 to 136 are signal source switching circuits for AC parameter measurement, 137 to 139 is a voltmeter switching circuit for measuring AC parameters, and 140 and 141 are buffer amplifiers.

0003

[Problems to be Solved by the Invention] What can be seen from the above conventional test head is that the application board 113
Since the configuration of the application board 113 is very complicated, (1) it takes time to design, manufacture, and develop a test program for the application board 113; (2) Application boards for analog equipment are difficult to arrange in a regular pattern like those for digital equipment, so
It is difficult to develop CAT (computer aided testing) (automatic generation of test programs). (3) Particularly in the analog equipment described above, since the application board 31 is complex, there are individual differences in the degree of completion of this board and test program, and high precision and high stability measurements cannot be expected. There were other problems.

[0004] Therefore, an object of the present invention is to simplify the board by devising the configuration of the application board.
This makes it easy to expand into CAT and perform high-precision measurements including calibration.

[0005]

[Means and Effects for Solving the Problems] The present invention provides a matrix circuit for switching AC applied signals for measurement of an integrated circuit under test, a matrix circuit for switching AC measurement signals obtained from the integrated circuit under test, and a matrix circuit for measuring DC parameters. , a DC/AC pin card for performing one or more of the following functions: AC signal input for measurement, AC signal measurement, and a contact pin connected to this pin card to make contact with an application board. A test head for a semiconductor measuring device, comprising: a calibration switching board for calibrating a measurement system; and a connection means for connecting each of the matrix circuits, pin cards, switching board and the tester. be.

That is, in the conventional system, the entire tip end of an automatic tester was treated as one test head, and its design was left to the designer. In the present invention,
The application board and the calibration board are separated from the test head main body, and the test head main body includes a switching matrix for the AC measurement signal to be applied to the IC under test (located on the application board), and a switching matrix for the AC measurement signal from the IC under test (located on the application board). Place the switching matrix, AC/DC pin card, calibration switching board, and contact pins (for spring action). Since each of these components within the test head main body can be easily arranged regularly, problems such as the above-mentioned conventional problems (1) to (3) can be easily improved.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a block diagram of an embodiment of the present invention. In the figure, 1 is an automatic tester, 2 is a DC measurement (DC characteristic measurement of the IC under test) device, 3 is a GND (grounding) system, and 4 and 5 are signal sources for measuring AC parameters (or arbitrary waveform generators).
, 6 and 7 are voltmeters (or waveform digitizers) for measuring AC parameters, 8 to 11 are switching relays, and 12 to 19 are connection coaxial cables. 20 is a tester (measurement) head, 21 is a connection connector, 22 is an AC applied signal switching matrix, 24 to 26 are AC/DC pin cards, 27
28 to 31 are connection coaxial cables, 32 to 37 are pin connectors with spring action, and 38 and 39 are connection coaxial cables. 40 is an application board, 41 is a device to be measured I
C (test device). PIN1 to PINn each correspond to a pin of the IC 41 under test, and there are actually two pins each, and they are normally used as a signal pin and a GND (ground) pin. Here, pins 32 to 37 are used for the functions necessary for all measurements, ie, DC parameter measurement, measurement AC signal input, and AC signal measurement. In other words, PIN1 to PINn serve as measurement pins for all or part of these three functions. The application board 40 is the IC4 to be measured.
1 etc. may be placed on a printed circuit board.

The test head 20 is connected to the automatic tester 1 and is used in contact with the terminals of the application board. The DC measuring device 2 uses pins DP1 to DPn (n indicates the number of pins) to apply a DC voltage, apply a current,
It has functions such as voltage measurement, voltage applied current measurement, current applied voltage measurement, etc., and a device with this function is connected to the measurement pin DP.
1 to DPn to form a matrix, and there are cases where a device having the above function is connected to each measurement pin. It is also used for supplying DC power to the IC 41 to be measured when measuring AC parameters. Specifically, the AC parameter measurement signal sources (or arbitrary waveform generators) 4 and 5 generate audio signals, video/chroma signals, and RF signals, and are used as input signals for the IC 41 to be measured. Voltmeter (or waveform digitizer) for measuring AC parameters
Reference numerals 6 and 7 measure signals from the IC under test, and have the functions of an audio voltmeter, a video/chroma voltmeter, and an RF voltmeter. In the above measurement, the GND system 3 supplies a GND potential to the IC to be measured using direct current or alternating current, and determines the GND potential for measurement.

FIG. 2 is a more specific diagram of FIG. 1. The DC measurement device 2 in FIG. 2(a) has a relay matrix configuration for DC measurement. Here, the cross point 2a is a switch S as shown in FIG. 2(b). 51 is an audio signal generator, 52 is an RF signal generator, 53 is a video/chroma signal generator, and 54 is a VTR signal generator. 55 is an audio voltmeter, 56 is an RF voltmeter, 5
7 is a video/chroma voltmeter, and 58 is a VTR voltmeter. 59 to 66 are switching relays, and 67 to 82 are connection coaxial cables.

In the test head 20, the number n of AC/DC pin cards 24 to 26 is set to 96 here. Therefore, the single index of the connection connector, the number of outputs of the AC applied signal switching matrix, the number of outputs of the AC measurement signal switching matrix, etc. are also 96. The coaxial cables A to H to the calibration switching board and the coaxial cables A to H of the test head 20 correspond to each other.

FIG. 3 shows AC applied signal switching matrix 2.
This is a specific example of 2. 91 is an analog switch or mechanical relay, 92 is a buffer, and Z0 is a matching resistor. The AC applied signal is applied signal output APS1 to APS
With respect to 96, an analog switch or mechanical relay 91 allows selection of a necessary AC applied signal. FIG. 4 is a specific example of the AC measurement signal switching matrix 23. AC measurement signal APM1 from IC41 under test
- It is possible to select connection of AC measurement (or waveform digitizer) 6 or 7 to the APM96.

FIG. 5 shows an AC/DC pin card (eg 26
) (here, only one pin is shown). This is used for the functions necessary for all measurements by this test head, that is, DC parameter measurement, measurement AC signal input, and AC signal measurement. 101 (same as 32), 102 are contact pins, 103 is a part of the card 26, 104 is a wiring pattern, 105 is a coaxial cable, and K1 to K8 are relay contacts. These are DC measurement pin DPn (n is the number of pins), AC application signal pin APSn, and AC measurement signal pin AP.
Connect Mn and GND to relays K1 to K to PINn on the application board according to measurement conditions.
This can be done by operating 8.

FIG. 6 shows a specific example of the calibration switching board 27, and FIG. 7 shows a specific example of the calibration board 121. In these figures, 111 is a calibration application signal line, and 112 is a measurement line. An example of the operation is to input a signal to PIN1 in FIG. Send it to one of these locations and perform calibration measurements. If there is an error, it is corrected to a correct value (for example, the transmission voltage of the signal source 4) using software. By combining it with the calibration switching board 27 in this way, it becomes possible to calibrate PINn to ensure accuracy.

FIG. 8 shows CA using the test head 20.
Regarding the expansion to T, a model of the measurement circuit and the concept of connection to the test head are shown. In the figure, reference numeral 131 indicates a generalized device under test (IC under test) 41, reference numeral 132 indicates a circuit section specified by measurement conditions, reference numeral 133 indicates a terminal thereof, and reference numeral 134 indicates a wire.

FIG. 9 shows, as an example of CAT development using this test head, an automatic program generation table based on input of measurement conditions into a table. In this table, test #1, 2, 3, ... are the test types, VF is DC voltage application, ASG is audio signal generator, AVM is audio voltmeter, R
FSG is RF signal generator, RFVM is RF voltmeter, VC
SG is video/chroma signal generator, VCVM is video/chroma signal generator
Chroma voltmeter, VM indicates DC voltage measurement. In this table,
For example, look at "Test #1" along the column next to it. For example, "VF 5V" means setting VF to 5V. Enter 1KHZ from AGS for PIN2. PIN3 is V
Set F to 0V. PIN96 measures AVM. This figure 9
If you create a table, the computer can automatically generate a test program by reading its contents.

As described above, (1) it is possible to significantly reduce the number of components on the conventional application board (1/3 of the conventional one), and it is possible to reduce the board design, production, and adjustment period. (2) Test head 20 despite being an analog device
Since the pattern arrangement of each part of is regular and simplified,
It becomes possible to simplify the test program and expand it to CAT. Incidentally, if there is a chart like the one shown in FIG. 9, a computer can read the contents and automatically generate a test program. (3) Since the test head 20 is simplified, individual differences are extremely small and highly accurate measurements including calibration can be performed.

[0017]

As described above, according to the present invention, it is possible to simplify the test head main body, to apply it to CAT, and to easily perform high-precision measurements including calibration.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is a specific configuration diagram of FIG. 1, in which (a) is an overall configuration diagram and (b) is a partially detailed diagram of (a).

FIG. 3 is a partially detailed view of FIG. 1;

FIG. 4 is a partially detailed view of FIG. 1;

FIG. 5 is a partially detailed view of FIG. 1;

FIG. 6 is a partially detailed view of FIG. 1;

FIG. 7 is a partially detailed view of FIG. 1;

FIG. 8 is a diagram showing an example of application to CAT according to the present invention.

FIG. 9 is a diagram showing an example of application to CAT according to the present invention, and for automatically generating a program by inputting measurement conditions in a table.

FIG. 10 is a configuration diagram of a conventional head.

[Explanation of symbols]

1...Automatic tester, 12-19...Coaxial cable for connection, 2
0...Test head, 21...Connection connector, 22...AC applied signal switching matrix, 23...AC measurement signal switching matrix, 24-26...AC/DC pin card, 2
7...Calibration switching board, 32-37...
Contact pin, 40...Application board, 41
...IC to be measured.

Claims (1)

[Claims] 1. A matrix circuit for switching an AC applied signal for measurement of an integrated circuit under test, a matrix circuit for switching an AC measurement signal obtained from the integrated circuit under test, a DC parameter measurement, an AC signal input for measurement, and an AC signal measurement. A DC/AC pin card for performing one or more of the following functions, a contact pin connected to this pin card to make contact with the application board, and a contact pin for calibrating the measurement system via this pin. 1. A test head for a semiconductor measuring device, comprising: a calibration switching board; and connection means for connecting each of the matrix circuits, pin cards, switching board, and a tester.