JPH0422467A - Nozzle - Google Patents
NozzleInfo
- Publication number
- JPH0422467A JPH0422467A JP12743990A JP12743990A JPH0422467A JP H0422467 A JPH0422467 A JP H0422467A JP 12743990 A JP12743990 A JP 12743990A JP 12743990 A JP12743990 A JP 12743990A JP H0422467 A JPH0422467 A JP H0422467A
- Authority
- JP
- Japan
- Prior art keywords
- air bubbles
- liquid
- nozzle
- bubbles
- port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 abstract description 22
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 238000000926 separation method Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明はデイスペンサー装置等に用いるノズルに関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a nozzle used in a dispenser device or the like.
〔従来の技術1
従来のノズルの一例を第4図を用いて説明する。ノズル
本体21の内部に最適径の穴22が明けられている。穴
22内をレジスト、接着剤等の液体が流下し、IC基板
、回路基板等に塗布される。[Prior Art 1 An example of a conventional nozzle will be explained using FIG. 4. A hole 22 with an optimum diameter is bored inside the nozzle body 21. Liquids such as resist and adhesive flow down through the holes 22 and are applied to IC boards, circuit boards, and the like.
〔発明が解決しようとする課題1
しかし従来のノズルによれば、内部に気泡を含むレジス
ト、接着剤等の液体を塗布すると、塗布された液体の全
体に気泡が残される結果、接着剤等では、硬化時の加熱
の際に、気泡が膨張する結果、接着強度が低下する。も
しくは接着強度がばらつくという問題点を有する。また
液体が感光性レジストの場合には、気泡の部分の露光不
良が発生し、良好なバクーン再現性が得られないという
課題を有する。このようにそれぞれの使用液体の特性を
悪くする課題が発生する。[Problem to be Solved by the Invention 1] However, according to the conventional nozzle, when a liquid such as a resist or adhesive containing air bubbles is applied, air bubbles are left throughout the applied liquid. , the bubbles expand during heating during curing, resulting in a decrease in adhesive strength. Otherwise, there is a problem that the adhesive strength varies. Further, when the liquid is a photosensitive resist, there is a problem that poor exposure occurs in the bubble portion, making it impossible to obtain good Bakun reproducibility. In this way, a problem occurs in which the characteristics of each liquid used are deteriorated.
本発明は以上の課題を解決するためになされたもので、
その目的とするところは、内部に気泡を含む液体を塗布
しても、塗布した液体の中央部に気泡を含まないノズル
を提供することである。The present invention has been made to solve the above problems,
The objective is to provide a nozzle that does not contain air bubbles in the center of the applied liquid even if the liquid that contains air bubbles is applied therein.
[課題を解決するための手段1
本発明のノズルは、給入口と吐出口の中間に気泡分離部
を設けたことを特徴とする。[Means for Solving the Problems 1] The nozzle of the present invention is characterized in that a bubble separating section is provided between the supply port and the discharge port.
[実 施 例]
本発明のノズルの一実施例を第1図の断面図により説明
する。1はノズルの給入口であって、ディスベンサーに
取付ける部分である。給入口1から管はノズルの中心方
向に延長され、2の気泡分離部中へ、上向きに放出する
放出部3へと接続される。気泡分離部2は、上がってき
た気泡を外へ出すための穴4とノズル外周にある穴4に
接続するバイパス路5から構成される。気泡分離部2の
下方は吐出口6が構成されている。バイパス路5と吐出
口はほぼ同じ高さである。[Example] An example of the nozzle of the present invention will be described with reference to the sectional view of FIG. 1 is a nozzle inlet, which is a part to be attached to the dispenser. From the inlet 1 the tube extends towards the center of the nozzle and is connected into the bubble separation section 2 to the discharge section 3 which discharges upwards. The bubble separating section 2 is composed of a hole 4 for discharging rising bubbles and a bypass path 5 connected to the hole 4 on the outer periphery of the nozzle. A discharge port 6 is formed below the bubble separating section 2 . The bypass passage 5 and the discharge port are at approximately the same height.
給入口1から気泡の入った液体を流入すると、液体は放
出部3から気泡分離部2中に放出される。この際、液体
中の気泡は上方に集められ穴4を通り、バイパス路5中
へ導かれる。気泡が分離された液体は下方の吐出口6か
ら吐出される。When liquid containing bubbles flows in from the supply port 1, the liquid is discharged from the discharge section 3 into the bubble separation section 2. At this time, bubbles in the liquid are collected upward, pass through the hole 4, and are guided into the bypass path 5. The liquid from which the bubbles have been separated is discharged from the lower discharge port 6.
その結果吐出された液体の中央部には気泡が入っていな
いので、レジスト塗布、接着剤塗布の場合、中心の重要
部には気泡がなく、レジスト塗布の際は、レジストの吐
出後、スピンナー等で回転させてレジストを拡散させる
が、中央に気泡がないため、スピンナーで回転後は全面
に気泡のないレジスト肋が得られる。また接着剤を吐出
した際も中心部は気泡がないので、ICチップの貼り付
(づ等に用いても、強度の安定した接着が得られる。As a result, there are no air bubbles in the center of the ejected liquid, so when applying resist or adhesive, there are no air bubbles in the central important area. It is rotated with a spinner to spread the resist, but since there are no air bubbles in the center, after rotation with a spinner, resist ribs without air bubbles can be obtained over the entire surface. Furthermore, even when the adhesive is discharged, there are no air bubbles in the center, so even when used for attaching IC chips, etc., stable adhesive strength can be obtained.
なお、以上の実施例では、バイパス路5の出口は、吐出
口6の周辺に設けてあり気泡を含んだ液が、気泡を含ん
でいない液の近辺に出てしまうが、第2図に示すように
、バイパス路7の出口を配管8により、吐出口9から遠
距離へ運び気泡を完全に分離することができる。In the above embodiment, the outlet of the bypass path 5 is provided around the discharge port 6, and the liquid containing bubbles comes out near the liquid that does not contain bubbles, but as shown in FIG. Thus, the outlet of the bypass path 7 can be carried far away from the discharge port 9 by the piping 8, and air bubbles can be completely separated.
また、第3図に示すとおり、気泡分離部10を充分体積
を大きくすれば、バイパス路が不要である。向、放出バ
ルブ11を設は吸引すれば、気泡は容易に抜ける。Moreover, as shown in FIG. 3, if the volume of the bubble separating section 10 is made sufficiently large, a bypass path is not necessary. If the release valve 11 is set up and suction is applied, the air bubbles can be easily removed.
[発明の効果]
以上に示す本発明によれば、内部に気体を含む液体を吐
出しても、液体が、外周部及び外部に導かれる構造とな
っているので、吐出した液体の中心部に気泡の発生がな
く、なめらかな塗布面が得られ、気泡による塗りむらが
なくなる。そのため例えば、接着剤を吐出した際は、均
等の膜厚が得られるので、安定した接着が可能であり、
また、感光性レジスト等の塗布に用いると、安定なレジ
スト塗布ができ、感光の均一性により1品質が向上する
。[Effects of the Invention] According to the present invention described above, even if a liquid containing gas inside is discharged, the liquid is guided to the outer periphery and outside, so that the center of the discharged liquid is No air bubbles are generated, a smooth coating surface is obtained, and uneven coating due to air bubbles is eliminated. Therefore, for example, when dispensing adhesive, a uniform film thickness is obtained, allowing for stable adhesion.
Furthermore, when used for coating a photosensitive resist, etc., stable resist coating can be achieved, and the quality is improved due to the uniformity of exposure.
第1図は本発明のノズルの一実施例を示す断面図、第2
図は本発明のノズルの他の実施例を示す断面図、第3図
は本発明のノズルの更に他の実施例を示す図、第4図は
従来のノズルを示す図。
1・・・・・・給入口
2.10・・・気泡分離部
3・・・・・・放出部
4・・・・・・八
5.7・・・・バイパス路
6.9・・・・吐出口
8・・・・・・配管
11・・・・・・放出バルブ
21・・・・・・ノズル本体
22 ・
・・八
以
上FIG. 1 is a sectional view showing one embodiment of the nozzle of the present invention, and FIG.
The figure is a sectional view showing another embodiment of the nozzle of the present invention, FIG. 3 is a diagram showing still another embodiment of the nozzle of the present invention, and FIG. 4 is a diagram showing a conventional nozzle. 1...Inlet port 2.10...Bubble separation section 3...Discharge section 4...85.7...Bypass path 6.9...・Discharge port 8...Piping 11...Discharge valve 21...Nozzle body 22...8 or more
Claims (1)
徴とするノズル。A nozzle characterized in that a bubble separating section is provided between an inlet and an outlet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12743990A JPH0422467A (en) | 1990-05-17 | 1990-05-17 | Nozzle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12743990A JPH0422467A (en) | 1990-05-17 | 1990-05-17 | Nozzle |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0422467A true JPH0422467A (en) | 1992-01-27 |
Family
ID=14959976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12743990A Pending JPH0422467A (en) | 1990-05-17 | 1990-05-17 | Nozzle |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0422467A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10087081B2 (en) | 2013-03-08 | 2018-10-02 | Ecolab Usa Inc. | Process for producing high solids colloidal silica |
-
1990
- 1990-05-17 JP JP12743990A patent/JPH0422467A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10087081B2 (en) | 2013-03-08 | 2018-10-02 | Ecolab Usa Inc. | Process for producing high solids colloidal silica |
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