JPH04223205A - Substrate position detection device - Google Patents

Abstract

PURPOSE:To enable an abnormality of a location where a substrate is located to be detected before substrate treatment is performed. CONSTITUTION:A substrate 5 consisting of a silicon for reflecting light is placed on a turntable 6 consisting of a non-reflection plate within a film-forming chamber 1. A light-source lamp 9, a plurality of reflection mirrors 10, and a light- receiving device 11 are placed at a position opposing the substrate 5. Light which is emitted from the light source lamp 9 repeats to be reflected between the substrate 5 and the reflection mirror 10, is received by the light-receiving device 11, and then a detection signal is sent to a control part 4.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate position detection apparatus, and more particularly to a substrate position detection apparatus for detecting the position of a substrate placed on a substrate mounting table of a substrate processing apparatus.

0002

2. Description of the Related Art In substrate processing equipment such as radio frequency (RF) sputtering equipment and ECR (electron cyclotron resonance) etching equipment that forms films on substrates or etches substrates, a substrate is used to set the substrate. A mounting table is provided within the substrate processing chamber. Then, the substrate is once taken into a transfer chamber provided adjacent to the substrate processing chamber, and is set on a substrate mounting table in the substrate processing chamber by a transfer unit in the transfer chamber. After that, processes such as film formation and etching are performed on the substrate.

0003

[Problems to be Solved by the Invention] In conventional substrate processing equipment, when setting a substrate on a substrate mounting table in a substrate processing chamber, the substrate may be placed out of its normal position or may be placed at an angle. There may be cases where If processing is performed without properly setting the substrate, the desired film thickness distribution or etching pattern will not be obtained, and the yield of the substrate will decrease. In conventional substrate processing apparatuses, setting of the substrates relies only on the accuracy of the transport mechanism, and does not detect the placement status of the substrates.

An object of the present invention is to provide a substrate position detection device that can detect whether or not a substrate is correctly placed before substrate processing is performed in a substrate processing apparatus, and can improve the yield of substrates. It's about doing.

[0005]

SUMMARY OF THE INVENTION A substrate position detecting device according to the present invention is a device for detecting the position of a substrate placed on a substrate mounting table of a substrate processing apparatus. This device includes a light irradiation means for irradiating light onto the substrate mounting table side, a light receiving means for detecting the light reflected from the substrate mounting table side, and a detection signal from the light receiving means to position the substrate on the substrate mounting table. and positional deviation detection means for detecting deviation.

[0006]

[Operation] In the substrate position detection device according to the present invention, light from the light irradiation means is irradiated onto the substrate set on the substrate mounting table in the substrate processing apparatus. The light reflected from the substrate side is detected by the light receiving means, and the detection signal is sent to the positional deviation detecting means. The positional deviation detection means detects the positional deviation of the substrate based on the result of light reception by the light receiving means.

[0007] In this way, it is possible to detect whether or not the substrate is correctly set on the substrate mounting table before processing the substrate.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a schematic configuration of a sputtering apparatus to which an embodiment of the present invention is applied.

In the figure, the present sputtering apparatus includes a film forming chamber 1 in which film formation is performed, a transfer chamber 2 disposed adjacent to the film forming material 1, a wafer case 3 containing a substrate, and a sputtering chamber 1. It mainly consists of a control section 4 that controls the entire device.

A turntable (substrate mounting table) 6 on which a substrate 5 is placed is arranged at the lower part of the film forming chamber 1 . The upper surface of the turntable 6 is formed of a non-reflective plate, and can be rotated by commands from the control section 4. A target 7 is arranged at a position facing the side of the turntable 6 far from the transfer chamber 2. Target 7 is
It is connected to a high frequency power source 8 outside the film forming chamber 1 via a matching box (not shown). The high frequency power source 8 supplies power to the target 7 according to a command from the control section 4 .

A light source lamp 9 and a plurality of reflecting mirrors 10 are installed at a position facing the side of the turntable 6 close to the transfer chamber 2.
and a light receiving device 11 are arranged. The light source lamp 9 irradiates light onto the turntable 6 side according to a command from the control section 4 . The plurality of reflection mirrors 10 are arranged in a circumferential manner above the substrate 5, as shown in FIG. Light receiving device 1
1 is a light source lamp 9 via a reflecting mirror 10 and a substrate 5.
The light detection signal received from the control unit 4 is sent to the control unit 4. Although not shown, the film forming chamber 1 is connected to a vacuum evacuation device for evacuating the inside of the film forming chamber 1 and a gas introduction device.

Furthermore, the control section 4 determines whether or not there is an abnormality in the set position of the board 5 based on the detection signal from the light receiving device 11, and displays the result on the CRT 12.

A transport unit 13 is arranged within the transport chamber 2 . The transport unit 13 has a substrate gripping claw 14, rotates in response to a command from the control section 4, and transports the substrate gripping claw 14 between the film forming chamber 1 and the wafer case 3.

Next, the operation will be explained.

First, the substrate gripping claws 14 of the transport unit 13
grips the substrate 5 on which a film is to be formed inside the wafer case 3 . Next, the transfer unit 13 rotates according to a command from the control section 4, and the substrate 5 is placed on the side of the turntable 6 closer to the transfer chamber 2.

According to a command from the control unit 4, the light source lamp 9
Light is irradiated from there toward the substrate 5 placed on the turntable 6. The light irradiated onto the substrate 5 is reflected upward as shown in FIG. 2, and then reflected back toward the substrate 5 by the reflection mirror 10. As shown in FIG.
By reflecting between each point, point e, and the reflecting mirror 10,
The light is received by the light receiving device 11. At this time, if the board 5 is not placed in the correct position on the turntable 6,
The light from the reflection mirror 10 side is irradiated onto the turntable 6, which is a non-reflection plate, and the light is no longer received by the light receiving device 11. Further, if the substrate 5 is placed on the turntable 6 at an angle, the angle of the reflected light from the substrate 5 changes and the light is no longer received by the light receiving device 11. In this way, if there is an abnormality in the arrangement of the substrate 5, it can be determined by the fact that the light receiving device 11 does not receive light. The light receiving device 11 sends a detection signal indicating whether or not light has been received to the control unit 4 . The presence or absence of an abnormality in arrangement is determined from the detection signal sent to the control section 4, and the result is displayed on the CRT 12.

If there is an abnormality in the placement of the substrate 5, the film forming process is stopped by a command from the control unit 4, and the position of the substrate can be changed correctly. In this way, in this apparatus, an abnormality in the arrangement of the substrate 5 can be detected before the film forming process.

When light is received by the light receiving device 11 and it is confirmed that there is no abnormality in the arrangement of the substrate 5, the turntable 6 is rotated by a command from the control section 4, and the substrate 5 is placed in a position facing the target 7. Placed. Subsequently, power is supplied from the high frequency power supply 8 to the target 7 according to a command from the control unit 4, and sputtering is performed between the target 7 and the substrate 5. After the film formation is completed, the turntable 6 rotates,
The substrate 5 is placed on the transfer chamber 2 side. The transport unit 13 grips the substrate 5 with the board gripping claws 14, and the transport unit 1
3 rotates and stores the substrate 5 on which the film has been formed into the wafer case 3.

[Other Embodiments] (a) In the embodiment described above, a plurality of reflecting mirrors 10 are disposed between a pair of light source lamps 9 and a light receiving device 11 to prevent abnormalities in the overall arrangement of the substrate 5. However, a pair of light source lamps 9 and a light receiving device 11 may be arranged at a plurality of points on the substrate 5 without using a reflecting mirror. According to this embodiment, it is possible to determine whether the abnormality in substrate placement is a lateral positional deviation, a rotational deviation, or an inclination. In addition, it is possible to identify points where there is an abnormality.

That is, as shown in FIG. 4, each point on the substrate 5 is irradiated with light from the light source lamp 9. Figure 5
shows a table for determining the presence or absence of an abnormality and its type. No. 1 indicates that all the light receiving devices at each point receive light and the board arrangement is performed normally. No. 2~No. Up to 4, no light was received at the points marked with an x mark, indicating that there was a positional shift. No.
5, point e is No. 6, no light is received at point a, which indicates that the substrate 5 has rotated and the chipped portion of the substrate 5 has rotated to point a or point e. No. 7, light is not received at all points, which indicates that the substrate 5 is arranged at an angle.

(b) In the above embodiment, silicon, which reflects light, was used for the substrate 5, but if the substrate 5 is made of a material that does not reflect light, a material that reflects light may be used toward the turntable 6 side. .

Examples of this case are shown in FIGS. 6 and 7. The light irradiated from the light source lamp 9 is reflected at points A, B, C, D, and E on the turntable 6 around the substrate 5 between a plurality of reflecting mirrors 10, and then sent to the light receiving device. 11
The light is received by the Since each point is set close to the periphery of the substrate 15, if the substrate 15 is misaligned, the substrate 15
The covered points no longer reflect light, and the light receiving device 11 does not receive light. In this way, a positional shift during placement of the substrate 5 can be detected.

(c) In the above embodiment, one embodiment of the present invention was adopted for the sputtering apparatus, but it may be used for other substrate processing apparatuses.

[0024]

Effects of the Invention The substrate position detection device according to the present invention can detect displacement of a substrate before processing the substrate. Therefore, by using the substrate processing apparatus of the present invention, a substrate processing apparatus with a high yield after substrate processing can be realized.

[0025]

[Brief explanation of the drawing]

FIG. 1 is a schematic configuration diagram of a substrate processing apparatus employing an embodiment of the present invention.

FIG. 2 is a schematic plan view of the substrate position detection device.

FIG. 3 is a schematic configuration diagram of a substrate position detection device.

FIG. 4 is a diagram corresponding to FIG. 3 of another embodiment.

FIG. 5 is a plan view of an abnormality determination table according to another embodiment.

FIG. 6 is a diagram corresponding to FIG. 2 of another embodiment.

FIG. 7 is a diagram corresponding to FIG. 3 of another embodiment.

[Explanation of symbols]

4 Control section 5　Substrate 6 Turntable 9 Light source lamp 11 Photo receiving device

Claims (1)

[Claims] 1. A substrate position detection device for detecting the position of a substrate placed on a substrate mounting table of a substrate processing apparatus, the device comprising: a light irradiation means for irradiating light onto the substrate mounting table side; A substrate position detection device comprising: a light receiving means for detecting light reflected from a mounting table side; and a positional deviation detecting means for detecting a positional deviation of a substrate on the substrate mounting table based on a detection signal from the light receiving means.