JPH04223073A - Electrical connecting device - Google Patents

Abstract

PURPOSE:To provide connecting members in a high density while preventing a short circuit of the connecting members and wirings, as to an electrical connecting device to connect electrically with members to be connected by plural connecting members planted on an insulating substrate. CONSTITUTION:An electrical connecting device 1 is composed of an insulating substrate 2 in which plural multilayer wirings 4 to 6 are formed; and connecting members 3 which consist of cylindrical fixing members 7 composed of a conductive material, fixed in the condition buried in the above insulating substance 2, and housing a coil spring 10 inside each member, and contacts 9 welded by pressure to a substrate 8 to be connected through the spring force of the springs 10 being connected electrically to the substrate 8 to be connected. Furthermore, the connecting device 1 is composed by connecting electrically the above contacts 9 and the cylindrical fixing members 7, and by using the above cylindrical fixing members 7 as wirings, so as to connect the above multilayer wirings 4 to 6.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to an electrical connection device,
In particular, the present invention relates to an electrical connection device that electrically connects a connected member using a plurality of connection members embedded in an insulating substrate.

[0002] In connection between circuit wiring boards or semiconductor boards arranged in electronic devices such as computers, a plurality of wires are connected all at once, and this connection is performed using an electrical connection device such as a connector. This is done using Particularly in computers that have increased in capacity in recent years, it is necessary to connect a large number of wires at once, and therefore the density of connection pins provided in electrical connection devices has also increased.

[0003]Therefore, there is a need for an electrical connection device that can reliably connect a large number of wiring lines even when connection pins are arranged at a high density.

0004

[Prior Art] As a device for electrically connecting circuit wiring boards or semiconductor boards generally arranged in electronic equipment,
Connector devices are known that include a male connector and a female connector. This connector device is configured to electrically connect the wires connected to each connector by fitting a male connector into a female connector. However, in a connector device with this configuration, as the number of wires increases, the force required to insert the male connector into the female connector and the force required to pull out the male connector from the female connector increases, resulting in poor insertion/removal operability. Become.

[0005] Also, a zero-insertion type connector device is known as an electrical connection device with improved operability during insertion and removal. In this connector device, a contact is provided on a board at a position to be electrically connected, a connecting pin is provided at a position facing the contact on the other board, and the connecting pin is pressed against the contact, thereby connecting both boards. The structure was designed to provide electrical connection between the two. Further, each connection pin was configured to have a wiring connected to it by soldering or the like.

[0006]

[Problems to be Solved by the Invention] However, in the above-mentioned zero-insertion type electrical connection device, as the number of wires to be connected increases and the density of the connection pins increases, the density of the wires connected to each connection pin increases. There was a problem that the structure near the connection pin arrangement position became complicated. If the density of the wires connected to each connection pin increases in this way, short circuits will occur between the connection pins and between the wires. On the other hand, if an attempt is made to prevent this short circuit, the connection pins must be placed apart from each other, which goes against high density.

The present invention has been made in view of the above points, and provides an electrical connection device in which connection members (connection pins) and wiring can be arranged at high density while preventing short circuits between the connection members (connection pins) and wiring. The purpose is to

[0008]

[Means for Solving the Problems] In order to solve the above problems, the present invention includes an insulating substrate in which a plurality of multilayer wirings are formed, and a conductive material embedded in the insulating substrate. A connection consisting of a cylindrical fixing part that is fixed by a cylindrical member and has a spring stored therein, and a contact part that presses against a member to be connected through the spring force of the spring and electrically connects with the member to be connected. and an electrical connection device configured by electrically connecting the contact portion and the cylindrical fixing portion, and using the cylindrical fixing portion as wiring to connect to the multilayer wiring. It is characterized by the fact that

[0009] Furthermore, the contact portion is configured to be displaceable within the cylindrical fixing portion, and a liquid is formed at a position inside the cylindrical fixing portion where the contact portion and the cylindrical fixing portion face each other at a temperature in the above-mentioned connected state. A structure may be adopted in which an easily fusible metal is provided and the contact portion and the cylindrical fixing portion are electrically connected via the easily fusible metal. Furthermore, within the insulating substrate, the extending direction of the cylindrical fixing portion and the extending direction of the multilayer wiring may be substantially perpendicular to each other.

0010

[Operation] According to the electrical connection device having the above structure, the cylindrical fixed part of the connecting member is used as a wiring, and this cylindrical fixed part is connected to the multilayer wiring, so that the wire is connected to the connecting member. wiring can be placed inside the insulating board,
It is possible to simplify the structure near the location where the connecting member is provided, and also to prevent short circuits between wirings.

[0011]

Embodiments Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a partially cutaway perspective view of an electrical connection device 1 according to an embodiment of the present invention. This electrical connection device 1 is
It is composed of an insulating substrate 2 and a connecting member 3, and has the function of electrically connecting, for example, a circuit board or a semiconductor substrate disposed within an electronic device.

The insulating substrate 2 is, for example, a laminated substrate in which a plurality of glass epoxy sheets are laminated. This insulating substrate 2
Each of the glass epoxy sheets constituting the epoxy sheets has wiring printed thereon in a predetermined pattern, so that the insulating substrate 2 has a structure in which multilayer wirings 4 to 6 (shown with matte finish in the figure) are formed inside. It has become. In addition, the insulating substrate 2 has
Fitting holes 2a are formed at a predetermined pitch, and the connecting member 3 is fitted and fixed into the fitting holes 2a.

The connecting member 3 includes a cylindrical fixing part 7 having a cylindrical shape with a bottom, a connecting part 9 that is pressed into contact with a connected board 8 (shown in FIG. 2), and a cylindrical fixing part 7 housed in the cylindrical fixing part 7. coil spring 1
0. Figure 3 shows a cross-sectional view of the connecting member 3.
Each member shown in (A) and constituting the connecting member 3 will be explained below.

The cylindrical fixing portion 7 is made of a conductive metal material. A coil spring 10 is housed within this cylindrical fixing part 7, and a connecting part 9 is disposed above it. A flange-shaped part 9a is formed at the lower part of the connecting part 9, and a hemispherical part 9b is formed at the upper part. This connecting portion 9 is also formed of a conductive metal material.

To assemble the connecting member 3, first the coil spring 10 is inserted into the cylindrical fixing part 7, and then the connecting part 9 is inserted from above. And the flange-like part 9a of the connecting part 9
is located inside the cylindrical fixing part 7, and the upper opening 7a of the cylindrical fixing part 7 is caulked inward. With this configuration, the brim portion 9a engages with the caulked upper opening 7a, thereby preventing the connecting portion 9 from separating from the cylindrical fixing portion 7. Further, the connecting portion 9 is biased in the direction of arrow A in FIG. 3(A) by the coil spring 10, and maintains the state shown in the figure. However, when a force is applied in the direction of arrow B in the figure, the connecting portion 9 is displaced within the cylindrical fixing portion 7, and the connecting member 3 performs an expanding and contracting action.

Furthermore, when the connecting portion 9 is inserted into the cylindrical fixing portion 7, a conductive liquid metal 11 is applied between the collar portion 9a and the inner wall of the cylindrical fixing portion 7. This liquid metal 11 is made of, for example, 75.5% by weight gallium (with a melting point of 15.7°C).
It is an alloy of Ga) and 24.5% by weight of indium (In). The liquid metal 11 having this structure is an easily melted metal that becomes liquid at room temperature when the connecting member 3 is used, and when the connecting portion 9 is displaced within the cylindrical fixing portion 7 as described above, the liquid metal 11 also It is displaced with the displacement of the flange-like part 9a, and is always interposed between the flange-like part 9a and the inner wall of the cylindrical fixing part 7. Therefore, regardless of the displacement of the connecting portion 9, the brim portion 9a and the cylindrical fixing portion 7 are configured to be electrically connected.

The connecting member 3 having the above structure is fixed to the insulating substrate 2 by fitting the cylindrical fixing portion 7 into the insertion hole 2a formed in the insulating substrate 2. In this fixed state, the connecting portion 9 is configured to protrude from the upper surface of the insulating substrate 2. Further, as described above, the multilayer wirings 4 to 6 are formed inside the insulating substrate 2, and when the cylindrical fixing part 7 is fitted into the insertion hole 2a, the cylindrical fixing part 7 is connected to the multilayer wirings. It is configured to be connected to 4 to 6. Therefore,
The connecting portion 9 is electrically connected to the multilayer wirings 4 to 6 via the liquid metal 11 and the cylindrical fixing portion 7. Moreover, since the insertion hole 2a is formed in a direction substantially perpendicular to the extending direction of the multilayer wirings 4 to 6, it is possible to connect the cylindrical fixing part 7 to a plurality of multilayer wirings. In this way, by using the configuration in which the cylindrical fixing part 7 is used as a wiring, the signal supplied to the connection part 9 is routed from the multilayer wiring 4 to the liquid metal 11 via the shortest distance, the cylindrical fixing part 7. 6, it is possible to prevent delays in signal transmission time.

FIG. 2 shows that the connecting member 3 having the above structure is
This shows a state in which it faces a connected substrate 8 that is electrically connected thereto. As shown in the figure, a plate-shaped contact 12 is provided at a position facing the connecting portion 9 of the connected board 8. This contact 12 is connected to a pattern (not shown) formed on the connected substrate 8.

In order to electrically connect the connecting member 3 to the connected substrate 8, the above-mentioned liquid metal 13 is applied to the upper part of the hemispherical portion 9b of the connecting portion 9 (see FIG. 3(A) for details). ,
The connecting member 3 and the connected substrate 8 are brought close to each other, and the connecting portion 9 is brought into pressure contact with the contact 12. FIG. 3(B) shows a state in which the connecting portion 9 is in pressure contact with the contact 12. Due to this pressure contact, the connecting portion 9 is displaced against the elastic force of the coil spring 10, and accordingly, the connecting portion 9 presses the contact 12 with a constant pressing force due to the elastic force of the coil spring 10. Further, as described above, the connecting portion 9 is connected to the multilayer wiring 4 via the liquid metal 11 and the cylindrical fixing portion 7.
~6 is electrically connected. Furthermore, as shown in the figure, since the liquid metal 13 is applied to the upper part of the hemispherical portion 9b, in the pressure-welded state, the liquid metal 13 spreads over a wide area between the connecting portion 9 and the contact point 1 due to its surface tension.
It is interposed between 2. Therefore, each of these configurations allows reliable electrical connection between the connecting member 3 and the connected substrate 8.

Furthermore, as described above, the connecting member 3 and the multilayer wirings 4 to 6 are connected by fitting the cylindrical fixing part 7 into the insertion hole 2a, and directly connecting the cylindrical fixing part 7 to the multilayer wirings 4 to 6. This is done by making contact. Therefore, there is no need to solder the wiring to the connecting member 3 as in the conventional case, and the structure in the vicinity of the connecting member 3 can be simplified. Further, the connecting member 3 has a compact cylindrical structure in which a cylindrical fixing portion 7, a connecting portion 9, and a coil spring 10 are linearly arranged. Therefore, the connection members 3 can be arranged with high density on the insulating substrate 2, and a large number of wirings can be connected in a small area.

[0021]

As described above, according to the present invention, by using the cylindrical fixing portion of the connecting member as a wiring,
The wiring connected to the connecting member can be placed inside the insulating substrate, which simplifies the structure in the vicinity of the connecting member's installation position, and also prevents short circuits between the wiring. It has the advantage of being able to be arranged in high density.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view of an electrical connection device that is an embodiment of the present invention.

FIG. 2 is a diagram showing a state in which the electrical connection device shown in FIG. 1 faces a connected board;

FIG. 3 is a diagram for explaining the structure and operation of a connecting member.

[Explanation of symbols]

1 Electrical connection device 2 Insulating substrate 3 Connection member 4-6 Multilayer wiring 7 Cylindrical fixing part 8 Connected board 9 Connection part 10 Coil spring 11,13 Liquid metal

Claims (3)

[Claims] Claim 1: A cylindrical fixing device comprising an insulating substrate on which a plurality of multilayer wirings are formed, and a conductive material, which is fixed while being embedded in the insulating substrate, and a spring is housed inside the insulating substrate. and a connecting member comprising a contact portion that presses against a connected member through the spring force of the spring and electrically connects with the connected member, the contact portion and the cylindrical fixing part are electrically connected to each other, and the cylindrical fixing part is used as a wiring to be connected to the multilayer wiring. 2. The contact portion is configured to be displaceable within the cylindrical fixing portion, and the connection state is set at a position facing the contact portion and the cylindrical fixing portion inside the cylindrical fixing portion. 2. The electrical connection device according to claim 1, further comprising: an easily fusible metal that becomes liquid at a temperature of , and electrically connects the contact portion and the cylindrical fixing portion via the easily fusible metal. . 3. The electrical connection device according to claim 1, wherein the extending direction of the cylindrical fixing portion and the extending direction of the multilayer wiring are substantially perpendicular to each other within the insulating substrate.