JPH0422006A - Insulated wire - Google Patents
Insulated wireInfo
- Publication number
- JPH0422006A JPH0422006A JP12464590A JP12464590A JPH0422006A JP H0422006 A JPH0422006 A JP H0422006A JP 12464590 A JP12464590 A JP 12464590A JP 12464590 A JP12464590 A JP 12464590A JP H0422006 A JPH0422006 A JP H0422006A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- insulating layer
- insulated wire
- resistance
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 18
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 18
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 229920000642 polymer Polymers 0.000 claims abstract description 11
- 239000004640 Melamine resin Substances 0.000 claims abstract description 10
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 10
- 239000011342 resin composition Substances 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 239000011241 protective layer Substances 0.000 claims description 18
- 239000004962 Polyamide-imide Substances 0.000 claims description 11
- 229920002312 polyamide-imide Polymers 0.000 claims description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims 1
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 abstract description 8
- 239000003921 oil Substances 0.000 abstract description 7
- 229920001515 polyalkylene glycol Polymers 0.000 abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 6
- 239000010721 machine oil Substances 0.000 abstract description 4
- 239000002826 coolant Substances 0.000 abstract 2
- 150000002334 glycols Chemical class 0.000 abstract 2
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000003507 refrigerant Substances 0.000 description 16
- 239000002966 varnish Substances 0.000 description 7
- 229920003055 poly(ester-imide) Polymers 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 229920001281 polyalkylene Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000007859 condensation product Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 2
- 235000019404 dichlorodifluoromethane Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WXGNWUVNYMJENI-UHFFFAOYSA-N 1,1,2,2-tetrafluoroethane Chemical compound FC(F)C(F)F WXGNWUVNYMJENI-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VOPWNXZWBYDODV-UHFFFAOYSA-N Chlorodifluoromethane Chemical compound FC(F)Cl VOPWNXZWBYDODV-UHFFFAOYSA-N 0.000 description 1
- 235000003363 Cornus mas Nutrition 0.000 description 1
- 240000006766 Cornus mas Species 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 125000000350 glycoloyl group Chemical group O=C([*])C([H])([H])O[H] 0.000 description 1
- 230000002414 glycolytic effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 210000004417 patella Anatomy 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical class [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、特に耐湿熱性、耐冷媒性に優れた絶縁電線
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an insulated wire particularly having excellent heat and humidity resistance and refrigerant resistance.
冷蔵庫、冷凍機等の冷媒圧縮機用モータは、フロン−１
１、フロン−１２、フロン−２２なとの冷媒の雰囲気下
で運転される。このため、このモータの巻線には、耐冷
媒性か要求されるとともに冷媒と併用される冷凍機油に
対する耐久性も要求される。Motors for refrigerant compressors such as refrigerators and freezers use Freon-1
It is operated in an atmosphere of refrigerants such as 1, Freon-12, and Freon-22. For this reason, the windings of this motor are required to have resistance to refrigerants and are also required to have durability against refrigerating machine oil used together with the refrigerant.
このような要求を満す絶縁電線としては、従来ポリイミ
ド線、ポリアミドイミド線、ポリエステルイミド線、ポ
リエステルアミドイミド線なとが用いられる。Conventionally, polyimide wires, polyamide-imide wires, polyester-imide wires, polyester-amide-imide wires, etc. have been used as insulated wires that meet these requirements.
ところで、近時地球環境保全の点からフロン１１、フロ
ン−１２の使用か削減、廃止の方向で進んでおり、その
代替の冷媒としてフロン１３４ａか有力とされている。Incidentally, in recent years, there has been a trend towards reducing or abolishing the use of Freon-11 and Freon-12 in order to preserve the global environment, and Freon-134a is considered to be a promising alternative refrigerant.
このフロン１３４ａと併用される冷凍機油としては、ポ
リアルキレングリコール系油が候補となってるが、ボリ
アルキレングリコール系油は吸水性か大きく、約１〜２
％の水分を吸収する。Polyalkylene glycol oil is a candidate for the refrigerating machine oil used in combination with Freon 134a, but polyalkylene glycol oil has a high water absorption rate of about 1 to 2
Absorbs % moisture.
よって、代替冷媒フロン−１３４ａとポリアルキレング
リコール系油との併用系における絶縁電線には、耐冷媒
性と耐湿熱性か併せて、要求されることになる。Therefore, an insulated wire in a system in which the alternative refrigerant Freon-134a and polyalkylene glycol oil are used together is required to have both refrigerant resistance and moist heat resistance.
このような観点から、ポリイミド線、ポリアミドイミド
線は耐冷媒性、耐湿熱性はともに優れているが、高価で
ある難点かある。また、ポリエステルイミド線、ポリエ
ステルアミトイミト線は、ともに分子内にエステル結合
を有するため加水分解されやすく、耐湿熱性に劣る欠点
かある。From this point of view, polyimide wires and polyamide-imide wires have excellent refrigerant resistance and heat and humidity resistance, but have the disadvantage of being expensive. Furthermore, since both polyesterimide wire and polyesteramitomide wire have ester bonds in their molecules, they are easily hydrolyzed and have the disadvantage of poor moist heat resistance.
一方、従来耐湿熱性か良好とされているポｒ）アミドイ
ミド／ポリエステルイミド線も、ポリエステルイミドか
上述のように加水分解性を有しているため、含有水分量
か多くなるフロン−１３４ａ／ポリアルキレングリコー
ル系浦系では、やはり１ｌＦＩ５ｉ熱性が不足する問題
かある。On the other hand, the poly(amideimide)/polyesterimide wire, which has conventionally been considered to have good heat and humidity resistance, has a high moisture content due to polyesterimide or polyesterimide having hydrolyzability as mentioned above. With the glycol-based Ura system, there is still a problem that 1lFI5i's thermal properties are insufficient.
よって、この発明の課題は、新しいフロン１３４ａ／ポ
リアルキレングリコール系冷凍機油系においても十分な
耐冷媒性、耐湿熱性を発揮する絶縁電線を提供すること
にある。Therefore, an object of the present invention is to provide an insulated wire that exhibits sufficient refrigerant resistance and heat and humidity resistance even in the new Freon 134a/polyalkylene glycol refrigerating machine oil system.
かかる課題は、分子量４００００〜６００００のフェノ
キシ樹脂と分子量１４０００〜２００００のフェノキ／
樹脂とのブレンドポリマー１００重量部に、アルキルエ
ーテル化メラミンＦｉ４脂１０〜１００重量部を配合し
た樹脂組成物からなる絶縁層を設けることで解決される
。This problem was solved by using phenoxy resin with a molecular weight of 40,000 to 60,000 and phenoxy resin with a molecular weight of 14,000 to 20,000.
This problem can be solved by providing an insulating layer made of a resin composition in which 10 to 100 parts by weight of an alkyl etherified melamine Fi4 resin is blended with 100 parts by weight of a blended polymer with a resin.
以下、この発明の詳細な説明する。The present invention will be explained in detail below.
第１図は、この発明の絶縁電線の例を示すもので、図中
符号Ｉは導体である。この導体１の外周には、絶縁層２
か被覆され、この絶縁層２上には保護層３かさらに被覆
されて、絶縁電線とされている。FIG. 1 shows an example of the insulated wire of the present invention, and the reference numeral I in the figure represents a conductor. An insulating layer 2 is formed around the outer periphery of the conductor 1.
This insulating layer 2 is further covered with a protective layer 3 to form an insulated wire.
絶縁層２は、分子量４００００〜６００００のフェノキ
シ樹脂と、分子ｔｚｏｏｏ〜２００００のフェノキシ樹
脂とのブレントポｌツマ−１００重量部に対しアルキル
エーテル化メラミン樹脂２０〜１００重量部を配合した
樹脂組成物から構成されている。The insulating layer 2 is composed of a resin composition in which 20 to 100 parts by weight of an alkyl etherified melamine resin is blended with 100 parts by weight of a blend of phenoxy resin having a molecular weight of 40,000 to 60,000 and a phenoxy resin having a molecular weight of 20,000 to 20,000. has been done.
ここて用いられるフェノキ／樹脂は、第２図に示ｔ 構
’１Ｍ 式ヲ持つビスフェノールＡとエピクロルヒドリ
ンとの縮合生成物であって、分子内に水酸基（ＯＨ基）
を有するものである。本発明では、このフェノキ／樹脂
として平均分子量が４００００〜６００００の範囲にあ
る高分子量のものと、平均分子量か１４０００〜２００
００の範囲にある低分子量のものとを混合したブレンド
ポリマーを使用する。高分子量のフェノキシ樹脂におい
て、その平均分子量が４００００未満ては可撓性か低下
して不都合であり、また６００００を越えると耐熱性か
低下して不都合となる。通常は５００００前後のものか
好適である。また、低分子量のフよツキ／樹脂において
、その平均分子量か１４０００未満ては耐熱性を向上さ
せるか可撓性を低下させ、２００００を越えると耐熱性
を低下させるとともにクレージングが発生しやすくなる
。通常は約１７０００程度のものか好ましい。The phenolic resin used here is a condensation product of bisphenol A and epichlorohydrin, which has the structure shown in Figure 2, and has a hydroxyl group (OH group) in the molecule.
It has the following. In the present invention, we use high molecular weight ones with an average molecular weight in the range of 40,000 to 60,000 and those with an average molecular weight in the range of 14,000 to 200.
A blend polymer containing a low molecular weight material in the range of 0.00 is used. In a high molecular weight phenoxy resin, if the average molecular weight is less than 40,000, the flexibility will be reduced, which is disadvantageous, and if it exceeds 60,000, the heat resistance will be reduced, which is disadvantageous. Usually, a value around 50,000 is suitable. In addition, in the case of a low molecular weight soft/resin, if the average molecular weight is less than 14,000, the heat resistance will be improved or the flexibility will be decreased, and if it exceeds 20,000, the heat resistance will be decreased and crazing will easily occur. Usually, it is preferably about 17,000.
また、高分子量のフェノキシ樹脂と低分子量の２二ノ牛
シ樹脂との混合比は、特に限定されないか、通常は高分
子量のフェノキ／樹脂か４０〜８０重量％、低分子量の
フェノキ／樹脂か２０〜６０重重％の範囲で選ぶことか
望ましい。これら２種のブレンドによって、絶縁層２に
適度の可撓性か与えられ、しかも耐熱性、機械的強度、
耐油性は優れたものとなる。In addition, the mixing ratio of high molecular weight phenoxy resin and low molecular weight phenoxy resin is not particularly limited, and is usually 40 to 80% by weight of high molecular weight phenoxy resin and 20% by weight of low molecular weight phenoxy resin. It is preferable to select it in the range of ~60% by weight. The blend of these two types provides the insulating layer 2 with appropriate flexibility, as well as heat resistance, mechanical strength,
Oil resistance is excellent.
このフェノキ／樹脂のブレンドポリマーの硬化剤として
作用するアルキルエーテル化メラミン樹脂としては、第
３図に示される構造式を有するアルキルエーテル化メラ
ミンとホルムアルテヒトとの縮合生成物で、平均分子量
か４５０〜５００程度のものか用いられる。このアルキ
ルエーテル化メラミン樹脂は、フェノキ／樹脂ブレンド
ポリマーの架橋剤として機能するもので、ブレンドポリ
マー１００重量部に対して１０−１００重量部の範囲で
添加される。添加量か１０重量部未満ては絶縁層２の耐
熱性、耐湿熱性か十分に得られず、１００重量部を越え
ると可撓性か低下する。The alkyl etherified melamine resin that acts as a curing agent for this phenyl/resin blend polymer is a condensation product of an alkyl etherified melamine and formaltechnique having the structural formula shown in Figure 3, and has an average molecular weight of 450 to 450. Approximately 500 pieces are used. This alkyl etherified melamine resin functions as a crosslinking agent for the phenwood/resin blend polymer, and is added in an amount of 10 to 100 parts by weight per 100 parts by weight of the blend polymer. If the amount added is less than 10 parts by weight, the insulating layer 2 will not have sufficient heat resistance and moist heat resistance, and if it exceeds 100 parts by weight, the flexibility will be reduced.
このようなフェノキシ樹脂ブレンドポリマーとアルキル
エーテル化メラミン樹脂からなる樹脂組成物は、７クロ
ヘキサノン、ツルヘントナフサなとの溶剤に溶解されて
樹脂分１０〜４０重里％のワニスとされ、導体１上に常
法により塗布、焼付けされて絶縁層２とされる。A resin composition consisting of such a phenoxy resin blend polymer and an alkyl etherified melamine resin is dissolved in a solvent such as 7-chlorhexanone or turgent naphtha to form a varnish with a resin content of 10 to 40%, and is constantly applied on the conductor 1. The insulating layer 2 is formed by coating and baking according to the method.
絶縁層２の厚さは、通常１０〜１００μｍの範囲とされ
るか、特にこの範囲に限定されるものではない。The thickness of the insulating layer 2 is usually in the range of 10 to 100 μm, but is not particularly limited to this range.
また、保護層３としては、種々の樹脂を用いることかで
きるか、なかでも熱硬化ホルマール樹脂あるいはポリア
ミドイミドからなるものか好ましい。Further, as the protective layer 3, various resins can be used, and among them, thermosetting formal resin or polyamideimide is preferable.
ここでの熱硬化ホルマール樹脂とは、ポリビニルホルマ
ール樹脂をヘースポリマーとし、これに硬化剤としてメ
ラミン樹脂、イソ／アネート樹脂、フェノール樹脂を配
合した樹脂組成物からなるものである。The thermosetting formal resin herein is a resin composition in which a polyvinyl formal resin is used as a hese polymer, and a melamine resin, an iso/anate resin, and a phenol resin are blended into this as a curing agent.
このような熱硬化ホルマール樹脂あるいはポリアミドイ
ミドからなる保護層３は、これらの樹脂組成物をシクロ
ヘキサノン、ソルベレトナフサなとの溶剤に溶解して樹
脂分１０〜４０重量％のワニスとし、絶縁層２上に常法
により塗布、焼き付けすることによフて形成される。こ
の保護層３の厚さは、通常１０〜１００μｍ程度とされ
る。The protective layer 3 made of such a thermosetting formal resin or polyamideimide is prepared by dissolving these resin compositions in a solvent such as cyclohexanone or sorbet naphtha to form a varnish with a resin content of 10 to 40% by weight, and then applying the resulting varnish to the insulating layer 2. It is formed by coating and baking using a conventional method. The thickness of this protective layer 3 is usually about 10 to 100 μm.
保護層３として、熱硬化ホルマール樹脂を用いたもので
は、耐摩耗性か良好となり、機械的強度も高いものとな
る。またポリアミドイミドを用いたものでは、耐熱性か
より高いものとなる。When a thermosetting formal resin is used as the protective layer 3, it has good abrasion resistance and high mechanical strength. Also, those using polyamideimide have higher heat resistance.
また、絶縁層２と保護層３の膜厚の比を０．５１〜２０
．１とすることか好ましい。保護層３の膜厚かこれより
も薄いと保護機能か不足し、これよりも厚いとコスト高
となって不都合となる。In addition, the ratio of the film thickness of the insulating layer 2 and the protective layer 3 is set to 0.51 to 20.
．． It is preferable to set it to 1. If the thickness of the protective layer 3 is thinner than this, the protective function will be insufficient, and if it is thicker than this, the cost will increase, which is disadvantageous.
このような絶縁電線にあっては、耐熱性、耐湿熱性、耐
冷媒性、耐油性に富むものとなり、特にフロン−１３４
ａ／ポリアルキレングリコ一ル系冷凍機曲混合系におい
ても、すくれた耐冷媒性、耐湿熱性を発揮する。Such insulated wires have high heat resistance, heat and humidity resistance, refrigerant resistance, and oil resistance, and are particularly resistant to Freon-134.
a/Excellent refrigerant resistance and moist heat resistance even in polyalkylene glycolytic refrigerator mixed systems.
以下、具体例を示して、本発明の作用効果を明確にする
。Hereinafter, specific examples will be shown to clarify the effects of the present invention.
（実施例１）
第１表に示す配合の組成物を７クロヘキサノンに溶解し
、樹脂分２０重量％のワニスを作成し、これを径１ｍｍ
の導体上に塗布、焼き付けし、厚さ４０μｍの絶縁層を
形成した。(Example 1) A varnish with a resin content of 20% by weight was prepared by dissolving the composition shown in Table 1 in 7-chlorhexanone, and the varnish was coated with a diameter of 1 mm.
This was applied and baked onto the conductor to form an insulating layer with a thickness of 40 μm.
第１表
＊ １
＊ ２
分１ｔ５００００のフェノキシ樹脂
分子量 １７０００のフェノキシ樹脂
＊３゛ブチル化変性メラミン樹脂、「ニーパン２０」
（三井東圧化学（株）製）
この絶縁電線について、可撓性、往復摩耗、熱軟化温度
、Ｔ２Ｏ０００Ｈｒ、耐湿熱性について試験し、その絶
縁層の特性を検討した。その結果を第２表に示す。Table 1 * 1 * 2 Phenoxy resin molecular weight of 1 ton 50,000 Phenoxy resin of 17,000 *3 Butylated modified melamine resin, "Kneepan 20"
(Mitsui Toatsu Chemical Co., Ltd.) This insulated wire was tested for flexibility, reciprocating wear, thermal softening temperature, T2O000Hr, and heat and humidity resistance, and the characteristics of its insulating layer were examined. The results are shown in Table 2.
可撓性、往復摩耗、熱軟化温度の測定は、ＪＩＳ−Ｃ−
３００３に基ついて行い、Ｔ２Ｏ０００Ｈｒの測定はＩ
Ｅｃ Ｐｕｂ１７２に基いて行った。また、耐湿熱性
は、水分１０体積％の雰囲気下、温度１５０°Ｃて過熱
劣化させたのち、絶縁破壊電圧（Ｂ Ｄ Ｖ）を測定し
、初期値の５０％となる日数で表した。Measurement of flexibility, reciprocating wear, and thermal softening temperature is based on JIS-C-
3003, and the measurement of T2O000Hr was conducted based on I
This was performed based on Ec Pub172. In addition, heat and humidity resistance was determined by measuring the dielectric breakdown voltage (B DV) after overheating and deterioration at a temperature of 150° C. in an atmosphere containing 10% moisture by volume, and expressed in terms of the number of days at which the dielectric breakdown voltage (B DV) reached 50% of the initial value.
（以 下 余 白）
第
表
第２表の結果から明らかなように、この絶縁電線の絶縁
層は、耐熱性、耐湿熱性、耐摩耗性、可撓性にすくれて
いることかわかる。(Margin below) As is clear from the results in Table 2, the insulating layer of this insulated wire has excellent heat resistance, moist heat resistance, abrasion resistance, and flexibility.
（実施例２）
実施例１におけるＮｏ、２．４，５，６．７の絶縁電線
の絶縁層（但し、厚さ１１μｍとした。）上にさらに熱
硬化ホルマール樹脂からなる厚さ９μｍの保護層を形成
したものと、同じ＜ Ｎｏ、 ２４．５，６．７の絶縁
電線の絶縁層（厚さ１１μｍ）上にさらにポリアミドイ
ミドからなる厚さ９μｍの保護層を形成したものをそれ
ぞれ製造し、これら絶縁電線について耐冷媒試験、湿熱
劣化試験を行った。結果を第３表（保護層か熱硬化ホル
マール樹脂からなるもの）および第４表（保護層かポリ
アミドイミドからなるもの）に示す。(Example 2) On the insulating layer (however, the thickness was 11 μm) of the insulated wires No., 2.4, 5, and 6.7 in Example 1, a 9 μm thick protection made of thermosetting formal resin was added. A protective layer of 9 μm thick made of polyamide-imide was further formed on the insulating layer (thickness 11 μm) of the same < No. 24.5, 6.7 insulated wire as the one with the layer formed. A refrigerant resistance test and a moist heat deterioration test were conducted on these insulated wires. The results are shown in Table 3 (protective layer made of thermosetting formal resin) and Table 4 (protective layer made of polyamideimide).
なお、ここでの熱硬化ホルマール樹脂からなる保護層の
形成は、市販のホルマールワニスｒＴＶＥ−５４５２ｊ
、（東芝ケミカル製）を塗布、焼付して行った。また、
ポリアミドイミドからなる保護層の形成は、市販のポリ
アミドイミドワニス（ｒＨｌ −４０５−２８ｊ日立化
成（株）製）を塗布、焼付して行った。 また、耐冷媒
試験は、フロン−１３４ａに１５０°Ｃて７日間浸漬す
るもの（１）およびフロン−１３４ａ／ポリアルキレン
グリコ一ル系冷凍機浦の混合物に水分を１６６重量％混
合させた混合液中に１５０’Ｃて７日間浸漬するもの（
ＩＩ）の２種で行い、湿熱劣化試験は、１体積％の水分
量において
５０°Ｃ１
４時気中劣化
後の絶縁破壊電圧で表した。The protective layer made of thermosetting formal resin was formed using commercially available formal varnish rTVE-5452j.
, (manufactured by Toshiba Chemical) was applied and baked. Also,
The protective layer made of polyamide-imide was formed by applying and baking a commercially available polyamide-imide varnish (rHl-405-28j, manufactured by Hitachi Chemical Co., Ltd.). In addition, the refrigerant resistance test was conducted by immersing in Freon-134a at 150°C for 7 days (1) and with a mixture of Freon-134a/polyalkylene glycolic refrigerator with 166% water content (1). immersed in water at 150'C for 7 days (
II), and the moist heat deterioration test was expressed as the dielectric breakdown voltage after deterioration in the air at 50° C. for 4 hours at a moisture content of 1% by volume.
第
表
（保護層
熱硬化ホルマール）
第４表
（保護層
ポリアミドイミド）
第３．４表の結果から明らかなように、本発明の絶縁電
線は、特に耐冷媒性、耐湿熱性に優れ、新しいフロン−
１３４ａやこれとポリアルキレングリコール系冷凍機油
との併用系においても十分使用に耐えられることがわか
る。Table 4 (Protective layer thermosetting formal) Table 4 (Protective layer polyamideimide) As is clear from the results in Table 3.4, the insulated wire of the present invention has particularly excellent refrigerant resistance and moist heat resistance, and −
It can be seen that 134a and a system in which it is used in combination with polyalkylene glycol-based refrigeration oil can be used satisfactorily.
７［発明の効果〕
以上説明したように、この発明の絶縁電線は分子３１４
００００〜６００００のフェノキ／樹脂と分利１１４０
００〜２００００のフェノキ／樹脂とのブレンドポリマ
ー１００重量部に、アルキルエーテル化メラミン樹脂１
０〜１００重量部ヲ配合した樹脂組成物からなる絶縁層
を有するものであるので、優れた耐熱性、耐冷媒性、耐
湿熱性、機械的特性等を有し、特にフロン−１３４８／
ポリアルキレングリコ一ル系冷凍曲の併用系においても
高い信頼性てもって使用することができる。7 [Effects of the Invention] As explained above, the insulated wire of the present invention has molecules of 314
0,000-60,000 phenomena/resin and share 1,140
100 parts by weight of blended polymer with phenolium/resin of 0-20000, 1 part of alkyl etherified melamine resin
Since it has an insulating layer made of a resin composition containing 0 to 100 parts by weight, it has excellent heat resistance, refrigerant resistance, moist heat resistance, mechanical properties, etc.
It can also be used with high reliability in a system in which polyalkylene glycolyl is used in combination with freezing.
第１図は、この発明の絶縁電線の例を示す概略断面図、
第２図および第３図はこの発明で用いられるフェノキシ
樹脂およびアル牛ルエーテル化メラミンの構造を示す化
学構造式である。
１・・導体、
２・絶縁層、
３・・保護層。FIG. 1 is a schematic cross-sectional view showing an example of the insulated wire of the present invention,
FIGS. 2 and 3 are chemical structural formulas showing the structures of the phenoxy resin and alkylene etherified melamine used in the present invention. 1. Conductor, 2. Insulating layer, 3. Protective layer.
Claims (4)
と分子量１４０００〜２００００のフェノキシ樹脂との
ブレンドポリマー１００重量部に、アルキルエーテル化
メラミン樹脂１０〜１００重量部を配合した樹脂組成物
からなる絶縁層を有する絶縁電線。(1) Insulation having an insulating layer made of a resin composition in which 10 to 100 parts by weight of an alkyl etherified melamine resin is blended with 100 parts by weight of a blend polymer of a phenoxy resin having a molecular weight of 40,000 to 60,000 and a phenoxy resin having a molecular weight of 14,000 to 20,000. Electrical wire.
護層か設けられた請求項（１）記載の絶縁電線。(2) The insulated wire according to claim (1), further comprising a protective layer made of thermosetting formal resin provided on the insulating layer.
が設けられた請求項（１）記載の絶縁電線。(3) The insulated wire according to claim 1, wherein a protective layer made of polyamideimide is provided on the insulating layer.
〜２０：１である請求項（２）または（３）記載の絶縁
電線。(4) The film thickness ratio of the insulating layer and the protective layer is 0.5:1
The insulated wire according to claim (2) or (3), wherein the ratio is 20:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12464590A JPH0422006A (en) | 1990-05-15 | 1990-05-15 | Insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12464590A JPH0422006A (en) | 1990-05-15 | 1990-05-15 | Insulated wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0422006A true JPH0422006A (en) | 1992-01-27 |
Family
ID=14890534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12464590A Pending JPH0422006A (en) | 1990-05-15 | 1990-05-15 | Insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0422006A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009123279A1 (en) * | 2008-04-03 | 2009-10-08 | 住友電工ウインテック株式会社 | Insulated wire, coil using the same, and motor |
-
1990
- 1990-05-15 JP JP12464590A patent/JPH0422006A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009123279A1 (en) * | 2008-04-03 | 2009-10-08 | 住友電工ウインテック株式会社 | Insulated wire, coil using the same, and motor |
| JP2009266797A (en) * | 2008-04-03 | 2009-11-12 | Sumitomo Electric Wintec Inc | Insulated wire |
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