JPH04216698A - Cooling module - Google Patents

Abstract

PURPOSE:To simplify constitution, reduce cost, and make an equipment small- sized, by cooling an electronic machine with a cooling unit whose temperature is lowered by expanding gas in a closed vessel by the driving of piston mechanism. CONSTITUTION:A cooling unit 1 is constituted of a tightly closed vessel 2, piston mechanism 3 linked with the vessel 2, and an electromagnetic valve 4 for taking the outside air in the vessel 2. An electronic machine 5 is arranged in the vessel 2. Gas in the vessel 2 is expanded by the driving of the piston mechanism 3, and the temperature inside the vessel 2 is decreased, thereby cooling the electronic machine 5 accommodated in the vessel 2. For example, a temperature detector 6 is installed in the vessel 2, and the outside air is taken in by opening the electromagnetic valve 4, when the detector 6 reaches a specified temperature. Then a control part 7 closes the electromagnetic valve 4, and drives the piston mechanism 3.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling module that cools electronic equipment using a cooling unit that lowers the temperature by expanding gas in a sealed container using a piston mechanism.

In recent years, in electronic devices such as supercomputers, power consumption has increased due to faster speeds and higher density packaging has progressed, and cooling devices are used in electronic devices to ensure stable operation. Semiconductor elements are forcibly cooled.

0003

2. Description of the Related Art Conventionally, a device has been constructed as shown in the conventional explanatory diagram of FIG. Figure 5(a) is a schematic diagram of the electronic device.
(b) is a side view of the cooling module.

As shown in FIG. 5(a), an electronic device 20 containing a plurality of cooling modules 21 is supplied with a refrigerant cooled to a predetermined temperature by a cooling device 23 through a pump (
(not shown), it is sent out as shown by the arrow A through the piping 24 and returned from the electronic device 20 as shown by the arrow B.

[0005] Such a cooling module 21 has electronic components 2 mounted on a printed circuit board 28, as shown in FIG. 5(b).
The cooling plate 22 is superimposed on the electronic device 26 formed by mounting the cooling plate 22, the bellows 22C provided on the cooling plate 22 is brought into pressure contact with the surface of the electronic component 27, and the arrow D is inserted from the supply port 22A of the cooling plate 22. The refrigerant 25 is supplied with a refrigerant 25 such as cold water, and is circulated by sending it out from the return port 22B as shown by the arrow E.

[0006] Therefore, the refrigerant 25 sent out from the cooling device 23 is circulated to each cooling plate 22, and
After the electronic components 27 are cooled, they are returned to the cooling device 23, and the cooling device 23 cools the refrigerant 25 to a predetermined temperature, thereby cooling the electronic device 26.

[0007]

However, in a configuration in which the electronic components 27 are cooled by circulating the refrigerant 25 through the cooling plate using the cooling device 23, a large-scale cooling device 23 is required.

[0008] Therefore, when constructing the apparatus, there were problems in that it was expensive and required a large installation space. Therefore, it is an object of the present invention to simplify the configuration to reduce the cost and reduce the size of the device.

[0009]

[Means for Solving the Problems] FIG. 1 is an explanatory diagram of the principle of the first invention, and FIG. 2 is an explanatory diagram of the principle of the second invention.

As shown in FIG. 1, there is a sealed container 2 made of a heat insulating material, and a piston mechanism 3 communicating with the container 2.
, a cooling unit 1 consisting of a solenoid valve 4 that takes outside air into the container 2 , and an electronic device 5 housed in the container 2 , which expands the gas in the container 2 by driving the piston mechanism 3 . By causing the container 2 to
In order to lower the temperature inside the container 2 and cool the electronic device 5 housed in the container 2, as shown in FIG. , a cooling unit 11 consisting of a solenoid valve 4 that takes outside air into the container 12, and an electronic device 13 attached to the cooling unit 11, and expands the gas in the container 12 by driving the piston mechanism 3. By this, the temperature inside the container 12 is lowered, and the cooling unit 1
1 is configured to cool the electronic device 13 attached thereto.

[0011] With this configuration, the above-mentioned problem is solved.

0012

[Operation] That is, a cooling unit 1 is formed which includes a sealed container 2 made of a heat insulating material, a piston mechanism 3 that expands the gas in the container 2, and a solenoid valve 4 that takes outside air into the container 2. The electronic device 5 is stored in the
By driving the piston mechanism 3, the gas inside the container 2 is expanded to lower the temperature, and the stored electronic equipment 5 is
In addition, a sealed container 12, a piston mechanism 3 that expands the gas in the container 12, and a container 1
A cooling unit 11 is formed by a solenoid valve 4 that takes in outside air into the cooling unit 2, and a container 12 is attached to an electronic device 13.
The temperature is lowered by expanding the gas in the container 12 by driving the piston mechanism 3, and the attached electronic device 13
The system is designed to provide cooling.

Therefore, it is not necessary to provide a large-scale cooling device 23 and circulate the refrigerant 25 as in the conventional case, and cooling can be performed by expanding the gas in the container by driving the piston mechanism 3. Cost reduction due to simplification and miniaturization of the device can be achieved.

[0014]

EXAMPLES The present invention will be explained in detail below with reference to FIGS. 3 and 4. FIG. 3 is a side sectional view of an embodiment according to the first invention, and FIG. 4 is an explanatory diagram of an embodiment according to the second invention, where (a) is a side sectional view and (b) is a perspective view. . The same reference numerals indicate the same objects throughout the figures.

As shown in FIG. 3, a closed container 2 made of a heat insulating material is provided with an intake port 2B and a communication port 2C, a solenoid valve 4 is connected to the intake port 2B, and a solenoid valve 4 is connected to the communication port 2C. A cooling unit 1 is formed by arranging the piston mechanisms 3 by means of the tools 10, and the inner chamber 2A of the container 2 is
The device is configured to house an electronic device 5 formed by mounting an electronic component 8 on a printed circuit board 9 .

The piston mechanism 3 includes a cylinder 3A that slides on the inner circumference of the cylindrical member 3B, an arm 3D connected to the cylinder 3A, and a crank that is supported by a bearing 3E and reciprocates the cylinder 3A via the arm 3D. It is formed by a shaft 3C and a motor 3F that rotates the crankshaft 3C via gears 3G and 3H.

Therefore, with the solenoid valve 4 closed, the cylinder 3A is slid in the direction of the arrow G by the drive of the motor 3F, thereby opening the inner chamber 2 of the container 2 from the vent 2C.
The gas A is sucked into the cylindrical member 3B, the gas in the inner chamber 2A can be expanded, and the temperature in the inner chamber 2A can be lowered.

In this case, if the absolute temperature before expansion is T1, the volume is V1, the absolute temperature after expansion is T2, the volume is V2, and the specific heat ratio of the gas in the inner chamber is κ, then the temperature T that decreases due to expansion is
2 can be determined by the following formula.

[0019]

[Math 1]

[0020] Therefore, there are two cases in which a diatomic gas such as air is used as the gas taken into the inner chamber 2A, and a case in which neon N
When the expansion coefficients are set to 5%, 7%, and 10% in the case of using gases of monoatomic molecules such as e and helium He, the respective lower temperatures are calculated to give the values shown in the table below.

[0021]

[Table 1]

Therefore, using a gas of monoatomic molecules, 1
Slide cylinder 3A so that the expansion rate is 0%,
By forming the cooling efficiency to be 30 to 50%,
The temperature can be lowered by about 8° C., and the electronic components 8 housed in the inner chamber 2A can be cooled.

[0023] Such cooling is actually performed on the motor 3F.
A control section 7 is provided to control the driving of the solenoid valve 4 and the opening/closing of the solenoid valve 4, and the control section 7 receives the temperature detected by the temperature detector 6 installed in the inner chamber 2A, and the temperature of the inner chamber 2A reaches a predetermined value. When the target is reached, the solenoid valve 4 is closed under the control of the control unit 7, the motor 3F is driven, and the cylinder 3A is moved in the direction of the arrow G.
By sliding it in the direction, the temperature of the inner chamber 2A is lowered, and when the temperature rises again to the predetermined temperature after the temperature has decreased, the solenoid valve 4 is controlled by the control section 7.
is opened, outside air is taken in from the intake port 2B, the cylinder 3A is slid in the direction opposite to the arrow G, and then the solenoid valve 4 is closed and the temperature of the inner chamber 2A is lowered by the suction of the cylinder 3A as described above. Do what you want to do over and over again.

Furthermore, in the case of FIG. 4(a), a solenoid valve 4 is provided at the intake port 12B of the sealed container 12,
The communication port 12C is configured so that an electronic device 13 formed by mounting an electronic component 8 on a printed circuit board 14 is tightly attached to a cooling unit 11 formed by fixing the cylindrical member 3B of the piston mechanism 3. It is something.

The outer periphery of the container 12 is covered with a cover 15 made of a heat insulating material, and the printed circuit board 14 is formed in close contact with the exposed surface 12D not covered by the cover 15.

Accordingly, by sliding the cylinder 3A in the direction of arrow G, the gas in the inner chamber 12A is expanded and the temperature is lowered, thereby cooling the electronic device 13 via the exposed surface 12D1. Therefore, as shown in FIG. 4(b), the container 12 of the cooling unit 11 is fixed to the printed board shelf 16 formed by housing a plurality of electronic devices 13 in the frame 17, and the container 12 of the cooling unit 11 is fixed to the printed board shelf 16. By covering the container 12 with the cover 15 so that the exposed surface 12D becomes the exposed surface 12D, the electronic device 13 housed in the printed board shelf 16 can be cooled.

Also, for cooling in this case, the temperature of the container 12 is detected by the temperature detector 6 installed inside the container 12 as described above, and when the temperature reaches a predetermined value, the controller 7
When the solenoid valve 4 is closed by the control, the piston mechanism 3 is driven in the direction of the arrow G to lower the temperature of the inner chamber 12A, and when cooling is performed again, the solenoid valve 4 is opened and the inner chamber 12A is cooled. As shown by arrow F, outside air is taken in, the piston mechanism 3 is returned to its original position, and the solenoid valve 4 is closed.
Cooling is performed by repeatedly closing the piston mechanism 3 and driving the piston mechanism 3 in the direction of arrow G.

Furthermore, in the illustration in FIG. 4(b), the cooling unit 11 is arranged on the side of the printed board shelf 16, but it is also possible to arrange the cooling unit 11 in the center of the printed board shelf 16. It is also possible to do this, and the same effect can be obtained in this case as well.

[0029]

As explained above, according to the present invention, a piston mechanism communicating with a sealed container is provided, and by driving the piston mechanism, the gas in the inner chamber of the container is expanded, thereby reducing the temperature of the inner chamber. The electronic equipment is cooled by lowering the temperature.

[0030] Therefore, when cooling a conventional refrigerant,
There is no need to provide a large-scale cooling device for circulation, and due to the simplified configuration, it can be easily mounted on, for example, a printed board shelf, and it is inexpensive, and the device can be made smaller, with great practical effects. be.

[Brief explanation of the drawing]

[Figure 1] Diagram explaining the principle of the first invention

[Fig. 2] Diagram explaining the principle of the second invention

[Fig. 3] Side sectional view of an embodiment according to the first invention

[Fig. 4] An explanatory diagram of an embodiment according to the second invention

[Figure 5] Conventional explanatory diagram

[Explanation of symbols]

1,11 Cooling unit 2,12 Container 3 Piston mechanism 4 Solenoid valve 5,13 Electronic equipment 6 Temperature detector 7 Control section

Claims (3)

[Claims] [Claim 1] A sealed container (2) made of a heat insulating material.
a cooling unit (1) comprising a piston mechanism (3) communicating with the container (2), and a solenoid valve (4) for introducing outside air into the container (2); an electronic device (5), the piston mechanism (
3) The temperature inside the container (2) is lowered by expanding the gas inside the container (2) by driving the
A cooling module that cools the electronic device (5) housed in the container (2). Claim 2: A sealed container (12);
a piston mechanism (3) communicating with the container (12);
A cooling unit (11) consisting of a solenoid valve (4) that takes in outside air into the cooling unit (11), and an electronic device (13) attached to the cooling unit (11). By expanding the gas inside the container (12), the temperature inside the container (12) is lowered and the electronic device (13) attached to the cooling unit (11) is cooled. cooling module. 3. The container (2, 12) according to claim 1 and claim 2 is provided with a temperature sensor (6) therein, and when the temperature sensor (6) reaches a predetermined temperature, The apparatus further includes a control section (7) that takes in the outside air by opening the solenoid valve (4), closes the solenoid valve (4) after taking in the outside air, and drives the piston mechanism (3). A cooling module featuring: