JPH04212206A - Insulating paint, solderable insulated wire, manufacture of the insulated wire, and flyback transformer using the insulated wire - Google Patents

Abstract

PURPOSE:To obtain an insulated wire having excellent heat resistivity and solderability by painting specific insulating paint including polyamic acid onto a conductor and baking it. CONSTITUTION:An insulating paint including a polyamic acid shown by formula I (where X stands for an alkylene group or an alkylenephenylene group, n is a positive integer, R<1> stands for a quadrivalent organic group shown by formula II, R<2> stands for a bivalent organic group shown by formula III. When R<1> is aquadrivalent organic group shown by formula IV, R<2> is selected to be a bivalent organic group shown by formula V, and k is selected to be an integer ranging from 1 to 10.) is applied onto a conductor 1, followed by baking. With this constitution, heat resistivity is compatible with solderability, so that a wire coated with a polyimide resin or with an imide-denaturated polyurethane resin available to electric machineries with high workability can be obtained.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to insulated wires and insulating paints that have excellent heat resistance and good solderability, and more specifically, the present invention relates to insulated wires and insulating paints that have excellent heat resistance and good solderability. The present invention relates to an insulated wire, a method for manufacturing the same, an insulating coating, and a flyback transformer using the insulated wire.

0002

[Prior Art] Recently, home appliances such as televisions have become more compact and lightweight, and in response to this, electrical equipment such as motors and transformers have become significantly smaller, lighter, and more efficient. There is also a strong desire to improve its reliability.

From these viewpoints, a material with excellent heat resistance is desired as a coating material for insulated wires used in the above-mentioned electrical equipment, etc., and wires using polyester resin paint are preferred.
It is used as a type (130°C) or F type (155°C) insulated wire. In addition, polyimide resin is known as a material with even better heat resistance.

On the other hand, the reduction in size, weight, and performance of electrical equipment requires thinner wires, and thinner polyester insulated wires are now required to have even higher performance.

Furthermore, since these polyester insulated wires are used in harsh environments, they are required to have chemical resistance, solvent resistance, hydrolysis resistance, and alkali resistance in addition to heat resistance and electrical insulation. There is.

[0006] Furthermore, there is a demand for process rationalization for the purpose of cost reduction.

[0007] As part of this effort, there is the rationalization and production line of the terminal stripping process of insulated wires.

At present, there are various methods for processing this terminal peeling, such as mechanical peeling, thermal decomposition peeling, chemical peeling, and solder peeling. The above solder stripping method is most preferable.

However, although polyester insulated wires have already been made into lines by chemical stripping, they require a certain amount of time to be immersed in chemicals and also require cleaning. Because of the danger of chemicals in handling, attempts were made to create a solder stripping line, but none of the conventional polyester insulated wires had solder stripping properties.

[0010]Although polyimide insulated wire has excellent heat resistance (Japanese Unexamined Patent Publication No. 1-124905), it does not have solder releasability.

[0011] As insulated wires that can be treated with solder peeling, there are polyurethane insulated wires whose main component is polyurethane resin, as seen in JP-A No. 64-90268, but the heat resistance is class E (120°C). It is low.

[0012] Therefore, there is a strong desire for an insulated wire coated with a heat-resistant resin having a heat resistance of class B (130°C) or higher, which can be subjected to solder peeling treatment.

[0013] Recently, when soldering a large number of stranded insulated wires, it has become common practice to strip the insulation film and solder the wires at the same time by directly immersing the wires with the insulation film still covered in a solder bath. Terminal processing has increased.

For this purpose, the insulating coating must be removed as quickly as possible following immersion into the solder bath. Naturally, the shorter the immersion time in the solder bath, the better.

[0015] In solder stripping, if the temperature of the molten solder bath exceeds 450°C, the oxidation deterioration of the solder bath progresses significantly, and the rate at which copper, which is a conductor, dissolves in the solder increases, resulting in the problem of wire thinning of insulated wires. will arise.

Considering the solder releasability as described above,
Insulated wires having an insulating film made of polyesterimide resin (Japanese Unexamined Patent Publication No. 63-289711) and polyurethane compositions formed from polyesterimide and isocyanate (Japanese Unexamined Patent Application No. 63-69819) have been proposed. However, these films have different chemical structures, the raw materials are special, and the reactions are complicated, making the products expensive, and they have poor electrical insulation properties due to the high concentration of polar groups. There are drawbacks. Furthermore, since there are many ester-type crosslinked structures, solderability may be poor.

[0017]

[Problem to be solved by the invention] In view of the above problems,
The heat resistance of the insulated wire coating material of the present invention is Class B (130°C).
The above describes the excellent thermal, mechanical, electrical, and
The present invention has been made to provide solderable insulated wires and insulating paints having chemical properties relatively easily and at low cost, and furthermore, to provide a flyback transformer using the above-mentioned insulated wires. With the goal.

[0018]

[Means for Solving the Problems] In order to achieve the above object, the present inventors have made extensive studies and have developed an insulating paint containing polyamic acid or polyimide with a specific chemical structure, or a polyamide coating with a specific chemical structure. The present inventors have discovered that an insulated wire that meets the above requirements can be obtained by applying an insulating paint containing acid and isocyanate or blocked isocyanate onto a conductor and baking it, and have arrived at the present invention. .

That is, the present invention provides general formula (Formula 1)

0
020]

[Chemical formula 1]

The present invention relates to a solderable insulated wire having a polyimide resin film, which is obtained by coating a conductor with an insulating paint containing a polyamic acid represented by the formula and baking it.

However, in the above general formula (Chemical formula 1), X is an alkylene group or an alkylenephenylene group that becomes the main chain in hydroxylamine, which is an end capping agent for polyamic acid, and particularly preferably, X is a group of the general formula (Chem.12)

0
023]

[Chemical formula 12]

An alkylene group selected from the group consisting of: or general formula (Formula 13)

[0025]

[Chemical formula 13]

An alkylenephenylene group selected from the group consisting of:

That is, in the above formula, HO-X- is represented by the general formula (Chemical formula 14)

[0028]

[Chemical formula 14]

It is a monovalent organic group selected from the group consisting of the following, and monoamines containing these groups are equally used as end-capping agents.

The same applies to X in other general formulas throughout this specification.

Further, n is a positive integer, and from the viewpoint of the mechanical strength of the film, n is desirably 5 or more. below,
The same applies to n in other general formulas throughout this specification.

Regarding R1 and R2, R1 has the general formula (Formula 2)

[0033]

[Case 2]

When R2 is a tetravalent organic group selected from the group consisting of:

[0035]

[Chemical 3]

A divalent organic group (h
is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is the general formula (Chemical formula 4)

[0037]

[C4]

When R2 is a tetravalent organic group selected from the group consisting of:

[0039]

[C5]

A divalent organic group (k
is an integer of 1 to 10, l and m are integers of 2 to 10).

The same applies to R1 and R2 in other general formulas throughout this specification.

The above insulated wire can be manufactured as follows.

That is, the present invention is based on the general formula (chemical formula 6)

[
0044

[C6]

Hydroxylamine represented by the formula (Chemical formula 7)

[0046]

[C7]

A tetracarboxylic dianhydride represented by:
General formula (Chemical formula 8)

[0048]

[Chemical formula 8]

A diamine represented by the formula (Chemical formula 1) is reacted with the diamine represented by the formula (Chemical formula 1) in the presence of an organic solvent.

[0050]

[Chemical formula 1]

After producing the polyamic acid shown below,
Soldering characterized by applying an insulating paint containing this on a conductor, baking it, and causing an intramolecular reaction between the amide group and the carboxyl group in the above general formula (Chemical formula 1) to imidize it into a polyimide resin. The present invention relates to a possible manufacturing method of an insulated wire.

The organic solvent used in the above production method is necessary for promoting the reaction, and includes, for example, dimethylacetamide, N-methylpyrrolidone, N-methylcaprolactam, dimethylsulfone, dimethylformamide, dimethylsulfoxide, and the like.

Further, in the above manufacturing method, a catalytic amount of tertiary amine may be added to the insulating coating. These include, for example, triethylamine, tri-n-butylamine, dimethyldodecylamine, pyridine, 4-isopropylpyridine, N-dimethylbenzylamine, isoquinoline,
N-methylmorpholine and the like. These tertiary amines act not only as catalysts for imidization but also for urethanization.

FIG. 1 is a sectional view of an insulated wire according to the present invention. In FIG. 1, 1 is a conductor such as a copper wire, and the conductor 1
An insulating film 2 is formed by applying an insulating paint and baking it.

By applying an insulating paint containing a polyamic acid represented by the above general formula (Chemical formula 1) onto a conductor and baking it, the amide group and carboxyl group in the general formula (Chemical formula 1) are converted into imide by an intramolecular reaction. At the same time, the solvent evaporates and a strong polyimide resin film is formed on the conductor.

In addition, insulating paints containing polyamic acid represented by the general formula (Chemical formula 1) undergo intramolecular imidization depending on conditions such as high reaction temperature during the synthesis process of the polyamic acid, resulting in the formation of the general formula (Chemical formula 1). 9)

[0057]

[Chemical formula 9]

It may also contain the polyimide shown below.

Furthermore, the insulating paint has the above general formula (Chemical formula 9)
Imidation may be performed in advance before coating on the conductor so that the polyimide shown in is included. In this case, it is desirable to add an imidization catalyst to the organic solvent during the polyamic acid synthesis reaction.

The imidization catalyst is the above-mentioned tertiary amine.

That is, the present invention provides general formula (Formula 9)

0
062]

[Chemical formula 9]

The present invention relates to a solderable insulated wire having a polyimide resin film, which is obtained by coating a conductor with an insulating paint containing polyimide represented by the formula and baking it.

Furthermore, the present invention provides a method for manufacturing the above-mentioned insulated wire using the general formula (Chemical formula 6).

[0065]

[C6]

Hydroxylamine represented by the formula (Chemical formula 7)

[0067]

[C7]

A tetracarboxylic dianhydride represented by:
General formula (Chemical formula 8)

[0069]

[Chemical formula 8]

A diamine represented by the formula (Chemical formula 9) is reacted with the diamine represented by the formula (Chemical formula 9) in the presence of an organic solvent.

[0071]

[Chemical formula 9]

The present invention relates to a method for producing a solderable insulated wire, which comprises producing a polyimide represented by the following formula, and then applying an insulating paint containing the polyimide onto a conductor and baking it.

[0073] Here, polyimide is produced by adding an imidization catalyst or increasing the reaction temperature.

Furthermore, the present invention provides general formula (Formula 1)

[
0075

[Chemical formula 1]

The polyamic acid shown below and the isocyanate
The present invention relates to a solderable insulated wire having an imidized polyurethane resin film, which is obtained by coating a conductor with an insulating paint containing isocyanate or blocked isocyanate and baking it.

[0077] Here, the method takes advantage of the fact that imidized polyurethane is produced by reacting the two terminal hydroxyl groups with isocyanate using polyamic acid represented by the general formula (Chemical formula 1) as a polyol. The insulated wire having the above-mentioned imidized polyurethane resin film can be manufactured as follows.

That is, the present invention provides general formula (Formula 1)

0
079]

[Chemical formula 1]

The polyamic acid represented by
or blocked isocyanate in an amount of 0.4 to 2 isocyanate groups per equivalent of terminal hydroxyl group of the above polyamic acid.
．． By applying an insulating paint containing a 0 equivalent ratio onto a conductor and baking it, the amide group and carboxyl group of the polyamic acid react intramolecularly to imidize it, and the terminal hydroxyl group is converted into isocyanate or carboxyl group. The present invention relates to a method for manufacturing a solderable insulated wire, characterized in that an imidized polyurethane resin is produced by reacting with a blocked isocyanate group.

Note that when the equivalent ratio of the terminal hydroxyl group to the isocyanate group is within the above range, the urethanization reaction is completed and the various properties of the coating layer are good. .1 equivalent is significantly better.

Examples of the isocyanate include diisocyanate or triisocyanate such as phenylene diisocyanate, tolylene diisocyanate, 1-ethylbenzene-2,4-diisocyanate, and diphenylmethane diisocyanate. Isocyanate, 1-isopropylbenzene-2,4-diisocyanate, 1-chlorobenzene-2,4-diisocyanate, xylylene diisocyanate, 1-nitrobenzene-2,4-diisocyanate
Isophorone diisocyanate, 1-methoxybenzene-2,4-diisocyanate, naphthalene diisocyanate, dimethylbiphenylene diisocyanate, 1-
Methylbenzene-2,4,6-triisocyanate, triphenylmethane triisocyanate, 1,3,5-trimethylbenzene-2,4,6-triisocyanate,
Examples include naphthalene-1,3,7-triisocyanate, biphenyl-2,4,4'-triisocyanate, and hexamethylene diisocyanate.

Examples of polyisocyanate compounds include low molecular weight isocyanates with a molecular weight of about 100 to 400.
In particular, diisocyanates, trimethylolpropane, hexanetriol, butanediol, etc. with a molecular weight of 60
Examples include urethane bond-containing polyisocyanates obtained by reacting low molecular weight polyols having a molecular weight of about 200 to 200, singly or as a mixture.

Blocked isocyanates include compounds obtained by blocking all of the above-mentioned isocyanates, including diisocyanate compounds and triisocyanate compounds having a molecular weight of about 300 to 10,000, and polyisocyanate compounds. In polyvalent isocyanate compounds having two or more isocyanate groups in one molecule, each isocyanate group is replaced by a compound having active hydrogen, such as phenol, cresol, xylene, etc. - Le,
Blocking is performed using a conventional method using a blocking agent such as phenols such as chlorphenol, oximes such as methyl ethyl ketone oxime, monoalcohols having primary, secondary, or tertiary hydroxyl groups, or caprolactam. You can use the one given. Alternatively, the polyhydric isocyanate compound may be blocked by reacting with a polyhydric alcohol such as trimethylolpropane, hexanetriol, or glycerin. Examples of commercially available blocked isocyanates that can be used in the present invention include Coronate AP Stable and Coronate 2 manufactured by Nippon Polyurethane Co., Ltd.
503, Coronate 2515, Millionate MS-50
, Desmodule AP-1 manufactured by Sumitomo Bayer Urethane Co., Ltd.
2 stable, desmodule CT stable, etc.

[0085] When forming the imidized polyurethane resin film, a tertiary amine as an imidization catalyst can be included in the insulating coating material as described above. Tertiary amines also act as catalysts for urethanization reactions.

The present invention also provides general formula (Formula 10)

00
87]

[Chemical formula 10]

The present invention relates to a solderable insulated wire having a polyimide resin film shown in the following.

As a method for forming this insulating film, the present invention uses the general formula (Chemical formula 7)

[0090]

[C7]

A tetracarboxylic dianhydride represented by:
General formula (Chemical formula 8)

[0092]

[Chemical formula 8]

[0093] A diamine represented by the formula (Chemical formula 11) is reacted with the diamine in the presence of an organic solvent.

[0094]

[Chemical formula 11]

After producing the polyamic acid represented by
By applying an insulating paint containing this on a conductor and baking it, it is imidized by an intramolecular reaction between an amide group and a carboxyl group in the formula (11), resulting in a solderable polyimide resin. This invention relates to a method of manufacturing an insulated wire.

[0096] Here, the organic solvent is the same as described above, and the insulating paint can contain a catalytic amount of tertiary amine as an imidization catalyst.

In the above formulas (10) and (11), n
is a positive integer, preferably 5 or more.

An insulated wire having a polyimide resin film represented by formula (10) can also be produced by applying an insulating paint containing polyimide represented by formula (10) onto a conductor and baking it. can.

That is, for example, general formula (Chemical formula 7)

01
00]

[C7]

A tetracarboxylic dianhydride represented by:
General formula (Chemical formula 8)

[0102]

[Chemical formula 8]

[0103] A diamine represented by the formula (Chemical formula 11) is reacted with the diamine in the presence of an organic solvent.

[0104]

[Chemical formula 11]

A polyamic acid represented by the following formula is produced, and the polyamic acid is imidized to form the general formula (Formula 10)

010
6]

[Chemical formula 10]

After producing the polyimide represented by the formula, an insulating paint containing the polyimide is applied onto a conductor and baked to produce an insulated wire. Here, imidization is
This is done by adding an imidization catalyst or by heating. The imidization catalyst is the above-mentioned tertiary amine.

[0108] In this way, when the insulating paint contains polyimide, the solvent evaporates when it is applied onto a conductor and baked, forming a strong insulating film.

The solderable insulated wire of the present invention using the above-mentioned insulating paint is provided by applying the above-mentioned insulating paint onto a conductor and then baking it in a general-purpose baking coating device to obtain a predetermined film thickness.

[0110] The conductor used at this time is, for example, copper,
The wire may be a silver or stainless steel wire, and the applicable conductor diameter may be any diameter from a very thin wire to a thick wire, and is not limited to a specific conductor diameter. Generally, it is mainly applied to copper wires having a diameter of about 0.030 to 2.0 mm.

[0111] The method for forming an insulating film on the above-mentioned conductor may be based on a conventionally known method. For example, an insulating paint is applied by a method such as a felt drawing method or a die drawing method, and then continuously heated at 300 to 500°C. 3 to 1 in a baking oven at a temperature of
A desired insulating film is formed by passing it several times to several tens of times for about 00 seconds each. In short, it is obtained by baking at a temperature and time sufficient to almost complete the curing reaction of the paint. In addition, the thickness of the insulation film is determined according to JIS, NEMA or I
This is the film thickness specified in standards such as EC.

[0112] All of the insulating paints used to form the coating of the insulated wire according to the present invention can also be used not only for forming the insulating coating for electric wires but also for various conductors.

The present invention also provides a flyback transformer using the above insulated wire.

[0114]

[Function] The insulating paint according to the present invention contains polyamic acid or polyimide with a specific chemical structure, or polyamic acid with a specific chemical structure and isocyanate or blocked isocyanate, and this insulating paint is used as a conductor. The polyimide resin or imidized polyurethane resin formed by coating and baking has excellent thermal, mechanical, electrical, and chemical properties, and insulated wires coated with this resin can be heated to 130°C.
It has higher heat resistance and good solderability.

[0115]

EXAMPLES The present invention will be explained in detail below based on Examples, but the present invention is not limited thereto.

[0116] In the Examples and Comparative Examples, the raw materials for the paint forming the insulating film are indicated by abbreviations. The meanings of the abbreviations are as follows.

B. General formula (Chemical formula 6)

[0118]

[C6]

The hydroxylamine represented by:
Abbreviation S...p-aminobenzyl alcohol (Chemical formula 15)

0
120]

[Chemical formula 15]

B. General formula (Chemical formula 7)

[0122]

[C7]

A tetracarboxylic dianhydride represented by:
General formula (Chemical formula 8)

[0124]

[Chemical formula 8]

There are two types of combinations with the diamine shown below. That is, 1. When the tetracarboxylic dianhydride is a compound with the following abbreviations (A1 to A8), the diamine is preferably a compound with the following abbreviations (B1 to B5); 2. When the tetracarboxylic dianhydride is a compound with the following abbreviations (A9 to A17), the diamine is preferably a compound with the following abbreviations (B6 to B13).

[0126] The following 17 types of tetracarboxylic dianhydrides are used.

[0127] Abbreviation A1...1, 3, 3a, 4, 5, 9b-
hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,
3-dione (chemical formula 16)

[0128]

[Chemical formula 16]

Abbreviation A2...Ethylene glycol bis(anhydrotrimellitate) (Chemical formula 17)

[0130]

[Chemical formula 17]

Abbreviation A3... Tetramethylene glycol bis(anhydrotrimellitate) (Chemical formula 18)

[0132]

[Chemical formula 18]

Abbreviation A4...Diethylene glycol bis(anhydrotrimellitate) (Chemical formula 19)

[0134]

[Chemical formula 19]

Abbreviation A5...Neopentyl glycol bis(
anhydrotrimellitate) (Chemical formula 20)

[0136]

[C20]

Abbreviation A6...1,4-cyclohexanedio-
Rubis (anhydrotrimellitate) (Chemical formula 21)

01
38]

[C21]

Abbreviation A7...p-xylylene glycol bis(anhydrotrimellitate) (Chemical formula 22)

[0140]

[C22]

Abbreviation A8...Hydroquinone di-(β-hydroxyethyl)ether bis(anhydrotrimellitate) (Chemical formula 23)

[0142]

[C23]

Abbreviation A9...Pyromellitic dianhydride (chemical formula 2
4)

[0144]

[C24]

Abbreviation A10...3,3',4,4'-diphenyltetracarboxylic dianhydride (Chemical formula 25)

[0146]

[C25]

Abbreviation A11...3,3',4,4'-benzophenonetetracarboxylic dianhydride (Chemical formula 26)

[0148]

[C26]

Abbreviation A12...2,3,6,7-naphthalenetetracarboxylic dianhydride (Chemical formula 27)

[0150]

[C27]

Abbreviation A13...1,4,5,8-naphthalenetetracarboxylic dianhydride (Chemical formula 28)

[0152]

[C28]

Abbreviation A14...1,2,5,6-naphthalenetetracarboxylic dianhydride (Chemical formula 29)

[0154]

[C29]

Abbreviation A15...3,3',4,4'-diphenyl ether tetracarboxylic dianhydride (Chemical formula 30)

0
156]

[C30]

Abbreviation A16...3,3',4,4'-diphenylmethanetetracarboxylic dianhydride (Chemical formula 31)

[0158]

[Chemical formula 31]

Abbreviation A17...3,3',4,4'-diphenylpropane tetracarboxylic dianhydride (Chemical formula 32)

0
160]

[C32]

On the other hand, the following 13 types of diamines are used.

Abbreviation B1...2,2-bis[4-(4'-aminophenoxy)phenyl]propane (Chemical formula 33)

[0163]

[Chemical formula 33]

Abbreviation B2...1,3-bis[2-(4'-aminophenyl)propyl]benzene (Chemical formula 34)

[0165]

[C34]

Abbreviation B3...4,4'-diaminodiphenylmethane (Chemical formula 35)

[0167]

[C35]

Abbreviation B4...1,3-bis(4-aminophenoxy)benzene (Chemical formula 36)

[0169]

[C36]

Abbreviation B5...4,4'-diaminodiphenyl ether (Chemical formula 37)

[0171]

[C37]

Abbreviation B6...4,4'-diaminodicyclohexylmethane (Chemical formula 38)

[0173]

[C38]

Abbreviation B7...1,4-di(aminomethyl)benzene (Chemical formula 39)

[0175]

[C39]

Abbreviation B8...4,4'-diaminodiphenylpropane (Chemical formula 40)

[0177]

[C40]

Abbreviation B9...1,4-di(aminomethyl)cyclohexane (Chemical formula 41)

[0179]

[C41]

Abbreviation B10...1,4-diaminocyclohexane (Chemical formula 42)

[0181]

[C42]

Abbreviation B11...4,4'-diaminodicyclohexylpropane (Chemical formula 43)

[0183]

[C43]

Abbreviation B12...Hexamethylenediamine (Chemical formula 44)

[0185]

[C44]

Abbreviation B13...2,2-dimethylpropylenediamine (Chemical formula 45)

[0187]

[C45]

C. The following two types of tertiary amines were used as imidization catalysts.

Abbreviation C1...Dimethyldodecylamine Abbreviation C
2...N-Dimethylbenzylamine The blocked isocyanate for the urethanization reaction is Desmodur CT Stable (manufactured by Sumitomo Bayer Urethane), and the isocyanate is diphenylmethane diisocyanate.
Furthermore, as an organic solvent for producing polyamic acid, a mixed solvent of dimethylacetamide (DMAc) and N-methylpyrrolidone (NMP) (1:1 by weight) was used.

[0190]

【Example】

(Example 1) 6.15 g (0.015 mol) of diamine B1, 40 g of solvent DMAc, and 40 g of NMP were placed in a reaction flask equipped with a stirrer, a thermometer, and a nitrogen inlet tube, and the mixture was heated at 25° C. under a nitrogen stream. While maintaining the temperature, stir thoroughly. To this solution, 4.95 g (0.0165 mol) of acid dianhydride A1 and 0.369 g (0.003 mol) of hydroxylamine S were gradually added. After adding everything, heat at 25℃ under nitrogen stream.
Stirring was continued for 12 hours to synthesize polyamic acid.

[0191] The obtained paint (polyamic acid solution) was heated to 0.
Coating on a 4mmφ copper wire at a wire speed of 10m/min at a furnace temperature of 37.
The wire was baked by passing it through a furnace with a furnace length of 3.0 m at 0° C. several times to obtain an insulated wire with a coating thickness of about 20 μm. In addition, the infrared absorption spectrum of the film has 1780cm￣1 and 138cm￣1.
Imide group absorption was observed at 0 cm￣1.

[0192] The obtained electric wire was rated according to JIS C3003-19.
Evaluation was made according to the test method for enameled copper wire and enameled aluminum wire of No. 84. The evaluation results are shown in Table 1.

(Example 2) 6.192 g (0.018 mol) of diamine B2, 40 g of solvent DMAc and 40 g of NMP, acid dianhydride A1
Polyamic acid was synthesized in the same manner as in Example 1, except that 5.85 g (0.0195 mol) of hydroxylamine S and 0.369 g (0.003 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 1, and evaluated in the same manner as in Example 1.

Table 1 shows the evaluation results.

(Example 3) 6.15 g (0.015 mol) of diamine B1, solvent D
Polyamic acid was prepared in the same manner as in Example 1, except that 40 g of MAc, 40 g of NMP, 6.765 g (0.0165 mol) of acid dianhydride A2, and 0.369 g (0.003 mol) of hydroxylamine S were used. was synthesized.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 1, and this was evaluated in the same manner as in Example 1.

Table 1 shows the evaluation results.

(Example 4) 7.224 g (0.021 mol) of diamine B2, 60 g of solvent DMAc and 60 g of NMP, acid dianhydride A2
A polyamic acid was synthesized in the same manner as in Example 1, except that 9.225 g (0.0225 mol) of hydroxylamine S and 0.369 g (0.003 mol) of hydroxylamine S were used.

[0200] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 1, and this was evaluated in the same manner as in Example 1.

[0201] The evaluation results are shown in Table 1.

(Example 5) 6.15 g (0.015 mol) of diamine B1, solvent D
60 g of MAc, 60 g of NMP, 6.765 g (0.0165 mol) of acid dianhydride A2, 0.369 g (0.003 mol) of hydroxylamine S, and 0.06 g of tertiary amine C1 were used. Polyamic acid was synthesized in the same manner as in Example 1 except for this.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 1, and this was evaluated in the same manner as in Example 1.

[0204] The evaluation results are shown in Table 1.

(Example 6) 3.69 g (0.009 mol) of diamine B1, solvent D
Polyamic acid was prepared in the same manner as in Example 1, except that 30 g of MAc, 30 g of NMP, 4.305 g (0.0105 mol) of acid dianhydride A2, and 0.369 g (0.003 mol) of hydroxylamine S were used. was synthesized.

[0206] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 1, and this was evaluated in the same manner as in Example 1.

[0207] The evaluation results are shown in Table 1.

(Example 7) Diphenylmethane diisocyanate was blended into the polyamic acid solution of Example 6 at a ratio of 1 equivalent of isocyanate group per 1 equivalent of terminal hydroxyl group and mixed to obtain a paint. Ta.

Using the obtained paint, an imidized polyurethane resin insulated wire of the present invention was obtained in the same manner as in Example 1, and this was evaluated in the same manner as in Example 1.

[0210] The evaluation results are shown in Table 1.

(Example 8) 6.15 g (0.015 mol) of diamine B1, solvent D
Polyamic acid was synthesized in the same manner as in Example 1, except that 40 g of MAc, 40 g of NMP, and 6.15 g (0.015 mol) of acid dianhydride A2 were used (however, hydroxylamine S was not used). .

[0212] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 1, and this was evaluated in the same manner as in Example 1.

[0213] The evaluation results are shown in Table 1.

(Example 9) 6.88 g (0.02 mol) of diamine B2, solvent DM
40g of Ac, 40g of NMP, 6g of acid dianhydride A1
．． A polyamic acid was synthesized in the same manner as in Example 1 except that 00g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 1, and this was evaluated in the same manner as in Example 1.

[0216] The evaluation results are shown in Table 1.

(Example 10) 5.84 g (0.02 mol) of diamine B4, solvent DM
50g of Ac, 50g of NMP, 8g of acid dianhydride A2
．． Polyamic acid was synthesized in the same manner as in Example 1, except that 2 g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 1, and evaluated in the same manner as in Example 1.

Table 1 shows the evaluation results.

(Example 11) 4 g (0.02 mol) of diamine B5, 40 g of solvent DMAc and 40 g of NMP, 8.2 g of acid dianhydride A2
Polyamic acid was synthesized in the same manner as in Example 1 except that (0.02 mol) was used (however, hydroxylamine S was not used).

[0221] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 1, and this was evaluated in the same manner as in Example 1.

[0222] The evaluation results are shown in Table 1.

(Example 12) 3.96 g (0.02 mol) of diamine B3, 40 g of solvent DMAc, and 40 g of NMP were placed in a reaction flask equipped with a stirrer, a thermometer, and a nitrogen inlet tube, and the mixture was heated under a nitrogen stream. The mixture was stirred thoroughly while maintaining the temperature at 25°C. In this solution,
9.225 g (0.0225 mol) of acid dianhydride A2 and 0.615 g (0.005 mol) of hydroxylamine S were gradually added. After adding everything, heat at 25℃ under nitrogen stream.
Stirring was continued for 14 hours to synthesize polyamic acid.

[0224] The obtained paint (polyamic acid solution) was mixed with 0.
Coat it on a 4mmφ copper wire at a wire speed of 10m/min and at a furnace temperature of 38.
The wire was baked by passing it through a furnace with a furnace length of 3.0 m at 0° C. several times to obtain an insulated wire with a coating thickness of about 20 μm. In addition, the infrared absorption spectrum of the film has 1780cm￣1 and 138cm￣1.
Imide group absorption was observed at 0 cm￣1.

[0225] The obtained electric wire was rated according to JIS C3003-19.
Evaluation was made according to the test method for enameled copper wire and enameled aluminum wire of No. 84. The evaluation results are shown in Table 2.

(Example 13) 3.168 g (0.016 mol) of diamine B3, 40 g of solvent DMAc and 40 g of NMP, acid dianhydride A2
A polyamic acid was synthesized in the same manner as in Example 12, except that 6.97 g (0.017 mol) of hydroxylamine S and 0.246 g (0.002 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 12, and evaluated in the same manner as in Example 1.

[0228] The evaluation results are shown in Table 2.

(Example 14) 4.95 g (0.025 mol) of diamine B3, solvent D
Polyamic acid was prepared in the same manner as in Example 12, except that 60 g of MAc, 60 g of NMP, 10.66 g (0.026 mol) of acid dianhydride A2, and 0.246 g (0.002 mol) of hydroxylamine S were used. was synthesized.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 12, and evaluated in the same manner as in Example 1.

[0231] The evaluation results are shown in Table 2.

(Example 15) 2.97 g (0.015 mol) of diamine B3, solvent D
30 g of MAc, 30 g of NMP, 6.56 g (0.016 mol) of acid dianhydride A2, 0.246 g (0.002 mol) of hydroxylamine S, and 0.045 g of tertiary amine C2 were used. Polyamic acid was synthesized in the same manner as in Example 12 except for this.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 12, and evaluated in the same manner as in Example 1.

[0234] The evaluation results are shown in Table 2.

(Example 16) 3.564 g (0.018 mol) of diamine B3, 40 g of solvent DMAc and 40 g of NMP, acid dianhydride A2
A polyamic acid was synthesized in the same manner as in Example 12, except that 8.61 g (0.021 mol) of hydroxylamine S and 0.738 g (0.006 mol) of hydroxylamine S were used.

[0236] It was a polyamic acid with n=6 in the general formula (Chemical formula 1) of the present invention.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 12, and evaluated in the same manner as in Example 1.

[0238] The evaluation results are shown in Table 2.

(Example 17) 4.158 g (0.021 mol) of diamine B3, 50 g of solvent DMAc and 50 g of NMP, acid dianhydride A2
A polyamic acid was synthesized in the same manner as in Example 12, except that 9.84 g (0.024 mol) of hydroxylamine S and 0.738 g (0.006 mol) of hydroxylamine S were used.

[0240] This was further reacted at 200°C for 3 hours,
It was imidized and confirmed by infrared absorption spectrum in the same manner as in Example 12.

An imidized insulated wire of the present invention was obtained in the same manner as in Example 12 using the obtained coating material (above solution), and evaluated in the same manner as in Example 1.

[0242] The evaluation results are shown in Table 2.

(Example 18) Into the polyamic acid solution of Example 16, 1 equivalent of isocyanate group was added per 1 equivalent of terminal hydroxyl group.
Diphenylmethane diisocyanate was blended and mixed to obtain a paint.

[0244] Using the obtained paint, an imidized polyurethane resin insulated wire of the present invention was obtained in the same manner as in Example 12.
This was evaluated in the same manner as in Example 1.

[0245] The evaluation results are shown in Table 2.

(Example 19) 3.96 g (0.02 mol) of diamine B3, solvent DM
40g of Ac, 40g of NMP, 8g of acid dianhydride A2
．． Polyamic acid was synthesized in the same manner as in Example 12, except that 2 g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 12, and evaluated in the same manner as in Example 1.

[0248] The evaluation results are shown in Table 2.

(Example 20) 5.94 g (0.03 mol) of diamine B3, solvent DM
60 g of Ac, 60 g of NMP, 1 acid dianhydride A2
Polyamic acid was synthesized in the same manner as in Example 12, except that 2.3 g (0.03 mol) was used. Add this to 210 more
℃ for 4 hours to perform imidization, which was confirmed by infrared absorption spectrum in the same manner as in Example 12.

An imidized insulated wire of the present invention was obtained in the same manner as in Example 12 using the obtained paint (above solution), and evaluated in the same manner as in Example 1.

[0251] The evaluation results are shown in Table 2.

(Example 21) In a reaction flask equipped with a stirrer, a thermometer, and a nitrogen inlet tube, 6.88 g (0.02 mol) of diamine B2, 50 g of solvent DMAc, and 50 g of NMP were charged, and the mixture was heated under a nitrogen stream. The mixture was thoroughly stirred while maintaining the temperature at 25°C. To this solution, 8.979 g (0.0205 mol) of acid dianhydride A3 and 0.123 g (0.001 mol) of hydroxylamine S were gradually added. After adding everything, add 1 at 25℃ under nitrogen stream.
Stirring was continued for 5 hours to synthesize polyamic acid.

[0253] The obtained paint (polyamic acid solution) was heated to 0.
Coating on a 4mmφ copper wire at a wire speed of 10m/min at a furnace temperature of 37.
The wire was baked by passing it through a furnace with a furnace length of 3.0 m at 0° C. several times to obtain an insulated wire with a coating thickness of about 20 μm. In addition, the infrared absorption spectrum of the film has 1780cm￣1 and 1380cm￣1.
Imide group absorption was observed at cm￣1.

[0254] The obtained electric wire was rated according to JIS C3003-1.
Evaluation was made according to the test method for enameled copper wire and enameled aluminum wire of 984.

Table 3 shows the evaluation results.

(Example 22) 3.2 g (0.016 mol) of diamine B5, solvent DM
40g of Ac, 40g of NMP, 7g of acid dianhydride A4
．． Polyamic acid was synthesized in the same manner as in Example 21, except that 491 g (0.0165 mol) and 0.123 g (0.001 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

[0258] The evaluation results are shown in Table 3.

(Example 23) 5.84 g (0.02 mol) of diamine B4, solvent DM
50g of Ac, 50g of NMP, 9g of acid dianhydride A5
．． Polyamic acid was synthesized in the same manner as in Example 21, except that 266 g (0.0205 mol) and 0.123 g (0.001 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

[0261] The evaluation results are shown in Table 3.

(Example 24) 5.94 g (0.03 mol) of diamine B3, solvent DM
70 g of Ac, 70 g of NMP, 1 g of acid dianhydride A6
Polyamic acid was synthesized in the same manner as in Example 21, except that 4.152 g (0.0305 mol) and 0.123 g (0.001 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

[0264] The evaluation results are shown in Table 3.

(Example 25) 5.2 g (0.026 mol) of diamine B5, solvent DM
65 g of Ac, 65 g of NMP, 1 of acid dianhydride A7
A polyamic acid was synthesized in the same manner as in Example 21, except that 2.879 g (0.0265 mol) and 0.123 g (0.001 mol) of hydroxylamine S were used.

[0266] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

Table 3 shows the evaluation results.

(Example 26) 6.424 g (0.022 mol) of diamine B4, 65 g of solvent DMAc and 65 g of NMP, acid dianhydride A8
A polyamic acid was synthesized in the same manner as in Example 21, except that 12.285 g (0.0225 mol) of hydroxylamine S and 0.123 g (0.001 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

[0270] The evaluation results are shown in Table 3.

(Example 27) 4.0 g (0.02 mol) of diamine B5, solvent DMA
45 g of c, 45 g of NMP, and 8.0 g of acid dianhydride A3.
A polyamic acid was synthesized in the same manner as in Example 21, except that 979 g (0.0205 mol) and 0.123 g (0.001 mol) of hydroxylamine S were used.

[0272] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and this was evaluated in the same manner as in Example 1.

Table 3 shows the evaluation results.

(Example 28) 5.84 g (0.02 mol) of diamine B4, solvent DM
50g of Ac, 50g of NMP, 8g of acid dianhydride A3
．． A polyamic acid was synthesized in the same manner as in Example 21, except that 979 g (0.0205 mol) and 0.123 g (0.001 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

Table 3 shows the evaluation results.

(Example 29) 5.84 g (0.02 mol) of diamine B4, solvent DM
50g of Ac, 50g of NMP, 8g of acid dianhydride A3
．． Polyamic acid was synthesized in the same manner as in Example 21, except that 979 g (0.0205 mol) of hydroxylamine S, 0.123 g (0.001 mol) of hydroxylamine S, and 0.05 g of tertiary amine C1 were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

Table 4 shows the evaluation results.

(Example 30) 2.92 g (0.01 mol) of diamine B4, solvent DM
30g of Ac, 30g of NMP, 4g of acid dianhydride A3
．． A polyamic acid was synthesized in the same manner as in Example 21, except that 818 g (0.011 mol) and 0.246 g (0.002 mol) of hydroxylamine S were used.

[0281] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

Table 4 shows the evaluation results.

(Example 31) Into the polyamic acid solution of Example 30, the terminal hydroxyl group 1
Diphenylmethane diisocyanate was blended and mixed at a ratio of 1 equivalent of isocyanate group per equivalent to obtain a paint.

[0284] Using the obtained paint, an imidized polyurethane resin insulated wire of the present invention was obtained in the same manner as in Example 21,
This was evaluated in the same manner as in Example 1.

Table 4 shows the evaluation results.

(Example 32) 5.84 g (0.02 mol) of diamine B4, solvent DM
50g of Ac, 50g of NMP, 8g of acid dianhydride A3
．． Polyamic acid was synthesized in the same manner as in Example 21 except that 76 g (0.02 mol) was used (however, hydroxylamine S was not used).

[0287] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

Table 4 shows the evaluation results.

(Example 33) 4.0 g (0.02 mol) of diamine B5, solvent DMA
45 g of c, 45 g of NMP, and 8.0 g of acid dianhydride A3.
Polyamic acid was synthesized in the same manner as in Example 21 except that 76 g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

Table 4 shows the evaluation results.

(Example 34) 6.88 g (0.02 mol) of diamine B2, solvent DM
55g of Ac, 55g of NMP, 8g of acid dianhydride A3
．． Polyamic acid was synthesized in the same manner as in Example 21 except that 76 g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

Table 4 shows the evaluation results.

(Example 35) 5.84 g (0.02 mol) of diamine B4, solvent DM
55g of Ac, 55g of NMP, 9g of acid dianhydride A4
．． A polyamic acid was synthesized in the same manner as in Example 21 except that 08 g (0.02 mol) of hydroxylamine S was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 21, and evaluated in the same manner as in Example 1.

Table 4 shows the evaluation results.

(Example 36) In a reaction flask equipped with a stirrer, a thermometer, and a nitrogen inlet tube, 2.72 g (0.02 mol) of diamine B7, 25 g of solvent DMAc, and 25 g of NMP were charged, and the mixture was heated under a nitrogen stream. The mixture was thoroughly stirred while maintaining the temperature at 25°C. To this solution, 4.578 g (0.021 mol) of acid dianhydride A9 and 0.246 g (0.002 mol) of hydroxylamine S were added.
Added gradually. After adding everything, heat at 25℃ under nitrogen stream for 15 minutes.
Stirring was continued for hours to synthesize polyamic acid.

[0299] The obtained paint (polyamic acid solution) was mixed with 0.
Coating on a 4mmφ copper wire at a wire speed of 10m/min at a furnace temperature of 37.
The wire was baked by passing it through a furnace with a furnace length of 3.0 m at 0° C. several times to obtain an insulated wire with a coating thickness of about 20 μm. In addition, the infrared absorption spectrum of the film has 1780cm￣1 and 1380cm￣1.
Imide group absorption was observed at cm￣1.

[0300] The obtained electric wire was rated according to JIS C3003-1.
Evaluation was made according to the test method for enameled copper wire and enameled aluminum wire of 984.

[0301] Table 5 shows the evaluation results.

(Example 37) 6.78 g (0.03 mol) of diamine B8, solvent DM
Polyamic acid was prepared in the same manner as in Example 36, except that 55 g of Ac, 55 g of NMP, 9.114 g (0.031 mol) of acid dianhydride A10, and 0.246 g (0.002 mol) of hydroxylamine S were used. was synthesized.

[0303] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and this was evaluated in the same manner as in Example 1.

[0304] The evaluation results are shown in Table 5.

(Example 38) 3.36 g (0.016 mol) of diamine B6, solvent D
30 g of MAc and 30 g of NMP, acid dianhydride A11
A polyamic acid was synthesized in the same manner as in Example 36, except that 5.474 g (0.017 mol) of hydroxylamine S and 0.246 g (0.002 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

Table 5 shows the evaluation results.

(Example 39) 2.84 g (0.02 mol) of diamine B9, solvent DM
Polyamic acid was prepared in the same manner as in Example 36, except that 30 g of Ac, 30 g of NMP, 5.628 g (0.021 mol) of acid dianhydride A12, and 0.246 g (0.002 mol) of hydroxylamine S were used. was synthesized.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

[0310] The evaluation results are shown in Table 5.

(Example 40) 2.964 g (0.026 mol) of diamine B10, 35 g of solvent DMAc and 35 g of NMP, acid dianhydride A
Polyamic acid was synthesized in the same manner as in Example 36, except that 7.236 g (0.027 mol) of No. 13 and 0.246 g (0.002 mol) of hydroxylamine S were used.

[0312] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

[0313] The evaluation results are shown in Table 5.

(Example 41) 5.712 g (0.024 mol) of diamine B11, 45 g of solvent DMAc and 45 g of NMP, acid dianhydride A
Polyamic acid was synthesized in the same manner as in Example 36, except that 6.7 g (0.025 mol) of No. 14 and 0.246 g (0.002 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

Table 5 shows the evaluation results.

(Example 42) 3.48 g (0.03 mol) of diamine B12, solvent D
50 g of MAc and 50 g of NMP, acid dianhydride A15
A polyamic acid was synthesized in the same manner as in Example 36, except that 9.61 g (0.031 mol) of hydroxylamine S and 0.246 g (0.002 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

[0319] Table 5 shows the evaluation results.

(Example 43) 2.04 g (0.02 mol) of diamine B13, solvent D
30 g of MAc and 30 g of NMP, acid dianhydride A16
Polyamic acid was synthesized in the same manner as in Example 36, except that 6.468 g (0.021 mol) of hydroxylamine S and 0.246 g (0.002 mol) of hydroxylamine S were used.

[0321] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

[0322] The evaluation results are shown in Table 5.

(Example 44) 4.52 g (0.02 mol) of diamine B8, solvent DM
Polyamic acid was prepared in the same manner as in Example 36, except that 40 g of Ac, 40 g of NMP, 7.056 g (0.021 mol) of acid dianhydride A17, and 0.246 g (0.002 mol) of hydroxylamine S were used. was synthesized.

[0324] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

Table 5 shows the evaluation results.

(Example 45) 4.52 g (0.02 mol) of diamine B8, solvent DM
Polyamic acid was prepared in the same manner as in Example 36, except that 40 g of Ac, 40 g of NMP, 6.762 g (0.021 mol) of acid dianhydride A11, and 0.246 g (0.002 mol) of hydroxylamine S were used. was synthesized.

[0327] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

[0328] Table 6 shows the evaluation results.

(Example 46) 4.76 g (0.02 mol) of diamine B11, solvent D
40 g of MAc and 40 g of NMP, acid dianhydride A16
Polyamic acid was synthesized in the same manner as in Example 36, except that 6.468 g (0.021 mol) of hydroxylamine S and 0.246 g (0.002 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

[0331] The evaluation results are shown in Table 6.

(Example 47) 4.52 g (0.02 mol) of diamine B8, solvent DM
40 g of Ac, 40 g of NMP, 6.762 g (0.021 mol) of acid dianhydride A11, 0.246 g (0.002 mol) of hydroxylamine S, and 0.06 g of tertiary amine C1 were used. Polyamic acid was synthesized in the same manner as in Example 36 except for this.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

Table 6 shows the evaluation results.

(Example 48) 2.26 g (0.01 mol) of diamine B8, solvent DM
Polyamic acid was prepared in the same manner as in Example 36, except that 25 g of Ac, 25 g of NMP, 3.703 g (0.0115 mol) of acid dianhydride A11, and 0.369 g (0.003 mol) of hydroxylamine S were used. was synthesized.

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

[0337] Table 6 shows the evaluation results.

(Example 49) Into the polyamic acid solution of Example 48, the terminal hydroxyl group 1
Diphenylmethane diisocyanate was blended and mixed at a ratio of 1 equivalent of isocyanate group per equivalent to obtain a paint.

[0339] Using the obtained paint, an imidized polyurethane resin insulated wire of the present invention was obtained in the same manner as in Example 36.
This was evaluated in the same manner as in Example 1.

[0340] The evaluation results are shown in Table 6.

(Example 50) 4.52 g (0.02 mol) of diamine B8, solvent DM
Polyamic acid was synthesized in the same manner as in Example 36, except that 40 g of Ac, 40 g of NMP, and 6.44 g (0.02 mol) of acid dianhydride A11 were used (however, hydroxylamine S was not used). .

[0342] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

[0343] The evaluation results are shown in Table 6.

(Example 51) 4.2 g (0.02 mol) of diamine B6, solvent DMA
35g of c, 35g of NMP, 5g of acid dianhydride A12
．． Polyamic acid was synthesized in the same manner as in Example 36, except that 36 g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

Table 6 shows the evaluation results.

(Example 52) 2.28 g (0.02 mol) of diamine B10, solvent D
35 g of MAc and 35 g of NMP, acid dianhydride A17
Example 36 except that 6.72 g (0.02 mol) of
Polyamic acid was synthesized in the same manner as (however, hydroxylamine S was not used).

[0348] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

Table 6 shows the evaluation results.

(Example 53) 2.04 g (0.02 mol) of diamine B13, solvent D
Polyamic acid was synthesized in the same manner as in Example 36, except that 25 g of MAc, 25 g of NMP, and 4.36 g (0.02 mol) of acid dianhydride A9 were used (however, hydroxylamine S was not used). .

[0351] Using the obtained paint (polyamic acid solution), an imidized insulated wire of the present invention was obtained in the same manner as in Example 36, and evaluated in the same manner as in Example 1.

[0352] The evaluation results are shown in Table 6.

[0353] Next, a comparative example will be shown.

Comparative Example 1 3.00 g (0.015 mol) of diamine B5, 20 g of solvent DMAc, and 20 g of NMP were placed in a reaction flask equipped with a stirrer, a thermometer, and a nitrogen inlet tube, and the mixture was heated for 25 hours under a nitrogen stream. The mixture was thoroughly stirred while maintaining the temperature at °C. In this solution,
3.597 g (0.0165 mol) of acid dianhydride A9 and 0.369 g (0.003 mol) of hydroxylamine S were gradually added. After all the mixture was added, stirring was continued for 12 hours at 25° C. under a nitrogen stream to synthesize polyamic acid.

[0355] The obtained paint (polyamic acid solution) was mixed with 0.
Coating on a 4mmφ copper wire at a wire speed of 10m/min at a furnace temperature of 37.
The wire was baked by passing it through a furnace with a furnace length of 3.0 m at 0° C. several times to obtain an insulated wire with a coating thickness of about 20 μm. In addition, the infrared absorption spectrum of the film has 1380 cm￣1 and 730 cm
Imide group absorption was observed at m￣1.

[0356] The obtained electric wire was treated with J in the same manner as in Example 1 above.
It was evaluated according to the test method for enamelled copper wire and enameled aluminum wire of IS C3003-1984, and the evaluation results are shown in Table 1.

Comparative Example 2 2.97 g (0.015 mol) of diamine B3, solvent D
Polyamic acid was prepared in the same manner as in Comparative Example 1, except that 20 g of MAc, 20 g of NMP, 3.597 g (0.0165 mol) of acid dianhydride A9, and 0.369 g (0.003 mol) of hydroxylamine S were used. was synthesized.

Using the obtained paint (polyamic acid solution), an imidized insulated wire was obtained in the same manner as in Comparative Example 1, and this was evaluated in the same manner as in Example 1.

[0359] The evaluation results are shown in Table 1.

Comparative Example 3 3.00 g (0.015 mol) of diamine B5, solvent D
Polyamic acid was synthesized in the same manner as in Comparative Example 1, except that 20 g of MAc, 20 g of NMP, and 3.27 g (0.015 mol) of acid dianhydride A9 were used (however, hydroxylamine S was not used). .

Using the obtained paint (polyamic acid solution), an imidized insulated wire was obtained in the same manner as in Comparative Example 1, and this was evaluated in the same manner as in Example 1.

[0362] The evaluation results are shown in Table 1.

Comparative Example 4 3.96 g (0.02 mol) of diamine B3, solvent DM
25g of Ac, 25g of NMP, 4g of acid dianhydride A9
．． A polyamic acid was synthesized in the same manner as in Comparative Example 1 except that 36 g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire was obtained in the same manner as in Comparative Example 1, and this was evaluated in the same manner as in Example 1.

[0365] The evaluation results are shown in Table 1.

Comparative Example 5 3.96 g (0.02 mol) of diamine B3, 40 g of solvent DMAc, and 40 g of NMP were placed in a reaction flask equipped with a stirrer, a thermometer, and a nitrogen inlet tube, and the mixture was heated for 25 hours under a nitrogen stream. The mixture was thoroughly stirred while maintaining the temperature at °C. To this solution, 4.578 g (0.021 mol) of acid dianhydride A9 and 0.246 g (0.002 mol) of hydroxylamine S were added.
Added gradually. After adding everything, heat at 25°C under a nitrogen stream for 14 hours.
Stirring was continued for hours to synthesize polyamic acid.

[0367] The obtained paint (polyamic acid solution) was heated to 0.
Coat it on a 4mmφ copper wire at a wire speed of 10m/min and at a furnace temperature of 38.
The wire was baked by passing it through a furnace with a furnace length of 3.0 m at 0° C. several times to obtain an insulated wire with a coating thickness of about 20 μm. In addition, the infrared absorption spectrum of the film has 1780cm￣1 and 1380cm￣1.
Imide group absorption was observed at cm￣1.

[0368] The obtained electric wire was treated with J in the same manner as in Example 1 above.
It was evaluated according to the enamelled copper wire and enameled aluminum wire test method of IS C3003-1984, and the evaluation results are shown in Table 2.

Comparative Example 6 3.96 g (0.02 mol) of diamine B3, solvent DM
40g of Ac, 40g of NMP, 4g of acid dianhydride A9
．． Polyamic acid was synthesized in the same manner as in Comparative Example 5 except that 36 g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire was obtained in the same manner as in Comparative Example 5, and evaluated in the same manner as in Example 1.

[0371] The evaluation results are shown in Table 2.

Comparative Example 7 10 g of a polyester polyol synthesized from a polyhydric alcohol and a polycarboxylic acid (Desmophene 600 manufactured by Sumitomo Bayer Urethane Co., Ltd.) was used as a blocked isocyanate (Desmodur manufactured by Sumitomo Bayer Urethane Co., Ltd.) CT stay
A coating composition was obtained by dissolving 21.2 g of lead octylate and 0.2 g of lead octylate in 40 g of cresol.

Using the obtained coating composition, an insulated wire was obtained in the same manner as in Comparative Example 5, and evaluated in the same manner as in Example 1.

[0374] The evaluation results are shown in Table 2.

Comparative Example 8 In a reaction flask equipped with a stirrer, a thermometer, and a nitrogen inlet tube, 3.96 g (0.02 mol) of diamine B3, 30 g of solvent DMAc, and 30 g of NMP were charged, and the mixture was heated for 25 hours under a nitrogen stream. The mixture was thoroughly stirred while maintaining the temperature at °C. To this solution, 4.469 g (0.0205 mol) of acid dianhydride A9 and 0.123 g (0.001 mol) of hydroxylamine S were gradually added. After adding everything, add 1 at 25℃ under nitrogen stream.
Stirring was continued for 5 hours to synthesize polyamic acid.

[0376] The obtained paint (polyamic acid solution) was heated to 0.
Coating on a 4mmφ copper wire at a wire speed of 10m/min at a furnace temperature of 37.
The wire was baked by passing it through a furnace with a furnace length of 3.0 m at 0° C. several times to obtain an insulated wire with a coating thickness of about 20 μm. In addition, the infrared absorption spectrum of the film has 1380 cm￣1 and 730 cm
Imide group absorption was observed at m￣1.

[0377] The obtained electric wire was treated with J in the same manner as in Example 1 above.
It was evaluated according to the enamelled copper wire and enameled aluminum wire test method of IS C3003-1984, and the evaluation results are shown in Tables 3 and 4.

Comparative Example 9 3.96 g (0.02 mol) of diamine B3, solvent DM
Polyamic acid was prepared in the same manner as in Comparative Example 8, except that 35 g of Ac, 35 g of NMP, 6.027 g (0.0205 mol) of acid dianhydride A10, and 0.123 g (0.001 mol) of hydroxylamine S were used. was synthesized.

Using the obtained paint (polyamic acid solution), an imidized insulated wire was obtained in the same manner as in Comparative Example 8, and this was evaluated in the same manner as in Example 1.

[0380] The evaluation results are shown in Tables 3 and 4.

Comparative Example 10 3.96 g (0.02 mol) of diamine B3, solvent DM
Polyamic acid was synthesized in the same manner as in Comparative Example 8, except that 35 g of Ac, 35 g of NMP, and 6.44 g (0.02 mol) of acid dianhydride A11 were used (however, hydroxylamine S was not used). .

Using the obtained paint (polyamic acid solution), an imidized insulated wire was obtained in the same manner as in Comparative Example 8, and evaluated in the same manner as in Example 1.

[0383] The evaluation results are shown in Tables 3 and 4.

Comparative Example 11 3.96 g (0.02 mol) of diamine B3, solvent DM
30g of Ac, 30g of NMP, 4g of acid dianhydride A9
．． Polyamic acid was synthesized in the same manner as in Comparative Example 8 except that 36 g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire was obtained in the same manner as in Comparative Example 8, and this was evaluated in the same manner as in Example 1.

[0386] The evaluation results are shown in Tables 3 and 4.

Comparative Example 12 In a reaction flask equipped with a stirrer, a thermometer, and a nitrogen inlet tube, 3.96 g (0.02 mol) of diamine B3, 30 g of solvent DMAc, and 30 g of NMP were charged, and the mixture was heated for 25 hours under a nitrogen stream. The mixture was thoroughly stirred while maintaining the temperature at °C.

[0388] Add 4.578% of acid dianhydride A9 to this solution.
g (0.021 mol) and hydroxylamine S.
246 g (0.002 mol) was added gradually. After all the mixture was added, stirring was continued for 15 hours at 25° C. under a nitrogen stream to synthesize polyamic acid.

[0389] The obtained paint (polyamic acid solution) was heated to 0.
Coating on a 4mmφ copper wire at a wire speed of 10m/min at a furnace temperature of 37.
The wire was baked by passing it through a furnace with a furnace length of 3.0 m at 0° C. several times to obtain an insulated wire with a coating thickness of about 20 μm. In addition, the infrared absorption spectrum of the film has 1780cm￣1 and 1380cm￣1.
Imide group absorption was observed at cm￣1.

[0390] The obtained electric wire was treated with J in the same manner as in Example 1 above.
It was evaluated according to the enamelled copper wire and enameled aluminum wire test method of IS C3003-1984, and the evaluation results are shown in Tables 5 and 6.

Comparative Example 13 4.0 g (0.02 mol) of diamine B5, solvent DMA
35g of c, 35g of NMP, 5g of acid dianhydride A12
．． A polyamic acid was synthesized in the same manner as in Comparative Example 12, except that 628 g (0.021 mol) and 0.246 g (0.002 mol) of hydroxylamine S were used.

Using the obtained paint (polyamic acid solution), an imidized insulated wire was obtained in the same manner as in Comparative Example 12, and this was evaluated in the same manner as in Example 1.

[0393] The evaluation results are shown in Tables 5 and 6.

Comparative Example 14 3.96 g (0.02 mol) of diamine B3, solvent DM
30g of Ac, 30g of NMP, 4g of acid dianhydride A9
．． Polyamic acid was synthesized in the same manner as Comparative Example 12 except that 36 g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire was obtained in the same manner as in Comparative Example 12, and this was evaluated in the same manner as in Example 1.

[0396] The evaluation results are shown in Tables 5 and 6.

Comparative Example 15 4.0 g (0.02 mol) of diamine B5, solvent DMA
35g of c, 35g of NMP, 5g of acid dianhydride A12
．． Polyamic acid was synthesized in the same manner as Comparative Example 12 except that 36 g (0.02 mol) was used (however, hydroxylamine S was not used).

Using the obtained paint (polyamic acid solution), an imidized insulated wire was obtained in the same manner as in Comparative Example 12, and this was evaluated in the same manner as in Example 1.

[0399] The evaluation results are shown in Tables 5 and 6.

0400]

[Table 1]

0401]

[Table 2]

0402]

[Table 3]

0403]

[Table 4]

0404]

[Table 5]

0405]

[Table 6]

As is clear from the results in Tables 1 to 6, the insulated wire of the present invention has the same or better general characteristics than the conventional product (comparative example), and also has excellent solderability. It is clear that it has.

[0407] That is, the electric wire of the present invention has excellent heat resistance and is also an excellent electric wire that can be soldered.

Next, an example of application to a flyback transformer for color TV will be shown.

A life test was conducted on a flyback transformer (FBT) using the electric wire of the present invention under voltage application.

FIG. 2 shows a schematic cross-sectional view of an FBT for color TV. Furthermore, FIG. 3 shows an enlarged view of the high-voltage coil portion, which significantly affects the service life.

In these figures, 3 is a high voltage winding, 4 is a high voltage bobbin, 5 is a low voltage winding, and 6 is a low voltage bobbin. The high voltage winding 3 is wound within a groove formed in the high voltage bobbin 4. The low voltage winding 5 is wound within a groove formed in the low voltage bobbin 6.

Further, 7 is a filler, 8 is a storage case, and 9 is a core.

[0413] Normally, the voltage between the windings in contact is 10~
It is said to be 300V.

[0414] Therefore, two electric wires were brought into contact and wound around a plastic cylinder, embedded in a filler (epoxy resin), and left at 110°C while applying a voltage of 3 kV between both ends exposed to the air. Then, an accelerated life test of the FBT was conducted to determine the time required for dielectric breakdown.

According to Weibull plot, Examples 1, 2, 3, 22, 28, 32, 35, 37, 49,
Electric wires using coating materials of 50 and 51 (however, the diameter of copper wire:
0.06mm, film thickness: 0.01mm), the time for 1% defective rate to occur was 450hr, 50hr
0hr, 600hr, 530hr, 550hr, 580
hr, 560hr, 540hr, 550hr, 570hr
r, 560 hours.

On the other hand, as coating materials for comparison, Desmophene 800 (polyol) manufactured by Sumitomo Bayer Urethane Co., Ltd. and Desmodur CT Stable (block type isocyanate) were used as coating materials for comparison.
A general-purpose polyurethane resin consisting of (g) was selected, an insulated wire was made, and the same accelerated life test as above was conducted. the result,
It was revealed that the time required for a 1% defective rate to occur was only 40 hours, which was extremely inferior to the example.

[0417] That is, by using the electric wire of the present invention, a conventional product (comparative example) using a general-purpose polyurethane resin
Compared to this, it is possible to extend the life of the FBT and increase its output.

0418]

[Effects of the Invention] The insulated wire of the present invention makes it possible to achieve both heat resistance and solderability without impairing electrical properties, mechanical properties, and chemical properties, and is suitable for electrical applications such as transformers that require heat resistance. It has an effect that can be used widely in equipment and has good workability.

Furthermore, the insulating paint of the present invention can be used to coat various conductors as a film that requires heat resistance and insulation.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an insulated wire according to the present invention.

FIG. 2 is a schematic cross-sectional view of a flyback transformer for color TV.

FIG. 3 is an enlarged view of a high-voltage coil portion in the sectional view of the transformer.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1... Conductor, 2... Insulating film, 3... High voltage winding, 4... High voltage bobbin, 5... Low voltage winding, 6... Low voltage bobbin, 7... Filler, 8...
Storage case, 9...core.

Claims (22)

[Claims] 1. A solderable insulated wire having a polyimide resin film, which is obtained by coating a conductor with an insulating paint containing a polyamic acid represented by the general formula (Chemical formula 1) and baking it. However, in the above general formula (Chemical formula 1),
X is an alkylene group or an alkylenephenylene group, n is a positive integer, and when R1 is a tetravalent organic group selected from the group consisting of general formula (Chemical formula 2) [Chemical formula 2], R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). [Claim 2] A hydroxylamine represented by the general formula (Chemical formula 6) [Chemical formula 6], a tetracarboxylic dianhydride represented by the general formula (Chemical formula 7) [Chemical formula 7], and a general formula (Chemical formula 8)
) A diamine represented by [Chemical formula 8] is reacted in the presence of an organic solvent to produce a polyamic acid represented by the general formula (Chemical formula 1) [Chemical formula 1], and then an insulating paint containing this is applied onto a conductor. A method for producing a solderable insulated wire, which comprises applying the polyimide resin to a polyimide resin, baking it, and causing an intramolecular reaction between the amide group and the carboxyl group in the general formula (Chemical formula 1) to imidize the polyimide resin. However, in the above general formulas (Chemical formula 6), (Chemical formula 7), (Chemical formula 8) and (Chemical formula 1), X is an alkylene group or an alkylenephenylene group, n is a positive integer, and R1 is 2) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 4) ) [Chemical 4] When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). 3. The method for producing a solderable insulated wire according to claim 2, wherein the insulating paint contains a catalytic amount of tertiary amine. 4. An insulating paint containing a polyamic acid represented by the general formula (Chemical formula 1): [Chemical formula 1]. However, in the above general formula (Chemical formula 1), X is an alkylene group or an alkylenephenylene group, n is a positive integer, and R1 is a tetravalent group selected from the group consisting of the general formula (Chemical formula 2) [Chemical formula 2] When it is an organic group, R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). 5. Applying an insulating paint containing a polyamic acid represented by the general formula (Chemical formula 1) [Chemical formula 1] and an isocyanate or a blocked isocyanate onto a conductor,
A solderable insulated wire with a baked imidized polyurethane resin film. However, in the above general formula (Chemical formula 1), X is an alkylene group or an alkylenephenylene group, n is a positive integer, and R1 is a tetravalent group selected from the group consisting of the general formula (Chemical formula 2) [Chemical formula 2] When it is an organic group, R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). [Claim 6] A polyamic acid represented by the general formula (Chemical formula 1) [Chemical formula 1] and an isocyanate or a blocked isocyanate are used in an amount of 0.4 isocyanate groups per equivalent of the terminal hydroxyl group of the polyamic acid. By applying an insulating coating compounded at a ratio of ~2.0 equivalents onto a conductor and baking it, the amide group and carboxyl group of the polyamic acid react intramolecularly to imidize it, and the terminal hydroxyl group becomes an isocyanate. - or blocked isocyanate
A method for manufacturing a solderable insulated wire, characterized in that an imidized polyurethane resin is produced by reacting with a solderable insulated wire. However, in the above general formula (Chemical formula 1), X is an alkylene group or an alkylenephenylene group, n is a positive integer, and R1 is a tetravalent group selected from the group consisting of the general formula (Chemical formula 2) [Chemical formula 2] When it is an organic group, R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). 7. The method for producing a solderable insulated wire according to claim 6, wherein the insulating paint contains a catalytic amount of tertiary amine. [Claim 8] A polyamic acid represented by the general formula (Chemical formula 1) [Chemical formula 1] and an isocyanate or a blocked isocyanate are used in an amount of 0.4 isocyanate groups per equivalent of the terminal hydroxyl group of the polyamic acid. An insulating coating compounded at a ratio of ~2.0 equivalents. However, the above general formula (Chemical formula 1
), X is an alkylene group or an alkylenephenylene group,
n is a positive integer, and when R1 is a tetravalent organic group selected from the group consisting of the general formula (Chemical formula 2) [Chemical formula 2], R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). 9. A solderable insulated wire having a polyimide resin film, which is obtained by coating a conductor with an insulating paint containing a polyimide represented by the general formula (Chemical Formula 9) and baking it. However, in the above general formula (Chemical formula 9), X
is an alkylene group or an alkylenephenylene group, n is a positive integer, and R1 is a tetravalent organic group selected from the group consisting of general formula (Chemical formula 2) [Chemical formula 2], R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). [Claim 10] A hydroxylamine represented by the general formula (Chemical formula 6) [Chemical formula 6], a tetracarboxylic dianhydride represented by the general formula (Chemical formula 7) [Chemical formula 7], and a general formula (Chemical formula 8)
) A diamine represented by [Chemical formula 8] is reacted in the presence of an organic solvent to produce a polyimide represented by the general formula (Chemical formula 9) [Chemical formula 9], and then an insulating paint containing this is applied onto a conductor. A method for manufacturing a solderable insulated wire, which comprises coating and baking. However, in the above general formulas (Chemical Formula 6), (Chemical Formula 7), (Chemical Formula 8) and (Chemical Formula 9), X is an alkylene group or an alkylenephenylene group, n is a positive integer, and R1 is 2) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). [Claim 11] An insulating paint containing a polyimide represented by the general formula (Chemical formula 9) [Chemical formula 9]. However, in the above general formula (Chemical formula 9), X is an alkylene group or an alkylenephenylene group, n is a positive integer, and R1 is the general formula (Chemical formula 2) [
When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). 12. A solderable insulated wire having a polyimide resin film represented by the general formula (Chemical formula 10). However, in the above general formula (Chemical formula 10), n is a positive integer, and when R1 is a tetravalent organic group selected from the group consisting of the general formula (Chemical formula 2) [Chemical formula 2], R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). [Claim 13] A tetracarboxylic dianhydride represented by the general formula (Chemical formula 7) [Chemical formula 7] and a tetracarboxylic dianhydride represented by the general formula (Chemical formula 8)
) A diamine represented by [Chemical formula 8] is reacted in the presence of an organic solvent to produce a polyamic acid represented by the general formula (Chemical formula 11) [Chemical formula 11], and then an insulating paint containing this is applied onto a conductor. A method for manufacturing a solderable insulated wire, characterized in that the amide group and the carboxyl group in the general formula (Chemical formula 11) are intramolecularly reacted and imidized to form a polyimide resin by coating and baking the solderable insulated wire. . However, in the above general formulas (Chemical formula 7), (Chemical formula 8) and (Chemical formula 11),
n is a positive integer, and when R1 is a tetravalent organic group selected from the group consisting of the general formula (Chemical formula 2) [Chemical formula 2], R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). 14. The method of manufacturing a solderable insulated wire according to claim 13, wherein the insulating paint contains a catalytic amount of a tertiary amine. 15. An insulating paint containing a polyamic acid represented by the general formula (Chemical Formula 11): [Claim 15] However, in the above general formula (Chemical formula 11), n is a positive integer, and when R1 is a tetravalent organic group selected from the group consisting of the general formula (Chemical formula 2) [Chemical formula 2], R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). 16. A polyimide resin film represented by the above general formula (Chemical formula 10), which is characterized in that an insulating paint containing a polyimide represented by the general formula (Chemical formula 10) [Chemical formula 10] is coated on a conductor and baked. A method of manufacturing a solderable insulated wire having the following methods. However, in the above general formula (Chemical formula 10),
n is a positive integer, and when R1 is a tetravalent organic group selected from the group consisting of the general formula (Chemical formula 2) [Chemical formula 2], R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). [Claim 17] A tetracarboxylic dianhydride represented by the general formula (Chemical formula 7) [Chemical formula 7] and a tetracarboxylic dianhydride represented by the general formula (Chemical formula 8)
) A diamine represented by [Chemical formula 8] is reacted in the presence of an organic solvent to produce a polyamic acid represented by the general formula (Chemical formula 11) [Chemical formula 11], and the polyamic acid is imidized to form the general formula (Chemical Formula 10) A method for producing a solderable insulated wire, which comprises producing a polyimide represented by the formula (Chemical Formula 10), and then applying an insulating paint containing the polyimide onto a conductor and baking it. However, in the above general formulas (Chemical Formula 7), (Chemical Formula 8), (Chemical Formula 11) and (Chemical Formula 11), n
is a positive integer, and when R1 is a tetravalent organic group selected from the group consisting of the general formula (Chemical formula 2) [Chemical formula 2], R2
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). 18. An insulating paint containing a polyimide represented by the general formula (Chemical formula 10): [Claim 18] However, in the above general formula (Chemical formula 10), n is a positive integer, and R1 is the general formula (Chemical formula 10).
Chemical formula 2) [Chemical formula 2] When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of general formula (Chemical formula 3) [Chemical formula 3] (h is an integer of 2 to 16, i and j are integers of 2 to 10), and R1 is a general formula (Chemical formula 3) 4) When R2 is a tetravalent organic group selected from the group consisting of
is a divalent organic group selected from the group consisting of the general formula (Chemical formula 5) [Chemical formula 5] (k is an integer of 1 to 10, l and m are integers of 2 to 10). 19. X is an alkylene group selected from the group consisting of general formula (Chemical formula 12) [Chemical formula 12] or general formula (Chemical formula 1)
3) The insulated wire according to claim 1, which is an alkylenephenylene group selected from the group consisting of: 20. X is an alkylene group selected from the group consisting of the general formula (Chemical formula 12) [Chemical formula 12] or the general formula (Chemical formula 1)
3) The method for producing an insulated wire according to any one of claims 2, 3, 6, 7, or 10, wherein the alkylenephenylene group is selected from the group consisting of: . [Claim 21] X is an alkylene group selected from the group consisting of the general formula (Formula 12) [Chemical formula 12] or the general formula (Formula 1
3) The insulating paint according to claim 4, 8 or 11, which is an alkylenephenylene group selected from the group consisting of: Claim 22: Claim 1, 5, 9 or 1
A flyback transformer characterized by using the insulated wire according to item 2.