JPH0421099Y2 - - Google Patents

Info

Publication number

JPH0421099Y2

JPH0421099Y2 JP7871987U JP7871987U JPH0421099Y2 JP H0421099 Y2 JPH0421099 Y2 JP H0421099Y2 JP 7871987 U JP7871987 U JP 7871987U JP 7871987 U JP7871987 U JP 7871987U JP H0421099 Y2 JPH0421099 Y2 JP H0421099Y2

Authority

JP

Japan

Prior art keywords

annular

holding plate

cylindrical body

annular holding

plate

Prior art date

1987-05-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000004020 conductor Substances 0.000 claims description 9
• 239000011248 coating agent Substances 0.000 claims description 5
• 238000000576 coating method Methods 0.000 claims description 5
• 238000001514 detection method Methods 0.000 claims description 3
• 229910052751 metal Inorganic materials 0.000 description 8
• 239000002184 metal Substances 0.000 description 8
• 229910000831 Steel Inorganic materials 0.000 description 3
• 239000003973 paint Substances 0.000 description 3
• 239000010959 steel Substances 0.000 description 3
• 229910052782 aluminium Inorganic materials 0.000 description 2
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
• 238000003780 insertion Methods 0.000 description 2
• 230000037431 insertion Effects 0.000 description 2
• 238000012423 maintenance Methods 0.000 description 2
• 238000005259 measurement Methods 0.000 description 2
• BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
• 239000004925 Acrylic resin Substances 0.000 description 1
• 229920000178 Acrylic resin Polymers 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 241001061260 Emmelichthys struhsakeri Species 0.000 description 1
• NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000006073 displacement reaction Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000012777 electrically insulating material Substances 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 239000003365 glass fiber Substances 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• 238000007689 inspection Methods 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 229910052755 nonmetal Inorganic materials 0.000 description 1
• 230000002093 peripheral effect Effects 0.000 description 1
• 229910052697 platinum Inorganic materials 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1