JPH0420718B2 - - Google Patents

Info

Publication number
JPH0420718B2
JPH0420718B2 JP61198485A JP19848586A JPH0420718B2 JP H0420718 B2 JPH0420718 B2 JP H0420718B2 JP 61198485 A JP61198485 A JP 61198485A JP 19848586 A JP19848586 A JP 19848586A JP H0420718 B2 JPH0420718 B2 JP H0420718B2
Authority
JP
Japan
Prior art keywords
workpiece
processing
copying
guide
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61198485A
Other languages
Japanese (ja)
Other versions
JPS6356381A (en
Inventor
Yoshihide Kanehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61198485A priority Critical patent/JPS6356381A/en
Publication of JPS6356381A publication Critical patent/JPS6356381A/en
Publication of JPH0420718B2 publication Critical patent/JPH0420718B2/ja
Granted legal-status Critical Current

Links

Description

【発明の詳細な説明】 [産業上の利用分野] この発明は、レーザ加工装置において、被加工
物と加工ヘツドとの距離を一定に保つためのレー
ザ加工用非接触倣い装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a non-contact tracing device for laser processing for maintaining a constant distance between a workpiece and a processing head in a laser processing device.

[従来の技術] 従来の上記のようなレーザ加工用非接触倣い装
置を第6図について説明する。
[Prior Art] A conventional non-contact tracing device for laser processing as described above will be explained with reference to FIG.

第6図において、1は加工ヘツドであり、加工
ヘツド1内には図示しない発振器から発振された
レーザ光2を集光する加工レンズ3が設けられ、
加工ヘツド1の先端部にはノズル4が形成されて
いる。そして、加工レンズ3によつて集光された
レーザ光2を焦点位置5で被加工物6に当てるこ
とにより、被加工物6に対して切断,溶接などの
レーザ加工を行うと共に、図示しない供給源から
ノズル4内に送られた酸素,窒素,アルゴンなど
の加工ガス7をノズル4の先端からレーザ光2と
同軸に被加工物6に向けて吹き出し、被加工物6
の加工を促進させている。
In FIG. 6, 1 is a processing head, and a processing lens 3 is provided in the processing head 1 to condense a laser beam 2 oscillated from an oscillator (not shown).
A nozzle 4 is formed at the tip of the processing head 1. By applying the laser beam 2 focused by the processing lens 3 to the workpiece 6 at the focal position 5, laser processing such as cutting and welding is performed on the workpiece 6, and a supply (not shown) is performed on the workpiece 6. Processing gas 7 such as oxygen, nitrogen, or argon sent from the source into the nozzle 4 is blown out from the tip of the nozzle 4 toward the workpiece 6 coaxially with the laser beam 2.
It is promoting the processing of

このようなレーザ加工装置では、上記加工ヘツ
ド1に固定された距離検出器8に、上記ノズル4
の外周に嵌まるものなどの倣い接触子9を可動に
連結し、この接触子9を被加工物6に摺動自在に
接触させることで、被加工物6と加工ヘツド1と
の距離を検出し、この距離が一定になるように上
記距離検出器8によつて加工ヘツド1または被加
工物6を移動させる制御を行つている。
In such a laser processing device, a distance detector 8 fixed to the processing head 1 is connected to the nozzle 4.
The distance between the workpiece 6 and the machining head 1 is detected by movably connecting a copying contact 9, such as one that fits on the outer periphery of the workpiece, and bringing this contactor 9 into slidable contact with the workpiece 6. However, the distance detector 8 controls the movement of the machining head 1 or the workpiece 6 so that this distance is constant.

[発明が解決しようとする課題] 従来のレーザ加工用非接触倣い装置は、以上の
ように構成されているので、第7図に示すよう
に、被加工物6の表面に倣い接触子9が接触し、
この接触子9によつて被加工物6の高温になる表
面に傷をつけ、被加工物の商品価値を下げてしま
うという問題点があつた。
[Problems to be Solved by the Invention] The conventional non-contact tracing device for laser processing is configured as described above, so that the contact 9 can be traced to the surface of the workpiece 6 as shown in FIG. contact,
There is a problem in that the contactor 9 damages the high-temperature surface of the workpiece 6, lowering the commercial value of the workpiece.

この発明は、上記のような問題点を解決するた
めになされたもので、被加工物に接触せずに倣い
接触子と同様な機能をもつ倣い案内子によつて、
被加工物と加工ヘツドとの距離を検出することに
より、被加工物の表面に傷がつかないようにした
レーザ加工用非接触倣い装置を簡単な構造で安価
に得ることを目的としている。
This invention was made to solve the above-mentioned problems, and uses a copying guide that has the same function as a copying contact without contacting the workpiece.
The object of the present invention is to provide a non-contact tracing device for laser machining with a simple structure and at low cost, which prevents scratches on the surface of a workpiece by detecting the distance between the workpiece and a processing head.

[課題を解決するための手段] この発明に係る非接触倣い装置は、上記のよう
なレーザ加工装置において、ノズルからの加工ガ
スを被加工物への吹き付けにより浮上する倣い案
内子を距離検出器に連結させたものである。
[Means for Solving the Problems] A non-contact copying device according to the present invention is a laser processing device as described above, in which a copying guide levitated by spraying processing gas from a nozzle onto a workpiece is connected to a distance detector. It is connected to.

[作用] この発明における非接触倣い装置は、ノズルか
ら被加工物に向けて吹き出す加工ガスによつて倣
い案内子を被加工物の表面から浮上させ、この状
態で距離検出器によつて加工ヘツドと被加工物と
の距離を検出でき、倣い案内子で被加工物の表面
に傷をつけることがない。また、この発明の非接
触倣い装置は、上記加工ガスを利用しているの
で、倣い案内子の浮上に別個の浮上用気体、およ
び倣い案内子を浮上させるための制御装置を必要
としないことにより、構造が簡単である。
[Function] The non-contact copying device of the present invention causes the copying guide to float above the surface of the workpiece by the processing gas blown from the nozzle toward the workpiece, and in this state, the distance detector detects the processing head. The distance between the machine and the workpiece can be detected, and the copying guide will not damage the surface of the workpiece. Furthermore, since the non-contact copying device of the present invention uses the above-mentioned processing gas, it does not require a separate floating gas for floating the copying guide and a control device for floating the copying guide. , the structure is simple.

[実施例] 以下、この発明に一実施例を第1図ないし第3
図について説明する。
[Example] Hereinafter, an example of this invention will be shown in FIGS. 1 to 3.
The diagram will be explained.

第1図ないし第3図において、第6図と同一符
号は同一または相当部分を示し、10は倣い案内
子であり、この案内子10は、リング状の浮上部
材11が中間リング12内に直径上でピン13,
13によつて上下回動自在に支持され、中間リン
グ12が直径上でピン13,13と直交するピン
14,14によつて支持部材15の孔部15a内
に上下回動自在に支持されて、ジンバル
(ginbal)構造の支持機構16が構成され、上記
孔部15aの外周側から斜め外上方に延びる腕部
15bが距離検出器に可動に連結されている。ま
た、浮上部材11は、ノズル4の外周に隙間を有
して嵌まり、被加工物6の表面6aと対向する面
11aは表面6aに対し平行または内周側が表面
6aと離れるように軸方向と直角な面に対して傾
斜している。なお、この実施例の上述した以外の
構成は第6図に示す従来の倣い装置と同様であ
る。
1 to 3, the same reference numerals as in FIG. 6 indicate the same or equivalent parts, and 10 is a copying guide, and this guide 10 has a ring-shaped floating member 11 inside an intermediate ring 12 with a diameter Pin 13 on top,
The intermediate ring 12 is vertically movably supported in the hole 15a of the support member 15 by pins 14, 14 which are perpendicular to the pins 13, 13 in diameter. A support mechanism 16 having a gimbal structure is constructed, and an arm portion 15b extending diagonally outward and upward from the outer peripheral side of the hole portion 15a is movably connected to a distance detector. Further, the floating member 11 is fitted onto the outer periphery of the nozzle 4 with a gap, and the surface 11a facing the surface 6a of the workpiece 6 is parallel to the surface 6a or in the axial direction such that the inner peripheral side is separated from the surface 6a. is inclined with respect to a plane perpendicular to. The configuration of this embodiment other than that described above is the same as that of the conventional copying apparatus shown in FIG.

以上のように構成された実施例の非接触倣い装
置は、ノズル4から吹き出す加工ガス7の流れで
浮上部材11が被加工物6の表面6aから浮上
し、倣い案内子10も浮上する。すなわち、この
実施例では、上述したジンバル構造の支持機構1
6を介して浮上部材11が支持部材15に支持さ
れ、浮上部材11の被加工物表面6a側の面11
aが自由に動くようになつているので、第2図に
示す被加工物6の表面6aが水平な場合はもちろ
ん、第3図に示す上記表面6aを傾斜している場
合でも、表面6aに対し浮上部材11が平行に保
たれて浮上する。この浮上状態での被加工物6と
加工ヘツドとの距離を上記案内子10が検出し、
距離検出器によつて被加工物6と加工ヘツド1と
の距離が一定となり、レーザ光2の焦点位置5が
被加工物6の適所に常に位置するように、加工ヘ
ツド1または被加工物6を移動させながら、被加
工物6にレーザ光2による切断,溶接などのレー
ザ加工を行うとともに、ノズル4から吹き出す加
工ガス7によつてレーザ加工を促進させる。
In the non-contact copying apparatus of the embodiment configured as described above, the floating member 11 floats from the surface 6a of the workpiece 6 due to the flow of the processing gas 7 blown out from the nozzle 4, and the copying guide 10 also floats. That is, in this embodiment, the support mechanism 1 of the gimbal structure described above is
6, the floating member 11 is supported by the support member 15, and the surface 11 of the floating member 11 on the workpiece surface 6a side
Since a can move freely, the surface 6a of the workpiece 6 can move freely, not only when the surface 6a of the workpiece 6 shown in FIG. 2 is horizontal, but also when the surface 6a is inclined as shown in FIG. On the other hand, the floating member 11 is kept parallel and floats. The guide 10 detects the distance between the workpiece 6 and the processing head in this floating state,
The distance detector keeps the distance between the workpiece 6 and the workpiece 1 constant, and the distance between the workpiece 6 and the workpiece 6 is adjusted so that the focal position 5 of the laser beam 2 is always located at a suitable position on the workpiece 6. While moving the workpiece 6, laser processing such as cutting and welding is performed on the workpiece 6 using the laser beam 2, and the laser processing is promoted by the processing gas 7 blown out from the nozzle 4.

第4図は、この発明の他の実施例を示し、この
実施例では、一体形の倣い案内子10を加工ガス
7の被加工物6への吹き出しによつて浮上させる
非接触倣い装置であつて、第4図に示すように、
被加工物6の表面6aが水平な場合には上述した
第1図ないし第3図に示すものと同様に、倣い案
内子10が被加工物6の表面6aに対し浮上した
状態で加工を行うことができ、問題がない。そし
て、第4図に示す非接触倣い装置では、第5図に
示す被加工物6の表面6aが傾斜している場合に
は、倣い案内子10の一部が被加工物6の表面6
aに接触し、焦点位置5がずれるとともに、表面
6aを案内子10が摺動して傷つけることがある
が、第1図ないし第3図に示す実施例の非接触倣
い装置では、上述したように、加工ガスの被加工
物への吹き付けによりこの被加工物から浮上する
浮上部材を、この浮上部材の被加工物側の面が自
由に動くようにジンバル構造を構成する支持機構
を介して支持部材に倣い接触子を支持させたの
で、被加工物の表面が傾斜している場合でも、こ
の表面と浮上部材が平行に浮上し、レーザ光の焦
点位置が所定方向からほとんどずれることがな
く、良好なレーザ加工を行うことができると共
に、上記案内子が被加工物の表面と接触してこの
表面を傷つけることがないという効果がある。
FIG. 4 shows another embodiment of the present invention, which is a non-contact copying device in which an integrated copying guide 10 is floated by blowing processing gas 7 onto a workpiece 6. As shown in Figure 4,
When the surface 6a of the workpiece 6 is horizontal, processing is performed with the copying guide 10 floating above the surface 6a of the workpiece 6, similar to what is shown in FIGS. 1 to 3 above. You can do it and there is no problem. In the non-contact copying device shown in FIG. 4, when the surface 6a of the workpiece 6 shown in FIG.
a, the focal point 5 may shift, and the guide 10 may slide and damage the surface 6a. However, in the non-contact copying apparatus of the embodiment shown in FIGS. A floating member that floats from the workpiece by blowing processing gas onto the workpiece is supported via a support mechanism that constitutes a gimbal structure so that the surface of the floating member on the workpiece side can move freely. Since the contactor is supported by the member, even if the surface of the workpiece is inclined, the surface and the floating member float parallel to each other, and the focal position of the laser beam hardly deviates from the predetermined direction. This has the effect that good laser processing can be performed and that the guide does not come into contact with the surface of the workpiece and damage the surface.

[発明の効果] 以上説明したように、この発明によれば、加工
ヘツドのノズルから加工ガスを被加工物に吹き付
けることで倣い案内子が浮上し、溶接加工時に上
記案内子が高温になつている被加工物の溶接部分
に接触しないことにより、案内子が被加工物に溶
着することがなく、さらに案内子が浮上している
ことにより、加工ヘツドが動いてもこれが案内子
に引きずれて加工精度を悪くすることもなく、し
たがつて、被加工物の商品価値を低下させること
がない。しかも、この発明の非接触倣い装置は、
加工ガス以外の案内子浮上用の気体や、案内子を
浮上させるための制御装置が不要であるので、構
造が簡単で安価であるという効果がある。
[Effects of the Invention] As explained above, according to the present invention, the copying guide floats by blowing processing gas onto the workpiece from the nozzle of the processing head, and the guide becomes hot during welding. By not touching the welding part of the workpiece, the guide will not be welded to the workpiece, and since the guide is floating, it will not be dragged by the guide even if the machining head moves. There is no deterioration in machining accuracy, and therefore there is no reduction in the commercial value of the workpiece. Moreover, the non-contact copying device of this invention
Since a gas for floating the guide other than the processing gas and a control device for floating the guide are not required, the structure is simple and inexpensive.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例に係るレーザ加工
用非接触倣い装置を示す倣い案内子の要部の拡大
斜視図、第2図および第3図は被加工物が水平な
場合および傾斜した場合における第1図の倣い案
内子の縦断面図、第4図および第5図はこの発明
の他の実施例に係るレーザ加工用非接触倣い装置
を示す倣い案内子の被加工物が水平な場合および
傾斜した場合における縦断面図、第6図は従来例
のレーザ加工用倣い装置を示す縦断面図、第7図
は第6図の倣い接触子の被加工物が傾斜した場合
における縦断面図である。 1…加工ヘツド、2…レーザ光、3…加工レン
ズ、4…ノズル、5…焦点位置、6…被加工物、
6a…被加工物の表面、7…加工ガス、8…距離
検出器、10…倣い案内子、11…浮上部材、1
1a…被加工部材側の面、12…中間リング、1
3,14…ピン、15…支持部材、16…支持機
構。なお、図中、同一符号は同一または相当部分
を示す。
FIG. 1 is an enlarged perspective view of the main part of a copying guide showing a non-contact copying device for laser processing according to an embodiment of the present invention, and FIGS. 2 and 3 show a case where the workpiece is horizontal and a case where the workpiece is inclined. The vertical cross-sectional view of the copying guide shown in FIG. 1, FIGS. 4 and 5 show a non-contact copying device for laser processing according to another embodiment of the present invention in which the workpiece of the copying guide is horizontal. FIG. 6 is a vertical cross-sectional view showing a conventional copying device for laser processing, and FIG. 7 is a vertical cross-section of the copying contact shown in FIG. 6 when the workpiece is tilted. It is a diagram. 1... Processing head, 2... Laser light, 3... Processing lens, 4... Nozzle, 5... Focus position, 6... Workpiece,
6a...Surface of workpiece, 7...Processing gas, 8...Distance detector, 10...Copying guide, 11...Floating member, 1
1a... Surface on the workpiece side, 12... Intermediate ring, 1
3, 14...pin, 15...support member, 16...support mechanism. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 1 レーザ光を集光して焦点位置近傍で被加工物
に当てる加工レンズ、および上記被加工物に向け
て加工ガスを吹き出すノズルを有する加工ヘツド
を備えたレーザ加工装置において、上記加工ガス
の被加工物への吹き付けによりこの被加工物から
浮上する倣い案内子を上記加工ヘツドに固定され
た距離検出器に連結させたことを特徴とするレー
ザ加工用非接触倣い装置。
1. In a laser processing device equipped with a processing head having a processing lens that focuses laser light and applies it to the workpiece near the focal position, and a nozzle that blows processing gas toward the workpiece, the processing gas is A non-contact tracing device for laser machining, characterized in that a tracing guide which floats up from the workpiece by spraying onto the workpiece is connected to a distance detector fixed to the machining head.
JP61198485A 1986-08-25 1986-08-25 Non-contact profiling device for laser beam processing Granted JPS6356381A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61198485A JPS6356381A (en) 1986-08-25 1986-08-25 Non-contact profiling device for laser beam processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61198485A JPS6356381A (en) 1986-08-25 1986-08-25 Non-contact profiling device for laser beam processing

Publications (2)

Publication Number Publication Date
JPS6356381A JPS6356381A (en) 1988-03-10
JPH0420718B2 true JPH0420718B2 (en) 1992-04-06

Family

ID=16391898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61198485A Granted JPS6356381A (en) 1986-08-25 1986-08-25 Non-contact profiling device for laser beam processing

Country Status (1)

Country Link
JP (1) JPS6356381A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2400063B (en) * 2003-04-03 2006-02-15 Exitech Ltd Positioning method and apparatus and a product thereof

Also Published As

Publication number Publication date
JPS6356381A (en) 1988-03-10

Similar Documents

Publication Publication Date Title
AU647095B2 (en) Apparatus and method for automatically aligning a welding device for butt welding workpieces
US8610030B2 (en) Laser beam processing machine
US8299392B2 (en) Rotating laser welding pressure unit
JPH0420718B2 (en)
JP4412455B2 (en) Welding torch control device and control method
JPS6356391A (en) Non-contact profiling device for laser beam processing
JPH03138092A (en) Laser beam machine
US4484854A (en) Robotic height sensor in laterally compliant probe
JPS6356382A (en) Non-contact profiling device for laser beam processing
JP2023502617A (en) Laser processing system and laser processing method
JP4251745B2 (en) Laser processing machine
JPH10225783A (en) Contact type welding line copying sensor
JP2000061669A (en) Laser beam machining device and method therefor
JPH0288152A (en) Positioning device
JPH0161178B2 (en)
JPS6333192A (en) Laser beam machining head
JPH02258188A (en) Laser beam welding equipment
JPH0239356B2 (en)
JP2007216269A (en) Laser beam machine
JPH077031Y2 (en) Nozzle with sensor for nozzle gap detection in laser processing equipment
JP3174653B2 (en) Laser processing equipment
JPS5987990A (en) Laser beam machine
JPS61242782A (en) Laser beam machine
JPH052805Y2 (en)
JPS62286696A (en) Profiling device

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees