JPS61242782A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPS61242782A JPS61242782A JP60084570A JP8457085A JPS61242782A JP S61242782 A JPS61242782 A JP S61242782A JP 60084570 A JP60084570 A JP 60084570A JP 8457085 A JP8457085 A JP 8457085A JP S61242782 A JPS61242782 A JP S61242782A
- Authority
- JP
- Japan
- Prior art keywords
- movement
- work
- axis table
- workpiece
- moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はレーザ加工装置の加工ヘッドの移動装置の改良
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement of a moving device for a processing head of a laser processing device.
第6図は従来のレーザ加工装置の側面図及び平面図で、
図中(1)はL字状サドル、(2)はY軸テーブル、(
3)はサドルの梁、(4)はX軸テーブル、(5)は加
工ヘッド、(6)は反射鏡、(7)は集光レンズ、(8
)はレーザ光、(9)は被加工物である。Figure 6 is a side view and a top view of a conventional laser processing device.
In the figure, (1) is the L-shaped saddle, (2) is the Y-axis table, (
3) is the beam of the saddle, (4) is the X-axis table, (5) is the processing head, (6) is the reflector, (7) is the condenser lens, (8)
) is the laser beam, and (9) is the workpiece.
被加工物(9)を載置したY軸テーブル(2)は、サド
ル(1)上を図の矢印Yの方向に移動し、一方加工ヘツ
ド(5)を装着したX軸テーブル(4)は、サドルの梁
(3)上を図の矢印X方向に移動するように構成されて
いる。このX軸テーブル(4)とY軸テーブル(2)の
XSY方向への移動によって加工ヘッド(5)を被加工
物(9)の所定位置に位置せしめ、加工ヘッド(5)よ
り放射するレーザ光(8)によって、被加工物(9)を
加工するのである。The Y-axis table (2) on which the workpiece (9) is placed moves on the saddle (1) in the direction of arrow Y in the figure, while the X-axis table (4) on which the machining head (5) is attached moves. , is configured to move on the beam (3) of the saddle in the direction of arrow X in the figure. By moving the X-axis table (4) and Y-axis table (2) in the XSY direction, the processing head (5) is positioned at a predetermined position on the workpiece (9), and the laser beam is emitted from the processing head (5). The workpiece (9) is processed by (8).
ところで第3図に示す従来装置においては、被加工物(
8)が大きくなるとY軸テーブル(2)も被加工物に対
応して大型化し、Y軸テーブル(2)の移動量もそれに
比例して大きくなる。このためレーザ加工装置の設置面
積は、Y軸テーブル(2)の長さに加えてテーブルの移
動量分だけ必要となる。すなわちY軸テーブル(2)の
長さをLとすれば、レーザ加工装置の設置寸法は2L以
上としなければならず、設置面積が大きくなるのが問題
点となっていた。By the way, in the conventional apparatus shown in Fig. 3, the workpiece (
8) becomes larger, the Y-axis table (2) also becomes larger corresponding to the workpiece, and the amount of movement of the Y-axis table (2) also becomes larger in proportion to it. Therefore, the installation area of the laser processing device is required to be equal to the length of the Y-axis table (2) and the amount of movement of the table. That is, if the length of the Y-axis table (2) is L, the installation dimension of the laser processing device must be 2L or more, which poses a problem in that the installation area becomes large.
本発明は上記問題点を解消するためになされたもので、
装置を小型化し、設置面積を小さくしたレーザ加工装置
を提供しようとするものである。The present invention was made to solve the above problems, and
The present invention aims to provide a laser processing device that is smaller in size and has a smaller installation area.
レーザ加工装置において、加工ヘッドを被加工物の移動
する方向と反対方向に、同時に移動させつるように構成
する。A laser processing apparatus is configured to move a processing head simultaneously in a direction opposite to a direction in which a workpiece moves.
上記構成によって、被加工物を載置したY軸テーブルの
Y軸方向への移動は、従来装置の1/2で済むこととな
り、レーザ加工装置も小型化し、その設置面積ら小さく
てすむこととなる。With the above configuration, the movement of the Y-axis table on which the workpiece is placed in the Y-axis direction is only 1/2 that of conventional equipment, and the laser processing equipment can also be downsized and its installation area can be reduced. Become.
第1図は本発明の一実施例を示すレーザ加工”装置の側
面図、第2図はその平面図である。図中け)〜(9)は
従来装置と同一部品を示している。叫は固定テーブル、
αυは移動梁、a’;aは反射鏡である。Fig. 1 is a side view of a laser processing device showing an embodiment of the present invention, and Fig. 2 is a plan view of the same. is a fixed table,
αυ is a moving beam, a'; a is a reflecting mirror.
図に示すように従来装置のL字状サドルを、固定テーブ
ル(11と移動梁Iの2部分に別ち、移動梁0υは固定
チーブルミl上をY方向に移動しうるように構成すると
ともに、移動梁01)の端部に反射鏡を設けた。As shown in the figure, the L-shaped saddle of the conventional device is divided into two parts: a fixed table (11) and a movable beam I, and the movable beam 0υ is constructed so that it can move in the Y direction on the fixed table mill I. A reflecting mirror was provided at the end of the moving beam 01).
この結果、移動梁αυのY軸方向への移動を、Y軸テー
ブル(2)の移動と常に反対方向に同時に移動するよう
に動作せしめることにより、被加工物(9)の加工位置
設定のためのY軸テーブル(2)のY方向の最大移動量
は、被加工物(9)の長さLの1.5倍ですむことにな
る。このためレーザ加工装置の寸法は小型化し、設置面
積は小さくてすむことになる。As a result, the movement of the moving beam αυ in the Y-axis direction is always performed simultaneously in the opposite direction to the movement of the Y-axis table (2), thereby setting the processing position of the workpiece (9). The maximum amount of movement of the Y-axis table (2) in the Y direction is 1.5 times the length L of the workpiece (9). Therefore, the dimensions of the laser processing device can be reduced, and the installation area can be reduced.
なおY軸テーブルを固定し、移動梁aυのみをY方向に
移動させれば、装置は更に小型化する。光走査式と呼ば
れるのがこの形式である。しかしこの結果レーザ(8)
の光路が長くなり、光路途中の反射鏡の取付誤差などに
よるビームの変位が大きくなって、加工精度が落ちる欠
点がある。Note that if the Y-axis table is fixed and only the movable beam aυ is moved in the Y direction, the device can be further miniaturized. This type is called the optical scanning type. However, this result laser (8)
The disadvantage is that the optical path becomes longer, and the displacement of the beam due to mounting errors in the reflecting mirrors in the optical path increases, resulting in a decrease in processing accuracy.
この点本発明は光走査式に対し加工精度を保持しながら
装置の小型化を図ったところに特徴がある0
〔発明の効果〕
本発明はレーザ加工装置において、被加工物と加工ヘッ
ドとを、互いに反対方向に同時に移動しうるように構成
したので、従来の被加工物のみを移動する装置に比べ、
装置を小型化し、装置の設置面積を25%以上小さくで
きるという優れた効果を上げることができた。In this respect, the present invention is characterized in that the apparatus is made smaller while maintaining machining accuracy compared to the optical scanning type. Since it is configured so that it can move in opposite directions at the same time, compared to conventional devices that only move the workpiece,
We were able to achieve the excellent effect of miniaturizing the device and reducing the installation area of the device by more than 25%.
第1図は本発明の一実施例を示すレーザ加工装置の側面
図、第2図はその平面図、第6図は従来装置の(a)は
側面図、(b)は平面図である。
図中(2)はY軸テーブル、(5)は加工ヘッド、Hは
固定テーブル、0υは移動梁である。
なお各図中、同−符弓は同−又は相当部分を示す。
代理人 弁理士 木 村 三 朗
第1図
10: 回定テープγしFIG. 1 is a side view of a laser processing apparatus showing an embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 6 is a side view of a conventional apparatus, and FIG. 6(b) is a plan view thereof. In the figure, (2) is a Y-axis table, (5) is a processing head, H is a fixed table, and 0υ is a moving beam. Note that in each figure, the same arrow indicates the same or equivalent part. Agent Patent Attorney Sanro Kimura Figure 1 10: Rotating tape gamma
Claims (1)
と加工ヘッドを係着した梁とを、同時に反対方向に移動
しうるように構成したことを特徴とするレーザ加工装置
。1. A laser processing device characterized in that the table on which a workpiece is placed and the beam on which a processing head is attached can be moved simultaneously in opposite directions.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60084570A JPS61242782A (en) | 1985-04-22 | 1985-04-22 | Laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60084570A JPS61242782A (en) | 1985-04-22 | 1985-04-22 | Laser beam machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61242782A true JPS61242782A (en) | 1986-10-29 |
JPH0359795B2 JPH0359795B2 (en) | 1991-09-11 |
Family
ID=13834324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60084570A Granted JPS61242782A (en) | 1985-04-22 | 1985-04-22 | Laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61242782A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03204187A (en) * | 1989-12-28 | 1991-09-05 | Amada Co Ltd | Laser beam machine |
DE4434504A1 (en) * | 1993-09-27 | 1995-03-30 | Mitsubishi Electric Corp | Laser cutting machine |
WO2009010388A1 (en) * | 2007-07-13 | 2009-01-22 | Robert Bosch Gmbh | Laser beam welding device and method |
US20160193694A1 (en) * | 2015-01-05 | 2016-07-07 | Johnson Controls Technology Company | Welding process for a battery module |
-
1985
- 1985-04-22 JP JP60084570A patent/JPS61242782A/en active Granted
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03204187A (en) * | 1989-12-28 | 1991-09-05 | Amada Co Ltd | Laser beam machine |
DE4434504A1 (en) * | 1993-09-27 | 1995-03-30 | Mitsubishi Electric Corp | Laser cutting machine |
US5637243A (en) * | 1993-09-27 | 1997-06-10 | Mitsubishi Denki Kabushiki Kaisha | Laser cutting machine |
US5756961A (en) * | 1993-09-27 | 1998-05-26 | Mitsubishi Denki Kabushiki Kaisha | Laser cutting machine |
DE4434504C2 (en) * | 1993-09-27 | 1998-07-16 | Mitsubishi Electric Corp | Laser cutting machine |
WO2009010388A1 (en) * | 2007-07-13 | 2009-01-22 | Robert Bosch Gmbh | Laser beam welding device and method |
US20160193694A1 (en) * | 2015-01-05 | 2016-07-07 | Johnson Controls Technology Company | Welding process for a battery module |
US10195688B2 (en) * | 2015-01-05 | 2019-02-05 | Johnson Controls Technology Company | Laser welding system for a battery module |
US11400546B2 (en) | 2015-01-05 | 2022-08-02 | Cps Technology Holdings Llc | Welding process for a battery module |
Also Published As
Publication number | Publication date |
---|---|
JPH0359795B2 (en) | 1991-09-11 |
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