JPH042069U - - Google Patents

Info

Publication number
JPH042069U
JPH042069U JP4229790U JP4229790U JPH042069U JP H042069 U JPH042069 U JP H042069U JP 4229790 U JP4229790 U JP 4229790U JP 4229790 U JP4229790 U JP 4229790U JP H042069 U JPH042069 U JP H042069U
Authority
JP
Japan
Prior art keywords
electronic components
printed wiring
paste
insulating substrate
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4229790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4229790U priority Critical patent/JPH042069U/ja
Publication of JPH042069U publication Critical patent/JPH042069U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP4229790U 1990-04-20 1990-04-20 Pending JPH042069U (US07922777-20110412-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4229790U JPH042069U (US07922777-20110412-C00004.png) 1990-04-20 1990-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4229790U JPH042069U (US07922777-20110412-C00004.png) 1990-04-20 1990-04-20

Publications (1)

Publication Number Publication Date
JPH042069U true JPH042069U (US07922777-20110412-C00004.png) 1992-01-09

Family

ID=31553720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4229790U Pending JPH042069U (US07922777-20110412-C00004.png) 1990-04-20 1990-04-20

Country Status (1)

Country Link
JP (1) JPH042069U (US07922777-20110412-C00004.png)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01107563A (ja) * 1987-10-20 1989-04-25 Cmk Corp プリント配線板におけるチップ部品の実装方法
JPH01290292A (ja) * 1988-05-18 1989-11-22 Abisare:Kk 封止剤の流出防止堰を有する導電回路基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01107563A (ja) * 1987-10-20 1989-04-25 Cmk Corp プリント配線板におけるチップ部品の実装方法
JPH01290292A (ja) * 1988-05-18 1989-11-22 Abisare:Kk 封止剤の流出防止堰を有する導電回路基板

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