JPH04206848A - Semiconductor evaluation device - Google Patents
Semiconductor evaluation deviceInfo
- Publication number
- JPH04206848A JPH04206848A JP2337509A JP33750990A JPH04206848A JP H04206848 A JPH04206848 A JP H04206848A JP 2337509 A JP2337509 A JP 2337509A JP 33750990 A JP33750990 A JP 33750990A JP H04206848 A JPH04206848 A JP H04206848A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor
- electrode
- evaluation
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000011156 evaluation Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- 238000004904 shortening Methods 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はＳｌやＧ ａ、Ａ ｓ等の半導体塞板上に形
成された半導体装置の評価装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an evaluation device for a semiconductor device formed on a semiconductor blocking plate such as Sl, Ga, As, or the like.
第４図は従来のコレｙ ｌ−を示す断面図で、図におい
て、（１）は半導体装置で、一般にウェハより切断され
た半導体チップである。（２）はコレットの側壁て、吸
着により半導体装置（１）を図示の々目く支持するもの
であり、一般にテフロン等により形成されている。（３
）はコレラＩ・の吸着口て、この部分より真空引きする
ことにより半導体装置（１）及び側壁（２）により囲ま
れた部分を減圧することによって半導体装置（１）を支
持するためのものである。FIG. 4 is a sectional view showing a conventional core yl-. In the figure, (1) is a semiconductor device, which is generally a semiconductor chip cut from a wafer. The side wall (2) of the collet supports the semiconductor device (1) by suction as shown in the figure, and is generally made of Teflon or the like. (3
) is a suction port for Cholera I. It is intended to support the semiconductor device (1) by evacuating the area surrounded by the semiconductor device (1) and the side wall (2). be.
次に、従来の半導体装置の評価方法について説明する。Next, a conventional semiconductor device evaluation method will be described.
従来ては、第４図のコレットにより半導体装置（１）を
吸着した後、評価装置のブローハステーシ（図示せず）
」二に半導体装置（１）を置き、ブローバステーラ上に
測定用針をセットする。この測定用針により半導体装置
（１）の評価を行ない、評価後、コレットによりブロー
バスデージ上の半導体装置（１）を再度吸着し、チップ
トレイ等の保管場所へ戻す。Conventionally, after the semiconductor device (1) is adsorbed by the collet shown in FIG. 4, the blower station (not shown) of the evaluation device is
Place the semiconductor device (1) on the second plate and set the measuring needle on the blower stabilizer. The semiconductor device (1) is evaluated using this measuring needle, and after the evaluation, the semiconductor device (1) on the blow bus stage is sucked again by the collet and returned to a storage location such as a chip tray.
従来の半導体評価方法は以」二のように、コレットによ
り半導体装置を吸着し移動した後、ブローバスデージ上
の測定針の設定をする工程か必要であるため、複数の工
程を必要とし、半導体装置の評価に余分な時間を要する
といった問題点かあった。The conventional semiconductor evaluation method requires multiple steps to set the measurement needle on the blow bus stage after picking up and moving the semiconductor device with a collet, as described in 2. There was a problem in that the evaluation required extra time.
この発明は上記のような問題点を解消するためになされ
たもので、半導体装置の評価に要する工程数を少なくす
るとともに、評価に要する時間を短縮出来る半導体評価
装置を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and aims to provide a semiconductor evaluation device that can reduce the number of steps required for evaluating a semiconductor device and shorten the time required for evaluation.
この発明に係る半導体評価装置は、コレンｌ−の側壁面
−ｈに半導体装置と接触する電極を設けたものである。The semiconductor evaluation device according to the present invention is provided with an electrode in contact with a semiconductor device on the side wall surface -h of the core L-.
この発明における半導体評価装置は、コレットの側壁面
上に評価用電極を設けることにより、半導体装置の吸着
と同時に評価を行い、半導体装置の評価に要する工程数
を減少すると共に所要時間を短縮できる。By providing the evaluation electrode on the side wall surface of the collet, the semiconductor evaluation device according to the present invention performs evaluation at the same time as the semiconductor device is attracted, thereby reducing the number of steps required for evaluating the semiconductor device and shortening the time required.
以下、この発明の一実施例を図について説明する。第１
図において、（４）は電極で、側壁（２）に固定されて
いる。なお、図中符号（１）〜（３）は前記従来のもの
と同一のものである。本実施例では吸着した半導体装置
（］）の電極に側壁（２）」二の電極（４）を接触させ
、この電極（４）に測定器（図示せず）を結線して置く
ことにより、半導体装置（１）を吸着すると同時に電気
的な評価を行なうものてあり、−工程たけて半導体装置
（１）の電気的な評価か行える。従来のものに比へて工
程数か減ることから短時間にて半導体装置の評価か可能
となる。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (4) is an electrode fixed to the side wall (2). Note that the symbols (1) to (3) in the figure are the same as those of the conventional device. In this example, the second electrode (4) of the side wall (2) is brought into contact with the electrode of the adsorbed semiconductor device (]), and a measuring device (not shown) is connected to this electrode (4). There is a device that performs electrical evaluation at the same time as the semiconductor device (1) is attracted, and electrical evaluation of the semiconductor device (1) can be performed after each step. Since the number of steps is reduced compared to conventional methods, semiconductor devices can be evaluated in a short time.
第２図はこの発明の他の実施例を示す断面図で、図中、
（５）ははねて、一端か電極（４）に接続され、かつ、
他端か収納筒（６）に接続されており、電極（４）はは
ね（５）及び収納筒（６）を介して外部と結線されるよ
うになっている。はね（５）は弾性を有することから、
図示のように電極（４）を可動式にして置くと、電極（
４）と半導体装置（１）を′に５に適正な圧力で接触さ
せることか出来、常に電気的に良好なコンタクトか得ら
れる効果かある。また、第３図はこの発明のさらにもう
１つの他の実施例を示す断面図であり、本実施例では半
導体装置（１）かコレットの側壁（２）より大きい場合
を示しており、例えば半導体装置（］）かウウニの場合
でも適用可能である。FIG. 2 is a sectional view showing another embodiment of the present invention, and in the figure,
(5) is connected at one end to the electrode (4), and
The other end is connected to the housing tube (6), and the electrode (4) is connected to the outside via the spring (5) and the housing tube (6). Since the spring (5) has elasticity,
When the electrode (4) is placed in a movable manner as shown, the electrode (
4) and the semiconductor device (1) can be brought into contact with 5 with appropriate pressure, which has the effect of always providing good electrical contact. Further, FIG. 3 is a sectional view showing yet another embodiment of the present invention, and this embodiment shows a case where the semiconductor device (1) is larger than the side wall (2) of the collet. It can also be applied to the case of a device (]) or a sea urchin.
なお、上記第２図の他の実施例ては電極（４）をばね（
５）を用いて支えているが、弾性を有する機構であれば
どのような構造でもよく、上記実施例と同様の効果を奏
する。In addition, in other embodiments shown in FIG. 2 above, the electrode (4) is connected to a spring (
5), but any structure can be used as long as it has elasticity, and the same effect as in the above embodiment can be achieved.
（発明の効果〕
以上のようにこの発明によれは、コレット側壁面上に半
導体装置と接触する電極を設けたので、１工程にて半導
体装置の評価か可能となり、半導体装置の評価に要する
時間を短縮できるという効果がある。(Effects of the Invention) As described above, according to the present invention, since the electrode that contacts the semiconductor device is provided on the side wall surface of the collet, it is possible to evaluate the semiconductor device in one process, and the time required for evaluating the semiconductor device is reduced. This has the effect of shortening the time.
第１図はこの発明の一実施例である半導体評価装置を示
す断面図、第２図及び第３図はこの発明の他の実施例で
ある半導体評価装置を示す断面図、第４図は従来のコレ
ットを示す断面図である。図において、（１）は半導体
装置、（２）はコレットの側壁、（３）は吸着口、（４
）は電極を示す。
なお、図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a sectional view showing a semiconductor evaluation device which is an embodiment of the present invention, FIGS. 2 and 3 are sectional views showing a semiconductor evaluation device which is another embodiment of the invention, and FIG. 4 is a conventional FIG. In the figure, (1) is the semiconductor device, (2) is the side wall of the collet, (3) is the suction port, and (4) is the side wall of the collet.
) indicates an electrode. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
着口より吸着することにより半導体装置を支持する半導
体支持装置において、上記側壁面上に、上記半導体装置
と接触する電極を設けたことを特徴とする半導体評価装
置。A semiconductor support device having a suction port and a side wall capable of supporting a semiconductor device, and supporting the semiconductor device by suction from the suction port, characterized in that an electrode is provided on the side wall surface to be in contact with the semiconductor device. Semiconductor evaluation equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2337509A JPH04206848A (en) | 1990-11-30 | 1990-11-30 | Semiconductor evaluation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2337509A JPH04206848A (en) | 1990-11-30 | 1990-11-30 | Semiconductor evaluation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04206848A true JPH04206848A (en) | 1992-07-28 |
Family
ID=18309326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2337509A Pending JPH04206848A (en) | 1990-11-30 | 1990-11-30 | Semiconductor evaluation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04206848A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8980655B2 (en) | 2013-08-08 | 2015-03-17 | Mitsubishi Electric Corporation | Test apparatus and test method |
-
1990
- 1990-11-30 JP JP2337509A patent/JPH04206848A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8980655B2 (en) | 2013-08-08 | 2015-03-17 | Mitsubishi Electric Corporation | Test apparatus and test method |
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