JPH042040U - - Google Patents
Info
- Publication number
- JPH042040U JPH042040U JP4279290U JP4279290U JPH042040U JP H042040 U JPH042040 U JP H042040U JP 4279290 U JP4279290 U JP 4279290U JP 4279290 U JP4279290 U JP 4279290U JP H042040 U JPH042040 U JP H042040U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- outer periphery
- center
- accommodating
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4279290U JPH042040U (tr) | 1990-04-20 | 1990-04-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4279290U JPH042040U (tr) | 1990-04-20 | 1990-04-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH042040U true JPH042040U (tr) | 1992-01-09 |
Family
ID=31554644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4279290U Pending JPH042040U (tr) | 1990-04-20 | 1990-04-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH042040U (tr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006054304A (ja) * | 2004-08-11 | 2006-02-23 | Sanyo Electric Co Ltd | セラミックパッケージ、集合基板及びその製造方法 |
-
1990
- 1990-04-20 JP JP4279290U patent/JPH042040U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006054304A (ja) * | 2004-08-11 | 2006-02-23 | Sanyo Electric Co Ltd | セラミックパッケージ、集合基板及びその製造方法 |
JP4511278B2 (ja) * | 2004-08-11 | 2010-07-28 | 三洋電機株式会社 | セラミックパッケージ |