JPH042040U - - Google Patents
Info
- Publication number
- JPH042040U JPH042040U JP4279290U JP4279290U JPH042040U JP H042040 U JPH042040 U JP H042040U JP 4279290 U JP4279290 U JP 4279290U JP 4279290 U JP4279290 U JP 4279290U JP H042040 U JPH042040 U JP H042040U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- outer periphery
- center
- accommodating
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Description
第１図はこの考案の一実施例である半導体用パ
ツケージの斜視図、第２図は第１図の組立断面図
、第３図は従来の半導体用パツケージの展開斜視
図、第４図は第３図の封止後の組立断面図である
。
図において、９はセラミツク、１０ａ，１０ｂ
は各々封止面の中央部および外周部、１１は金め
つき金属板を示す。
Fig. 1 is a perspective view of a semiconductor package which is an embodiment of this invention, Fig. 2 is an assembled sectional view of Fig. 1, Fig. 3 is an exploded perspective view of a conventional semiconductor package, and Fig. 4 is an exploded perspective view of a conventional semiconductor package. FIG. 4 is an assembled sectional view of FIG. 3 after sealing; In the figure, 9 is ceramic, 10a, 10b
1 represents the center and outer periphery of the sealing surface, respectively, and 11 represents a gold-plated metal plate.
Claims (1)
円柱状の空間を持つ半導体用パツケージにおいて
、前記半導体用パツケージの枠部上面の中央寄り
と外周部で段差を設けたことを特徴とする半導体
用パツケージ。 A semiconductor package having a rectangular parallelepiped and cylindrical space for accommodating a semiconductor chip, characterized in that a step is provided near the center and on the outer periphery of the upper surface of the frame of the semiconductor package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4279290U JPH042040U (en) | 1990-04-20 | 1990-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4279290U JPH042040U (en) | 1990-04-20 | 1990-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042040U true JPH042040U (en) | 1992-01-09 |
Family
ID=31554644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4279290U Pending JPH042040U (en) | 1990-04-20 | 1990-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042040U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006054304A (en) * | 2004-08-11 | 2006-02-23 | Sanyo Electric Co Ltd | Ceramic package, aggregaed substrate, and manufacturing method thereof |
-
1990
- 1990-04-20 JP JP4279290U patent/JPH042040U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006054304A (en) * | 2004-08-11 | 2006-02-23 | Sanyo Electric Co Ltd | Ceramic package, aggregaed substrate, and manufacturing method thereof |
| JP4511278B2 (en) * | 2004-08-11 | 2010-07-28 | 三洋電機株式会社 | Ceramic package |