JPH04199773A - Manufacture of flexible printed circuit board - Google Patents

Abstract

PURPOSE:To accurately position and to automate a positioning to suck by positioning to suck a film coverlay to a peeling jig in a state of a cover material adhered to a protective sheet having high rigidity. CONSTITUTION:After positioning pins 18, 19 of a peeling jig 17 are inserted from a film coverlay 11 side into reference holes 14 and the jig 17 and a cover material 10 are positioned, the material 10 is sucked to the jig 17 by means such as air sucking, etc. The material 10 has sufficient strength for insertions of the pins 18, 19 by a protective sheet 12. Thus, since the coverlay 11 is adhered to the sheet 12 having higher rigidity than that thereof, positioned to the jig in the state of the material having sufficient strength to be sucked, the material can be positioned in the state having its body accurately, and the operation can be automated.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a method for manufacturing a flexible printed wiring board used in electronic equipment, etc., and more specifically, a method of manufacturing a flexible printed wiring board used in electronic equipment, etc. It is about the method.

<Prior art> Such a flexible printed wiring board has a structure in which a flexible circuit board serving as a base material has a wiring pattern printed on a highly flexible base film using a conductor, and electronic components in the wiring pattern are printed. The conductor circuit portion, except for necessary locations such as mounting lands, contacts, and connection lands, is covered and protected by a film coverlay attached thereto, and its strength is reinforced.

The film coverlay has a thickness of about 60 μm and is made of a flexible material, so before it is attached to the flexible circuit board, it is attached to a release paper or film that is more rigid than itself. This release paper or film makes it easy to perform processing using a mold or drill when drilling holes in the film coverlay to expose a predetermined surface of the flexible circuit board, and also Protects the applied adhesive.

When attaching a film coverlay to a circuit board, after peeling off the film coverlay from the release paper or film, the operator holds the film coverlay 1 in his hand and visually positions it as shown in FIG. and is attached to the flexible circuit board 2. Or Figure 6(a)
, Using a jig 3 equipped with positioning pins 4 and 5 as shown in (b), a flexible circuit board 2 is attached to this jig 3.
After inserting the positioning pins 4 and 5 into the reference holes of the film cover lay 1 and positioning them mutually, the film cover lay 1 is made flexible by inserting the positioning pins 4 and 5 through the reference holes 1a and 1b of the film cover lay 1. It is positioned and attached to the circuit board 2.

<Problems to be Solved by the Invention> Incidentally, in recent years, the circuit density and component mounting density in the flexible printed wiring board have tended to become higher and higher. The holes for this purpose are becoming smaller and smaller. Therefore, the film coverlay 1 is attached to the circuit board 2.
High precision is required for positioning the exposure hole with respect to the conductor circuit of the circuit board 2 when pasting it on the circuit board.

However, the film coverlay 1 that has been peeled off from the release paper or film has a thickness of about 60 μm and is made of a so-called stiff material, so it is difficult to handle and the application process cannot be automated. As described above, an operator holds in his hand the film coverlay 1 that has been peeled off from the release paper or film and positions it relative to the conductor circuit visually or using the jig 3. Visual positioning inevitably becomes less accurate, resulting in a minimum positional deviation of about 0.3 m, and even if performed by a highly skilled person, the limit is to suppress the positional deviation to about 0.2 m. On the other hand, even when using the jig 3, the film cover 1 itself is extremely thin and the positioning pins 4 are far inferior in rigidity.
, 5 in terms of strength, and as shown in Figure 3, positional deviation occurs in the reference holes 1a and 1b relative to the positioning pins 4 and 5, so the positioning accuracy is not much different from simply visual inspection. . Therefore, a required conductor circuit portion of the circuit board 2 is not exposed, which may cause a defect.

The present invention has been made in view of these conventional problems, and enables the film coverlay to be positioned and attached to a circuit board with high precision, and the attachment work can be easily automated. The technical problem is to provide a method for manufacturing a flexible printed wiring board that can also be used.

Means for Solving the Problems> In the present invention, as a technical means for achieving the above-mentioned problems, a flexible printed wiring board is manufactured through the following steps. That is, openings are made at predetermined locations in a cover material attached to a film coverlay or a protective sheet with higher rigidity, and the cover material and a peeling jig are positioned relative to each other. After the film coverlay surface of the cover material is adsorbed to the peeling jig, the protective sheet is peeled off, and the flexible circuit board is mutually positioned on the adhesion jig using its positioning member so that it can be attached and detached. , and after bonding the film coverlay and the flexible circuit board by mutually positioning the peeling jig to the adhesion jig using the positioning member, remove the film cover of the adhesion jig. It is characterized by going through a step of releasing the adsorption to the ray.

Function: The film coverlay is attached to a protective sheet with higher rigidity and the cover material, which has sufficient strength, is positioned and adsorbed to the peeling jig, so this positioning is
Since the cover material is stiff, it can be performed with high precision, and this work can also be automated.

Then, the protective sheet on the opposite side of the jig is peeled off from the cover material that has been positioned and adsorbed with high precision on the peeling jig.
The positioning of this peeling jig and the adhesion jig, in which the flexible circuit board is positioned using a positioning member and removably fixed, can be performed with high precision, and as a result, the flexible circuit board is positioned on each of these jigs. The film coverlay and circuit board are positioned with the same high precision as both jigs.

<Example> Hereinafter, a preferred example of the present invention will be described in detail with reference to the drawings.

1 to 4 show the main parts of an embodiment of the present invention in the order of steps, and FIG. 1(a) shows the film coverlay 11.
This figure is a plan view of a rolled state of a cover material 10 formed by pasting the above on a release paper 12. Separation slits 1 are provided at predetermined intervals only in the film cover lay 11.
5 is formed. And film coverlay 11
The release paper 12 peeled off is wound up by a winding roller 16. Note that a film may be used instead of the release paper 12.

When attaching the film coverlay 11 to a flexible circuit board (to be described later), first, as shown in FIG. After the peeling jig 17 and the cover material 10 are positioned through the peeling jig 17, the cover material 10 is removed from the peeling jig 17 by means such as air suction.
is adsorbed to. The cover material 10 is sealed by the protective sheet 12 to have sufficient strength against the insertion of the positioning pins 18 and 19, and the mutual positioning of the cover material 10, that is, the film coverlay 11 and the peeling jig 17 at this time is The positional shift can be performed with a high accuracy of about 50 μm at maximum.

After this positioning, the positioning pins 18 and 19 are housed in the peeling jig 17, as shown in FIG.
As the cover material 10 is being wound up, the jig 17 moves in the direction of the arrow in synchronization with the traveling of the cover material 10 at this time. Therefore, the film coverlay 11 . On the other hand, since the release paper 12 is wound up by the take-up roller 16, the release paper 12 is peeled off from the film coverlay 11 very smoothly. When the peeling point reaches the separation slit 15 of the film coverlay 11, the winding operation of the release paper 12 stops,
Only the film coverlay 11 with standard dimensions is used in the peeling jig 1.
7 remains in an adsorbed state.

Next, as shown in FIG.
Insert the positioning pin 24.25 into the reference hole 22.23 of this.
The peeling jig 17 with the film coverlay 11 adsorbed thereon is inserted into the peeling jig 17 and the positioning pins 24 and 25 are inserted into the positioning holes 26 and 27 of the peeling jig 17. When bonded to the adhesion jig 21 in a mutually positioned state, as a result both jigs 17
The film coverlay 11 and the flexible circuit board 20 attached to each other in a positioned state at 21 are mutually positioned, and the film coverlay 1 of the peeling jig 17
When the adsorption to 1 is released, the film cover lay 11
is attached to the flexible circuit board 20. At the time of the above-mentioned positioning, the film cover layer 11 is attracted to the peeling jig 17 and has sufficient strength for insertion of the positioning pins 24 and 25, so the final film cover layer 11 and The positioning accuracy with respect to the flexible circuit board 20 is sufficiently within the range of positional deviation of about 100 μm at maximum.

After that, both jigs 17 and 21 are removed and the same process as described above is repeated the required number of times, and finally, by going through the well-known thermocompression bonding process of temporary bonding with a heating roller etc. and final bonding with a hot plate press, A flexible printed wiring board is completed.

Note that as a positioning means, the jig 1 in the above embodiment is used.
In addition to mechanical means using the positioning pins 1B, 19, 22, and 23, optical means such as recognition may also be used.

<Effects of the Invention> As described above, according to the method for manufacturing a flexible printed wiring board of the present invention, the film coverlay can be positioned in the peeling jig in the state of the cover material stuck to the protective sheet with higher rigidity. Since the cover material has sufficient strength, positioning can be performed with high accuracy, and since the cover material has sufficient strength, this positioning and suction work can also be automated.

After peeling off the protective sheet from the cover material adsorbed on the peeling jig, the peeling jig is attached to a high-precision adhesive jig in which the flexible circuit board is positioned and removably fixed using a positioning member. As a result, the film coverlay and circuit board positioned on these jigs can be positioned with extremely high precision, and there is no process of handling the film coverlay separately after peeling it from the protective sheet. The entire process can also be automated.

[Brief explanation of the drawing]

Figures 1 (a) and (b) are a plan view and a cutaway front view of a processed cover material in the form of a roll according to an embodiment of the present invention, and Figure 2 shows the cover material being attached to a peeling jig. Figure 3 is a cutaway front view of the step of adsorbing the protective sheet from the cover material, Figure 4 is a cutaway front view of the process of positioning and attaching the film coverlay to the circuit board, FIG. 5 is a front view of the coverlay pasting process according to the conventional method, and FIGS. 6(a) and 6(b) are a front view and a cut front view of another conventional method. 10... Cover material 11... Film cover lay 13... Opening 14... Reference hole (opening) 12... Release paper (protective sheet) 17... Peeling jig 20...・Flexible circuit board 21... pasting jig patent applicant: Sharp Corporation
Rin Nishi 1) New-12~ = 8 Procedural amendment Patent application filed on November 29, 1990 (2) 2. Name of invention Method for manufacturing flexible printed wiring board 3. Relationship with the amended person's case Patent applicant address: 22-22 Nagaike-cho, Abeno-ku, Osaka City Name (
504) Sharp Co., Ltd. Representative: Haruo Tsuji 4, Agent address: Miyuki Building, 15-13 Usagano-cho, Kita-ku, Osaka
Telephone (06) 315-7481~25, Date of amendment order Voluntary amendment 6, Subject of amendment Drawing

Claims (1)

[Claims] (1) Openings are made at predetermined locations in a cover material in which a film coverlay is attached to a more rigid protective sheet, and the cover material and a peeling jig are positioned relative to each other. After the film coverlay surface of the cover material is adsorbed to the peeling jig, the protective sheet is peeled off, and the flexible circuit board is attached to and removed from the bonding jig by mutually positioning it with its positioning member. Fix it freely,
After the peeling jig is mutually positioned with the adhesion jig by the positioning member and the film coverlay and the flexible circuit board are bonded, the adhesion jig is adsorbed to the film coverlay. A method for manufacturing a flexible printed wiring board, characterized by releasing the flexible printed wiring board.