JPH0419796Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a novel semiconductor package opener device.

[Prior art and its problems]

Various semiconductor package opener devices have been developed that expose semiconductor chips that have been conventionally sealed in plastic packages and can be used for inspection during failure analysis or quality checks.

In recent years, an apparatus has been provided that has a solution storage section consisting of a storage tank and a semiconductor package opening section that uses a pump to inject the solution into the semiconductor package and unseal it. Now I can do it. However, the solution is strongly acidic, such as sulfuric acid or nitric acid, and handling it, such as transferring it to a tank, is dangerous, so improvements in safety are desired. Instead, we developed a system in which a commercially available reagent bottle containing a lysis solution is directly set in the lysis solution storage section.

The entire outline of an example of an opener device including such a solution storage section will be described with reference to FIG. This is the opening part of the package.

The solution in the reagent bottle 4 in the storage section 15 is sent to the heater tank 5 of the preheating section 16 by air pressure applied from a device (not shown), where it is preheated to an appropriate temperature, approximately 250° C. in the case of sulfuric acid. Further, it is sent to the dissolution tank 12 in the unsealing section 17. The magnet 10 rotated by the motor 11 causes the acid-proof pump 9 in the case 8 of the dissolution tank 12 to operate, and the solution 3 is pumped into the case 8.
is injected from the tip nozzle 7 through the opening 6 onto the semiconductor package 1 set on the workbench 2,
This can now be opened.

In this case, the solution injected onto the semiconductor package 1 usually falls into the dissolution tank 12 below and is circulated again so that it can be used for the injection work, but sometimes the package 1 is broken or installed. The solution may leak and overflow onto the workbench 2 due to defects or the like. In such cases, an alarm was issued, stopping or interrupting the operation of the device, and wiping the device with an absorbent material such as cloth or paper, but such work was dangerous and inefficient due to the strong acidity of the dissolving solution. Therefore, improvement is desired.

[Purpose and structure of the invention]

Thus, the present invention solves the drawbacks of the conventional opener device and automatically recovers the solution that leaks onto the workbench even if a semiconductor package breaks, without interrupting the operation of the device. The purpose of this invention is to provide a device that can be used repeatedly and opened safely and continuously.

According to research and experiments conducted by the inventors of the present invention, the object is to have a solution storage section and an opening section for the semiconductor package, and the opening section for the semiconductor package is used to set the package in a packing having an opening. A semiconductor package opener device comprising a workbench and a dissolution tank provided below the workbench and having a device for accommodating a dissolution solution and injecting it onto the package, wherein a groove having an inclined surface on the outer periphery of the packing; It has been found that this can be achieved by an apparatus characterized in that a leakage circulation mechanism is provided in which a suction port is connected to the dissolution tank, and a leakage circulation mechanism is provided in which the suction port is connected to the dissolution tank and a suction device is interposed therebetween. It was released.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS The semiconductor package opener device according to the present invention will be explained in more detail with reference to the drawings showing one embodiment thereof.

In FIG. 1, a semiconductor package 1 in which a semiconductor chip 20 is sealed is set in a packing 21 having an opening 6 above a workbench 2. As shown in FIG.
A groove 23 having an inclined surface 22 is provided on the outer periphery of the packing 21, and the deepest part of the groove 23 is connected to a leakage suction port 24 which is a through hole of a certain length. The tip of the etching block 25, which has the suction port 24 formed therein, is connected to an aspirator 27 via a hose 26.

In FIG. 2, an aspirator 27 is connected to a connector 2 to a hose 28 leading to a pressurized air source (not shown).
Connect via 9, then buffer 30, connector 3
1 to a duct (not shown), and the buffer 30 is connected to, for example, a dissolving tank 12 shown in FIG. 3 via a solenoid valve 32 and a hose 33. The above hose 26, 3 is also shown in Figure 3.
3 is illustrated.

[Effect]

In the apparatus of the present invention having the above-mentioned configuration, the solution leaked onto the workbench 2 when the semiconductor package is opened is removed from the groove 21 provided on the outer periphery of the package 21.
is collected at its deepest point along the slope 22 of.
Here, when the pressurized air is returned to the duct via the aspirator 27 and the solenoid valve 32 is opened, the leaked solution is sucked from the leakage suction port 24 by the suction action of the aspirator 27, and the aspirator 27, buffer 30, and solenoid valve 32 to the dissolution tank 12, where it can be circulated again and used. In FIG. 2, thick arrows indicate leakage channels, and thin arrows indicate pressurized air channels.

〔effect〕

Thus, according to the present invention, a groove having an inclined surface and a suction port connected to the groove are provided on the outer circumference of the gasket of the workbench, and a mechanism is provided in which a suction device including an aspirator is interposed between the suction port and the dissolving tank. Therefore, the solution that leaked onto the workbench could be collected in a groove and returned to the solution tank easily and safely without interrupting the operation of the equipment or having to manually dispose of strong acids. It can be used for circulation. Therefore, the leakage liquid can be disposed of very safely and efficiently, so that the present invention provides a very effective semiconductor package opener device.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing a main part of an example of the device according to the present invention, FIG. 2 is a perspective view of the same, and FIG. 3 is a schematic explanatory view of the entire device. 1... Semiconductor package cage, 2... Workbench, 12
...Dissolution tank, 15...Dissolved solution storage section, 16...Dissolved solution preheating section, 17...Semiconductor package opening section,
23... Groove, 27... Aspirator.

Claims (1)

[Scope of utility model registration request] The semiconductor package opening section has a solution storage section and a semiconductor package opening section, and the semiconductor package opening section includes a work table for setting the package in a packing having an opening, and a work table provided below the worktable for accommodating the solution solution. In this semiconductor package opener device, the semiconductor package is provided with a groove having an inclined surface on the outer periphery of the package and a suction port connected to the groove, and the suction port and the melting tank are provided with a groove having an inclined surface on the outer periphery of the package. An opener device for a semiconductor package, characterized in that a leakage circulation mechanism is provided in which tanks are connected and a suction device is interposed between them.