JPH04194738A - Method for determining haze and continuous foreign object group - Google Patents

Method for determining haze and continuous foreign object group

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Publication number
JPH04194738A
JPH04194738A JP2326504A JP32650490A JPH04194738A JP H04194738 A JPH04194738 A JP H04194738A JP 2326504 A JP2326504 A JP 2326504A JP 32650490 A JP32650490 A JP 32650490A JP H04194738 A JPH04194738 A JP H04194738A
Authority
JP
Japan
Prior art keywords
signal
haze
foreign object
continuous
average value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2326504A
Other languages
Japanese (ja)
Other versions
JP2571468B2 (en
Inventor
Masashi Honda
本田 正志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi Electronics Engineering Co Ltd
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Filing date
Publication date
Application filed by Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Electronics Engineering Co Ltd
Priority to JP2326504A priority Critical patent/JP2571468B2/en
Publication of JPH04194738A publication Critical patent/JPH04194738A/en
Application granted granted Critical
Publication of JP2571468B2 publication Critical patent/JP2571468B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)

Abstract

PURPOSE:To determine a haze and a continuous foreign object group by calculating an average value of haze signal within a unit region which is obtained by classifying a surface of a wafer in square, detecting a signal protruding from this average value, and then comparing it with a reference value. CONSTITUTION:A light-receiving signal Vr which is output from an amplifier 3a of a signal processing part 3 is fed to plus terminal of a comparator 3b. This output foreign object signal Vp is sampled and digitized by a sampling digital circuit 3d-1 and is converted to the signal Vp. Then, it is taken into a microprocessor 3f through an interface 3e, a coordinate value is added to it, and then it is stored in a memory 3f. On the other hand, frequency components of the signal Vr which is fed to a low-pass filter 3c are cut off, it is converted to a digital haze signal Vh by a sampling digital circuit 3d-2, is taken into a microprocessor 3f through an interface 3e, the coordinates value is added to it, and it is stored in a memory 3g.

Description

【発明の詳細な説明】 [産業上の利用分野] この発明は、ウェハなどに対する異物検査装置における
ヘイズ(曇り)と異物の連続した異物群の判別方法に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for determining haze (cloudiness) and a continuous group of foreign objects in a foreign object inspection apparatus for wafers and the like.

[従来の技術] 半導体ICの素材のシリコンなどのウェハは、その表面
に異物などが付着すると製品の品質が低下するの!、表
面が研磨された鏡面の段階で異物検査装置により検査さ
れる。ただし鏡面には異物のほか、ヘイズとよばれる曇
り(またはもや)がやや広い範囲に付着しており、ヘイ
ズは配線パターンの形成に有害であるので同時に検査さ
れる。
[Prior Art] When foreign matter adheres to the surface of silicon wafers, which are the raw material for semiconductor ICs, the quality of the product deteriorates! When the surface is polished to a mirror surface, it is inspected by a foreign matter inspection device. However, in addition to foreign matter, the mirror surface has cloudiness (or mist) called haze attached to a rather wide area, and since haze is harmful to the formation of wiring patterns, it is inspected at the same time.

第4図(a)、(b)、(c)により、異物とヘイズに
対する検査装置の概念と、検査方法の概要を説明する。
The concept of the inspection device for foreign matter and haze and the outline of the inspection method will be explained with reference to FIGS. 4(a), (b), and (c).

図(a)において、ウェハ1の表面には異物p1’+ 
p2が孤立して付着し、またヘイズb1.−h2がある
範囲に4分布して付着している。ただし、異物p2はヘ
イズh2の範囲内に存在する。また、ヘイズhl+  
tlzの濃度は位置により変化して、いわば濃度分布し
ている。図(b)において、ウェハ1の表面に対して検
出光学系2の光源2aよりレーザビームを投射して走査
し、異物またはヘイズによる散乱光を集光レンズ2bに
より集光して光電変換器2Cに受光する。なお、異物ま
たはヘイズが存在しない鏡面では、レーザビームは正反
射して光電変換器2cに受光されないように構成されて
いる。光電変換器2Cの出力は信号処理部3のアンプ3
aにより適当なレベルに増幅され、図(a)の異物pt
 t I)2およびヘイズht y h2に対応して図
(e)の上欄に示す受光信号vrがえられる。受光信号
vrはコンパレータ3bの子端子に入力するとともに、
ローパスフィルタ3cに入力して高周波数成分がカット
され、低周波数成分がコンパレータ3bの一端子に加え
られる。ヘイズht 、  h2に対する信号(ht 
)、  (h2)は変化が緩慢であるのでローパスフィ
ルタ3Cを通過し、ヘイズの濃淡に対応した波高値のヘ
イズ信号vhl、vh2が出力端子3d−2より出力さ
れる。一方、異物pl、p2に対する時間幅が短いパル
ス(ps )、  (1)2)信号は、そのままコンパ
レータ3bを通して異物の大きさに対応した波高値の異
物信号vP1.vP2が出力される。
In Figure (a), there is a foreign particle p1'+ on the surface of the wafer 1.
p2 is isolated and attached, and haze b1. -h2 is attached in four distributions in a certain range. However, the foreign substance p2 exists within the range of the haze h2. Also, haze hl+
The concentration of tlz changes depending on the position, so to speak, there is a concentration distribution. In Figure (b), a laser beam is projected and scanned from the light source 2a of the detection optical system 2 onto the surface of the wafer 1, and the light scattered by foreign objects or haze is focused by the condensing lens 2b to form a photoelectric converter 2C. Receives light. Note that on a mirror surface free of foreign matter or haze, the laser beam is specularly reflected and is not received by the photoelectric converter 2c. The output of the photoelectric converter 2C is sent to the amplifier 3 of the signal processing section 3.
The foreign substance pt shown in Figure (a) is amplified to an appropriate level by
A light reception signal vr shown in the upper column of FIG. 3(e) is obtained corresponding to tI)2 and haze htyh2. The light reception signal vr is input to the child terminal of the comparator 3b, and
The signal is input to a low-pass filter 3c, high frequency components are cut off, and low frequency components are added to one terminal of a comparator 3b. Haze ht, signal for h2 (ht
) and (h2) change slowly, so they pass through the low-pass filter 3C, and haze signals vhl and vh2 with peak values corresponding to the shading of the haze are output from the output terminal 3d-2. On the other hand, the pulses (ps) with short time widths (1) and 2) for the foreign objects pl and p2 are passed through the comparator 3b as they are, and the foreign object signal vP1. vP2 is output.

ナオ、ローパスフィルタ3Cの出力カコンハレータ3b
の比較電圧とされているので、ヘイズh2の高さを差し
引いた異物信号vP2がえられる。
Nao, output capacitor 3b of low-pass filter 3C
Therefore, the foreign object signal vP2 can be obtained by subtracting the height of the haze h2.

[解決しようとする課題] 以上における異物1)t t p2は孤立したものであ
るが、これが連続して異物群となる場合がある。
[Problem to be Solved] Although the foreign matter 1) t t p2 in the above is an isolated object, it may be continuous and form a group of foreign objects.

このような連続異物群は上記の検査方法では検出するこ
とが困難である。以下図により説明する。
It is difficult to detect such a continuous group of foreign substances using the above-mentioned inspection method. This will be explained below using figures.

第5図(a)は、ヘイズのない鏡面に互いに接触、また
は近接して付着した複数n個の異物p1 ’=pnより
なる連続異物群を示す。これに対する受光信号vrは、
図(b)のように個々の異物に対する受光信号が重なり
合って波高値が僅かに変動し、異物群の長さだけ継続す
る波形となる。このような受光信号vrに対する異物信
号vPは図(e)に示すように波高値が微小なためS/
N比が悪くて検出が困難である。一方、受光信号vrは
ローパスフィルタ3cにより高周波数成分がカットされ
、これが恰もヘイズ信号vh’として出力される。
FIG. 5(a) shows a continuous foreign object group consisting of a plurality of n foreign objects p1'=pn attached to a haze-free mirror surface in contact with or close to each other. The light reception signal vr for this is
As shown in Figure (b), the light reception signals for individual foreign objects overlap and the peak value changes slightly, resulting in a waveform that continues for the length of the foreign object group. The foreign object signal vP with respect to the received light signal vr has a very small peak value as shown in Figure (e), so the S/
Detection is difficult due to poor N ratio. On the other hand, the high frequency component of the received light signal vr is cut by the low-pass filter 3c, and this is output as a haze signal vh'.

図(d)〜(f)は、異物群p1−1)nが、ヘイズh
の上に乗っている場合で、異物信号vPは微弱で検出さ
れず、正しいヘイズ信号vhの上に誤ったヘイズ信号v
h’が重畳して出力される。以上により、いずれの場合
も連続異物群はヘイズとして誤検出される。なお、異物
がある距離以上離れているときは、上記した孤立異物と
して検出されることは勿論である。
Figures (d) to (f) show that the foreign object group p1-1)n has a haze h
When the foreign object signal vP is too weak to be detected, an erroneous haze signal v is placed on top of the correct haze signal vh.
h' is output in a superimposed manner. As a result of the above, in either case, the continuous foreign object group is erroneously detected as haze. Note that when a foreign object is separated by a certain distance or more, it is of course detected as the above-mentioned isolated foreign object.

さて、前記したように比較的広い範囲に分布しているヘ
イズに対して、連続異物群の長さは実際問題として非常
に短い。また、たとえ異物群が長い場合でも、途中で切
れ目があっていくつかの短い連続異物群に分かれている
場合が殆どである。
Now, in contrast to haze, which is distributed over a relatively wide range as described above, the length of a continuous foreign object group is actually very short. Furthermore, even if the foreign object group is long, there is often a break in the middle and the foreign object group is divided into several short continuous foreign object groups.

そこで、誤検出されたヘイズ信号vh’は長さがある程
度短く、かつ波高値が本来のヘイズ信号Vhより大きい
ことに着眼して両者を判別することが可能と考えられる
Therefore, it is considered possible to distinguish between the two by focusing on the fact that the erroneously detected haze signal vh' has a somewhat shorter length and a peak value larger than the original haze signal Vh.

この発明は以上の考え方により、異物検査装置において
ヘイズと連続異物群を判別する方法を提供することを目
的とするものである。
Based on the above concept, it is an object of the present invention to provide a method for discriminating between haze and continuous foreign matter groups in a foreign matter inspection apparatus.

[課題を解決するための手段] この発明は、被検査のウェハの表面に対してレーザビー
ムを投射し、表面に付着した異物またはヘイズによる散
乱光を光電変換器により受光し、その受光信号vrをコ
ンパレータの子端子およびローパスフィルタにそれぞれ
入力し、ローパスフィルタにより受光信号vrに含まれ
る高周波数成分をカットしてコンパレータの一端子に入
力し、コンパレータの出力信号を異物に対する異物信号
vPとし、ローパスフィルタの出力信号をヘイズに対す
るヘイズ信号vhとする異物検査装置におけるヘイズと
連続異物群の判別方法であって、ヘイズ信号vhを微小
な間隔Δlでサンプリングしてデジタルのヘイズ信号[
vhlに変換する。マイクロプロセッサの処理により、
ウェハの表面を方形に区分した単位セルS内におけるヘ
イズ信号[vhlの平均値[vhl−をそれぞれ計算す
る。各単位セルS内におけるヘイズ信号[vhlのうち
の平均値[vhココ−り突出した突出信号[:VO3を
検出し、その連続する個数Nをカウントする。個数Nが
基準値Mより小さいとき、このN個の突出信号[VO3
を異物が連続した連続異物群に対する異物信号[:v、
p’]と判別するものである。
[Means for Solving the Problems] The present invention projects a laser beam onto the surface of a wafer to be inspected, receives scattered light due to foreign matter or haze attached to the surface using a photoelectric converter, and converts the received light signal vr. are respectively input to the child terminal of the comparator and the low-pass filter, and the high-frequency components included in the received light signal vr are cut by the low-pass filter and input to one terminal of the comparator, and the output signal of the comparator is used as the foreign object signal vP for the foreign object, and the low-pass filter This is a method for distinguishing between haze and a continuous foreign object group in a foreign object inspection apparatus in which the output signal of a filter is used as a haze signal vh for haze, and the haze signal vh is sampled at minute intervals Δl to generate a digital haze signal [
Convert to vhl. Through microprocessor processing,
The average value [vhl-] of the haze signal [vhl] in the unit cell S obtained by dividing the surface of the wafer into squares is calculated. The average value [vh of the haze signal [vhl] in each unit cell S and the prominent protruding signal [:VO3] are detected, and the number N of consecutive haze signals is counted. When the number N is smaller than the reference value M, these N protruding signals [VO3
is the foreign object signal for a continuous foreign object group [:v,
p'].

[作用コ 以上の判別方法においては、ヘイズ信号vhは微小な間
隔Δヌでサンプリング−デジタル化されてヘイズ信号[
vhlに変換され、マイクワプロセッサの処理により各
単位領域S内におけるその平均値[v h1w+が計算
される。各単位領域Sについて、ヘイズ信号[v、h]
のうちの平均値[vhlより突出している突出信号[V
O3を検出して、その連続個数Nをカウントし、これが
基準値Mより小さいとき、このN個の突出信号[Vtl
]は連続異物群に対する異物信号[vp ’ ]と判別
される。以上において、方形の単位領域Sを設定し、単
位セルS内における平均値[vhコに対してヘイズ信号
[vhlを比較して突出信号[Vtl]を検出する理由
は、ヘイズの濃淡が場所的に大幅に変化し、これに対応
してヘイズ信号[vhlも太き(変動するので、両者の
比較が困難であるからであり、これに対して単位領域S
をヘイズの濃淡変化が比較的小さい範囲に設定し、その
範囲の平均値[v h]mをとることにより突出信号[
VO3を確実に検出するもので、従ってヘイズの濃淡分
布と、連続異物群の最大の長さを勘案して単位領域の方
形の一辺、および基準値Mを定めることが必要である。
In the above discrimination method, the haze signal vh is sampled and digitized at minute intervals Δnu, and the haze signal [
vhl, and its average value [v h1w+ within each unit area S is calculated by processing by the microphone processor. For each unit area S, haze signal [v, h]
The average value [VHL of the protruding signal [V
O3 is detected and the consecutive number N is counted, and when this is smaller than the reference value M, the N projecting signals [Vtl
] is determined to be a foreign object signal [vp' ] for a continuous foreign object group. In the above, the reason why a rectangular unit area S is set and a salient signal [Vtl] is detected by comparing the haze signal [vhl] with the average value [vh] within the unit cell S is that the haze density varies depending on the location. This is because the haze signal [vhl is also thicker (varies), making it difficult to compare the two.
is set to a range where the change in haze density is relatively small, and by taking the average value [v h]m of that range, the prominent signal [
VO3 is to be detected reliably, and therefore it is necessary to determine one side of the rectangle of the unit area and the reference value M in consideration of the haze density distribution and the maximum length of the continuous foreign object group.

この場合、方形の一辺は基準値Mより十分太き(設定す
ることが必要条件で、さもないと平均値[v h]mに
異物群の波高値が影響するからである。
In this case, one side of the rectangle is sufficiently thicker than the reference value M (setting is a necessary condition, otherwise the average value [v h]m will be influenced by the peak value of the foreign object group.

[実施例] 第1図は、この発明によるヘイズと連続異物群の判別方
法の実施例における概略のブロック構成図を示す。検出
光学系2は第4図(b)に示した従来の構成と同一で説
明を省略する。信号処理部3のアンプ3aより出力され
る受光信号vrはコンパレータ3bの子端子に入力し、
その出力の異物信号vpはサンプリング・デジタル化回
路(SP・A/D)3a−tによりサンプリング・デジ
タル化されて異物信号[vp]に変換され、インタフェ
ース(I/F)3fを経てマイクロプロセッサ(MPU
)3rに取り込まれ、座標値を付加してメモリ(MEM
)3bに記憶される。一方、ロー!寸スフィルタ(LF
)3cに入力した受光信号vrは、その高周波数成分が
カットされてSP・A/D 3 d−2によりデジタル
のヘイズ信号[vhlに変換され、I/F3eを経てM
PU3rに取り込まれ、座標値を付加してMEM3gに
記憶される。
[Embodiment] FIG. 1 shows a schematic block diagram of an embodiment of the haze and continuous foreign object group discrimination method according to the present invention. The detection optical system 2 has the same structure as the conventional structure shown in FIG. 4(b), and a description thereof will be omitted. The light reception signal vr output from the amplifier 3a of the signal processing section 3 is input to the child terminal of the comparator 3b,
The output foreign object signal vp is sampled and digitized by sampling and digitizing circuits (SP/A/D) 3a-t and converted into a foreign object signal [vp], which is then sent to the microprocessor ( MPU
)3r, coordinate values are added, and the memory (MEM
) 3b. On the other hand, Low! Dimension filter (LF
) 3c, the high frequency component of the received light signal vr is cut and converted into a digital haze signal [vhl] by the SP・A/D 3 d-2, which is sent to the M via I/F 3e.
It is taken into the PU 3r, added with coordinate values, and stored in the MEM 3g.

第2図(a)〜(d)により、ウェハに設定される単位
領域Sと、第1図の各部の動作を説明する。
The unit area S set on the wafer and the operation of each part in FIG. 1 will be explained with reference to FIGS. 2(a) to 2(d).

図(a)において、ウェハ1のオリエンティション・フ
ラットOFをX軸とし、これに直角なy軸によりxy座
標系が設定され、X方向に検出光学系2のレーザビーム
を掃引し、間隔Δl′で表面が走査される。前記したヘ
イズの濃淡分布と連続異物群の最大の長さを勘案して、
ウェハ1の表面に2辺の長さがLx、Lyの方形の単位
領域Sがマトリックスに設定される。図(b)は1個の
単位領域Sと走査線を示す。各走査線に対するヘイズ信
号vhがΔlの間隔でサンプリング・デジタル化され、
図(C)および(d)に示すヘイズ信号[vhlがME
M3gに記憶される。図(c)は単位領域S内にヘイズ
hのみが付着した場合を示し、各ヘイズ信号[vhlは
ヘイズhの濃淡に従って緩慢に変化しており、MPU3
fによりそれらの平均値[Vh]a+が計算されてME
M3gに記憶される。この場合は、平均値[v hl+
*に対する各ヘイズ信号[vhlの偏差は小さいので、
異物群がないものと判別される。これに対して図(d)
は、平均値[vt+]層より大きく突出した突出信号[
V旧がある場合で、これを検出してその連続した個数N
をカウントし、個数Nが基準値Mより小さいときは、こ
れを連続異物群に対する異物信号[vp ’ ]と判別
する。異物信号[vp ’ ]は、前記した孤立異物に
対する異物信号Cvp]と併合して編集され、プリンタ
(PRT)3hに出力される。ただし、個数Nが基準値
Mより大きいときは必ずしも連続異物群とはみなされず
、ヘイズの濃度がその部分で急激に変化している場合が
あり、疑異物信号[vp#]として出力される。なお、
ヘイズ信号[Vh]は連続異物群の有無にかかわらず、
その平均値[v h]mのデータがPRT3hに出力さ
れる。
In Figure (a), the orientation flat OF of the wafer 1 is taken as the X axis, and the xy coordinate system is set by the y axis perpendicular to this, and the laser beam of the detection optical system 2 is swept in the X direction, with an interval Δl' The surface is scanned. Considering the haze density distribution and the maximum length of the continuous foreign object group mentioned above,
On the surface of the wafer 1, a rectangular unit area S with lengths of two sides Lx and Ly is set in a matrix. Figure (b) shows one unit area S and a scanning line. The haze signal vh for each scanning line is sampled and digitized at intervals of Δl,
The haze signal shown in Figures (C) and (d) [vhl is ME
Stored in M3g. Figure (c) shows the case where only the haze h adheres within the unit area S, and each haze signal [vhl changes slowly according to the density of the haze h, and the MPU3
Their average value [Vh]a+ is calculated by f and ME
Stored in M3g. In this case, the average value [v hl+
Since the deviation of each haze signal [vhl for * is small,
It is determined that there are no foreign bodies. In contrast, figure (d)
is a prominent signal [vt+] that is larger than the average value [vt+] layer.
If there are V olds, detect this and calculate the number of consecutive pieces N
is counted, and when the number N is smaller than the reference value M, this is determined to be a foreign object signal [vp'] for a continuous foreign object group. The foreign object signal [vp'] is combined with the foreign object signal Cvp for the isolated foreign object described above, edited, and output to the printer (PRT) 3h. However, when the number N is larger than the reference value M, it is not necessarily regarded as a continuous foreign object group, and the haze concentration may change rapidly in that part, and this is output as a suspected foreign object signal [vp#]. In addition,
The haze signal [Vh] is determined regardless of the presence or absence of a continuous foreign object group.
Data of the average value [v h]m is output to PRT3h.

第3図は上記の連続異物群の判別方法に対する処理手順
を示すフローチャートで、まず、ウェハ1の表面がレー
ザビームにより走査され、えられた異物信号[vP]と
ヘイズ信号[vhコのデータがそれらの座標値を付加し
てMEM3gに収録され■、各単位領域S内における[
vhlの平均値[Vh]maが計算される■。ついで、
各単位領域S内の[vhlのうちの、[vhlsrを突
出する突出信号[VO3を検出し■、連続する[V11
]の個数Nをカウントする■。個数Nが基準値Mより小
さいときは(■のyes)、N個の突出信号[VO3が
連続異物群に対する異物信号[vp ’ 3と判別され
てMEMに記憶され■、また個数Nが基準値M以上のと
きは(■のnO)、疑異物信号[vp″コと判別されて
記憶される■。以上の各異物信号[vp]。
FIG. 3 is a flowchart showing the processing procedure for the above-described continuous foreign object group discrimination method. First, the surface of the wafer 1 is scanned by a laser beam, and the obtained foreign object signal [vP] and haze signal [vh] are These coordinate values are added and recorded in MEM3g, and [[
■ The average value of vhl [Vh]ma is calculated. Then,
Detects the protruding signal [VO3 that protrudes [vhlsr] of [vhl in each unit area S, and continues [V11
]Count the number N.■. When the number N is smaller than the reference value M (yes in ■), the N protruding signals [VO3 are determined to be the foreign object signals [vp' 3] for the continuous foreign object group and are stored in the MEM, and the number N is the reference value. When it is equal to or greater than M (nO of ■), it is determined as a suspected foreign object signal [vp'' and stored as ■. Each of the above foreign object signals [vp].

[vp ’ ]および疑異物信号[vp ” ]のデー
タは、それぞれ編集されて異物データとしてPRT3h
に出力される■。また、ヘイズ信号の平均値[v h]
gmがヘイズデータとして出力される■。
[vp'] and suspected foreign object signal [vp''] data are edited and sent to PRT3h as foreign object data.
■ is output to. Also, the average value of the haze signal [v h]
■ gm is output as haze data.

以上の実施例においては、レーザビームの走査方式をx
y定走査したが、回転走査方式の場合は、各サンプリン
グデータは(R,θ)座標により表示されてMEM3g
に収録されるので、これをXy座標系に変換して上記の
処理を行う。座標変換は通常の技術により容易に行うこ
とができるので詳細な説明は省略する。
In the above embodiment, the scanning method of the laser beam is x
Although y constant scanning was used, in the case of rotational scanning, each sampling data is displayed by (R, θ) coordinates and MEM3g
This is recorded in the XY coordinate system and the above processing is performed. Coordinate transformation can be easily performed using common techniques, so detailed explanation will be omitted.

[発明の効果] 以−Fの説明により明らかなように、この発明によるヘ
イズと連続異物群の判別方法においては、ウェハの表面
をヘイズの濃淡変化が比較的小さい単位領域Sに区分し
、各単位領域S内におけるヘイズ信号[vhlの平均値
[vhlwが計算され、平均値[vhコより突出してい
る突出信号[VO3を検出し、その連続個数Nが基準値
Mより小さいとき、これを連続異物群に対する異物信号
[vp ’ ]と判別するもので、従来ヘイズと誤判定
されていた連続異物群が正しく判別され、異物検査の信
頼性の向上に寄与する効果には大きいものがある。
[Effects of the Invention] As is clear from the explanation in F below, in the method for discriminating haze and continuous foreign matter groups according to the present invention, the surface of the wafer is divided into unit regions S in which the change in haze density is relatively small, and each The haze signal [average value of vhlw [vhlw] within the unit area S is calculated, and when the protruding signal [VO3 that is more prominent than the average value [vh] is detected and the consecutive number N is smaller than the reference value M, it is continuously By identifying the foreign object signal [vp'] for a foreign object group, the continuous foreign object group, which was conventionally erroneously determined to be haze, is correctly identified, and this has a great effect in contributing to improving the reliability of foreign object inspection.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、この発明によるヘイズと連続異物群の判別方
法の実施例に対する概略ブロック構成図、第2図(a 
) 、 (b ) 、 (c )および(d)は、ウェ
ハに設定される単位領域Sと、第1図の各部の動作説明
図、第3図は連続異物群の判別の方法の手順を示すフロ
ーチャート、第4図(a)、(b)および(c)は、ウ
ェハに付着した異物とヘイズに対する検査装置の構成図
、および検査方法の概念の説明図、第5図(a)、(b
)、(c) 、(d)、(e)および(f)は、連続異
物群の信号波形と、連続異物群がヘイズと誤判定される
理由の説明図である。 1・・・ウェハ、      2・・・検出光学系、2
a・・・光源、     2b・・・集光レンズ、2c
・・・光電変換器、  3・・・信号処理部、3a・・
・アンプ、     3b・・・コンパレータ、3C・
・・ローパスフィルタ(LF)、3d−1,3d−2・
・・サンプリング・デジタル化回路(SP@A/D)、 3e・・・インタフェース(I/F)、3f・・・マイ
クロプロセッサ(MEM)、3g・・・メモリ (ME
M)、 3h・・・プリンタ(PRT)、 ■〜■・・・フローチャートのステップ番号。
FIG. 1 is a schematic block diagram of an embodiment of the method for discriminating between haze and continuous foreign matter groups according to the present invention, and FIG.
), (b), (c) and (d) are unit areas S set on the wafer and explanatory diagrams of the operation of each part in Fig. 1, and Fig. 3 shows the procedure of the method for determining continuous foreign matter groups. The flowchart, FIGS. 4(a), (b), and (c) is a block diagram of an inspection apparatus for foreign matter and haze attached to a wafer, and an explanatory diagram of the concept of the inspection method, and FIGS. 5(a), (b).
), (c), (d), (e), and (f) are explanatory diagrams of the signal waveform of a continuous foreign object group and the reason why the continuous foreign object group is erroneously determined to be haze. 1... Wafer, 2... Detection optical system, 2
a... Light source, 2b... Condensing lens, 2c
...Photoelectric converter, 3...Signal processing section, 3a...
・Amplifier, 3b...Comparator, 3C・
・Low pass filter (LF), 3d-1, 3d-2・
...Sampling/digitization circuit (SP@A/D), 3e...Interface (I/F), 3f...Microprocessor (MEM), 3g...Memory (ME
M), 3h...Printer (PRT), ■~■...Step number of flowchart.

Claims (1)

【特許請求の範囲】[Claims] (1)被検査のウェハの表面に対してレーザビームを投
射し、該表面に付着した異物またはヘイズによる散乱光
を光電変換器により受光し、該光電変換器の受光信号v
rをコンパレータの+端子およびローパスフィルタにそ
れぞれ入力し、該ローパスフィルタにより該受光信号v
rに含まれる高周波数成分をカットして前記コンパレー
タの一端子に入力し、前記コンパレータの出力信号を前
記異物に対する異物信号vPとし、前記ローパスフィル
タの出力信号を前記ヘイズに対するヘイズ信号vhとす
る異物検査装置において、前記ヘイズ信号vhを微小な
間隔Δlでサンプリングしてデジタルのヘイズ信号[v
h]に変換し、マイクロプロセッサの処理により、前記
ウェハの表面を方形に区分した単位領域S内における該
ヘイズ信号[vh]の平均値[vh]mをそれぞれ計算
し、各該単位領域内の該ヘイズ信号[vh]のうち、該
平均値[vh]mより突出した突出信号[VH]を検出
して連続する個数Nをカウントし、該個数Nが基準値M
より小さいとき、該N個の突出信号[VH]を前記異物
が連続した連続異物群に対する異物信号[vp’]と判
別する、ヘイズと連続異物群の判別方法。
(1) A laser beam is projected onto the surface of the wafer to be inspected, and a photoelectric converter receives the scattered light due to foreign matter or haze attached to the surface, and the received light signal v of the photoelectric converter is
r is input to the + terminal of the comparator and the low-pass filter, and the received light signal v is input by the low-pass filter.
A foreign object in which a high frequency component included in r is cut and inputted to one terminal of the comparator, the output signal of the comparator is used as a foreign object signal vP for the foreign object, and the output signal of the low-pass filter is used as a haze signal vh for the haze. In the inspection device, the haze signal vh is sampled at minute intervals Δl to obtain a digital haze signal [v
h], and the microprocessor calculates the average value [vh]m of the haze signal [vh] within a unit area S obtained by dividing the surface of the wafer into squares, and calculates the average value [vh]m of the haze signal [vh] in each unit area Among the haze signals [vh], prominent signals [VH] that are more prominent than the average value [vh]m are detected and the consecutive number N is counted, and the number N is equal to the reference value M.
A method for discriminating between haze and a continuous foreign object group, wherein the N protrusion signals [VH] are determined as foreign object signals [vp'] for a continuous foreign object group in which the foreign objects are continuous.
JP2326504A 1990-11-28 1990-11-28 How to distinguish between haze and continuous foreign particles Expired - Fee Related JP2571468B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2326504A JP2571468B2 (en) 1990-11-28 1990-11-28 How to distinguish between haze and continuous foreign particles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2326504A JP2571468B2 (en) 1990-11-28 1990-11-28 How to distinguish between haze and continuous foreign particles

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Publication Number Publication Date
JPH04194738A true JPH04194738A (en) 1992-07-14
JP2571468B2 JP2571468B2 (en) 1997-01-16

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Country Link
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JP2009133778A (en) * 2007-11-30 2009-06-18 Hitachi High-Technologies Corp Inspection apparatus and inspection method
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Cited By (7)

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Publication number Priority date Publication date Assignee Title
JP2007501944A (en) * 2003-05-19 2007-02-01 ケーエルエー−テンカー テクノロジィース コーポレイション Apparatus and method for enabling robust separation between signals of interest and noise
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JP2009133778A (en) * 2007-11-30 2009-06-18 Hitachi High-Technologies Corp Inspection apparatus and inspection method
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