JPH04192484A - Manufacture of semiconductor laser device - Google Patents
Manufacture of semiconductor laser deviceInfo
- Publication number
- JPH04192484A JPH04192484A JP32420090A JP32420090A JPH04192484A JP H04192484 A JPH04192484 A JP H04192484A JP 32420090 A JP32420090 A JP 32420090A JP 32420090 A JP32420090 A JP 32420090A JP H04192484 A JPH04192484 A JP H04192484A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- blocking layer
- glass
- semiconductor laser
- laser device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 239000011521 glass Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000002844 melting Methods 0.000 claims abstract description 5
- 230000008018 melting Effects 0.000 claims abstract description 5
- 239000012141 concentrate Substances 0.000 claims abstract 2
- 230000000903 blocking effect Effects 0.000 abstract description 7
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 3
- 239000000156 glass melt Substances 0.000 abstract description 3
- 239000007864 aqueous solution Substances 0.000 abstract description 2
- 238000005253 cladding Methods 0.000 description 9
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 7
- 239000000758 substrate Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001962 electrophoresis Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は半導体レーザの構造、製造方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure and manufacturing method of a semiconductor laser.
第7図〜第12図は埋込みリッジ型と呼ば口る半導体レ
ーザ装置の従来の製造方法例を示したものである。図に
おいて、(1〕は基板、(2)は下クラッド層、(3月
ま活性層、(4)ば上クラッド層、(5月まコンタクト
層、(s−b)はブロック層、(7)は電極を示す。7 to 12 show an example of a conventional manufacturing method for a semiconductor laser device called a buried ridge type. In the figure, (1) is the substrate, (2) is the lower cladding layer, (3) is the active layer, (4) is the upper cladding layer, (is the contact layer (5), (sb) is the block layer, (7) ) indicates an electrode.
次に動作について説明する。p、n1!極(7)、(3
)間に電位差をかけると、下クラッド層(n−AIGa
As)(2)からは電子が、上クラッド層(p−A l
GaAs )(4)からはホールが活性層(3)に注入
さ0再結合し発光する。Next, the operation will be explained. p, n1! Pole (7), (3
), the lower cladding layer (n-AIGa
As) (2), electrons are transferred to the upper cladding layer (p-A l
Holes are injected from GaAs ) (4) into the active layer (3) and recombined to emit light.
このとき電流ブロック層(6a) (As−5系ガラス
)によって、この部分は電流がブロックされそれ以外の
実際に発光する部分近くに集中して電流が流れ効率良く
発光する。At this time, the current is blocked by the current blocking layer (6a) (As-5 glass) in this portion, and the current flows concentrated near the other portion that actually emits light, emitting light efficiently.
従来の半導体レーザ装置の製造方法は以上のように構成
さ口ていたので、ブロック層(6−b)を形成するとき
、気相法による選択エピタキシャル成長を行なう必要が
ある。エピタキシャル結晶成長を行なうためには、結晶
成長装置は各条件が十分にコントロールさ口る必要があ
り、装置は高価なものが必要であるなどの問題があった
。Since the conventional manufacturing method of a semiconductor laser device has the structure as described above, when forming the block layer (6-b), it is necessary to perform selective epitaxial growth using a vapor phase method. In order to perform epitaxial crystal growth, it is necessary to sufficiently control each condition of the crystal growth apparatus, and there are problems such as the need for an expensive apparatus.
この発明は上記のような問題点を解消するためになされ
たもので、ブロック層を形成する際、例えば、As−5
系ガラスのような低融点、高抵抗のガラスを用いること
のできる半導体レーザ装置を得ることを目的とする。This invention was made to solve the above problems, and when forming a block layer, for example, As-5
The object of the present invention is to obtain a semiconductor laser device that can use a glass having a low melting point and high resistance, such as a glass based on glass.
本発明に係わる半導体レーザ装置の製造方法は、ブロッ
ク層をエピタキシャル成長法でつくったn−GaAs
の代わりに、例えば、As−3系ガラスのような低融
点、高抵抗のガラスを用いたものである。In the method for manufacturing a semiconductor laser device according to the present invention, the block layer is made of n-GaAs made by an epitaxial growth method.
Instead, for example, a low melting point, high resistance glass such as As-3 glass is used.
この発明における半導体レーザ装置の製造方法はブロッ
ク−層に用いたAs−5系ガラスは高抵抗であるため、
p−n逆バイアスの層をエピタキシャルに作る必要はな
(、As−5系ガラスメルトにつけたのち取出して固化
すれば良い。In the method for manufacturing a semiconductor laser device in this invention, since the As-5 glass used for the block layer has high resistance,
There is no need to epitaxially form the pn reverse bias layer (it can be applied to As-5 glass melt, taken out and solidified).
以下、この発明の一実施例について説明する。 An embodiment of the present invention will be described below.
第1図〜第6図はこの発明の一実施例による半導体レー
ザ装置の製造方法を示す工程図である。1 to 6 are process diagrams showing a method of manufacturing a semiconductor laser device according to an embodiment of the present invention.
第1図において、(1) l!基板(n−GaAs)、
(2ンは下り57 )’ 層(n−AIGaAs)、(
3)(ば活性層(AIGaAs)、(4)(ま上クラッ
ド層(p−AlGaAs )、(5)LCコン’) ’
) ト層(p−GaAs)、(6−a) +;lブロッ
ク層(As−8系ガラス)、(7)はp−電極、(8)
はn−電極である。In Figure 1, (1) l! Substrate (n-GaAs),
(2nd line is down 57)' layer (n-AIGaAs), (
3) (active layer (AIGaAs), (4) (upper cladding layer (p-AlGaAs), (5) LC layer)'
) G layer (p-GaAs), (6-a) +; l block layer (As-8 glass), (7) is p-electrode, (8)
is the n-electrode.
次に動作について説明する。Next, the operation will be explained.
p、nli極(n 、 (sン間に電位差をかけると、
下クラッド層(n−AlGaAs )(2)からは電子
が、上クラッド層(p−AIGaAs)(4)からはホ
ールが活性層(3)ニ注入すn再結合し発光する。この
とき電泳ブロック層(6a)(As−5系ガラス)lこ
町って、この部分は電泳がブロックされ、それ以外の実
際に発光する部分近くに集中して電流が流れ効率良く発
光する。When a potential difference is applied between the p, nli poles (n, (s),
Electrons are injected from the lower cladding layer (n-AlGaAs) (2) and holes from the upper cladding layer (p-AIGaAs) (4) are injected into the active layer (3) and recombine to emit light. At this time, electrophoresis is blocked in this part of the electrophoresis blocking layer (6a) (As-5 glass), and current flows concentrated near the other parts that actually emit light, emitting light efficiently.
次に製造工程を説明する。従来例では第2図でチッ化膜
を部分的に形成し、そ口を第3図でエツチング後、 n
−GaAsブロック層をエピタキシャルに成長させた。Next, the manufacturing process will be explained. In the conventional example, a nitride film is partially formed as shown in FIG. 2, and after the edge is etched as shown in FIG.
- A GaAs block layer was grown epitaxially.
その後、電極を形成し、レーザとした。After that, electrodes were formed to create a laser.
本発明では、エツチング後、As−3系ガラスメルトに
浸漬するだけで、ブロック層を形成し、余部についたブ
ロック層はアルカリ水溶液で選択エッチして除去し、そ
の後電極を形成しレーザとする。In the present invention, after etching, a block layer is formed by simply immersing it in an As-3 glass melt, and the remaining block layer is removed by selective etching with an alkaline aqueous solution, after which electrodes are formed and used as a laser.
このようにブロック層を従来のn−GaAsエピタキシ
ャル層からAs−5ガラスに変えたので、ブロック層形
成が容易になった。Since the block layer was changed from the conventional n-GaAs epitaxial layer to As-5 glass in this way, the formation of the block layer became easier.
第1図〜第6図は本発明実施例の製造方法を示したもの
で工程断面図、第7図〜第12図は従来の製造方法を示
した工程断面図である。
(11it基板(n−GaAs) 、 (2)12下ク
ラッド層(n−AIGaAs)、(3)ハ活性層(n−
GaAs) 、(4)+!上ツクラッド層p−AIGa
As) 、(5月ハコンタクト層(p−GaAs)、(
6J−(a) i、tブロック層(As−5系ガラス)
、(7)はp!極、(8)はn電極である。
なお、各図中、同−符i+は同一、又は相当部分である
。1 to 6 are process sectional views showing a manufacturing method according to an embodiment of the present invention, and FIGS. 7 to 12 are process sectional views showing a conventional manufacturing method. (11it substrate (n-GaAs), (2) 12 lower cladding layer (n-AIGaAs), (3) C active layer (n-
GaAs), (4)+! Upper cladding layer p-AIGa
As), (May contact layer (p-GaAs), (
6J-(a) i, t block layer (As-5 glass)
, (7) is p! The pole (8) is an n-electrode. In addition, in each figure, the same symbol i+ indicates the same or equivalent part.
Claims (1)
して、低融点(600℃以下)、高抵抗(10^8Ω・
cm以上)のガラスを用いたことを特徴とする半導体レ
ーザ装置の製造方法。As a block layer to concentrate the current to a specific part, we use a low melting point (below 600℃), high resistance (10^8Ω・
1. A method for manufacturing a semiconductor laser device, characterized in that a glass having a diameter of 1 cm or more is used.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32420090A JPH04192484A (en) | 1990-11-26 | 1990-11-26 | Manufacture of semiconductor laser device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32420090A JPH04192484A (en) | 1990-11-26 | 1990-11-26 | Manufacture of semiconductor laser device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04192484A true JPH04192484A (en) | 1992-07-10 |
Family
ID=18163181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32420090A Pending JPH04192484A (en) | 1990-11-26 | 1990-11-26 | Manufacture of semiconductor laser device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04192484A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1170839A2 (en) * | 2000-07-07 | 2002-01-09 | Lucent Technologies Inc. | Mesa geometry semiconductor light emitter having chalcogenide dielectric coating |
-
1990
- 1990-11-26 JP JP32420090A patent/JPH04192484A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1170839A2 (en) * | 2000-07-07 | 2002-01-09 | Lucent Technologies Inc. | Mesa geometry semiconductor light emitter having chalcogenide dielectric coating |
JP2002076516A (en) * | 2000-07-07 | 2002-03-15 | Lucent Technol Inc | Mesa structure semiconductor light emitter having chalcogenide dielectric coating |
EP1170839A3 (en) * | 2000-07-07 | 2002-04-03 | Lucent Technologies Inc. | Mesa geometry semiconductor light emitter having chalcogenide dielectric coating |
US6463088B1 (en) | 2000-07-07 | 2002-10-08 | Lucent Technologies Inc. | Mesa geometry semiconductor light emitter having chalcogenide dielectric coating |
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