JPH04192484A - Manufacture of semiconductor laser device - Google Patents

Manufacture of semiconductor laser device

Info

Publication number
JPH04192484A
JPH04192484A JP32420090A JP32420090A JPH04192484A JP H04192484 A JPH04192484 A JP H04192484A JP 32420090 A JP32420090 A JP 32420090A JP 32420090 A JP32420090 A JP 32420090A JP H04192484 A JPH04192484 A JP H04192484A
Authority
JP
Japan
Prior art keywords
layer
blocking layer
glass
semiconductor laser
laser device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32420090A
Other languages
Japanese (ja)
Inventor
Yoichiro Ota
太田 洋一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP32420090A priority Critical patent/JPH04192484A/en
Publication of JPH04192484A publication Critical patent/JPH04192484A/en
Pending legal-status Critical Current

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  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To easily form a blocking layer by a method wherein a glass whose melting point is low and whose resistance is high such as an As-S-based glass is used for the blocking layer. CONSTITUTION:A glass whose melting point is low (600 deg.C or lower) and whose resistance is high (10<8>OMEGA.cm or higher) is used for a blocking layer 6a which is used to concentrate an electric current in a definite part. When a potential difference is applied across a p-electrode and an n-electrode 7, 8, electrons are injected from a lower clad layer (n-AlGaAs) 2 and holes are injected into an active layer 3 from an upper clad layer (p-AlGaAs) 4; they are recombined; light is emitted. The electric current is blocked in this part; it is concentrated near a part, other than the part which actually emits light; the light is emitted with high efficiency. Thereby, the blocking layer 6a is formed when it is immersed in an As-S-based glass melt after an etching operation; the blocking layer in other parts is etched selectively and removed by an alkaline aqueous solution; after that, electrodes are formed. A laser is obtained.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は半導体レーザの構造、製造方法に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure and manufacturing method of a semiconductor laser.

〔従来の技術〕[Conventional technology]

第7図〜第12図は埋込みリッジ型と呼ば口る半導体レ
ーザ装置の従来の製造方法例を示したものである。図に
おいて、(1〕は基板、(2)は下クラッド層、(3月
ま活性層、(4)ば上クラッド層、(5月まコンタクト
層、(s−b)はブロック層、(7)は電極を示す。
7 to 12 show an example of a conventional manufacturing method for a semiconductor laser device called a buried ridge type. In the figure, (1) is the substrate, (2) is the lower cladding layer, (3) is the active layer, (4) is the upper cladding layer, (is the contact layer (5), (sb) is the block layer, (7) ) indicates an electrode.

次に動作について説明する。p、n1!極(7)、(3
)間に電位差をかけると、下クラッド層(n−AIGa
As)(2)からは電子が、上クラッド層(p−A l
GaAs )(4)からはホールが活性層(3)に注入
さ0再結合し発光する。
Next, the operation will be explained. p, n1! Pole (7), (3
), the lower cladding layer (n-AIGa
As) (2), electrons are transferred to the upper cladding layer (p-A l
Holes are injected from GaAs ) (4) into the active layer (3) and recombined to emit light.

このとき電流ブロック層(6a) (As−5系ガラス
)によって、この部分は電流がブロックされそれ以外の
実際に発光する部分近くに集中して電流が流れ効率良く
発光する。
At this time, the current is blocked by the current blocking layer (6a) (As-5 glass) in this portion, and the current flows concentrated near the other portion that actually emits light, emitting light efficiently.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の半導体レーザ装置の製造方法は以上のように構成
さ口ていたので、ブロック層(6−b)を形成するとき
、気相法による選択エピタキシャル成長を行なう必要が
ある。エピタキシャル結晶成長を行なうためには、結晶
成長装置は各条件が十分にコントロールさ口る必要があ
り、装置は高価なものが必要であるなどの問題があった
Since the conventional manufacturing method of a semiconductor laser device has the structure as described above, when forming the block layer (6-b), it is necessary to perform selective epitaxial growth using a vapor phase method. In order to perform epitaxial crystal growth, it is necessary to sufficiently control each condition of the crystal growth apparatus, and there are problems such as the need for an expensive apparatus.

この発明は上記のような問題点を解消するためになされ
たもので、ブロック層を形成する際、例えば、As−5
系ガラスのような低融点、高抵抗のガラスを用いること
のできる半導体レーザ装置を得ることを目的とする。
This invention was made to solve the above problems, and when forming a block layer, for example, As-5
The object of the present invention is to obtain a semiconductor laser device that can use a glass having a low melting point and high resistance, such as a glass based on glass.

〔課題を解決するための手段〕[Means to solve the problem]

本発明に係わる半導体レーザ装置の製造方法は、ブロッ
ク層をエピタキシャル成長法でつくったn−GaAs 
 の代わりに、例えば、As−3系ガラスのような低融
点、高抵抗のガラスを用いたものである。
In the method for manufacturing a semiconductor laser device according to the present invention, the block layer is made of n-GaAs made by an epitaxial growth method.
Instead, for example, a low melting point, high resistance glass such as As-3 glass is used.

〔作用〕[Effect]

この発明における半導体レーザ装置の製造方法はブロッ
ク−層に用いたAs−5系ガラスは高抵抗であるため、
p−n逆バイアスの層をエピタキシャルに作る必要はな
(、As−5系ガラスメルトにつけたのち取出して固化
すれば良い。
In the method for manufacturing a semiconductor laser device in this invention, since the As-5 glass used for the block layer has high resistance,
There is no need to epitaxially form the pn reverse bias layer (it can be applied to As-5 glass melt, taken out and solidified).

〔実施例〕〔Example〕

以下、この発明の一実施例について説明する。 An embodiment of the present invention will be described below.

第1図〜第6図はこの発明の一実施例による半導体レー
ザ装置の製造方法を示す工程図である。
1 to 6 are process diagrams showing a method of manufacturing a semiconductor laser device according to an embodiment of the present invention.

第1図において、(1) l!基板(n−GaAs)、
(2ンは下り57 )’ 層(n−AIGaAs)、(
3)(ば活性層(AIGaAs)、(4)(ま上クラッ
ド層(p−AlGaAs )、(5)LCコン’) ’
) ト層(p−GaAs)、(6−a) +;lブロッ
ク層(As−8系ガラス)、(7)はp−電極、(8)
はn−電極である。
In Figure 1, (1) l! Substrate (n-GaAs),
(2nd line is down 57)' layer (n-AIGaAs), (
3) (active layer (AIGaAs), (4) (upper cladding layer (p-AlGaAs), (5) LC layer)'
) G layer (p-GaAs), (6-a) +; l block layer (As-8 glass), (7) is p-electrode, (8)
is the n-electrode.

次に動作について説明する。Next, the operation will be explained.

p、nli極(n 、 (sン間に電位差をかけると、
下クラッド層(n−AlGaAs )(2)からは電子
が、上クラッド層(p−AIGaAs)(4)からはホ
ールが活性層(3)ニ注入すn再結合し発光する。この
とき電泳ブロック層(6a)(As−5系ガラス)lこ
町って、この部分は電泳がブロックされ、それ以外の実
際に発光する部分近くに集中して電流が流れ効率良く発
光する。
When a potential difference is applied between the p, nli poles (n, (s),
Electrons are injected from the lower cladding layer (n-AlGaAs) (2) and holes from the upper cladding layer (p-AIGaAs) (4) are injected into the active layer (3) and recombine to emit light. At this time, electrophoresis is blocked in this part of the electrophoresis blocking layer (6a) (As-5 glass), and current flows concentrated near the other parts that actually emit light, emitting light efficiently.

次に製造工程を説明する。従来例では第2図でチッ化膜
を部分的に形成し、そ口を第3図でエツチング後、 n
−GaAsブロック層をエピタキシャルに成長させた。
Next, the manufacturing process will be explained. In the conventional example, a nitride film is partially formed as shown in FIG. 2, and after the edge is etched as shown in FIG.
- A GaAs block layer was grown epitaxially.

その後、電極を形成し、レーザとした。After that, electrodes were formed to create a laser.

本発明では、エツチング後、As−3系ガラスメルトに
浸漬するだけで、ブロック層を形成し、余部についたブ
ロック層はアルカリ水溶液で選択エッチして除去し、そ
の後電極を形成しレーザとする。
In the present invention, after etching, a block layer is formed by simply immersing it in an As-3 glass melt, and the remaining block layer is removed by selective etching with an alkaline aqueous solution, after which electrodes are formed and used as a laser.

〔発明の効果〕〔Effect of the invention〕

このようにブロック層を従来のn−GaAsエピタキシ
ャル層からAs−5ガラスに変えたので、ブロック層形
成が容易になった。
Since the block layer was changed from the conventional n-GaAs epitaxial layer to As-5 glass in this way, the formation of the block layer became easier.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第6図は本発明実施例の製造方法を示したもの
で工程断面図、第7図〜第12図は従来の製造方法を示
した工程断面図である。 (11it基板(n−GaAs) 、 (2)12下ク
ラッド層(n−AIGaAs)、(3)ハ活性層(n−
GaAs) 、(4)+!上ツクラッド層p−AIGa
As) 、(5月ハコンタクト層(p−GaAs)、(
6J−(a) i、tブロック層(As−5系ガラス)
、(7)はp!極、(8)はn電極である。 なお、各図中、同−符i+は同一、又は相当部分である
1 to 6 are process sectional views showing a manufacturing method according to an embodiment of the present invention, and FIGS. 7 to 12 are process sectional views showing a conventional manufacturing method. (11it substrate (n-GaAs), (2) 12 lower cladding layer (n-AIGaAs), (3) C active layer (n-
GaAs), (4)+! Upper cladding layer p-AIGa
As), (May contact layer (p-GaAs), (
6J-(a) i, t block layer (As-5 glass)
, (7) is p! The pole (8) is an n-electrode. In addition, in each figure, the same symbol i+ indicates the same or equivalent part.

Claims (1)

【特許請求の範囲】[Claims]  電流を特定する部分に集中させるためのブロック層と
して、低融点(600℃以下)、高抵抗(10^8Ω・
cm以上)のガラスを用いたことを特徴とする半導体レ
ーザ装置の製造方法。
As a block layer to concentrate the current to a specific part, we use a low melting point (below 600℃), high resistance (10^8Ω・
1. A method for manufacturing a semiconductor laser device, characterized in that a glass having a diameter of 1 cm or more is used.
JP32420090A 1990-11-26 1990-11-26 Manufacture of semiconductor laser device Pending JPH04192484A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32420090A JPH04192484A (en) 1990-11-26 1990-11-26 Manufacture of semiconductor laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32420090A JPH04192484A (en) 1990-11-26 1990-11-26 Manufacture of semiconductor laser device

Publications (1)

Publication Number Publication Date
JPH04192484A true JPH04192484A (en) 1992-07-10

Family

ID=18163181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32420090A Pending JPH04192484A (en) 1990-11-26 1990-11-26 Manufacture of semiconductor laser device

Country Status (1)

Country Link
JP (1) JPH04192484A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1170839A2 (en) * 2000-07-07 2002-01-09 Lucent Technologies Inc. Mesa geometry semiconductor light emitter having chalcogenide dielectric coating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1170839A2 (en) * 2000-07-07 2002-01-09 Lucent Technologies Inc. Mesa geometry semiconductor light emitter having chalcogenide dielectric coating
JP2002076516A (en) * 2000-07-07 2002-03-15 Lucent Technol Inc Mesa structure semiconductor light emitter having chalcogenide dielectric coating
EP1170839A3 (en) * 2000-07-07 2002-04-03 Lucent Technologies Inc. Mesa geometry semiconductor light emitter having chalcogenide dielectric coating
US6463088B1 (en) 2000-07-07 2002-10-08 Lucent Technologies Inc. Mesa geometry semiconductor light emitter having chalcogenide dielectric coating

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