JPH04187428A - Decorative panel and manufacture thereof - Google Patents

Abstract

PURPOSE:To accurately reproduce the vessel pattern of wood on a grain pattern by constituting a decorative panel of a plate material having a large number of micropores, the adhesive layer formed on the surface of the plate material, a transfer ink layer of a grain pattern and the transparent resin layer applied over the transfer ink layer and the micropores. CONSTITUTION:A vinyl chloride resin film 8 having a printed ink layer 9 of a grain pattern is prepared and the ink layer 9 of the film 8 is placed on a laminate consisting of a plate material 1 and a base material 3 so as to be brought into close contact with the second adhesive layer 6 to be bonded thereto under pressure. When the vinyl chloride resin film 8 is peeled off, the ink layer 9 of the vinyl chloride resin film 8 is transferred to the plate material 1 by the adhesive force of the second adhesive layer 6 to obtain such a state that the printed ink layer 9 of the grain pattern is formed to the region excepting the parts of micropores 2, 2.... Finally, for example, a transparent resin such as polyester is sprayed to the laminated material having the printed ink layer 9 formed thereto from above by a sprayer F3 and solidified. By this method, a natural grain pattern can be faithfully reproduced.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a decorative board on which a wood grain pattern is applied using transfer ink and a method for manufacturing the same, and particularly to measures for improving the wood grain pattern.

(Prior Art) Conventionally, as disclosed in Japanese Patent Publication No. 61-29269, a coating film of transparent resin has been formed on the surface of a wooden substrate having an uneven shape that simulates the uneven shape of a conduit portion of wood grain, etc. ,
Next, after applying adhesive to the surface to form an adhesive layer, a thin thermoplastic resin film with a wood grain print is pressed with a heated roll, and hot air is used to apply the thermoplastic resin film to the uneven parts of the wooden substrate. A method for manufacturing a laminate decorative board that attempts to reproduce the uneven shape of conduit portions of wood in a wood grain pattern by fusing together is a known technique.

(Problem to be Solved by the Invention) However, in the above conventional method, a transparent resin coating film is first formed on the surface of a wooden substrate, and a film with wood grain printing is fused thereon. The structure is such that a transparent resin coating film of a predetermined thickness is interposed between the conduit and the concave and convex portions of the conduit.

Therefore, even if an attempt was made to faithfully reproduce the fine irregularities of the conduit, the outline of the end face of the conduit would become unclear, making it difficult to reproduce.

The present invention has been made in view of the above, and an object of the present invention is to create a wood conduit pattern with a wood grain pattern by providing a means for applying a wood grain pattern close to a substrate having fine holes such as a conduit. The objective is to accurately reproduce the above.

(Means for Solving the Problem) The means taken by the invention of claim (1) to achieve the above object is such that the decorative board is made of a board material having a large number of micropores and a material formed on the surface of the board material. an adhesive layer, a transfer ink layer with a wood grain pattern formed on the surface of the board on which the adhesive layer is formed, excluding the micropores, and a transparent resin covering the transfer ink layer and each micropore. It is composed of layers.

The means taken by the invention of claim (2) is that the method for manufacturing a decorative board is applied by applying a heat-pressure sensitive adhesive to the surface of a board material having a large number of micropores to form an adhesive layer, and ink with a wood grain pattern. After the ink layer is pressed onto the board while the film is in contact with the adhesive layer, the film is removed and the ink layer with the wood grain pattern is applied to the surface of the board except for each micropore. is transferred, and then a transparent resin is applied to the transfer ink layer.

(Function) According to the above configuration, in the invention of claim (1), an ink layer with a wood grain pattern is formed by transfer on the surface of a board material having a large number of micropores via a thin adhesive layer, and then Since it is coated with a transparent resin layer, micropores corresponding to the conduit pattern of wood clearly appear in the wood grain pattern of the ink layer.
The minute irregularities are faithfully reproduced. Furthermore, the transparent resin coating reinforces the pattern so that it does not collapse. Therefore, the wood grain pattern of the ink layer has a natural appearance, and the commercial value of the decorative board increases.

In the invention of claim (2), since the ink layer with the wood grain pattern is transferred from the top of the plate material by pressure bonding, the adhesive layer of the heat-sensitive adhesive is pressed into the micropores in the micropores of the plate material by pressure bonding. be done. Therefore, even if adhesive bridging occurs in the micropores due to the viscosity of the adhesive, the air pressure caused by the pressure bonding will cause the micropores to open or the adhesive to drip into the micropores. This ensures that the ink layer is transferred only to areas excluding the micropores, improving the reproducibility of the micropores in the wood grain pattern.

(Example) Hereinafter, an example of the present invention will be described based on the drawings.

1 to 12 sequentially show the manufacturing process of a decorative board according to an embodiment of the present invention.

First, a large number of fine holes 2, 2.・
... (see Figures 1 and 2). This large number of micropores 2, 2. ... has a conduit pattern unique to wood.

Next, an adhesive such as epoxy is sprayed onto the base material 3 made of a steel plate, an aluminum plate, a plywood plywood, etc. using a sprayer F1 (see FIG. 3). Then, the above-mentioned plate material 1 is placed on this base material 3, and a release paper 4 made of polypropylene, for example, is placed on the plate material 1, and with these three members stacked on top of each other, the temperature and pressure are 15Kg/
(See Figure 4)
After the heat pressing is completed, the release paper 4 is peeled off from the plate material 1 (see FIG. 5).

In addition, instead of the steps from FIG. 3 to FIG. 5 above, step 12
As shown in the figure, the hot melt film 7 may be sandwiched between the base material 3 and the plate material 1, and the hot press may be performed with the release paper 4 placed on the plate material 1.

Next, a second adhesive (for example, a heat-pressure sensitive adhesive such as a polyester resin or a urethane resin adhesive) is uniformly sprayed using the sprayer F2 onto the laminated material plate produced by the above process. (see Figure 6), infrared lamps L, L
When the adhesive solvent is blown off by heating to a temperature of about 60 to 80°C (see Fig. 7), the cross-sectional shape in this state will be the one between the base material 3 and the plate material 1, as shown in Fig. 13. The first adhesive layer 5 is interposed on the plate material 1, and the thickness is 10 to 50 μm.
It has a structure in which a second adhesive layer 6 of approximately
This second adhesive layer 6 has micropores 2, 2 . In the portions marked with .

Then, as shown in FIG. 8, a vinyl chloride resin film 8 having a printing ink layer 9 with a wood grain pattern is prepared, and the plate material 1 formed in the above steps is prepared. On top of the laminate consisting of the base material 3 etc.
The ink layer 9 of this film 8 is placed on the second adhesive layer 6 in close contact with the film 8, and so-called compressed air lamination is performed, in which the ink layer 9 of the film 8 is placed in close contact with the second adhesive layer 6 under pressure conditions of, for example, 3 to 5 kg/c. At this time, the cross-sectional state when the transfer film 8 is stacked on the laminate is as follows:
As shown in FIG. 14, the second adhesive layer 6 that was bridging at the openings of some of the micropores 2 is pressed downward by the air pressure from the compressed air lamination to open the micropores 2.
Or it will be in a state where it hangs downward within the micropore 2.

Then, when the vinyl chloride resin film 8 is peeled off (see Figure 9), the ink layer 9 of the vinyl chloride resin film 8 is removed.
It is transferred to the plate material 1 side by the adhesive force of the adhesive layer 6, and the 15th
As shown in the figure, each micropore 2.2. A printing ink layer 9 with a wood grain pattern is formed in the area excluding the portions marked with .

Finally, a transparent resin such as polyester is sprayed using a sprayer F3 from above the laminated material on which the printing ink layer 9 has been formed (see Fig. 10), and this transparent resin is solidified to create a decorative appearance. A plate K is prepared (see FIG. 11).

At this time, the cross-sectional structure of this decorative board is as shown in FIG. ...
A transparent resin layer 10 is formed inside, and micropores 2.2. ...
The pattern has been strengthened so that it does not collapse.

Therefore, the decorative board formed in the above embodiment has a large number of micropores 2.2. An ink layer 9 with a wood grain pattern is formed by transfer on the surface of the board 1 having a thin second adhesive layer 5, and a transparent resin layer 10 is coated on top of the ink layer 9. Micro holes 2, 2. correspond to the conduit pattern of the wood in the grain pattern of the wood. ...appears clearly,
The minute irregularities are faithfully reproduced. Moreover, by finally covering with a transparent resin, the above-mentioned pattern is reinforced so that it does not collapse. Therefore, the wood grain pattern of the printing ink layer 9 can be given a natural appearance, and the crystal value of the decorative board can be increased.

In addition, as a manufacturing method for this decorative board, if a heat-pressure sensitive adhesive is applied to the surface of the board material 1 and a printing ink layer 9 with a wood grain pattern is transferred thereon by pressure bonding, the surface of the board material is The adhesive layer of the heat-pressure sensitive adhesive is pressed into the micro holes 2, 2, . That is, such micropores 2, 2 . ..., due to the viscosity of the adhesive, micropores 2, 2 . . . . Bridges of adhesive often occur in the areas of micropores 2, 2, .
It is difficult to apply adhesive only to the areas other than... Therefore, even if the ink layer is transferred using the adhesive force of this adhesive, there is a possibility that not all the patterns of micropores 2, 2°, etc. in the wood grain pattern will be reproduced. On the other hand, the bridging of the adhesive can be eliminated by air pressure due to pressure bonding as described above, or the fine holes 2, 2. By hanging the ink layer 9 inside, the ink layer 9 can be reliably transferred only to the portions excluding the minute holes 2, 2°, etc., and the reproducibility of the conduit pattern can be improved.

In the above embodiment, the plate material 1 was backed up with the base material 3, but the decorative board of the present invention is not limited to such an embodiment, and a transfer ink layer 9 is provided on the plate material 1 alone. may be provided.

Further, in the above embodiment, the plate material 1 is made of wood, but the plate material of the present invention is not limited to this embodiment, and for example, a porous resin material or the like may be used as the plate material. good.

(Effects of the Invention) As explained above, according to the invention of claim (1), an adhesive layer is formed on the surface of a board material having a large number of micropores corresponding to wood conduits as a decorative board, An ink layer with a wood grain pattern is formed on the surface of the board except for the micropores, and the area covering the ink layer and each micropore is covered with a transparent resin layer. By having only a thin adhesive layer in between, the outline of the fine pores in the board material can be clearly seen in the wood grain pattern of the ink layer, and the pattern can be reinforced with transparent resin, faithfully replicating the natural wood grain pattern. Can be reproduced.

According to the invention of claim (2), as a method for manufacturing a decorative board, a heat-pressure sensitive adhesive is applied to the surface of a board material having a large number of micropores to form an adhesive layer, and an ink layer with a wood grain pattern is applied. Since the transfer was done by pressure bonding from above this adhesive layer,
Even if there is an adhesive that bridges and closes the micropores, air pressure can push the adhesive downward to ensure that the outline of the micropores in the board is revealed on the ink layer.
It is possible to clarify the contours of micropores.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, and FIGS. 1 to 12 show the manufacturing process of a decorative board, FIGS. 1 and 2 show the drilling process of the board, and FIG. 3 shows the process of forming the first adhesive layer. Coating process, Figure 4 shows the lamination process of the plate material and base material, Figure 5 shows the process of removing release paper from the laminate, Figure 6 shows the process of applying the second adhesive layer, and Figure 7 shows the second adhesive layer. Figure 8 shows the process of evaporating the solvent in the agent layer, the process of pressing the wood grain patterned film onto the plate material, the process of removing the film after pressing, the process of applying the transparent resin material, Figures 10 and 11, and the process of applying the transparent resin material. FIG. 12 is a diagram showing another example of the method of laminating the plate material and the base material, and FIG. 13 is a sectional view taken along the line A-A in FIG. Figure 14 is a sectional view taken along the line B-B in Figure 9 showing the cross-sectional state when the transfer film is laminated on the second adhesive layer,
Figure 5 is a cross-sectional view taken along the line C-C in Figure 9 showing the cross-sectional state when the ink layer is transferred onto the second adhesive layer, and Figure 16 is a cross-section of the final decorative board on which the transparent resin layer has been formed. 1st to indicate status
FIG. 1 is a sectional view taken along line DD in FIG. K Decorative board 1 Board material 3 Base material 6 Second adhesive layer 9 Ink layer 10 Transparent resin layer patent Applicant Nishikawa Kasei Co., Ltd. - Agent Patent attorney 1) Hiroshi (and 1 other person), ]-4, . K Decorative board No. 1 Fig. 1 Board material Fig. 2 Fig. 3 Fig. 12 Fig. 6 Fig. 13 Fig. 14 Fig. 15 Fig. 7

Claims (2)

[Claims] (1) A board material having a large number of micropores, an adhesive layer formed on the surface of the board material, and a wood grain pattern formed on the surface of the board material with the adhesive layer formed thereon, excluding the micropores. A decorative board comprising a transfer ink layer and a transparent resin layer covering the transfer ink layer and each micropore. (2) A heat-pressure sensitive adhesive is applied to the surface of a plate material having many micropores to form an adhesive layer, and an ink layer with a wood grain pattern is attached to the film, and the ink layer is attached to the adhesive layer. After pressing the film into contact with the plate material, removing this film and transferring the ink layer with the wood grain pattern to the areas on the surface of the plate material excluding each micropore, and then applying a transparent resin to the transferred ink layer. A method for manufacturing a decorative board characterized by: