JPH04186858A - Inspection equipment for lead bending of semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To eliminate short comings of conventional inspection equipment using an optical fiber sensor incapable of flexible response of an inspection equipment side to the change of lead bending inspection, by installing an optical fiber sensor means, a bit map forming means, and a bit map referring means which are individually specified. CONSTITUTION:The following are installed; optical fiber sensor means 4, 2 which optically scan the lateral width of an arbitrary reference part position of a semiconductor integrated circuit device 1 having specified positional relations to an outer lead 3 tip part and an outer lead 3, and generate two different rectangular pulses 5, 6 by photoelectric conversion, a bit map forming means which converts the above rectangular pulses 5 and 6 into bit pulses, respectively, and stores them in a storage device, and a bit map referring means which changes the number of bits of a bit map 9 corresponding with the lateral width of the above part position, by the same ratio so as to correspond with the change of bending allowable specification of the outer lead, and refers the bit map 8 corresponding with the tip part width of the outer lead 3 to the bit positional relations. For example, the change of the number of bits of the above bit map is performed from the central position or the end portion of the bit map.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application 1] The present invention relates to a lead bending inspection device for semiconductor integrated circuit devices, and particularly to an inspection device using an optical fiber sensor method.

[Conventional Technique 1] Conventionally, lead bending of semiconductor integrated circuit devices (hereinafter referred to as IC) has been inspected using either an image processing method or an optical fiber sensor method.

The former method, which uses image processing, is literally a visual inspection method using an enlarged image, while the latter method, which uses optical fiber sensors, uses a light emitting and receiving fiber sensor, etc., to first establish a reference for the lead tip and lead shoulder. Optical parts are each optically scanned, and the obtained optical scanning outputs are converted into square pulses, and then converted again into positive and negative pulse trains through logic processing, and the positional relationship between the two is detected using an information processing method. It is an inspection method.

[Invention or solution = Section to be attempted] However, the method using image processing not only requires expensive inspection equipment, but also requires the IC to be inspected to be temporarily in a stationary state when capturing the image. ,There is a problem of low processing capacity, how to use, and when using the optical fiber sensor method, the equipment is cheaper than the image processing method, and a logical data processing method is used, so it is difficult to change the inspection standard. On the other hand, there are problems with inspection equipment, which are not flexible and cannot be easily changed. In addition, there are deficiencies such as difficult maintenance of pulse accuracy, and fortune-telling.

However, this optical fiber sensor method is inexpensive, simple in terms of photographing the ocean, does not require the IC to be stationary like the image processing method, and has excellent detection accuracy. There are quite a few advantages in terms of processing capacity, cost, and foil surface, so I've recently become a fan of Kiko CP! note change f
This is a technology that can fully meet user demands for fg. Furthermore, it is highly desirable from various viewpoints that the optical fiber CELEZER method will be able to quickly overcome the above deficiencies.

The object of the present invention is to provide a semiconductor integrated circuit which solves the problem of the unconventional optical fiber separator method that does not allow the inspection equipment to respond flexibly to changes in bending inspection standards. An object of the present invention is to provide a lead bending inspection device.

[Measures for Solving the Problems] According to the present invention, a method for inspecting lead bending of a semiconductor integrated circuit device includes a method for inspecting lead bending of a semiconductor integrated circuit device, in which the tip of an external lead and the semiconductor integrated circuit device are in a specific positional relationship with the external lead. The width of the arbitrary reference part I is scanned with light and optical-electrical conversion is performed to obtain two different widths.
fiber optic sensor means for generating one rectangular pulse;
1j Put the two square pulses into the bit pulse. 1
The bit mark forming means to be converted and stored in the memory device and the bit Δ of the H-7 h map corresponding to the width of the reference portion are changed to the same ratio in accordance with the change in the external lead bend tolerance standard. The device is configured to include a bit map corresponding to the width of the tip of the external lead and a bit map displaying means for pasting the bit positional relationship. At this time, the number of bits of the bitmap corresponding to the width of the reference part is changed from the center position of the bitmap, or the number of bits of the bitmap corresponding to the width of the reference part is changed from Pi1 to the edge of the map. I can do what I want to do.

[Function] According to the present invention, in response to a change in the lead bending standard, the number of bits in the map to the pin 1 corresponding to the width of the reference part is changed at the same ratio as the change ratio, so that the heart part of the device is changed. Even without making any changes, it is possible to conduct tests in accordance with changes in the world in an isometric manner.

[Example] Next, the present invention will be explained in detail with reference to the drawings.

The first section fal and fbl are a front view and a side view showing a schematic arrangement of a semiconductor integrated circuit device and a fiber sensor in an embodiment of the present invention, and FIG.
FIG. 3 is a processing chart of inspection data showing an embodiment of the present invention. According to this embodiment, the external lead 3
The width of the lead layer and the tip of the lead are each selected within a range that should serve as an inspection standard, and the light emitting/receiving fiber sensors 2 and 4 are respectively arranged. Here, when the semiconductor integrated circuit device (IC) is slid in the direction A, the sensors 2 and 4 generate rectangular pulses 6 and 5, respectively, from the reflection from the surface toward the ray 1. Then, the rectangular pulses 5 and 6 are sampled by the sampling robot 7 (refer to FIG. 2) and stored in the corresponding bitmap memories.

Figure 2 fd+ and tel bitmaps 8 and 9
shows the map states of the square pulses 5 and 6, respectively. Then, it is multiplied to a map 9 of 100% (%) multiplied by -1 - shoulder width (+□1 corresponding to the pitch of the rectangular pulse 6). In other words, the percentage N (%j [, tL [Fig. 2 ffl fully open], and the lead tip width (
The bitmap 8 corresponding to tl) is compared. In other words, within the reference range ft2- expressed as a percentage N (%)
A pass/fail judgment is made based on whether the l-tip width (tl) is completely included. According to conventional inspection devices, the quality of lead bending is determined by a direct comparison method that simply determines whether the lead tip width is within the lead shoulder width defined as a reference range. That is, the pulse width t2 of the square pulse 6
It is determined whether the pulse width t1 of the square pulse 5 is included in the pulse width t1 of the square pulse 5. Therefore, if the judgment criteria are fixed in this way, there will be a significant lack of flexibility in response to changes in inspection standards, and the entire structure of the inspection apparatus will have to be reconsidered.

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For the rectangular pulse 5, it is possible to further expand the standard image by performing E multiplication processing.

[Effects of the Invention] As explained in detail above, according to the present invention 1, the inspection reference range for pass/fail judgment can be made variable, so that lead-1
- Can easily follow changes in standards regarding bending. In addition, since the maintainability of pulse accuracy is easy, it is possible to completely eliminate the problem of inflexibility of bending inspection equipment in response to changes in inspection standards.

[Brief explanation of drawings]

FIG. 1 is a front view and a side view showing a schematic arrangement of a semiconductor integrated circuit device and a humidifier according to an embodiment of the present invention; FIG.
t~) are inspection data processing charts showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Semiconductor integrated circuit device, 2.4...-Emitting/receiving optical fiber sensor, 3...-External line-1, 5--Square pulse corresponding to lead tip width, 6...
・Square pulse corresponding to lead shoulder width, 7...Sampling strobe, 8...Bit map corresponding to lead tip width, 9-
-Bitmap corresponding to the lead shoulder width, 10...Bitmap corresponding to the percentage of the lead shoulder width. Patent applicant Kyushu NEC Co., Ltd.

Claims (3)

[Claims] (1) Optically scan the width of the tip of an external lead and an arbitrary reference portion of the semiconductor integrated circuit device that is in a specific positional relationship with the external lead, and perform optical-to-electrical conversion to generate two different rectangular pulses. an optical fiber sensor means, a bitmap forming means for converting the two rectangular pulses into bit pulses and storing them in a memory device, and determining the number of bits of the bitmap corresponding to the width of the reference portion according to an external lead bend tolerance standard. A lead bending inspection device for a semiconductor integrated circuit device, comprising: a bitmap collation unit that changes the ratio to the same ratio in response to a change in the width of the external lead, and collates the bit positional relationship with a bitmap corresponding to the tip width of the external lead. . (2) The lead bending inspection device for a semiconductor integrated circuit device according to claim 1, wherein the number of bits in the bitmap corresponding to the width of the reference portion is changed from the center position of the bitmap. (3) The lead bending inspection device for a semiconductor integrated circuit device according to claim 1, wherein the number of bits of the bitmap corresponding to the width of the reference portion is changed from an end of the bitmap.