JPH04186699A - Cooling device for electronic equipment - Google Patents
Cooling device for electronic equipmentInfo
- Publication number
- JPH04186699A JPH04186699A JP31190290A JP31190290A JPH04186699A JP H04186699 A JPH04186699 A JP H04186699A JP 31190290 A JP31190290 A JP 31190290A JP 31190290 A JP31190290 A JP 31190290A JP H04186699 A JPH04186699 A JP H04186699A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- power
- fan
- electronic equipment
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 16
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000020169 heat generation Effects 0.000 abstract 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明は、電子機器キャビネット内に設置された各種プ
リント基板上に取付けた半導体素子等の発熱部品の放熱
に係わり、特に大型の冷却ファンを用いることなく、発
熱部品近傍に小型ファンを設けて有効に冷却を行う電子
機器の冷却装置に関する。Detailed Description of the Invention (a) Industrial Application Field The present invention relates to heat dissipation from heat-generating components such as semiconductor elements mounted on various printed circuit boards installed in electronic equipment cabinets, and particularly relates to the use of large cooling fans. The present invention relates to a cooling device for electronic equipment that effectively cools electronic equipment by providing a small fan near heat-generating components without using a heat-generating component.
（ロ）従来の技術
一般に電子機器のキャビネットにおいては、その内部に
多数の発熱部品、例えはパワートランジスタ、種々のＬ
ＳＩを備えており、これらから発生する熱を放散させる
構成が採用されている。そこで−例として特開平２−４
０００号公報があげられる。(b) Conventional technology In general, electronic equipment cabinets contain many heat-generating parts, such as power transistors and various L
It is equipped with an SI, and a configuration is adopted to dissipate the heat generated from these. Therefore, for example, JP-A-2-4
Publication No. 000 is mentioned.
（ハ）発明が解決しようとする課題
前述の従来例では、冷却ファンによる空気の通路を形成
するガイドを設けたもので、１個の冷却ファンでかなり
大量の流量を供給する方式であり、特にＯＡ機器にとっ
ては、室内の騒音となるケースが多い。即ちかなり大き
い冷却ファンにより、発熱部品に対して空気を送るため
に、その回転音だけでなく、風切り音が問題となり、静
かさを求められるときに、上記構成ではどうしても騒音
が大きく、又設置された場所をとる所謂空間利用率が低
い欠点があった。(c) Problems to be Solved by the Invention In the conventional example described above, a guide is provided to form an air passage by a cooling fan, and a considerably large amount of flow is supplied by one cooling fan. For OA equipment, this often causes indoor noise. In other words, since a fairly large cooling fan is used to send air to the heat-generating components, not only the rotation noise but also wind noise becomes a problem, and when quietness is required, the above configuration inevitably produces a lot of noise and is difficult to install. However, it has the drawback of low space utilization.
そこで本発明は、上記欠点を除去した新規な電子機器の
冷却装置を提供するものである。Therefore, the present invention provides a novel cooling device for electronic equipment that eliminates the above-mentioned drawbacks.
＜二）課題を解決するための手段
本発明は、プリント基板に設けたＬＳＩ等の発熱部品に
対して、個々に小容量のスポットファンによって冷風を
供給する構成である。<2) Means for Solving the Problems The present invention is configured to individually supply cold air to heat-generating components such as LSIs provided on a printed circuit board using small-capacity spot fans.
（ホ）作用
本発明の電子機器用キャビネッ！・の冷却装置では、プ
リント基板上の半導体素子等発熱素子の個々にＪ＼容量
のスポットファンにて冷却する構成であり、個々のモー
タの回転音は）ＪＸさく、更に風切り音も小さいので、
ＯＡ＠器における騒音対策が行える。(E) Effect Cabinet for electronic equipment of the present invention!・In the cooling system, each heating element such as a semiconductor element on a printed circuit board is cooled by a spot fan with a capacity of J\\, and the rotation noise of the individual motor is low, and the wind noise is also small.
Noise countermeasures can be taken for OA @ equipment.
くべ）実施例
図面に従って本発明を説明すると、第１図は本発明の電
子機器の冷却装置の要部斜視図、第２図は要部拡大斜視
図を示し、図面において、（１〉は電子機器キャビネッ
ト、（２）はプリン１〜基板、（３）はパワートランジ
スタ、（４）はＬＳＩ等のＩＣ１（５）はインダクタン
ス素子、（６）はスポットファンを示す。次に本発明の
構成について説明すると、電子機器キャビネット（１）
内に種々のプリント基板（２）（２）・・・を設ける。Example) The present invention will be explained according to the drawings. Fig. 1 shows a perspective view of the main parts of the cooling device for electronic equipment of the invention, and Fig. 2 shows an enlarged perspective view of the main parts. Equipment cabinet, (2) shows the printer 1 to the board, (3) shows the power transistor, (4) shows the IC such as LSI, (5) shows the inductance element, and (6) shows the spot fan.Next, regarding the configuration of the present invention To explain, electronic equipment cabinet (1)
Various printed circuit boards (2) (2)... are provided inside.
この場合各プリント基板には、メモリ素子ヲ含む各種半
導体素子、例えは電源回路用のパワートランジスタ（３
）、ＩＣ（４）、インダクタンス素子（５）等か取付け
られる。その取付方法としては、自動挿入機又は表面実
装用のマウンタ機等を用いる。In this case, each printed circuit board is equipped with various semiconductor elements including memory elements, such as power transistors (3
), IC (4), inductance element (5), etc. can be attached. As for the mounting method, an automatic insertion machine or a mounter machine for surface mounting is used.
プリント基板（２）に取付けられた各種電子部品の中で
、発熱か犬なるパワートランジスタ〈３）、ＩＣ（４＞
近傍には、冷却用のスポットファン（６）を設置しであ
る。Among the various electronic components installed on the printed circuit board (2), there are power transistors (3) and ICs (4) that generate heat.
A spot fan (6) for cooling is installed nearby.
上記スポットファン（６）は各素子が高温になろうとし
たとき即ち個々に温度センサを用い二所定温度以上に達
したときに作動するようにしておけ門ヱ
は、節電か可能になると共に騒召−奔ネが更に行える。The above-mentioned spot fan (6) can be configured to operate when each element reaches a high temperature, that is, when each element reaches a predetermined temperature or higher using an individual temperature sensor, which makes it possible to save power and reduce noise. - You can do more tongne.
上記スポットファンは、／Ｊ〜型冷却用ファンであり、
発熱部品に個別に設け、前述のようにセンサにて所定温
度に達１．たときに自シ）的に上り己ファンを作動させ
れば、特にバッテリ駆動タイプのＯＡ機器でのバッテリ
消費が抑制できる。The spot fan is a /J~ type cooling fan,
It is installed individually on the heat-generating parts, and as mentioned above, the sensor reaches a predetermined temperature.1. If the upstream fan is activated automatically when the system is in use, battery consumption can be suppressed, especially in battery-powered OA equipment.
（ト）発明の効果
本発明の電子機器用キャビネットの冷却装置によれは、
発熱素子の近傍にスポットファンで冷却する構成であり
、従来のキルビネット内全体を冷却する方式に比べて騒
音は小きくなると共に節電も行え、ポータプル型のＯＡ
機器にとって本発明は極めて効果を発揮できる。(G) Effects of the Invention The cooling device for electronic equipment cabinet of the present invention has the following effects:
It has a configuration in which spot fans are used to cool the heat generating element, which reduces noise and saves power compared to the conventional method that cools the entire inside of the kill net.
The present invention can be extremely effective for equipment.
第１図は本発明の電子機器の冷却装置を示す斜視図、第
２図は同装置の要部拡大斜視図を示す。
（１）・・・電子機器キャビネット、 （２）・・・プ
リント基板、 （３）・・・パワートランジスタ、（４
）・・弓Ｃ１（５）・・・インダクタンス素子、 （６
）・・・スポットファン。FIG. 1 is a perspective view showing a cooling device for electronic equipment according to the present invention, and FIG. 2 is an enlarged perspective view of a main part of the device. (1)...Electronic equipment cabinet, (2)...Printed circuit board, (3)...Power transistor, (4
)... Bow C1 (5)... Inductance element, (6
)...Spot fan.
Claims (1)
ト基板及び冷却用ファンを備えた電子機器用キャビネッ
トにおいて、前記プリント基板上の発熱部品近傍にスポ
ットファンを設け、発熱部品の個々に対する送風により
前記発熱部品からの熱を放散させることを特徴とした電
子機器の冷却装置。(1) In an electronic device cabinet equipped with a printed circuit board to which a heat generating component is attached, the printed circuit board, and a cooling fan, a spot fan is provided near the heat generating component on the printed circuit board, and a spot fan is provided near the heat generating component on the printed circuit board to blow air to each heat generating component. A cooling device for electronic equipment that is characterized by dissipating heat from heat-generating components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31190290A JPH04186699A (en) | 1990-11-16 | 1990-11-16 | Cooling device for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31190290A JPH04186699A (en) | 1990-11-16 | 1990-11-16 | Cooling device for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04186699A true JPH04186699A (en) | 1992-07-03 |
Family
ID=18022791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31190290A Pending JPH04186699A (en) | 1990-11-16 | 1990-11-16 | Cooling device for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04186699A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5636103A (en) * | 1995-06-12 | 1997-06-03 | Bushner; Edward M. | Portable air cooling apparatus for electronic components |
-
1990
- 1990-11-16 JP JP31190290A patent/JPH04186699A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5636103A (en) * | 1995-06-12 | 1997-06-03 | Bushner; Edward M. | Portable air cooling apparatus for electronic components |
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