JPH0418474U - - Google Patents
Info
- Publication number
- JPH0418474U JPH0418474U JP5724290U JP5724290U JPH0418474U JP H0418474 U JPH0418474 U JP H0418474U JP 5724290 U JP5724290 U JP 5724290U JP 5724290 U JP5724290 U JP 5724290U JP H0418474 U JPH0418474 U JP H0418474U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- land portions
- substrate
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5724290U JPH0418474U (zh) | 1990-06-01 | 1990-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5724290U JPH0418474U (zh) | 1990-06-01 | 1990-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0418474U true JPH0418474U (zh) | 1992-02-17 |
Family
ID=31581779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5724290U Pending JPH0418474U (zh) | 1990-06-01 | 1990-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0418474U (zh) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032622A (ja) * | 2004-07-15 | 2006-02-02 | Mitsubishi Electric Corp | リードレスパッケージの実装構造 |
| JP2008060182A (ja) * | 2006-08-30 | 2008-03-13 | Hitachi Ltd | 車載用電子回路装置 |
| JP2011142130A (ja) * | 2010-01-05 | 2011-07-21 | Murata Mfg Co Ltd | 実装基板への電子部品の実装構造、実装基板、および電子部品が実装された実装基板 |
| JP2012004590A (ja) * | 2011-08-31 | 2012-01-05 | Hitachi Automotive Systems Ltd | 車載用電子回路装置の製造方法または電子回路装置 |
| JP2013021486A (ja) * | 2011-07-11 | 2013-01-31 | Nippon Dempa Kogyo Co Ltd | 発振器及びその製造方法 |
-
1990
- 1990-06-01 JP JP5724290U patent/JPH0418474U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032622A (ja) * | 2004-07-15 | 2006-02-02 | Mitsubishi Electric Corp | リードレスパッケージの実装構造 |
| JP2008060182A (ja) * | 2006-08-30 | 2008-03-13 | Hitachi Ltd | 車載用電子回路装置 |
| JP2011142130A (ja) * | 2010-01-05 | 2011-07-21 | Murata Mfg Co Ltd | 実装基板への電子部品の実装構造、実装基板、および電子部品が実装された実装基板 |
| JP2013021486A (ja) * | 2011-07-11 | 2013-01-31 | Nippon Dempa Kogyo Co Ltd | 発振器及びその製造方法 |
| JP2012004590A (ja) * | 2011-08-31 | 2012-01-05 | Hitachi Automotive Systems Ltd | 車載用電子回路装置の製造方法または電子回路装置 |