JPH0418441U - - Google Patents
Info
- Publication number
- JPH0418441U JPH0418441U JP1990057257U JP5725790U JPH0418441U JP H0418441 U JPH0418441 U JP H0418441U JP 1990057257 U JP1990057257 U JP 1990057257U JP 5725790 U JP5725790 U JP 5725790U JP H0418441 U JPH0418441 U JP H0418441U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor device
- bump electrode
- wiring
- uneven
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W72/29—
-
- H10W72/934—
-
- H10W72/983—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990057257U JPH0418441U (enExample) | 1990-06-01 | 1990-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990057257U JPH0418441U (enExample) | 1990-06-01 | 1990-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0418441U true JPH0418441U (enExample) | 1992-02-17 |
Family
ID=31581805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990057257U Pending JPH0418441U (enExample) | 1990-06-01 | 1990-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0418441U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006114827A (ja) * | 2004-10-18 | 2006-04-27 | Denso Corp | 半導体装置 |
-
1990
- 1990-06-01 JP JP1990057257U patent/JPH0418441U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006114827A (ja) * | 2004-10-18 | 2006-04-27 | Denso Corp | 半導体装置 |