JPH0418438U - - Google Patents

Info

Publication number
JPH0418438U
JPH0418438U JP1990059735U JP5973590U JPH0418438U JP H0418438 U JPH0418438 U JP H0418438U JP 1990059735 U JP1990059735 U JP 1990059735U JP 5973590 U JP5973590 U JP 5973590U JP H0418438 U JPH0418438 U JP H0418438U
Authority
JP
Japan
Prior art keywords
bonding
pattern
wire
bare chip
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990059735U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990059735U priority Critical patent/JPH0418438U/ja
Publication of JPH0418438U publication Critical patent/JPH0418438U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H01L2224/48096—Kinked the kinked part being in proximity to the bonding area on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａ〜ｅは本考案のウエツジボンド用パタ
ーンの実施例の正面図、第２図は第１図ａのウエ
ツジボンド用パターンとベアチツプの電極とのワ
イヤーボンデイングした状態を示す説明図、第３
図はベアチツプの位置がずれた場合におけるベア
チツプの電極と第１図ａのウエツジボンド用パタ
ーンとのワイヤーボンデイングを示す説明図、第
４図はベアチツプの電極パツドの位置がずれた場
合におけるベアチツプの電極と第１図ａのウエツ
ジボンド用パターンとのワイヤーボンデイングを
示す説明図、第５図は本考案のウエツジボンド用
パターンの先端とボンデイングワイヤーが垂直に
交わる状態を示す説明図、第６図は従来のウエツ
ジボンド用パターンとベアチツプの電極とのワイ
ヤーボンデイングを示す説明図、第７図は他の従
来のウエツジボンド用パターンとベアチツプ電極
とのワイヤーボンデイングを示す説明図、第８図
ａ〜ｃは通常のワイヤーボンデイングの方法を示
す説明図、第９図はベアチツプの電極パツドの位
置がずれた場合における従来のワイヤーボンデイ
ングを示す説明図、第１０図ａ〜ｃは第９図にお
けるワイヤーボンデイングされる状態を示す説明
図である。 １……ボンデイングパターン、２……配線、３
……ベアチツプ、４……ボンデイングワイヤー、
５……ベアチツプ電極パツド、６……ダイボンド
用ベタパターン、７……ベアチツプ、８……ダイ
ボンド用ベタパターン、９……ベアチツプ電極パ
ツド、１０……ボンデイングワイヤー、１１……
ボンデイングパターン、１２……配線、１３……
ボンデイングパターン端面、１４……ボンデイン
グパターン、１５……ボンデイングパターン端面
、１６……キヤピラリー、１７……ボンデイング
ワイヤー底部、１８……ボンデイングパターン側
面。

Claims (1)

    【実用新案登録請求の範囲】
  1. ワーヤーボンデイングによりベアチツプの各電
    極と接続されている基板上の配線パターンにおい
    て、該配線パターンのウエツジボンド用パターン
    の少なくとも先端がボンデイングワイヤーに対し
    て曲率を有することを特徴とするウエツジボンド
    用パターン。
JP1990059735U 1990-06-06 1990-06-06 Pending JPH0418438U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990059735U JPH0418438U (ja) 1990-06-06 1990-06-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990059735U JPH0418438U (ja) 1990-06-06 1990-06-06

Publications (1)

Publication Number Publication Date
JPH0418438U true JPH0418438U (ja) 1992-02-17

Family

ID=31586495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990059735U Pending JPH0418438U (ja) 1990-06-06 1990-06-06

Country Status (1)

Country Link
JP (1) JPH0418438U (ja)

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