JPH04184094A - Flat circular heat pipe - Google Patents

Abstract

PURPOSE:To prevent a heat transfer loss between a heat pipe and fins in view of its heat transfer by a method wherein the heat pipe is comprised of a predetermined rectangular-shaped bottom part (an evaporating part) and a predetermined upper surface lid (a condensing part). CONSTITUTION:A flat circular heat pipe is a rectangular in its shape and has a circular bottom. A side surface 3 of an inner surface is formed with a V-shaped part at the evaporating part of the heat pipe, and a bottom surface 2 at the inner surface is formed with a spider-like or approximate cross-like fine V-shaped groove formation. Then, a corner part 4 between the bottom surface and the side surface is provided with a V-shaped deep groove. Then, the upper surface lid 5 of the container is a metallic product acting as a lid part to be fixed to the case 1. The inner surface 6 of the circular metallic plate has vane-like heat absorption plate perpendicular to the lid plate at a part corresponding to the condensing part of the inner side of the heat pipe of the closed pipe. It is machined with the same metal as that of the lid, a vane of the metallic plate for use in increasing a heat absorption area of the condensing part is also provided. Corner portions of the roots of the metallic plate and the lid metal are used as a liquid returning group for the condensing part and they are used as fins 7, thereby a heat radiation capability is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION In the case of cooling a semiconductor element using a heat pipe, the amount of heat generated due to the miniaturization of the semiconductor element is increased due to the rapid progress of advanced technology. However, there is currently no definitive treatment method for cold parts of semiconductor devices. The problem is that the cooling capacity is inferior to the amount of heat generated by the element itself. (1) There is an interlayer on the contact surface between the element itself and the heat pipe. Although heat pipes have heat transport ability, their shape has drawbacks; if the shape is cylindrical, the contact surface with the element is a line, and even if the heat pipe is flat, it is not completely flat but a curved surface. It can be pointed out that complete contact cannot be achieved due to uneven surfaces, etc., resulting in heat transport loss. (2
) Heat dissipation by the heat pipe is measured by attaching fins to the condensing side of the heat pipe to expand the heat dissipation area. There are two ways to attach the fins: press-fitting and adhesive using solvent.
Both methods involve heat transfer loss due to contact. Press-fitting creates a space at the contact surface, which causes heat transfer loss during heat transfer between the heat pipe and the fins. Bonding using a solvent involves heat transfer loss due to the presence of the solvent on the bonding surface.

In order to solve these drawbacks, a corresponding flat and circular heat pipe was invented. First, the contact surface between the semiconductor element and the heat pipe is completely flat, has good adhesion, and can absorb a large amount of heat generated by the element itself. Next, as a heat dissipation treatment, the fins are made of a heat pipe integrated with the heat pipe, and there is no need for press-fitting or gluing the fins, so heat transfer loss can be prevented. In addition, by providing an absorption plate on the condensation side of the inner surface of the sealed heat pipe container, the heat absorption rate inside the sealed tube can be increased, and the thermal efficiency can be increased.

The invented flat-circular heat pipe has a solid, circular bottom part shown in Figure 1, and the inner side surface of the heat pipe, that is, the evaporation part, has a V-shaped groove as shown in Figure 3. , on the bottom surface of the inner surface, as shown in the evaporation section 2 of the heat pipe concerned, a thin ■-shaped glue groove is provided in the shape of a spider web or cross to form a groove on the bottom surface. Next, the bending angle between the bottom and side parts As shown in Figure 4, a deep ■-shaped groove is provided. When using the product as a heat pipe, the heat pipe can be installed at a flat, vertical, or diagonal angle. Even if it is installed, the bottom surface will have a spider web shape or a cross shape 7 in Figure 2 due to the capillary pressure of the V-shaped deep groove in Figure 4.
The hydraulic fluid flows through the introduction groove cut into a shape and spreads over the entire bottom surface.

The above is the function of the bottom of the box conduit and the hydraulic fluid.

Next, Fig. 5 shows the metal work that will be the part of the lid attached to the solid body in Fig. 1, and the inner surface of the circular metal plate shown in Fig. 6, the part corresponding to the condensation part inside the heat pipe sealed tube,
A blade-shaped heat absorbing plate is installed at right angles to the plate shape of the lid, and a blade-shaped metal plate is installed to increase the heat absorption area of the condensation part by processing the same metal as the metal of the lid. The corner of the base of the plate and the metal of the lid is used as the hot liquid groove in the condensing section.

The fins shown in FIG. 7 are designed to absorb heat absorbed in the condensing section by processing the same metal as the lid and using the fins to increase the secondary heat capacity. The box conduit parts in Figure 1 and the lid parts in Figure 5 described above are shown in Figure 8.The lid in Figure 5 is submerged in the position of the lid stopper step, the circumference is welded, the pressure is reduced, and the hydraulic fluid is removed. After injection, it is used as a heat pipe.

Make a piece of metal with good thermal conductivity for the diameter of the corresponding flat/circular heat pipe, which is slightly larger than the size of the semiconductor.1.
Glue the metal piece using silver paste, make a hole from the side of the metal piece to the center point, insert the thermocouple, glue the semiconductor to one side of the flat part of the metal piece, and attach the corresponding heat pipe to the other flat part. After adhering, we measured the heat pipe and obtained the following results. However, the results of the above measurements: (2) Measurement at top heat, (3) Vertical measurement, (4) Measurement at an angle of 45 degrees, the temperature is about -9 degrees. Although there were differences, good measurements were made.

[Brief explanation of drawings]

Figure 1 Exploded view 1@ Box-shaped bottom part of the vessel 2 Groove on the bottom of the container 3Groove on the inner side of the container 4 acute angle grooves inside the container 5 Lid on top of container B Heat absorption plate inside the sealed tube 7 Heat sink attached to sealed tube t1g2 diagram heat pipe assembly diagram Patent agent Satomi Ito o l■ #Jノ]Z

Claims (1)

[Claims] 1. The relevant heat pipe has a box-shaped bottom portion (
This is a flat, circular heat pipe consisting of an evaporation section) and an upper lid section (condensation section) shown in FIG. A V-shaped groove is provided in the entire inner bottom part of the box-shaped bottom part shown in FIG. 1 in a spider web shape or a cross shape shown in FIG. 2, and the groove is used as a groove (evaporation part). A V-shaped groove is also provided on the entire surface of the side surface of the inner surface shown in FIG. 3, and is used as a side groove. Next, deep grooves with acute angles are machined at the corners of the bottom and side surfaces, as shown in Figure 4. 2 Top Lid Part The surface of the single material metal shown in Figure 5 is provided with integrated fins as shown in Figure 7 to increase the heat radiation area, minimize metal heat transfer loss during heat radiation, and maximize heat radiation. You can expect good results. The inner surface of the sealed tube shown in Figure 6, which shows the back side of the lid metal in Figure 5, is also equipped with a metal piece, similar to the fins on the front side, to increase the heat absorption surface of the steam, and to promote liquid return at the corner of the base of the metal piece. It is used as a measuring groove.