JPH0418334U - - Google Patents

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Publication number
JPH0418334U
JPH0418334U JP5907790U JP5907790U JPH0418334U JP H0418334 U JPH0418334 U JP H0418334U JP 5907790 U JP5907790 U JP 5907790U JP 5907790 U JP5907790 U JP 5907790U JP H0418334 U JPH0418334 U JP H0418334U
Authority
JP
Japan
Prior art keywords
diaphragm
resistance value
circuit board
capacitor plate
connecting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5907790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5907790U priority Critical patent/JPH0418334U/ja
Publication of JPH0418334U publication Critical patent/JPH0418334U/ja
Pending legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図、第3図aおよび第3図bはこ
の考案による圧力センサの第1の実施例を示し、
第1図は全体を示す概略断面図、第2図は第1図
に示すものの部分拡大断面図、第3図aは第1図
に示すものの部分拡大図、第3図bは第3図aに
示すものの側面図、第4図、第5図および第6図
はこの考案による圧力センサの第2の実施例を示
し、第4図は全体を示す概略断面図、第5図は第
4図に示すものの部分拡大断面図、第6図は第4
図に示すものの部分拡大図、第7図および第8図
はこの考案による圧力センサの第3の実施例を示
し、第7図は全体を示す概略断面図、第8図は第
7図に示すものの部分拡大断面図、第9図および
第10図はこの考案による圧力センサの第4の実
施例を示し、第9図は部分平面図、第10図は第
9図に示すもののA−A線断面図、第11図はこ
の考案による圧力センサの第5の実施例を示す部
分平面図、第12図は従来の圧力センサを示す概
略断面図である。 1,21……ボデイ、2,22……ダイアフラ
ム、2a……凹所、2b……薄肉部、3,23…
…ダイアフラム素子(歪みゲージ)、4,24…
…回路部材、5,25……回路基板、6,26…
…コンデンサプレート、7,27……貫通コンデ
ンサ、8,28……接続部材、6a,6b,8a
,8b……ばね部、9,29……スリーブ、10
,30……フレキシブルサーキツト、11,31
……コネクタ、12……圧力導入孔、13……空
所、16……付勢部材。
1, 2, 3a and 3b show a first embodiment of the pressure sensor according to this invention,
Fig. 1 is a schematic sectional view showing the whole, Fig. 2 is a partially enlarged sectional view of what is shown in Fig. 1, Fig. 3a is a partially enlarged view of what is shown in Fig. 1, and Fig. 3b is a partially enlarged sectional view of what is shown in Fig. 3a. 4, 5 and 6 show a second embodiment of the pressure sensor according to this invention, FIG. 4 is a schematic sectional view showing the whole, and FIG. 5 is a side view of the pressure sensor shown in FIG. Figure 6 is a partially enlarged sectional view of the one shown in Figure 4.
7 and 8 show a third embodiment of the pressure sensor according to this invention, FIG. 7 is a schematic sectional view showing the whole, and FIG. 8 is shown in FIG. 7. 9 and 10 show a fourth embodiment of the pressure sensor according to this invention, FIG. 9 is a partial plan view, and FIG. 10 is a view taken along line A-A of the thing shown in FIG. 11 is a partial plan view showing a fifth embodiment of the pressure sensor according to this invention, and FIG. 12 is a schematic sectional view showing a conventional pressure sensor. 1, 21... Body, 2, 22... Diaphragm, 2a... Recess, 2b... Thin wall portion, 3, 23...
...Diaphragm element (strain gauge), 4, 24...
...Circuit member, 5, 25...Circuit board, 6, 26...
... Capacitor plate, 7, 27 ... Feedthrough capacitor, 8, 28 ... Connection member, 6a, 6b, 8a
, 8b... Spring part, 9, 29... Sleeve, 10
, 30...Flexible circuit, 11, 31
... Connector, 12 ... Pressure introduction hole, 13 ... Hole, 16 ... Biasing member.

Claims (1)

【実用新案登録請求の範囲】 (1) 筒状をなすボデイ1内に、圧力の作用によ
つて変位するダイアフラム2を設けるとともに、
該ダイアフラム2にダイアフラム2の変位によつ
て抵抗値を変化させるダイアフラム素子3を設け
、さらに、前記ボデイ1内に、前記ダイアフラム
素子3の抵抗値の変化を検出する回路基板5と、
コンデンサプレート6と、前記回路基板5とコン
デンサプレート6とを接続する接続部材8とから
なる回路部材4を設け、該回路部材4はそれを構
成している回路基板5が変位した際、この変位に
追随して前記接続部材8が変位することを特徴と
する圧力センサ。 (2) 前記接続部材8の一部にはばね部8a,8
bが設けられている請求項1記載の圧力センサ。 (3) 筒状をなすボデイ1内に、圧力の作用によ
つて変位するダイアフラム2を設けるとともに、
該ダイアフラム2にダイアフラム2の変位によつ
て抵抗値を変化させるダイアフラム素子3を設け
、さらに、前記ボデイ1内に、該ダイアフラム素
子3の抵抗値の変化を検出する回路基板5と、該
回路基板5に接続部材8によつて接続されるとと
もに、付勢部材16によつて前記ボデイ1に付勢
されるコンデンサプレート6とからなる回路部材
4を設けたことを特徴とする圧力センサ。 (4) 筒状をなすボデイ1内に、圧力の作用によ
つて変位するダイアフラム2を設けるとともに、
該ダイアフラム2にダイアフラム2の変位によつ
て抵抗値を変化させるダイアフラム素子3を設け
、さらに、前記ボデイ1内に、該ダイアフラム素
子3の抵抗値の変化を検出する回路基板5と、該
回路基板5に接続部材8によつて接続されるとと
もに、一部にばね部6a,6bを形成したコンデ
ンサプレート6とからなる回路部材4を設けたこ
とを特徴とする圧力センサ。
[Claims for Utility Model Registration] (1) A diaphragm 2 that is displaceable by the action of pressure is provided in a cylindrical body 1, and
The diaphragm 2 is provided with a diaphragm element 3 that changes the resistance value according to the displacement of the diaphragm 2, and further includes a circuit board 5 in the body 1 that detects a change in the resistance value of the diaphragm element 3.
A circuit member 4 consisting of a capacitor plate 6 and a connecting member 8 connecting the circuit board 5 and the capacitor plate 6 is provided, and when the circuit board 5 constituting the circuit member 4 is displaced, the circuit member 4 is A pressure sensor characterized in that the connecting member 8 is displaced in accordance with . (2) A portion of the connecting member 8 has spring portions 8a, 8.
The pressure sensor according to claim 1, further comprising: b. (3) A diaphragm 2 that is displaced by the action of pressure is provided in the cylindrical body 1, and
The diaphragm 2 is provided with a diaphragm element 3 whose resistance value is changed by displacement of the diaphragm 2, and further a circuit board 5 is provided in the body 1 to detect a change in the resistance value of the diaphragm element 3; 5 through a connecting member 8 and a capacitor plate 6 which is biased against the body 1 by a biasing member 16. (4) A diaphragm 2 that is displaced by the action of pressure is provided in the cylindrical body 1, and
The diaphragm 2 is provided with a diaphragm element 3 whose resistance value is changed by displacement of the diaphragm 2, and further a circuit board 5 is provided in the body 1 to detect a change in the resistance value of the diaphragm element 3; 5. A pressure sensor characterized in that a circuit member 4 is provided, which is connected to a capacitor plate 6 by a connecting member 8 and has a capacitor plate 6 partially formed with spring portions 6a and 6b.
JP5907790U 1990-06-04 1990-06-04 Pending JPH0418334U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5907790U JPH0418334U (en) 1990-06-04 1990-06-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5907790U JPH0418334U (en) 1990-06-04 1990-06-04

Publications (1)

Publication Number Publication Date
JPH0418334U true JPH0418334U (en) 1992-02-17

Family

ID=31585262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5907790U Pending JPH0418334U (en) 1990-06-04 1990-06-04

Country Status (1)

Country Link
JP (1) JPH0418334U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS613020A (en) * 1984-06-18 1986-01-09 Matsushita Electric Ind Co Ltd Fluid pressure sensor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS613020A (en) * 1984-06-18 1986-01-09 Matsushita Electric Ind Co Ltd Fluid pressure sensor

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