JPH04181759A - Cooling apparatus using boiling heat transfer - Google Patents

Abstract

PURPOSE:To completely take out a noncondensable gas and to prevent the cooling ability of a condenser from being lowered by a method wherein a guide passage one end of which is connected to a hole and the other end of which is opened upward is formed inside the condenser. CONSTITUTION:A coolant liquid 4 is boiled by heat at a semiconductor stack 5; it robs the heat of the semiconductor stack 5. The heat is changed to a high-temperature coolant vapor; it is passed through a vapor pipe 6a; it is guided into a condenser 6; it is cooled inside the condenser 6; it is condensed and liquefied; it is changed to a low-temperature coolant liquid; it is passed through a liquid pipe 6b; it is returned again to a container 3. When this operation is repeated sequentially, the semiconductor stack 5 is cooled well. Although the height of an outside box 1 is low and the mounting position of a pipe 7 is moved to the lower part, a noncondensable gas can be taken out easily to the outside form the side of the pipe 7 even when the gas stays at the upper part of the condenser 6 because the other end side of a guide passage 13 is opened at the upper part of the condenser 6. Thereby, it is possible to completely take out the non-condensable gas and to prevent the cooling ability of the condenser form being lowered.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a boiling cooling device for cooling a semiconductor incorporated in, for example, a control device mounted on an electric vehicle, and in particular to a condensing device that constitutes a main part of the boiling cooling device. It concerns the improvement of utensils.

[Conventional technology]

FIG. 7 is a sectional view showing a conventional evaporative cooling device of this kind disclosed in, for example, Japanese Patent Application Laid-Open No. 63-128737. In the figure, (1) has an open chamber <la) and a closed chamber (1
b) an outer box that forms an outer shell and partitions the (2)
L31 is a waterproof gasket that provides watertightness between the open chamber (la) and the closed chamber (lb), and L31 is a container provided at the bottom of the open chamber (1a) in which refrigerant liquid (2) is stored. ((
5) is a semiconductor stack immersed in a refrigerant liquid (2), (
6) is a condenser provided in the upper part of the container (3) and communicates with the inside of the container (31) via a steam pipe (6a) and a liquid pipe (6b), and (7) is formed on the side wall of this condenser 16. As shown in Figure 8, open the valve (10) provided on the vibrator (9) before it is cut to create a vacuum. After evacuating the inside of the container (3) and condenser (6) to a vacuum using a pump (not shown), the refrigerant is filled, the valve (10) is closed, and the vibrator (9) is closed.
) is crushed and cut, and the cut portion is sealed by, for example, welding. (11) is a gate drive unit for gate driving connected to the semiconductor stack ((5) by connection m (+2+).

In the conventional evaporative cooling device configured as described above, first, when the semiconductor stack (51) is driven, heat is generated.

This heat causes the refrigerant liquid (a) to boil and the semiconductor stack (
5) and turns into high-temperature refrigerant vapor, which flows through the steam pipe (6a
) into the condenser (6), where it is cooled and condensed into liquid, becoming a low-temperature refrigerant liquid and flowing into the liquid pipe (6b).
) and return to the container (3).

In this way, the boiling cooling device cools the semiconductor stack (6) as the object to be cooled by utilizing the phase change of the cold 11, so the refrigerant liquid is inside the container (3) and the condenser (6). It needs to be filled with phase or gas phase, and if non-condensable gas such as air is mixed in, the desired cooling performance cannot be obtained.

For this reason, although the interior is evacuated before the refrigerant liquid (4) is injected, it is also necessary to remove non-condensable gases mixed in with the refrigerant itself. As a method of removing this semiconductor stack (
5) to make the pressure of the refrigerant (2) in the container (3) above atmospheric pressure, and by opening the vibro, the non-condensable gas is taken out together with the refrigerant vapor.

On the other hand, when using fluorocarbons, fluorocarbons, etc. as the refrigerant liquid (2), since the specific gravity is larger than that of air, the air is forced upward and accumulates at the top of the condenser (6). In order to remove non-condensable gas, it is necessary to place the vibrator (7) as high as possible in the upper part of the condenser (6).6 [Problems to be Solved by the Invention] Conventional boiling cooling device Since the is configured as described above, the open chamber (1a) and the closed chamber (lb) can be sealed, for example, when the height of the entire device must be lowered to be installed under the floor of an electric car. Waterproof packing for stopping (2)
installation must be moved downwards, resulting in
Since the vibrator α) could not be attached to the top of the condenser (6), the non-condensable gas P could not be completely taken out, leading to problems such as a decrease in the cooling capacity of the condenser (6). .

This invention was made to solve the above-mentioned problems, and provides a boiling cooling device that can completely remove non-condensable gas and prevent the cooling capacity of the condenser from decreasing. The purpose is to

[Means to solve the problem]

The evaporative cooling device according to the present invention includes a guide path in a condenser that communicates with a hole for injecting refrigerant and removing non-condensable gas at one end and opens upward at the other end.

C Effect] The guide path of the evaporative cooling device in this invention introduces the non-condensable gas staying in the upper part of the condenser from the other end, and leads it out of the condenser through the vibrator from the one end.

[Embodiments of the invention]

An embodiment of the present invention will be described below.

FIG. 1 is a cross-sectional view showing the configuration of an evaporative cooling device according to an embodiment of the present invention, FIG. 2 is a diagram showing the manufacturing process of the vibrator part of the evaporative cooling device in FIG. In Figure 0, which is a detailed enlarged view of the vibrator part of the boiling cooling device, there are an outer box (1), an open chamber (1a), and a closed chamber (1b).
), waterproof packing (2), container (3), refrigerant liquid (4),
Semiconductor stack (5), condenser (6), steam pipe (6a)
, liquid tube (6b), vibrator (7), hole (81, vibrator (9)
), valve (10), gate drive unit (II)
Since the connecting wires (12) are the same as those of the conventional device shown in FIG. 7, their explanation will be omitted. (+3) is the condenser (6
) and the guide plate (13a), the negative end communicates with the hole (8) and the other end opens to the top of the condenser (6).

In the boiling cooling device according to an embodiment of the present invention configured as described above, the refrigerant liquid (2) is boiled by the heat of the semiconductor stack ((6), and the semiconductor stack It absorbs the heat of F51, becomes high-temperature refrigerant vapor, is guided into the condenser (6) through the steam pipe (6a), is cooled in the condenser (6), condenses, and liquefies, and becomes a low-temperature refrigerant liquid. The liquid then passes through the liquid pipe (6b) and returns to the container (3).Then, by sequentially repeating this operation, the semiconductor stack is cooled well.

Also, as shown in Figure 1, the height of the outer box (1) is lowered,
Even though the vibrator (7) is installed downward, it opens at the other end of the guide path (13) or at the top of the condenser (6). Even if non-condensable gas accumulates in the guide path (13) in the above embodiment, it can be easily taken out from the side of the vibrator C: 7) and there is no deterioration in cooling performance. As shown in Figure 3, is formed by the guide plate (13a) and the side of the condenser (6), but as shown in Figure 4, the pipe (7) is connected to the inside of the condenser (6). The same effect can be obtained by extending the tube and bending it upward at a right angle so that the tip is located at the upper part of the condenser.

Furthermore, although the immersion type boiling cooling device was explained in the above embodiment, as shown in FIGS. 5 and 6, an evaporator (15) is stacked between each semiconductor element (14) to form a semiconductor stack This evaporator (15) and condenser (
It goes without saying that the same effect can be achieved even when applied to a non-immersion type boiling cooling device having a configuration in which a connecting pipe (16) is connected between the above and 6).

〔Effect of the invention〕

As described above, according to the present invention, a guide path is formed in the condenser, one end of which communicates with the hole for refrigerant injection and non-condensable gas removal, and the other end of which opens upward. It is possible to provide a boiling cooling device that can completely take out the non-condensable gas that remains in the boiling water and prevent the cooling capacity of the condenser from decreasing.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the configuration of a boiling cooling device according to an embodiment of the present invention, FIG. 2 is a diagram showing the manufacturing process of the pipe section of the boiling cooling device in FIG. 1, and FIG. FIG. 4 is a detailed enlarged view of the pipe section of the evaporative cooling device, FIG. 4 is a sectional view showing a modification of the pipe section in FIG. 3, and FIG. 5 is a sectional view showing the configuration of the evaporative cooling device in another embodiment of the invention. 6 is a front view taken along the line VI-Vl in FIG. 5, FIG. 7 is a sectional view showing the configuration of a conventional boiling cooling device, and FIG. 8 is a front view of the boiling cooling device in FIG. 7. It is a figure which shows the manufacturing process of a pipe part. In the figure, (6) is a condenser, the cylindrical hole is a hole, and (13) is a guide path. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Patent Attorney Masuo Oiwa Figure 7 Figure 8

Claims (1)

[Scope of Claims] A condenser having holes in the side wall for injecting refrigerant and venting non-condensable gas, and introducing high-temperature refrigerant vapor into the interior, condensing it and liquefying it, and discharging it to the outside as a low-temperature refrigerant liquid. An evaporative cooling device characterized in that a guide path is formed in the condenser, one end communicating with the hole and the other end opening upward.