JPH04179139A - Reliability life testing device - Google Patents
Reliability life testing deviceInfo
- Publication number
- JPH04179139A JPH04179139A JP30426390A JP30426390A JPH04179139A JP H04179139 A JPH04179139 A JP H04179139A JP 30426390 A JP30426390 A JP 30426390A JP 30426390 A JP30426390 A JP 30426390A JP H04179139 A JPH04179139 A JP H04179139A
- Authority
- JP
- Japan
- Prior art keywords
- door
- samples
- chamber
- sample
- constant temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 44
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 238000005192 partition Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000013102 re-test Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置の信頼性特命試験装置に関し、特
に装置における恒温槽の試料用電気入力供給ソケット部
構造と試験終了試料の冷却室構造に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a special reliability testing device for semiconductor devices, and in particular to a structure of an electrical input supply socket for a sample in a thermostatic chamber in the device and a cooling chamber structure for a sample after testing. Regarding.
第3図は従来の一例を示す信頼性寿命試験装置における
恒温槽部の断面図である6従来、この種の信頼性寿命試
験装置は、例えば、第3図に示すように、試料らを収納
する恒温槽1と、この恒温槽1の内部に試′#I5を装
着する試験用の回路基板4と、この回路基板4を恒温槽
1の内壁に取付けるとともに電気入力するためのソケッ
ト3と、恒温槽内の温度を一定に加熱する発熱体ユニッ
l−2とを有している。Fig. 3 is a cross-sectional view of a constant temperature chamber in a reliability life test apparatus, which is an example of the conventional reliability life test apparatus. a test circuit board 4 for mounting the sample #I5 inside the thermostatic oven 1; a socket 3 for attaching the circuit board 4 to the inner wall of the thermostatic oven 1 and for electrical input; It has a heating element unit 1-2 that heats the temperature inside the constant temperature bath at a constant temperature.
この信頼性寿命試験装置で半導体装置を試験する場合は
、試料である半導体装置を恒温′N11に収納し、試験
を行い、試験時間終了後、恒温槽の発熱対ユニツl−2
の電源を切り、槽内温度が設置室の室温になるまて冷却
し、その後、試料の電気入力供給を停止して試料を取り
出していた。When testing a semiconductor device using this reliability life test equipment, the semiconductor device as a sample is stored in a constant temperature 'N11, the test is carried out, and after the test time is over,
The power was turned off and the chamber was cooled until the temperature inside the chamber reached the room temperature of the installation chamber.Then, the electrical input supply to the sample was stopped and the sample was taken out.
また、槽内温度を冷却してから、試料の電気入力をはじ
めて停止するのは、特に試験中に集められた試料内部の
可動性イオン等が熱により拡散するのを防ぐなめである
。Furthermore, the reason why the electrical input to the sample is stopped only after the temperature inside the chamber has been cooled is to prevent mobile ions, etc. inside the sample collected during the test from being diffused by heat.
第4図は従来の他の例を示す信頼性寿命試験装置におけ
る恒温槽部の断面図である。また、他の信頼性寿命試験
装置は、例えば、第4図に示すように、試料用電気入力
供給のソケット3を可動式のパネル12に取付け、外部
から恒温槽1に差しこむ方式になっているにのような装
置の場りは、試験終了後パネル用電気供給のコネクタ】
3から電気入力を供給しf、lままパネル12を抜き取
り、冷却のために専用に設置し、であるパネル用架台に
のせ冷却していた。FIG. 4 is a sectional view of a constant temperature chamber in a reliability life test apparatus showing another example of the conventional apparatus. In addition, other reliability life test devices, for example, as shown in FIG. 4, have a method in which a socket 3 for supplying electrical input for a sample is attached to a movable panel 12 and inserted into a constant temperature chamber 1 from the outside. The place for devices like Iruni is the connector for the electrical supply for the panel after the test is completed]
Electrical input was supplied from 3, and the panel 12 was removed from the panel 12, installed exclusively for cooling, and placed on a panel mount for cooling.
1発明か解決しようとする課題〕
ト述した従来の信頼性寿命試験装置て、前者の場合は、
試験時間終了後試料を取り出す際に恒温槽全体を冷却す
る必要がある。こめため、例えば、試験終了時間か異な
る試料も入っている場斤ても、いっしょに冷却するため
、試験を一時中断することになり時間的損失かあっな。1. Problem to be solved by the invention] In the former case, the conventional reliability life test device mentioned in
It is necessary to cool the entire thermostatic chamber when taking out the sample after the test period. For example, if there are samples that have different test end times, they will be cooled all at once, so the test will have to be temporarily interrupted, resulting in a loss of time.
そのほか力例として、試験が長時間にわたる試料と短時
間の試料がいっしょに試験された場合、長時間試験試料
は本来の試験ス1〜レスとは異なる熱変化ス)ヘレスを
多数回受けることになり、試験の確度において問題があ
る。As another example, if a sample that has been tested for a long time and a sample that has been tested for a short time are tested together, the long-time test sample may be subjected to multiple thermal changes that are different from the original test results. Therefore, there is a problem with the accuracy of the test.
また、後者の場合では、試験毎にパネルを抜き差しする
・ピ・要かあり、恒温槽の温度を不安定にする問題があ
り、さらに、パネルの冷却時にしか使用しない専用の冷
却用架台を必要とする問題点もあった。In addition, in the latter case, the panel must be inserted and removed for each test, which causes the problem of unstable temperature in the thermostatic chamber.Furthermore, it requires a dedicated cooling stand that is only used when cooling the panel. There were also some problems.
本発明の目的は、かかる問題を解消する信頼性が命試験
装置を提供することである、。It is an object of the present invention to provide a reliable life test device that eliminates such problems.
本発明の信頼性寿命試験装置は、少なくとも一面に扉を
有する恒温槽と、この恒温槽内に配置されるとともに試
料装着用の回路基板が外周部に所定の角度で複数枚取付
けられる割り出し回転軸と、前記扉を挟み前記恒温槽内
壁に取付けられるとともに少なくとも一つの市f記回路
基板を含む室に仕切るシャッタを開閉する断熱シャッタ
機構とを備えている。The reliability life test device of the present invention includes a constant temperature chamber having a door on at least one side, and an indexing rotating shaft placed inside the constant temperature chamber and having a plurality of circuit boards for mounting samples attached at a predetermined angle on the outer periphery. and a heat insulating shutter mechanism that opens and closes a shutter that is attached to the inner wall of the thermostatic chamber with the door in between and partitions into a chamber containing at least one circuit board.
「実施例〕 次に、本発明に−)いて図面を参照して説明する。"Example〕 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例を示す信頼性寿命試験装置に
おける恒温槽部の断面図である。この信頼性9.?命試
験装置は、同図に示すように、放射状に等角度に複数の
試料装着用回路基板4が該周囲に取付けられるとともに
恒温槽1内に配置される割出し回転軸6と、この割出し
回転軸6を等角度に割出し2回転させるインデックス機
構部(図示ぜり”)と、扉りを挟み恒温槽1の内壁に取
(=I幻られるとともに一つの回路基板4を含む什切り
範囲7aを熱遮断するシャッタを開閉する断熱シャッタ
機構とを有している。それ以外は従来と同しである。FIG. 1 is a cross-sectional view of a constant temperature chamber in a reliability life test apparatus showing an embodiment of the present invention. This reliability9. ? As shown in the figure, the life test apparatus includes a plurality of circuit boards 4 for mounting samples radially and at equal angles around the index rotary shaft 6 disposed in a thermostatic chamber 1, and An indexing mechanism (not shown) that indexes the rotary shaft 6 at equal angles and rotates it twice is attached to the inner wall of the thermostatic chamber 1 with the door in between (=I) and a complete range including one circuit board 4. It has a heat insulating shutter mechanism that opens and closes a shutter that isolates heat from 7a.The rest is the same as the conventional one.
次に、この信頼性寿命試験装置の動作を説明する。まず
、扉9を開け、割出し回転軸6にソケッ1−3を介して
取付けられる回路基板4の全てに試′F:+ 5を取付
ける。次に、扉9を閉じ、試験を開始する。次に、所定
の試験時間の終了した試料5が取付けられる回路基板4
が扉9に面する位置に来るように、割り出し回転軸6を
回転させる。次に、回路基板4が位置決めされたら、断
熱シャッタ機[8が動作し、2つのシャッタと扉9で仕
切る什切り範囲7aの室を形成する。次に、扉9を開け
、外気を導入し、試料5を冷却する。次に、試料5が冷
却した後、試料5への電気入力を停止し、試料5を回路
基板4より取りはずず。Next, the operation of this reliability life test device will be explained. First, the door 9 is opened, and the test pieces F:+5 are attached to all of the circuit boards 4 that are attached to the index rotation shaft 6 through the sockets 1-3. Next, door 9 is closed and the test is started. Next, the circuit board 4 to which the sample 5 after the predetermined test time is attached is mounted.
The index rotation shaft 6 is rotated so that it comes to a position facing the door 9. Next, once the circuit board 4 is positioned, the heat insulating shutter device [8 is operated to form a chamber with a partition area 7a partitioned by two shutters and a door 9. Next, the door 9 is opened, outside air is introduced, and the sample 5 is cooled. Next, after the sample 5 has cooled, the electrical input to the sample 5 is stopped, and the sample 5 is removed from the circuit board 4.
また、新たに試験を開始する試料かある場合は、試料5
を回路基板4に装着し開いている電気入力供給用のソケ
ット3に設置する。再び試料への電気入力を開始後恒温
雰囲気発生装置で作成した恒温槽内部温度と同じ温度の
雰囲気を注入し、冷却室の温度を恒温槽の温度と同じに
する。その後断熱シャッタ機構8を動作させ、シャッタ
を引きもどし、もとの恒温槽とする。この再試験を続行
しているほかの試料は試験条件の変化を受けることがな
く安定した試験ストレスを得ることができる。In addition, if there is a new sample to start testing, sample 5
is mounted on the circuit board 4 and installed in the open electrical input supply socket 3. After starting electrical input to the sample again, inject an atmosphere with the same temperature as the temperature inside the constant temperature chamber created by the constant temperature atmosphere generator to make the temperature of the cooling chamber the same as the temperature of the constant temperature chamber. Thereafter, the heat insulating shutter mechanism 8 is operated and the shutter is pulled back to return to the original constant temperature bath. Other samples that are undergoing this retest will not be subject to changes in test conditions and will be able to obtain stable test stress.
第2図は本発明の他の実施例を示す信頼性寿命試験装置
における恒温槽部の断面図である。この6一
信頼性寿命試験装置は、同図に示すように、什切り範囲
7aだけではなく、什切り範囲7 bを形成する断熱シ
ャッタ機構8を追加したことである。FIG. 2 is a sectional view of a constant temperature chamber in a reliability life test apparatus showing another embodiment of the present invention. As shown in the figure, this 6-reliability life test device has an additional heat insulating shutter mechanism 8 that forms not only the end range 7a but also the end range 7b.
このことにより、取り出す試料の量及び投入する試IF
lの量により、冷却すべき仕切り範囲の大きさを可変す
ることができる特徴がある。また、大容量の什切り室を
冷却するために、新たに試料を冷却する冷気供給部10
を設け、仕切られる室の温度を室温まで早く冷却する機
能もそなえている。This determines the amount of sample to be taken out and the sample IF to be put in.
It has the feature that the size of the partition range to be cooled can be varied by changing the amount of l. In addition, in order to cool the large-capacity tithing chamber, a cold air supply section 10 is also installed to cool the sample.
It also has a function that quickly cools the temperature of the partitioned room to room temperature.
さらに、試料を再装填した後、早く恒温槽の温度まて立
子らせるために、温気供給部11を設けたことである。Furthermore, a hot air supply section 11 is provided in order to quickly bring the temperature of the thermostatic chamber up after reloading the sample.
それ以外は、前述の実施例と同じである。The rest is the same as the previous embodiment.
この実施例は、前述の実施例と比べ、シャッタ機構を更
に多く設けることにより、より汎用性かある利点かある
。さらに、試験時間をより節約出来る利点かある。This embodiment has the advantage of being more versatile than the previous embodiment by providing more shutter mechanisms. Furthermore, there is the advantage that testing time can be further saved.
以−1−説明したように本発明は、試料を装填する複数
の回路基板が所定の角度で放射状に該円筒部に取付けら
れる割出し回転軸と、扉面と協動し、少なくとも一つの
回路基板を含む領域を仕切るシャッタを開閉させる断熱
シャッタ機構を設けることによって、恒温槽内に収納さ
れる試料を槽内の温度を維持しなから任意に取出し、補
充することが出来るので、中断に要する時間を必要とす
ることなく、より角度の高い能率的な信頼性が命試験装
置が得られるという効果がある。As described above, in the present invention, a plurality of circuit boards on which a sample is loaded cooperates with an index rotation shaft attached to the cylindrical part radially at a predetermined angle and a door surface, and at least one circuit By providing an insulating shutter mechanism that opens and closes the shutter that partitions the area containing the substrate, samples stored in the thermostatic chamber can be taken out and replenished at will without maintaining the temperature inside the chamber. This has the effect that the life test equipment can obtain more efficient reliability without requiring much time.
第1図は本発明の一実施例を示す信頼性寿命試験地にお
ける恒温槽部の断面図、第2図は本発明の他の実施例を
示す信頼性寿命試験装置における恒温槽部の断面図、第
3図及び第4図は従来の信頼性寿命試験装置例における
恒温槽部の断面図である。
1・・・恒温槽、2・・・発熱体ユニッI〜、3・・・
ソケット、4・・・回路基板、5・・試料、6・・割り
出し回転軸、7a、7b・・・仕切り範囲、8・・・断
熱シャッタ機構、9・・扉、10・・・冷気供給部、1
]・・・温気供給部、]2・・パネル、13・コネクタ
。
一つ−FIG. 1 is a cross-sectional view of a constant temperature chamber in a reliability life test site showing one embodiment of the present invention, and FIG. 2 is a cross-sectional view of a constant temperature chamber in a reliability life test apparatus showing another embodiment of the present invention. , FIG. 3, and FIG. 4 are cross-sectional views of a constant temperature chamber in an example of a conventional reliability life test device. 1... Constant temperature chamber, 2... Heating element unit I~, 3...
Socket, 4... Circuit board, 5... Sample, 6... Index rotation axis, 7a, 7b... Partition range, 8... Heat insulation shutter mechanism, 9... Door, 10... Cold air supply section ,1
]...Hot air supply unit, ]2...Panel, 13.Connector. One-
Claims (1)
に配置されるとともに試料装着用の回路基板が外周部に
所定の角度で複数枚取付けられる割り出し回転軸と、前
記扉を挟み前記恒温槽内壁に取付けられるとともに少な
くとも一つの前記回路基板を含む室に仕切るシャッタを
開閉する断熱シャッタ機構とを備えることを特徴とする
信頼性寿命試験装置。a constant temperature chamber having a door on at least one side; an indexing rotating shaft disposed within the constant temperature chamber and having a plurality of circuit boards for mounting samples attached at a predetermined angle on the outer periphery thereof; and an inner wall of the constant temperature chamber with the door in between. 1. A reliability lifespan test apparatus comprising: a heat insulating shutter mechanism that opens and closes a shutter that is attached to a chamber and partitions into a chamber containing at least one of the circuit boards.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30426390A JPH04179139A (en) | 1990-11-09 | 1990-11-09 | Reliability life testing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30426390A JPH04179139A (en) | 1990-11-09 | 1990-11-09 | Reliability life testing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04179139A true JPH04179139A (en) | 1992-06-25 |
Family
ID=17930948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30426390A Pending JPH04179139A (en) | 1990-11-09 | 1990-11-09 | Reliability life testing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04179139A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5397998A (en) * | 1991-07-22 | 1995-03-14 | Fujitsu Limited | Burn-in apparatus |
JP2014145589A (en) * | 2013-01-25 | 2014-08-14 | Espec Corp | Environment forming apparatus, and method of putting goods in and taking goods out of the same |
-
1990
- 1990-11-09 JP JP30426390A patent/JPH04179139A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5397998A (en) * | 1991-07-22 | 1995-03-14 | Fujitsu Limited | Burn-in apparatus |
JP2014145589A (en) * | 2013-01-25 | 2014-08-14 | Espec Corp | Environment forming apparatus, and method of putting goods in and taking goods out of the same |
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