JPH04178573A - Measuring device for semiconductor integrated circuit - Google Patents
Measuring device for semiconductor integrated circuitInfo
- Publication number
- JPH04178573A JPH04178573A JP2306896A JP30689690A JPH04178573A JP H04178573 A JPH04178573 A JP H04178573A JP 2306896 A JP2306896 A JP 2306896A JP 30689690 A JP30689690 A JP 30689690A JP H04178573 A JPH04178573 A JP H04178573A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- measurement
- circuit
- measurement section
- handler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 238000005259 measurement Methods 0.000 claims abstract description 32
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 230000001419 dependent effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体集積回路の測定装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a measuring device for semiconductor integrated circuits.
従来この種の半導体集積回路の測定装置は、電気的測定
回路を有する測定器(以降テスタと呼ふ)と半導体集積
回路(以降ICと呼ぶ)のハンドリングブロービングを
行なう自動供給収納装置(以降ハンドラと呼ぶ)とを電
気的に接続し、ICの電気的特性を測定することを可能
にしていた。Conventionally, this type of semiconductor integrated circuit measuring equipment consists of a measuring device (hereinafter referred to as a tester) having an electrical measuring circuit and an automatic supply/storage device (hereinafter referred to as a handler) that handles and blows semiconductor integrated circuits (hereinafter referred to as IC). It was possible to measure the electrical characteristics of the IC by electrically connecting the IC to the IC.
上述した従来のICの測定装置でのハンドラ測定部の温
度は、ハンドラ周辺の室内空調により影響を受け、又そ
の構造からハンドラ測定部の温度はハンドラの構造が測
定部の風の流れを防いでいると室内空調だけでは制御で
きなかった。In the conventional IC measuring device described above, the temperature of the handler measurement section is affected by the indoor air conditioning around the handler, and due to its structure, the temperature of the handler measurement section is affected by the structure of the handler, which prevents wind flow in the measurement section. When the air conditioner was in the room, it could not be controlled by indoor air conditioning alone.
又、ハンドラの測定部を恒温状態にするには多大な経費
がかかり、測定部の調整、トラブル解除をする際に大き
な支障がでていた。In addition, it costs a lot of money to bring the measuring section of the handler to a constant temperature state, which creates a big problem when adjusting the measuring section and troubleshooting troubles.
このことにより、例えばDRAMのホールド特性等のよ
うに測定部の温度が測定結果に重大な影響を及ぼす測定
項目の場合に、車内空調の能力。This makes it possible to improve the performance of the in-vehicle air conditioning in the case of measurement items where the temperature of the measuring section has a significant effect on the measurement results, such as the hold characteristics of DRAM.
ハンドラの構造によってICの良品歩留が左右されると
いう欠点があった。There was a drawback that the yield of good ICs was affected by the structure of the handler.
本発明の半導体集積回路の測定装置は、被測定半導体集
積回路に接続して電気特性を測定する測定部の温度を検
出して温度データを出力する温度検出部を有するハンド
ラと、前記温度データを入力して変換信号を出力する変
換回路及び前記測定部の測定データと規約値とを入力し
て比較・演算する演算回路を有するテスタとを含んで構
成されている。The semiconductor integrated circuit measuring device of the present invention includes a handler having a temperature detection section that detects the temperature of a measurement section that is connected to a semiconductor integrated circuit under test to measure electrical characteristics and outputs temperature data; The tester includes a conversion circuit that receives input and outputs a conversion signal, and a tester that has an arithmetic circuit that inputs, compares and calculates the measurement data of the measuring section and standard values.
第1図は本発明の第1の実施例のブロック図である。 FIG. 1 is a block diagram of a first embodiment of the present invention.
被測定IC30に接続するハンドラ10の測定部1に温
度検出部2を設けることにより、測定部1の温度T、を
検出しテスタ20へと温度情報s、rを送る。By providing the temperature detection section 2 in the measurement section 1 of the handler 10 connected to the IC to be measured 30, the temperature T of the measurement section 1 is detected and temperature information s, r is sent to the tester 20.
テスタ20では、送られてきた温度情報STを変換回路
3により変換し、測定の補正条件を決める条件発生回路
4に転送する。In the tester 20, the sent temperature information ST is converted by a conversion circuit 3 and transferred to a condition generation circuit 4 that determines measurement correction conditions.
条件発生回路4では予め温度依存特性によって定められ
た温度係数式に応じて測定規格値Scに補正し測定デー
タSMと比較する演算回路5に送る。The condition generation circuit 4 corrects the measurement standard value Sc to a measurement standard value Sc according to a temperature coefficient formula determined in advance based on temperature dependence characteristics, and sends it to the arithmetic circuit 5 where it is compared with the measurement data SM.
そこで演算回路5は測定データSMと規格値Scとの比
較結果S。を出力する。Therefore, the arithmetic circuit 5 calculates the comparison result S between the measurement data SM and the standard value Sc. Output.
第2図は本発明の第2の実施例のブロック図である。FIG. 2 is a block diagram of a second embodiment of the invention.
ハンドラ10の温度検出部2の温度情報T、に従い、測
定部1の測定データSMをテスタ20゜の変換回路31
により補正し演算回路5に送り、条件発生回路4aの規
格値Scsと共に比較・演算され、結果Soが出力され
る。According to the temperature information T of the temperature detection unit 2 of the handler 10, the measurement data SM of the measurement unit 1 is converted to the conversion circuit 31 of the tester 20°.
It is corrected and sent to the calculation circuit 5, where it is compared and calculated together with the standard value Scs of the condition generation circuit 4a, and the result So is output.
以上説明したように本発明は、ハンドラの測定部の温度
を検出しその温度に見合う測定規格値もしくは測定デー
タへの変換することにより、温度依存の高い電気的特性
の測定をする際に室内空調の乱れ、空調空気のしゃ断、
周辺設備・部位の発熱等、測定部の温度が恒温状態を保
てずとも、測定部温度を補正した正しい測定が可能とな
る。As explained above, the present invention detects the temperature of the measurement part of the handler and converts it into a measurement standard value or measurement data that corresponds to the temperature. turbulence, interruption of air-conditioned air,
Even if the temperature of the measurement part cannot be maintained at a constant temperature due to heat generation from surrounding equipment or parts, correct measurement can be performed by correcting the temperature of the measurement part.
第1図は本発明の第1の実施例のブロック図、第2図は
本発明の第2の実施例のブロック図である。
]・・測定部、2・・・温度検出部、3.3a・・・変
換回路、4.48・・・条件発生回路、5・・・演算回
路、10・・ハンドラ、20,20.・・・テスタ、3
o・・・被測定IC0
代理人 弁理士 内 原 晋
党 1 関
尤 2 図FIG. 1 is a block diagram of a first embodiment of the invention, and FIG. 2 is a block diagram of a second embodiment of the invention. ]... Measuring unit, 2... Temperature detection unit, 3.3a... Conversion circuit, 4.48... Condition generation circuit, 5... Arithmetic circuit, 10... Handler, 20, 20. ...Tester, 3
o... IC0 to be measured Agent Patent attorney Shinto Hara 1 Guan Yu 2 Figure
Claims (1)
測定部の温度を検出して温度データを出力する温度検出
部を有するハンドラと、前記温度データを入力して変換
信号を出力する変換回路及び前記測定部の測定データと
規約値とを入力して比較・演算する演算回路を有するテ
スタとを含むことを特徴とする半導体集積回路の測定装
置。a handler having a temperature detection section that detects the temperature of a measurement section connected to a semiconductor integrated circuit under test to measure electrical characteristics and outputs temperature data; a conversion circuit that inputs the temperature data and outputs a conversion signal; A tester for measuring a semiconductor integrated circuit, comprising: a tester having an arithmetic circuit that inputs, compares and calculates the measurement data of the measurement section and standard values.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2306896A JPH04178573A (en) | 1990-11-13 | 1990-11-13 | Measuring device for semiconductor integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2306896A JPH04178573A (en) | 1990-11-13 | 1990-11-13 | Measuring device for semiconductor integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04178573A true JPH04178573A (en) | 1992-06-25 |
Family
ID=17962567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2306896A Pending JPH04178573A (en) | 1990-11-13 | 1990-11-13 | Measuring device for semiconductor integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04178573A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100499909B1 (en) * | 1998-05-11 | 2005-09-26 | 삼성전자주식회사 | How to check the handler temperature during semiconductor device inspection |
-
1990
- 1990-11-13 JP JP2306896A patent/JPH04178573A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100499909B1 (en) * | 1998-05-11 | 2005-09-26 | 삼성전자주식회사 | How to check the handler temperature during semiconductor device inspection |
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