JPH04178265A - Structure of soldering iron tip - Google Patents
Structure of soldering iron tipInfo
- Publication number
- JPH04178265A JPH04178265A JP30108090A JP30108090A JPH04178265A JP H04178265 A JPH04178265 A JP H04178265A JP 30108090 A JP30108090 A JP 30108090A JP 30108090 A JP30108090 A JP 30108090A JP H04178265 A JPH04178265 A JP H04178265A
- Authority
- JP
- Japan
- Prior art keywords
- tip
- soldering iron
- soldering
- iron tip
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title claims abstract description 108
- 229910052742 iron Inorganic materials 0.000 title claims abstract description 54
- 238000005476 soldering Methods 0.000 title claims abstract description 52
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 33
- 239000010432 diamond Substances 0.000 claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 claims abstract description 32
- 238000007747 plating Methods 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 230000001154 acute effect Effects 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 2
- 238000009736 wetting Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 7
- 230000014759 maintenance of location Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007664 blowing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は電気配線や各種のはんだ付けなどに用いるはん
だゴテのコテ先に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to the tip of a soldering iron used for electrical wiring and various types of soldering.
〈従来の技術〉
はんだゴテおよびそのコテ先については、その用途や条
件により様々なものが考案され使用されているが、特に
近年は自動はんだ付け機械が著しく普及し、その機能の
高度化に対応してコテ先にも更なる改良が求められてい
る。<Conventional technology> Various types of soldering irons and their tips have been devised and used depending on their purpose and conditions, but automatic soldering machines have become particularly popular in recent years, and their functions have become increasingly sophisticated. Therefore, further improvements are required for the tip of the iron.
例えば第５図に示すのは、自動はんだ付け機械ｌのはん
だゴテ２の部分である。このはんだゴテ２は、自動はん
だ付け機械１の昇降スライド３にブラケット４を介して
取付けられており、ヒータ部５により加熱されるコテ本
体６、そしてブラケット４に取付けた調節クリップ７に
固定されたエア吹出しノズル８および糸はんだ供給ノズ
ル９等々からなっている。コテ本体６は熱伝導性の良い
銅、純鉄、ニッケルなどの材料で形成されている。For example, what is shown in FIG. 5 is a soldering iron 2 of an automatic soldering machine 1. This soldering iron 2 is attached to an elevating slide 3 of an automatic soldering machine 1 via a bracket 4, and is fixed to a iron body 6 heated by a heater part 5 and an adjustment clip 7 attached to the bracket 4. It consists of an air blowing nozzle 8, a wire solder supply nozzle 9, and so on. The iron body 6 is made of a material with good thermal conductivity, such as copper, pure iron, or nickel.
この自動はんだ付け機械１は、ヒータ部５により加熱さ
れて所定の温度となったコテ本体６のコテ先１０に糸は
んだ供給ノズル９から糸はんだを供給し、コテ先ｌＯの
熱により融解した融解はんだ液を、コテ先１０を当接さ
せて加熱したワーク１１の所定部位の表面に施してはん
だ付けをするものである。はんだゴテ２は昇降スライド
３により昇降され、コテ先ＩＯがワークＩＩに当接・離
隔自在となるように調整されている。また、エア吹出し
ノズル８および糸はんだ供給ノズル９はそれぞれ図示せ
ぬニアコンプレッサや糸はんだ供給装置に接続されてい
る。尚、エア吹出しノズル８からのエアは、コテ先ｌＯ
の表面の残渣を吹き飛ばして清掃するためのものである
。This automatic soldering machine 1 supplies thread solder from a thread solder supply nozzle 9 to a soldering iron tip 10 of a soldering iron body 6 which has been heated to a predetermined temperature by a heater part 5, and melts the solder wire by the heat of the soldering iron tip lO. Soldering is performed by applying a solder liquid to the surface of a predetermined portion of a heated workpiece 11 that is brought into contact with an iron tip 10. The soldering iron 2 is raised and lowered by a lifting slide 3, and is adjusted so that the soldering iron tip IO can freely come into contact with and separate from the workpiece II. Further, the air blowing nozzle 8 and the wire solder supply nozzle 9 are respectively connected to a near compressor and a wire solder supply device (not shown). In addition, the air from the air blowing nozzle 8 is
This is for cleaning by blowing away the residue on the surface.
〈発明が解決しようとする課題〉
しかしながら、このような従来のコテ先にあっては、コ
テ先を形成する材料として銅、純鉄、ニッケルなどのい
わゆるはんだに対する「ヌレ性」の良い材質が採用され
、融解はんだ液の付着・保持性や作業性の良いことを意
図するようにしている。しかしその反面、融解はんだ液
の付着・保持性が良いことからコテ先が汚れ易く、その
都合によっでは掃除の必要がある。また、長時間のはん
だ付け作業において、場合によってはワークに施すべき
融解はんだ液の一部を付着・保持したまま次の工程に進
んでしまうなど、供給したはんだの量が正確にはワーク
に施された使用量とはならず、はんだ盛り量が一定しな
いため製品の品質管理上の問題となるおそれかあった。<Problem to be solved by the invention> However, in such conventional iron tips, materials with good "wetting properties" for solder, such as copper, pure iron, and nickel, are used to form the iron tip. It is intended to have good adhesion and retention of molten solder liquid and workability. However, on the other hand, because of the good adhesion and retention of molten solder, the tip of the soldering iron tends to get dirty, and depending on the situation, cleaning may be necessary. In addition, during long-time soldering work, in some cases, the amount of solder supplied may not be accurate enough to be applied to the workpiece. Since the amount of solder used was not the same as the one specified, and the amount of solder applied was not constant, there was a risk of problems in product quality control.
また、コテ先の使用条件が厳しい場合、例えば半導体の
ワイヤホンディングなどの場合にはコテ先が摩耗してし
まうという問題もある。更にははんだ付け作業において
使用されるフラックスなどの薬品に対しても変化せず安
定していることが求められる。 本発明は、このような
従来の技術に着目してなされたものであり、高温での安
定性および耐摩耗性に優れ、汚れ難く掃除の必要が軽減
でき、また、はんだの使用量を正確にできるはんだゴテ
のコテ先を提供せんとするものである。Furthermore, when the iron tip is used under severe conditions, such as in the case of semiconductor wire bonding, there is also the problem that the iron tip wears out. Furthermore, it is required to be stable and unaffected by chemicals such as flux used in soldering work. The present invention has been made by focusing on such conventional technology, and has excellent stability at high temperatures and wear resistance, is resistant to staining, reduces the need for cleaning, and can accurately control the amount of solder used. The purpose is to provide a soldering iron tip that can be used.
〈課題を解決するための手段〉
本発明に係るはんだゴテのコテ先は、上記のような課題
を解決するために、コテ先の先端部にダイヤモンドチッ
プを取り付け、該ダイヤモンドチップのワークと当接す
る先端面部にワーク表面との夾角が鋭角となる斜面を設
けたものである。<Means for Solving the Problems> In order to solve the above-mentioned problems, the soldering iron tip according to the present invention has a diamond tip attached to the tip of the soldering iron tip, and the diamond tip comes into contact with a workpiece. The tip surface is provided with a slope that forms an acute angle with the workpiece surface.
また、この斜面に、上下方向に沿う溝部を凹設したもの
である。Further, a groove portion extending in the vertical direction is recessed in this slope.
更には、コテ先の先端部およびその付近と、ダイヤモン
ドチップを先端部に取付けるロウ付け部が、はんだに対
するヌレ性がない金属によるメッキ層にて被覆されてい
るものである。Furthermore, the tip of the soldering iron tip and its vicinity, as well as the brazed portion for attaching the diamond tip to the tip, are coated with a metal plating layer that does not wet with solder.
〈作 用〉
上記のように構成した本発明のはんだゴテのコテ先構造
においては、ワークに当接するコテ先の先端部に極めて
優れた耐摩耗性を有するダイヤモンドチップを取り付け
ているため、ワークとの接触による摩耗が格段に軽減さ
れる。これにより、正確なはんだ付けを長期にわたって
行うことができるほか、フラックスなどの薬品に対し化
学的にも安定している材質であるため寿命の長いものと
することができる。また、ダイヤモンドチップは融解は
んだ液の離脱性が良いことから汚れ難く、掃除の必要が
軽減できると共に、供給したはんだの全量が速やかにワ
ークに施され、はんだの使用量を正確にすることができ
る。また、ダイヤモンドチップはこの他の性質として、
熱伝導性が良く、熱容量が大きいことから、使用中にお
いてコテ先の温度が下がり難く、従ってはんだを早く融
解し、且つワークを早く加熱することができる。<Function> In the soldering iron tip structure of the present invention configured as described above, a diamond tip with extremely excellent wear resistance is attached to the tip of the soldering iron tip that comes into contact with the workpiece, so that it does not touch the workpiece. Wear caused by contact between the two is significantly reduced. This allows for accurate soldering over a long period of time, and because the material is chemically stable against chemicals such as flux, it can have a long life. In addition, since the diamond tip has a good ability to release molten solder, it is difficult to get dirty, reducing the need for cleaning, and the entire amount of supplied solder is quickly applied to the workpiece, making it possible to accurately use the amount of solder. . In addition, other properties of diamond chips include:
Since it has good thermal conductivity and a large heat capacity, the temperature of the soldering iron tip does not easily drop during use, so the solder can be melted quickly and the workpiece can be heated quickly.
ダイヤモンドチップのワークと当接する先端面部に設け
た斜面は、ワーク表面との夾角が鋭角となるため、融解
はんだ液をこの二面の間に挟み込み、付着・保持性を向
上させる。更にこの斜面に凹設した溝部に融解はんだ液
の一部が入り込んだ状態となり安定して保持される。こ
のため融解はんだ液の離脱性が良いダイヤモンドチップ
を使用しても良好な付着・保持性をもたせることができ
、安定したはんだ付けが可能となる。The slope provided on the tip surface of the diamond tip that comes into contact with the workpiece has an acute angle with the workpiece surface, so the molten solder liquid is sandwiched between these two surfaces to improve adhesion and retention. Furthermore, a portion of the molten solder liquid enters the groove formed in the slope and is stably held. Therefore, even if a diamond tip is used, which has good releasability of the molten solder liquid, good adhesion and retention can be achieved, and stable soldering can be achieved.
また、コテ先の先端部およびその付近と、ダイヤモンド
チップを先端部に取付けるロウ付け部が、はんだに対す
るヌレ性がない金属によるメッキ層にて被覆されている
ことにより、融解はんだ液の飛散などによる付着が防止
される。In addition, the tip of the soldering iron tip and its vicinity, as well as the brazed part where the diamond tip is attached to the tip, are coated with a metal plating layer that does not wet the solder. Adhesion is prevented.
〈実 施 例〉
本発明の実施例を以下、第１図〜第４図を参照して説明
する。尚、従来と共通する部分には同一の符号を付し、
重複する説明は省略する。<Examples> Examples of the present invention will be described below with reference to FIGS. 1 to 4. In addition, the same parts as before are given the same symbols,
Duplicate explanations will be omitted.
第１１ｆｆｌは第１実施例を示すもので、コテ先１２の
ワーク１１と当接する先端部１３に円板状のダイヤモン
ドチップ１４を取付けたものである。ダイヤモンドチッ
プ１４は、その端面と相応する端面形状に仕上げられた
コテ先１２の先端部１３にろう付け１５により取付けら
れている。ダイヤモンドチップ１４およびコテ先１２の
先端部１３をこのような形状にして、ろう付け１５によ
り取付けることにより製造、修理を容易にできるもので
ある。そして、ダイヤモンドチップ１４のワーク１１と
当接する先端面部１６に、ワーク１１の表面との夾角が
鋭角となる斜面１７を設け、更にこの斜面１７に上下方
向に沿う溝部１７ａを凹設したものである。The 11th ffl shows the first embodiment, in which a disc-shaped diamond tip 14 is attached to the tip 13 of the soldering iron tip 12 that comes into contact with the workpiece 11. The diamond tip 14 is attached by brazing 15 to the tip 13 of the soldering iron tip 12, which has an end face shaped to match the end face of the diamond tip 14. Manufacturing and repair can be facilitated by forming the diamond tip 14 and the tip 13 of the soldering iron tip 12 into such shapes and attaching them by brazing 15. A slope 17 is provided on the tip end surface 16 of the diamond tip 14 that comes into contact with the work 11, and the slope 17 includes an acute angle with the surface of the work 11, and a groove 17a extending vertically is formed in the slope 17. .
第２図は第２実施例を示すもので、コテ先１８の先端部
１９に設けた傾斜面部２０に板状のダイヤモンドチップ
２１を添わせて取りつけたものである。このダイヤモン
ドチップ２１のワーク１１と当接する先端面部２２にも
ワーク１１の表面との夾角が鋭角となる斜面２３が設け
られており、更に溝部２３ａが凹設されている。このよ
うな形状とすることにより、板状のダイヤモンドチップ
２１の厚さを比較的薄くしても大きな斜面２３を得るこ
とができ、経済的に有利となるものである。FIG. 2 shows a second embodiment, in which a plate-shaped diamond tip 21 is attached to an inclined surface 20 provided on the tip 19 of a soldering iron tip 18. The tip end face 22 of the diamond tip 21 that comes into contact with the work 11 is also provided with a slope 23 that forms an acute angle with the surface of the work 11, and is further provided with a groove 23a. By adopting such a shape, even if the thickness of the plate-shaped diamond tip 21 is made relatively thin, a large slope 23 can be obtained, which is economically advantageous.
第３図は第３実施例を示すもので、コテ先２４の先端部
２５に水平面部２６と傾斜面部２７とを設け、各々の面
の形状に相応する板状のダイヤモンドチップ２８および
２９を添わせて取りつけたものである。ダイヤモンドチ
ップ２８にはワーク１１と当接する先端面部３０が設け
られており、ダイヤモンドチップ２９にはワーク１１の
表面との夾角が鋭角となる斜面３１が設けられており、
更に溝部３１ａが凹設されている。このような構造とす
ることにより、ダイヤモンドチップ２８．２９を薄くし
ても大きな斜面３１か得られると共に、ワーク１１との
当接における荷重や衝撃に対して強度を高めることがで
きる。また、小さなダイヤモンドチップを組合わせるこ
とにより加工性も良く、更に経済的に有利となるもので
ある。FIG. 3 shows a third embodiment, in which a horizontal surface portion 26 and an inclined surface portion 27 are provided at the distal end 25 of the soldering iron tip 24, and plate-shaped diamond tips 28 and 29 corresponding to the shape of each surface are attached. It was installed at the same time. The diamond tip 28 is provided with a tip end surface portion 30 that comes into contact with the work 11, and the diamond tip 29 is provided with a slope 31 that includes an acute angle with the surface of the work 11.
Further, a groove portion 31a is recessed. With such a structure, a large slope 31 can be obtained even if the diamond chips 28, 29 are made thin, and the strength can be increased against the load and impact caused by contact with the workpiece 11. In addition, by combining small diamond chips, the workability is good and it is also economically advantageous.
第４図は第４実施例を示すもので、コテ先３２の先端部
３３に設けた凹部３４に棒状のダイヤモンドチップ３５
を圧入したものである。このダイヤモンドチップ３５は
円錐状に先端を細くして形成されており、円形の先端面
部３６を取り囲んで全周に斜面３７が設けられている。FIG. 4 shows a fourth embodiment, in which a rod-shaped diamond tip 35 is inserted into a recess 34 provided in the tip 33 of the iron tip 32.
is press-fitted. This diamond tip 35 is formed into a conical shape with a tapered tip, and a slope 37 is provided around the entire circumference surrounding a circular tip surface portion 36.
このような形状とすることにより、ワーク１１の微細な
部分への精密なはんだ付け作業が可能となるものである
。By having such a shape, precise soldering work can be performed on minute parts of the workpiece 11.
尚、これらのコテ先１２．１８．２４．３２において、
各々の先端部１３．１９．２５．３３およびその付近と
、ダイヤモンドチップ１４．２１．２８．２９を先端部
１３．１９．２５に取付けるロウ付け部１５を、はんだ
に対するヌレ性がない金属によるメッキ層にて被覆する
ことにより、融解はんだ液の飛散などによる付着が防止
される。In addition, at these iron tips 12.18.24.32,
Each tip 13.19.25.33 and its vicinity, and the brazed portion 15 that attaches the diamond tip 14.21.28.29 to the tip 13.19.25 are plated with a metal that does not wet with solder. Covering with a layer prevents adhesion due to scattering of molten solder liquid.
このメッキについては、例えばハードクロームメッキな
どが好適である。As for this plating, for example, hard chrome plating is suitable.
〈発明の効果〉
本発明に係るはんだゴテのコテ先構造は、以上説明して
きた如き内容のものであって、コテ先の先端部にダイヤ
モンドチップを取付けたことにより、正確なはんだ付け
作業を長期にわたって行うことができ、コテ先の寿命を
長いものとすることができる。また、汚れ難く掃除の必
要が軽減できるほか、供給したはんだの全量を速やかに
ワークに施し、はんだの使用量を正確にすることができ
るので、特に半導体のワイヤボンディングなどには好適
なものである。更には、ダイヤモンドチップに設けた斜
面は、融解はんだ液の良好な付着・保持性をそこに期待
することができ、安定したはんだ付けが可能となり、斜
面に凹設した溝部は更に付着・保持性を向上させるもの
である。<Effects of the Invention> The soldering iron tip structure of the present invention is as described above, and by attaching a diamond tip to the tip of the soldering iron tip, accurate soldering work can be carried out over a long period of time. This can be done over a long period of time, and the life of the iron tip can be extended. In addition, it is difficult to get dirty and reduces the need for cleaning, and the entire amount of supplied solder can be quickly applied to the workpiece, making it possible to accurately use the amount of solder, making it particularly suitable for wire bonding of semiconductors. . Furthermore, the slopes formed on the diamond tip can be expected to have good adhesion and retention properties for molten solder liquid, making stable soldering possible, and the grooves formed on the slopes further improve adhesion and retention properties. It is intended to improve
第１図は、本発明の第１実施例を示すコテ先構造の斜視
図、
第２図は、本発明の第２実施例を示すコテ先構造の側面
図、
第３図は、本発明の第３実施例を示すコテ先構造の側面
図、
第４図は、本発明の第４実施例を示すコテ先構造の側面
図、そして
第５図は、従来のはんだゴテのコテ先を示す側面図であ
る。
１１−・−ワーク
第１図
第３図
第４図
先端面部３６1 is a perspective view of a soldering iron tip structure showing a first embodiment of the present invention, FIG. 2 is a side view of a soldering iron tip structure showing a second embodiment of the present invention, and FIG. 3 is a perspective view of a soldering iron tip structure showing a second embodiment of the present invention. FIG. 4 is a side view of a soldering iron tip structure showing a fourth embodiment of the present invention, and FIG. 5 is a side view of a conventional soldering iron tip. It is a diagram. 11-- Workpiece Figure 1 Figure 3 Figure 4 Tip surface part 36
Claims (3)
てはんだ付けを行うはんだゴテのコテ先構造において、 上記コテ先はその先端部にダイヤモンドチップを備え、
そして該ダイヤモンドチップのワークと当接する先端面
部に、ワーク表面との夾角が鋭角となる斜面を設けたこ
とを特徴とするはんだゴテのコテ先構造。(1) In the tip structure of a soldering iron that melts solder at the tip and heats the workpiece for soldering, the soldering iron tip is equipped with a diamond tip at its tip,
The tip structure of a soldering iron is characterized in that a sloped surface having an acute angle with the surface of the workpiece is provided on the tip end surface of the diamond tip that comes into contact with the workpiece.
に記載のはんだゴテのコテ先構造。(2) Claim 1 in which a groove extending in the vertical direction is recessed in the slope.
The soldering iron tip structure described in .
チップを先端部に取付けるロウ付け部が、はんだに対す
るヌレ性がない金属によるメッキ層にて被覆されている
請求項１または２に記載のはんだゴテのコテ先構造。(3) The solder according to claim 1 or 2, wherein the tip of the soldering iron tip and its vicinity and the brazed portion where the diamond tip is attached to the tip are coated with a plating layer made of a metal that has no wettability to solder. The structure of the iron tip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30108090A JPH04178265A (en) | 1990-11-08 | 1990-11-08 | Structure of soldering iron tip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30108090A JPH04178265A (en) | 1990-11-08 | 1990-11-08 | Structure of soldering iron tip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04178265A true JPH04178265A (en) | 1992-06-25 |
Family
ID=17892627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30108090A Pending JPH04178265A (en) | 1990-11-08 | 1990-11-08 | Structure of soldering iron tip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04178265A (en) |
-
1990
- 1990-11-08 JP JP30108090A patent/JPH04178265A/en active Pending
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