JPH04174600A - Automatic backup pin exchanging device for electronic parts mounting machine - Google Patents

Abstract

PURPOSE:To improve the working efficiency and prevent the occurrence of wrong insertion of backup pins by automating the operations that hold and take out the backup pins from a housing box and inserts the backup pins into prescribed hole on a setting plate. CONSTITUTION:When backup pin transferring conditions regulated by the dimension, etc., of a printed board 14 are inputted, a controller drives a movable table 10, positions backup pins 180 housed in a backup pin housing box 17, and makes a pin holding section 21 to hold the pins 180. Then the controller moves the table 10 so as to position a hole 119 of a setting plate 11 immediately below a holding section 21 and inserts the pin 180 into the hole 119 by lowering the section 21 by actuating an elevating/lowering mechanism 22. After a prescribed number of pins 180 are inserted into the prescribed number of holes of the plate 11 by repeating the above-mentioned operations, a substrate 14 is placed on the backup pins 180 through guide rails 15 and 16. Therefore, the working efficiency can be improved and, at the same time, the occurrence of wrong insertion can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component mounting machine that automatically mounts electronic components onto a printed circuit board, and particularly relates to an electronic component mounting machine that automatically mounts electronic components onto a printed circuit board.

The present invention relates to an automatic hack amplifier pin replacement device for an electronic component mounting machine that automatically inserts backup pins into predetermined holes in a setting plate on which a printed circuit board is placed.

[Conventional technology]

In an electronic component mounting machine that automatically attaches electronic components to a printed circuit board, the printed circuit board is placed on guide rails and multiple Place it on top of the backup pin. This hack amplifier pin is inserted into the hole in the seso teng plate.

The insertion position and number of backup pins to be inserted into the holes in the seso-ten plate vary depending on the dimensions of the printed circuit board, etc., but the insertion of the bank-up pins has conventionally been done manually by a single worker.

[Problem to be solved by the invention]

Although the electronic component mounting operation of the electronic component mounting machine is automatically controlled, the insertion of the hack-up bin is done manually, so there is still a problem that the overall work efficiency of the electronic component mounting machine is low. Furthermore, since it is done manually, the insertion position of the backup pin may be incorrect, which may result in unstable placement of the printed circuit board.

Therefore, two objects of the present invention are to automate the insertion of hack-up bins, improve work efficiency, and prevent erroneous insertion.

[Means to solve the problem]

In order to solve the above problems, 1 the automatic hack-up bin exchange device for an electronic component mounting machine in which a backup pin for partially placing a printed circuit board on which an electronic component is mounted is inserted into a predetermined hole of a setting plate according to the present invention is a separator. A hack-up bin storage box that is disposed near the prong plate and stores a hack-up bin, a backup pin gripping means for gripping a backup pin, and a predetermined backup in the bank-up bin storage box by the back-up pin gripping means. It is comprised of a control means for gripping the pin and inserting the gripped hack-up bottle into a predetermined hole of the sesoten plate.

[Effect]

The control means is programmed with positioning control for transferring the bank-up bin, as well as operations for gripping and releasing the hack-up bin.

Therefore, by inputting the hack-up bin transfer conditions stipulated by the dimensions of the printed circuit board, etc.,
The control means controls the gripping and releasing of the hack-up bin gripping means, and controls the positioning of the hole in the cenotening plate and the positioning of the hack-up bin storage box, so that the hack-up bin is automatically stored in the hack-up bin. Grasp a predetermined backup pin from the box and transfer the gripped hack-up bin to a predetermined hole in the sesoten plate.

[Embodiment] FIG. 1 shows a partial configuration of an embodiment of an automatic bank-up bin exchange device for an electronic component mounting machine according to the present invention. The automatic bank-up bin exchange device shown in FIG. A moving table 10 that is moved in the X direction or the Y direction by. The setting plate 11 placed on this moving table 10, the backup pin storage box 17 provided beside this setting plate 11 (not shown in FIG. 1, see FIG. 2), and the upper part of this moving table 10. A fixed block 20. is fixed to a fixed support member 19 provided in the fixed block 20. A bottle gripping portion 21 fixed to the lower part of this fixed block 20. A lifting mechanism 22 is provided on the upper part of the fixed block 20 and lifts and lowers the bottle gripping portion 21.

The setting plate 11 has a plurality of holes, for example, hole 1.
10 to 113 are drilled, hack-up bins 12 are inserted into these holes, and printed bases Fi, 14 are placed on the inserted bank-up bins and guide rails 15.16.
is placed.

In order to place the printed circuit board 14 on the backup pins 12, the bank amplifier bin automatic exchange device of the present invention places a predetermined one of the plurality of bank up bins housed in the backup pin storage box 17 into a predetermined hole of the setting plate 11. Automatically insert (transfer) into.

In this embodiment, the movable table 10 is moved into two
It is configured to move in the dimensional direction, X-Y direction.

This control device utilizes a control mechanism of an electronic component mounting machine that positions the printed circuit board 14 by moving the moving table 10 when mounting the electronic component at a predetermined position on the printed circuit board 14. Therefore, in the positioning control described below, the moving table 10 is moved using the existing positioning control device of the electronic component mounting machine.

In order to grip and release the hack-up bottle, the bottle gripping portion 21 has a mechanism as shown in FIG.

The bottle gripping portion 21 consists of an opening/closing jaw 211 for gripping and releasing a bank-up bottle, and a cylinder unit 212 above the opening/closing jaw 211. That is, the opening/closing jaw 211 grips and releases the backup pin by opening and closing in the direction A in the figure. Furthermore, a lifting mechanism 22 is provided at the upper part of the fixed block 20 in order to lift and lower the opening/closing jaw 211 that grips and releases the backup pin.

The control operation of the automatic backup pin exchange device according to the embodiment of the present invention will be described with reference to FIG.

Step Sol 4'" The control device first inputs backup pin transfer conditions defined by the dimensions of the printed circuit board 14 at that time. This backup pin transfer condition determines which backup pin in the backup pin storage box 17 should be selected. Regarding which hole in the setting plate 11 to transfer, for example, the coordinates where the backup pin is placed in the backup pin storage box 17 and the coordinate position to transfer the backup pin in the setting plate 11, or , expressed by their respective large numbers.

The input transfer conditions are stored in the memory within the control device.

In the following explanation, the first backup pin transfer is carried out in the hack amplifier pin storage box 1 as shown in FIG. 3(a).
7 backup pin 180 setting plate 11
The case of transferring to the hole 119 will be exemplified.

Soup 302 First, the control device drives the moving table 10 to position the backup pin 180 housed in the bank up pin storage box 17 so that it is directly below the opening/closing jaw 211.

Soup 5O3 13 As shown in FIG. While opening the bank amplifier pin 180
lower towards. - Then, when the opening/closing jaw 211 descends to a position where it can grip the backup pin 180, the opening/closing jaw 211 is closed and the backup pin 180 is gripped.

Soup SO4 The control device energizes the lifting mechanism 22 to lower the backup pin 1.
The opening/closing jaw 211 holding the opening/closing jaw 80 is raised. Subsequently, the control device drives the movable table 10 to position the hole 119 of the seso-ten plate 11 directly below the opening/closing jaw 211.

When the opening/closing jaw 211 is located directly above the hole 119 as shown in FIG. is lowered, and the backup pin 180 is further pushed into the hole 119.

With this, the backup pin 180 in the backup pin storage box 17 has been transferred to the hole 119 of the setting plate 11.

Soup SO6 The control device judges the input transfer conditions and if it is necessary to transfer the tertiary backup pin.

Returning to step SO2, the above-described transfer operation is repeated.

Step SO7 When all the backup pins have been manually transferred, the control device drives the moving table 1o to return the setting plate 11 to its initial position.

In this state, the printed circuit board 14 is placed on the transferred bank up pins via the printed circuit board guide rails 15 and 16 with a predetermined number of backup pins transferred to the predetermined holes of the seso-ten plate 11. , automatic mounting of electronic components is performed as before.

In the above embodiment, the case has been described in which the bottle gripping portion 21 is fixed and the setting plate 11 and the bank-up bin storage box 17 are moved by the moving table 1o. Pin storage box 17 and seso tengu plate 11
It can also be configured to be movable between.

Furthermore, in the above examples, the transfer of the bank-up bin from the bank-up pin storage box 17 to the hole in the setting plate 11 was described, but conversely, the transfer of the bank-up bin from the hole in the setting plate 11 to the bank-up bin storage box 17 is also possible. The same is true.

Furthermore, the backup pins transferred to the holes of the seso-ten plate 11 may be controlled to be replaced with each other.

(Effects of the Invention) As described above, according to the backup pin automatic exchange device of the present invention, hack-up bins are automatically exchanged, which saves labor, shortens replacement work, and improves work efficiency. .

Also, with this backup pin automatic replacement.

The electronic component mounting machine is now capable of fully automatic operation, and the mounting of electronic components is entirely automated.

Furthermore, according to the hack-up bin automatic exchange device of the present invention, there is no need to transfer erroneous backup pins, and the reliability of bank-up bin transfer is improved.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the configuration of an automatic hack-up bin exchange device for an electronic component mounting machine according to an embodiment of the present invention. FIG. 2 is a detailed view of the opening/closing jaw shown in FIG. 1. 3(a) to 3(C) are diagrams showing the operation of the drive mechanism of the backup pin automatic exchange device of FIG. 1. FIG. 4 is a flowchart showing the operation of the control device according to the embodiment of the present invention. (Explanation of symbols) 10...Movement table, 11...Setting plate,
12. Backup pin, 110~113.119.
- Hole, 14... Printed circuit board. 15.16...Guide rail, 17...Huck-up bin storage box, 19...Fixed support member, 20...Fixed block, 21...Bin gripping part, 22...Kidori elevation mechanism, 211...
・Opening/closing jaw.

Claims (1)

[Claims] 1. An automatic backup pin replacement device for an electronic component mounting machine that transfers a backup pin for mounting a printed circuit board on which an electronic component is mounted to a predetermined hole of a setting plate, the backup pin being arranged near the setting plate, a backup pin storage box containing a backup pin, a backup pin gripping means for gripping the backup pin, and the backup pin gripping means grips a predetermined backup pin in the backup pin storage box, and the backup pin is gripped in a predetermined hole of a setting plate. An automatic backup pin exchange device for an electronic component mounting machine, comprising a control means for transferring backup pins.