JPH04174588A - Flexible film for connection - Google Patents
Flexible film for connectionInfo
- Publication number
- JPH04174588A JPH04174588A JP30224090A JP30224090A JPH04174588A JP H04174588 A JPH04174588 A JP H04174588A JP 30224090 A JP30224090 A JP 30224090A JP 30224090 A JP30224090 A JP 30224090A JP H04174588 A JPH04174588 A JP H04174588A
- Authority
- JP
- Japan
- Prior art keywords
- film
- melting point
- connection
- polyester
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002844 melting Methods 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 21
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003063 flame retardant Substances 0.000 claims abstract description 12
- 229920000728 polyester Polymers 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 3
- 230000008018 melting Effects 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 12
- 239000010408 film Substances 0.000 abstract description 28
- 238000013508 migration Methods 0.000 abstract description 7
- 230000005012 migration Effects 0.000 abstract description 7
- 239000010409 thin film Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 229920006267 polyester film Polymers 0.000 abstract description 5
- 239000012212 insulator Substances 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 2
- 239000000155 melt Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は接続用フレキシブルフィルムに関し、特に回路
基板やディスプレイパネルを含む電子部品の高信頼性で
低価格の接続用フレキシブルフィルムに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible film for connection, and particularly to a flexible film for connection that is highly reliable and inexpensive for electronic components including circuit boards and display panels.
従来の接続用フレキシブルフィルムは、第４図、（ａ）
、（ｂ）に示すように、絶縁フィルム１上にパターニン
グされた導体薄膜３が形成され、端子接続部１５及び回
路部品実装部を除き、接着剤５により絶縁フィルム２が
貼り合わされ、端子接続部１５には異方性導電体４が形
成されていた。The conventional flexible film for connection is shown in Fig. 4 (a).
, as shown in (b), a patterned conductive thin film 3 is formed on the insulating film 1, and the insulating film 2 is bonded with adhesive 5 except for the terminal connecting part 15 and the circuit component mounting part, and the terminal connecting part 15, an anisotropic conductor 4 was formed.
この端子接続部１５が回路基板の端子接続部や、第５図
（ａ）、（ｂ）に示すディスプレイパネル等のＡ’ｇ端
子］３へ熱圧着することにより接続していた。This terminal connection part 15 was connected to the terminal connection part of the circuit board or the A'g terminal] 3 of the display panel shown in FIGS. 5(a) and 5(b) by thermocompression bonding.
異方性導電体４は、小さな半田粒１１が一様に分布する
熱硬化性樹脂１２よりなり、硬化温度以上に加熱、圧着
することにより、第５図（ｂ）に示すように、Ａｇ端子
１３でのみ半田粒１１により導通が取れ、その化ガラス
基板１４の露比している部分は、熱硬化性樹脂１２によ
り接着されるが横方向の導通が取れないなめ絶縁となり
、異方性導電体として機能する。The anisotropic conductor 4 is made of a thermosetting resin 12 in which small solder particles 11 are uniformly distributed, and is heated to a temperature higher than the curing temperature and crimped to form an Ag terminal as shown in FIG. 5(b). Conductivity is established only at 13 by the solder grains 11, and the exposed portion of the glass substrate 14 is bonded with the thermosetting resin 12, but lateral conductivity cannot be established, resulting in anisotropic conduction. It functions as a body.
この従来の接続用フレキシブルフィルムでは、端子接続
部に高価な異方性導電体を使用しているのでコスト高と
なる欠点があった。This conventional connection flexible film uses an expensive anisotropic conductor in the terminal connection portion, which has the disadvantage of increasing costs.
又、ディスプレイパネル等のＡｇ端子部へ熱圧着しなと
き、耐湿評価でマイグレーションが生じ易い欠点があっ
た。これは異方性導電体が硬化したとき熱硬化性樹脂と
内部に分布している半田粒との間に隙間が生じ易く、そ
こに水分が入り込むのではないかと推定する。Furthermore, when it is not thermocompression bonded to the Ag terminal portion of a display panel, etc., there is a drawback that migration is likely to occur in a moisture resistance evaluation. It is assumed that this is because when the anisotropic conductor is cured, gaps are likely to be formed between the thermosetting resin and the solder grains distributed inside, and moisture may enter there.
本発明の目的は、安価で耐湿性に優れ、マイグレーショ
ンの発生を防止できる接続用フレキシブルフィルムを提
供することにある。An object of the present invention is to provide a flexible connection film that is inexpensive, has excellent moisture resistance, and can prevent migration.
本発明は、回路部品とディスプレイパネルを含む電子部
品の端子部間を電気的に接続する端子接続部と、絶縁フ
ィルム上にバターニングされた導体回路とを有し前記絶
縁フィルム上にＩＣを含む回路部品を実装する接続用フ
レキシブルフィルムにおいて、前記絶縁フィルム上の前
記導体回路の前記端子接続部に形成された低融点半田層
と、該低融点半田層を残した前記端子接続部が難燃性て
かつ少くとも２００℃以下の融点をもつ絶縁体層とから
成っている。The present invention includes a terminal connection part that electrically connects terminal parts of an electronic component including a circuit component and a display panel, and a conductor circuit patterned on an insulating film, and includes an IC on the insulating film. In a flexible connection film for mounting circuit components, a low melting point solder layer formed on the terminal connection portion of the conductor circuit on the insulating film and the terminal connection portion in which the low melting point solder layer remains are flame retardant. and an insulating layer having a melting point of at least 200° C. or lower.
次に、本発明の実施例について図面を多照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）、（ｂ）、（ｃ＞は本発明の第１の実施例
の平面図及びそのＡ−Ａ′緑断面図、Ｂ−Ｂ’線断面図
である。FIGS. 1(a), (b), and (c) are a plan view of a first embodiment of the present invention, a cross-sectional view taken along the line A-A', and a cross-sectional view taken along the line B-B'.
第１の実施例は、第１図（ａ）〜（ｃ）に示すように、
ポリエステルフィルム６上にバターニングされたＣｕｆ
ｆ膜８をＣｕめつき又はＣｕ箔を接着剤により貼付けた
ものをホトリソグラフィの手法でバターニングしたり、
厚膜プリントで形成し、低融点半田層９の形成部を除き
難燃性かつ２００℃以下の低融点ポリエステル層１０を
形成し、ポリエステルフィルム７を端子接続部１らを除
き熱溶着する。最後に、端子接続部１５のＣｕ薄膜８上
に低融点半田層９を電気半田めっき等により形成する。The first embodiment, as shown in FIGS. 1(a) to (c),
Cuf buttered on polyester film 6
The f-film 8 is plated with Cu or a Cu foil is pasted with adhesive, and then buttered by photolithography.
It is formed by thick film printing, and a flame retardant and low melting point polyester layer 10 of 200° C. or less is formed except for the portion where the low melting point solder layer 9 is formed, and the polyester film 7 is heat welded except for the terminal connecting portion 1 and the like. Finally, a low melting point solder layer 9 is formed on the Cu thin film 8 of the terminal connection portion 15 by electrical solder plating or the like.
第２図（ａ）、（ｂ）は第１図の接続用フィルムをディ
スプレイパネル等のＡｇ端子へ熱圧着する方法を説明す
る断面図である。FIGS. 2(a) and 2(b) are cross-sectional views illustrating a method of thermocompression bonding the connection film shown in FIG. 1 to an Ag terminal of a display panel or the like.
第２図（ａ）、（ｂ）に示すようにディスプレイパネル
等のガラス基板１４上に形成されたＡｇ端子１３と接続
用フレキシブルフィルムの低融点半田層９との位置合わ
せを行ない、接続用フレキシブルフィルムの端子接続部
１５をおしつけ、難燃性かつ低融点ポリエステル層１０
及び低融点半田層９の溶融点以上に加熱圧着する。尚、
難燃性かつ低融点ポリエステル層１０と低融点半田層９
の溶融温度を近づけておけば作業し易くなる。このとき
作業温度は、ガラス基板１４が熱衝撃で割れないよう２
００℃以下としな。As shown in FIGS. 2(a) and 2(b), the Ag terminal 13 formed on the glass substrate 14 of a display panel etc. and the low melting point solder layer 9 of the flexible film for connection are aligned, and the flexible film for connection is The terminal connection part 15 of the film is pressed, and the flame retardant and low melting point polyester layer 10 is applied.
and heat and press to a temperature higher than the melting point of the low melting point solder layer 9. still,
Flame retardant and low melting point polyester layer 10 and low melting point solder layer 9
It will be easier to work if the melting temperatures of the two are kept close to each other. At this time, the working temperature is set to 2.
Keep it below 00℃.
尚、ポリエステル層１０は、それ自体は難燃性でもなく
、又、低融点のものでもないので他の難燃物質や低融点
の物質の混合や分子量を小さくすること等により、難燃
性かつ低融点のポリエステルを主成分とする絶縁体とし
ている。The polyester layer 10 itself is neither flame retardant nor has a low melting point, so it can be made flame retardant and non-flammable by mixing other flame retardant substances or low melting point substances, reducing the molecular weight, etc. The insulator is mainly composed of low melting point polyester.
このようにすることにより、異方性導電体のような高価
なものを使用しないためコスト低減が可能となり、かつ
Ａｇ端子１３間は水を通さないポリエステルを基本材質
とした物質で溶着されているため水分が入りにくく、マ
イグレーションの改善された接続用フレキシブルフィル
ムを提供できた。By doing this, it is possible to reduce the cost because expensive items such as anisotropic conductors are not used, and the Ag terminals 13 are welded with a substance whose basic material is polyester, which does not allow water to pass through. As a result, we were able to provide a flexible connection film that prevents moisture from entering and has improved migration.
第３図（ａ）、（ｂ）、（ｃ）は本発明の第２の実施例
の平面図及びそのｃ−ｃ’線断面図、Ｄ−Ｄ′線断面図
である。FIGS. 3(a), 3(b), and 3(c) are a plan view of a second embodiment of the present invention, a sectional view taken along line CC', and a sectional view taken along line D-D'.
第２の実施例は、第２図（ａ）〜（ｃ）に示すように、
前述の第１の実施例との相違部は、難燃性かつ低融点の
絶縁体１０を端子接続部１５の電気的接続部の周囲を全
てかこむよう形成した点である。これに従ってＣｕ薄Ｍ
８は、端まで前述の第１の実施例と同様に形成してもよ
いし、第３図＜ｂ）に示すように、必要部分のみとして
も良い、！気的接続部には低融点半田を電気めっき法に
て形成し、低融点半田層９とした。The second embodiment, as shown in FIGS. 2(a) to (c),
The difference from the first embodiment described above is that a flame-retardant and low-melting point insulator 10 is formed so as to completely surround the electrical connection part of the terminal connection part 15. According to this, Cu thin M
8 may be formed in the same manner as in the first embodiment described above up to the end, or only the necessary portion may be formed as shown in FIG. 3<b). A low melting point solder was formed on the gaseous connection portion by electroplating to form a low melting point solder layer 9.
このようにすることにより、前述の第１の実施例より更
に端子接続部１５に水分等が入り込まない構造とするこ
とができるため、Ａｇ端子１３でのマイグレーションを
改善することができる。By doing so, it is possible to create a structure in which moisture and the like do not enter the terminal connecting portion 15 even more than in the first embodiment described above, so that migration at the Ag terminal 13 can be improved.
以上説明したように本発明は、水分を通さないポリエス
テルを基本材質とした難燃性がつ低融点の絶縁体を接着
剤として用い、低融点半田により導通をとるようにした
端子接続部をもつ接続用フレキシブルフィルムを用いる
ことにより、特に、耐湿評価の必要なディスプレイパネ
ル等のＡｇ端子において水分が入りにくいため、従来の
ものよりマイグレーション特性が改善され、がっ、従来
使用していた異方性導電体のような高価なものを使用し
ないためコスト低減が可能となる効果を有する。As explained above, the present invention has a terminal connection part that uses a flame-retardant, low-melting point insulator made of moisture-impermeable polyester as an adhesive as an adhesive, and establishes electrical conductivity with a low-melting point solder. By using a flexible film for connection, it is difficult for moisture to enter, especially in Ag terminals such as display panels that require moisture resistance evaluation, so migration characteristics are improved compared to conventional ones, and the anisotropy that was previously used is improved. Since expensive items such as conductors are not used, the cost can be reduced.
第１図（ａ）、（ｂ）、（ｃ）は本発明の第１の実施例
の平面図及びそのＡ−Ａ’線断面図、Ｂ−Ｂ’線断面図
、第２図（ａ＞、（ｂ）は第１図の接続用フレキシブル
フィルムをディスプレイパネル等のＡｇ端子へ熱圧着す
る方法を説明する断面図、第３図（ａ）、（ｂ）、（ｃ
）は、本発明の第２の実施例の平面図及びそのｃ−ｃ’
線断面図、Ｄ−Ｄ’線断面区、第４１１（ａ）、（ｂ）
は従来の接続用フレキシブルフィルムの一例の平面図及
びそのＥ−Ｅ’線断面図、第５図（ａ）。
（ｂ）は従来の接続用フレキシブルフィルムの一例をデ
ィスプレイパネル等のＡｇ端子へ熱圧着する方法を説明
する断面図である。
１．２・・・絶縁フィルム、３・・・導体薄膜、４・・
・異方性導電体、５・・・接着剤、６．７・・・ポリエ
ステルフィルム、８・・・Ｃｕ薄膜、９・・・低融点半
田層、１０・・・ポリエステル層、１１・・・半日粒、
１２・・・熱硬化性樹脂、１３・・・Ａｇ端子、１４・
・・ガラス基板、１５・・・端子接続部。FIGS. 1(a), (b), and (c) are a plan view of the first embodiment of the present invention, its sectional view taken along line AA', sectional view taken along line BB', and FIG. , (b) is a sectional view illustrating a method of thermocompression bonding the flexible connection film shown in Fig. 1 to an Ag terminal of a display panel, etc., and Figs. 3 (a), (b), (c)
) is a plan view of the second embodiment of the present invention and its c-c'
Line sectional view, DD' line sectional view, No. 411 (a), (b)
FIG. 5(a) is a plan view and a cross-sectional view taken along the line E-E' of an example of a conventional flexible film for connection. (b) is a cross-sectional view illustrating a method of thermocompression bonding an example of a conventional connection flexible film to an Ag terminal of a display panel or the like. 1.2... Insulating film, 3... Conductor thin film, 4...
- Anisotropic conductor, 5... Adhesive, 6.7... Polyester film, 8... Cu thin film, 9... Low melting point solder layer, 10... Polyester layer, 11... half day grain,
12...Thermosetting resin, 13...Ag terminal, 14...
...Glass substrate, 15...terminal connection part.
Claims (2)
子部間を電気的に接続する端子接続部と、絶縁フィルム
上にパターニングされた導体回路とを有し前記絶縁フィ
ルム上にＩＣを含む回路部品を実装する接続用フレキシ
ブルフィルムにおいて、前記絶縁フィルム上の前記導体
回路の前記端子接続部に形成された低融点半田層と、該
低融点半田層を残した前記端子接続部が難燃性でかつ少
くとも２００℃以下の融点をもつ絶縁体層とから成るこ
とを特徴とする接続用フレキシブルフィルム。1. A terminal connection part that electrically connects terminal parts of an electronic component including a circuit component and a display panel, and a conductor circuit patterned on an insulating film, and a circuit component including an IC is mounted on the insulating film. In the flexible film for connection, the low melting point solder layer formed on the terminal connection portion of the conductor circuit on the insulating film and the terminal connection portion with the low melting point solder layer remaining are flame retardant and at least 200% A flexible connection film characterized by comprising an insulating layer having a melting point of ℃ or less.
を特徴とする請求項１記載の接続用フレキシブルフィル
ム。2. 2. The flexible connecting film according to claim 1, wherein the basic material of the insulating layer is polyester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30224090A JPH04174588A (en) | 1990-11-07 | 1990-11-07 | Flexible film for connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30224090A JPH04174588A (en) | 1990-11-07 | 1990-11-07 | Flexible film for connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04174588A true JPH04174588A (en) | 1992-06-22 |
Family
ID=17906643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30224090A Pending JPH04174588A (en) | 1990-11-07 | 1990-11-07 | Flexible film for connection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04174588A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327873A (en) * | 2003-04-28 | 2004-11-18 | Asahi Glass Co Ltd | Connection structure of reed electrode and flexible wiring board |
-
1990
- 1990-11-07 JP JP30224090A patent/JPH04174588A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327873A (en) * | 2003-04-28 | 2004-11-18 | Asahi Glass Co Ltd | Connection structure of reed electrode and flexible wiring board |
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