JPH04173580A - Electronic component chip storage cassette - Google Patents

Abstract

PURPOSE:To increase the storage density of electronic component chips by a method wherein a plurality of cavities are provided to extend radially in a disk shaped case, and a plurality of electronic component chips are stored in each cavity in a specified direction respectively. CONSTITUTION:An electronic component chip storage cassette 1 is equipped with a disk shaped case 2. In the case 2, a plurality of cavities 3 are provided in such a manner that they extend radially. Each cavity 3 is given, e.g. by a groove formed on one main surface of the case 2. Therefore, a lid 4 is used to close the upper surface opening of each cavity 3. Respective cavities 3 form linear shapes which extend in the radial direction of the disk shaped case 2. A chip discharge port 9 has a size which permits passing through of an electronic component chip 5 which is stored in the cavity 3. In the meantime, a vent hole 10 which is aligned with a specified cavity 3 is provided on the inner peripheral wall 8 of the lid 4. For example, compressed air is induced in the cavity 3 through this vent hole 10.

Description

Detailed Description of the Invention [Industrial Application Fields] This invention is applicable not only to packaging and transportation of electronic component chips, but also to electronic components such as chip mounting machines that mount electronic component chips onto printed circuit boards, etc. The present invention relates to an electronic component chip storage cassette which also provides a form suitable for use in supplying a large number of electronic component chips to an apparatus for handling chips.

In this specification, the term "electronic component chip" includes passive components, active components, and other electrical components, and includes not only chip-shaped electronic components as finished products but also electronic component chips as semi-finished products. Also includes.

[Prior Art] The applicant of the present application has proposed a method for supplying a plurality of electronic component chips to an apparatus for handling electronic component chips, as described in, for example, Japanese Unexamined Patent Publication No. 63-272686. We proposed an electronic component chip storage cassette. The above-mentioned electronic component chip storage cassette basically includes a plurality of electronic component chips and a case having a storage space therein for randomly storing the electronic component chips.

Such electronic component chip storage cassettes can be used as is.
Not only is it used as a packaging form when electronic component chip manufacturers ship electronic component chips, but electronic component chip consumers also use it to attach multiple electronic component chips to chip mounting machines. It can be applied to supply component chips to a chip mounting process.

[Problems to be Solved by the Invention] For example, in a chip mounting process, electronic component chips are picked up one by one by a suitable chuck mechanism and mounted as they are on a printed circuit board or the like in a predetermined orientation. At this time, the electronic component chip to be picked up by the chuck mechanism must be oriented in a predetermined direction in advance.

When using the conventional electronic component chip storage cassette described above to supply electronic component chips to a chip mount machine, a separate alignment device is required to orient the multiple electronic component chips in a predetermined direction. It is. because,
This is because, in the storage space of a conventional cassette, electronic component chips are merely stored in a random state, and the electronic component chips ejected therefrom are oriented in an arbitrary direction.

On the other hand, if the electronic component chip stored in the electronic component chip storage cassette is already oriented in a predetermined direction, in the subsequent handling of the electronic component chip,
There is no need to operate these to direct them in a predetermined direction,
For example, the chip mounting process can be carried out efficiently, and a separate alignment device is not particularly required, so that the chip mounting machine can be simplified.

Therefore, an object of the present invention is to provide an electronic component chip storage cassette having the above-mentioned advantages.

[Means for Solving the Problems] An electronic component chip storage cassette according to the present invention is provided with a plurality of electronic component chips and a cavity for storing the plurality of electronic component chips in a state where each of the plurality of electronic component chips is oriented in a predetermined direction. Includes a case.

Further, the case has a disc shape, and a plurality of cavities are provided so as to extend radially in the disc-shaped case, and each cavity has a plurality of electronic component chips each extending in a predetermined direction. It is stored facing up.

[Function] According to the electronic component chip storage cassette according to the present invention, a plurality of electronic component chips can be sequentially ejected from the end of each cavity while facing in a predetermined direction. Furthermore, by rotating the disc-shaped case, each of the plurality of cavities can be brought to a predetermined position one after another. Therefore, all the electronic component chips housed in each of the plurality of cavities can be taken out from the same position.

[Effects of the Invention] As described above, according to the present invention, all electronic component chips housed in all cavities can be taken out from the same position while being oriented in a predetermined direction. The electronic component chips taken out in this manner can be brought directly to a process for handling electronic component chips, such as a chip mounting process. Therefore, it is possible to improve the efficiency of the process of handling electronic component chips such as the chip mounting process, and it is also possible to omit a special alignment device, so it is possible to simplify the equipment that handles electronic component chips such as a chip mount machine. can be achieved.

Further, in the disc-shaped case, since the plurality of cavities are distributed so as to extend radially, a large number of cavities can be arranged within a case of limited size. In this manner, the storage density of electronic component chips can be increased, so that the number of electronic component chips stored in one cassette can be increased.

Furthermore, when cavities are provided to extend radially in a disc-shaped case, it is easy to give each cavity a linear shape.

Such a linear cavity allows smooth movement of the electronic component chip within the cavity. Therefore, the electronic component chips do not become clogged within the cavity, and the supply of electronic component chips can be stabilized, highly reliable, and speeded up.

[Embodiment] FIG. 1 is a front view showing an electronic component chip storage cassette 1 according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1. The electronic component chip storage cassette 1 includes a disc-shaped case 2. A plurality of cavities 3 are provided in the case 2 so as to extend radially.

In this embodiment, each cavity 3 is provided by a groove formed in one main surface of the case 2.

Therefore, the lid 4 is used to close the top opening of each cavity 3.

In this embodiment, each of the cavities 3 has a linear shape extending in the radial direction of the disc-shaped case 2. Each cavity 3 accommodates a plurality of electronic component chips 5, each oriented in a predetermined direction. In addition, in FIGS. 1 and 2, for convenience of illustration, the width and height of the cavity 3 and the size of the electronic component chip 5 are thicker than the size of the case 2 (although not shown). ,
In reality, the width and height of the cavity 3 and the size of the electronic component chip 5 are compared to the size of the case 2.
It is smaller than what is shown.

Therefore, in reality, more cavities 3 than the number shown are provided, and each cavity 3 accommodates a larger number of electronic component chips 5 than the number shown.

Although the aforementioned lid 4 is partially cut away in FIG. 1, it has a disk shape similar to the case 2 as a whole. As clearly shown in FIG. 2, the lid 4 has a main wall 6 that closes the upper opening of the cavity 3, and an outer peripheral wall 7 that closes the outer end of the cavity 3 in the length direction and an inner peripheral wall 6. It has an inner circumferential wall 8 that closes the side end.

Also, as shown in the right half of FIG. 2, the outer peripheral wall 7 of the lid 4 is provided with one chip outlet 9 that is aligned with a particular one of the cavities 3. The chip outlet 9 has a size that allows the electronic component chip 5 housed in the cavity 3 to pass therethrough. On the other hand, the inner circumferential wall 8 of the lid 4 is provided with one air hole 10 which is aligned with the above-mentioned particular one of the cavity 3. For example, compressed air is introduced into the cavity 3 through this air hole 1o.

Furthermore, a center hole 11 is provided at the center of the case 2, into which a drive shaft 14 (FIG. 3) for rotating the case 2 is fitted.

In such an electronic component chip storage cassette 1, the lid 4 is fixed to the case 2 while the electronic component chip storage cassette 1 is being transported or, for example, before being installed in a chip mounting machine, and the chip ejection port 9 and the air The hole 1o is kept closed to prevent the electronic component chip 5 from spilling out.

Note that if the air hole 1o is smaller than the cross-sectional dimension of the electronic component chip 5, there is no need to intentionally close the air hole 1o.

On the other hand, for example, when installed on a chip mount machine,
The case 2 is made rotatable relative to the lid 4, and the chip outlet 9 and air hole 10 are opened.

The chip mounting process using the electronic component chip storage cassette 1 will be described below with reference to FIG.

In FIG. 3, the electronic component chip storage cassette 1 is shown with the main wall 6 of the lid 4 removed.

Regarding the cavity 3 provided in the case 2,
Only representative ones are shown.

Electronic component chip storage cassette 1 is chip mounting machine 1
It is mounted on the mounting base 13 of No. 2. At this time, the drive shaft 14 is fitted into the center hole 11 of the case 2, and the case 2 is brought into a state where it can be rotated intermittently in the direction shown by the arrow 15 by the drive shaft 14.

On the other hand, the lid 4 is fixed to the mounting base 13 with the straight line connecting the chip outlet 9 and the air hole 10 facing in the horizontal direction. A nozzle 16 is also arranged so that compressed air can be introduced through the air hole 10 into the cavity 3 aligned therewith.

A shutter 17 is provided on the mounting base 13.

The shutter 17 is rotatable back and forth about a shaft 18 as indicated by an arrow 19 . As a result, shutter 1
7 is a chip moving path 2 formed on the upper surface of the mounting table 13.
0 can be in a state where it is shut off or a state where it is opened. A compression spring 21 is provided in connection with the shutter 17;
The compression spring 21 always urges the shutter 17 to assume a blocking position. Further, in relation to the shutter 17, a push-up pin 22 is provided to reciprocate in the direction shown by an arrow 23. Push-up pin 2
2 pushes up the shutter 17, the shutter 17 is placed in a state where the chip movement path 20 is opened.

Further, on the mounting table 13, a suction bit 24 is placed at an arrow 25.
As shown, it is provided so that it can move back and forth. The suction bit 24 is provided with a suction groove 26 that forms a vacuum path between the suction bit 24 and the mounting base 13 . The left end of the suction groove 26 in FIG. 3 is open to the outside. The suction groove 26 is provided with vacuum suction from a vacuum source (not shown) via a suction passage 27 .

Above the mounting table 13, a suction chuck 28 is provided with an arrow 29
It is movably provided as shown in .

Next, a procedure for subjecting the electronic component chip 5 stored in the electronic component chip storage cassette 1 to a chip mounting process will be described.

A case 2 included in an electronic component chip storage cassette 1 is rotated by a predetermined angle in the direction indicated by an arrow 15 by a drive shaft 14, so that a specific cavity 3 is aligned with a chip outlet 9 and an air hole 10.

Next, compressed air is ejected from the nozzle 16, and the air hole lO
Compressed air is introduced into the cavity 3 through. As a result, the plurality of electronic component chips 5 in the cavity 3
is moved to the outer circumferential side of the case 2, and the electronic component chip 5 located at the outermost circumferential side is stopped by the shutter 17.

Next, the push-up pin 22 is operated to move upward, thereby rotating the shutter 17 in a counterclockwise direction. As a result, the chip movement path 20 becomes open.

In the above-mentioned state, the suction bit 24 is moved to the left in FIG. 3 to suction the electronic component chip 5 located on the outermost circumferential side, and then returns to the original position while retaining the electronic component chip 5 suctioned. be returned.

Next, the suction chuck 28 suction-holds the electronic component chip 5 that has been moved by the suction bit 24, and is operated as shown by an arrow 29 to place the electronic component chip 5 in a predetermined position on a printed circuit board (not shown). 5 is mounted.

After the above-described operation is repeated and all of the electronic component chips 5 in a particular cavity 3 are ejected, the case 2 is moved so that the next cavity 3 is aligned with the chip ejection port 9 and the air hole 10. is rotated by a predetermined angle. Even in this state, the above-described operation is repeated again.

Although the electronic component chips 5 housed in each cavity 3 are usually of the same type, electronic component chips 5 of different types may be housed in the cavity 3. In this case, different types of electronic component chips 5 may be stored in one cavity 3, or electronic component chips 5 of the same type may be stored in one cavity 3; There may be ways to change it depending on the situation. In any case, if the storage mode of the electronic component chips 5 is selected so that the electronic component chips 5 are ejected in the order in which they are mounted, one or a relatively small number of electronic component chip storage cassettes 1 can be used. , a chip mounting process can be performed. Therefore, for example, the distance that the suction chuck 28 must be moved can be shortened, so that the chip mounting process can be sped up and setup changes can be easily performed.

Further, in the illustrated embodiment, each cavity 3 extends linearly, but it may extend curvedly.

In addition, although the electronic component chip storage cassette 1 is oriented vertically in FIG. 3 when performing the chip mounting process, it may be oriented horizontally instead.

Further, in the illustrated embodiment, a cavity 3 is formed in the case 2 in the shape of a groove, and the upper opening of the cavity 3 is closed by a lid 4. This has the advantage of facilitating the manufacture of the electronic component chip storage cassette 1, but if such an advantage is not desired, a cavity closed in advance including the top opening may be provided in the case. You can do it like this.

In addition, the lid 4 is divided into a peripheral wall 6, an outer peripheral wall 7, and an inner peripheral wall 8, and while the peripheral wall 6 is fixed to the case 2, the outer peripheral wall 7 is
and the inner circumferential wall 8 may be rotatably combined with the case 2, respectively.

In this case, if the air hole 10 formed in the inner circumferential wall 8 has a size that does not allow the electronic component chip 5 to pass through, such an air hole 10 is provided corresponding to each cavity 3. However, the inner peripheral wall 8 may also be fixed to the case 2.

[Brief explanation of the drawing]

FIG. 1 is a front view showing an electronic component chip storage cassette 1 according to an embodiment of the present invention, with a lid 4 partially cut away. FIG. 2 is a sectional view taken along the line ■--■ in FIG. 1. FIG. 3 is a schematic cross-sectional view showing a state in which a chip mounting process is being performed using the electronic component chip storage cassette 1. In the figure, 1 is an electronic component chip storage cassette, 2 is a case, 3 is a cavity, 4 is a lid, 5 is an electronic component chip,
9 is a chip outlet, 10 is an air hole, and 11 is a center hole.

Claims (1)

[Claims] The case includes a plurality of electronic component chips, and a case provided with a cavity for accommodating the plurality of electronic component chips, each facing a predetermined direction, the case having a disc shape. None, a plurality of the cavities are provided to extend radially in the disc-shaped case, and each of the cavities accommodates a plurality of the electronic component chips, each oriented in a predetermined direction. , Electronic component chip storage cassette.