WO2004051730A1 - Parts feeder - Google Patents

Parts feeder Download PDF

Info

Publication number
WO2004051730A1
WO2004051730A1 PCT/JP2003/015228 JP0315228W WO2004051730A1 WO 2004051730 A1 WO2004051730 A1 WO 2004051730A1 JP 0315228 W JP0315228 W JP 0315228W WO 2004051730 A1 WO2004051730 A1 WO 2004051730A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
supply
tray
wafer
component supply
Prior art date
Application number
PCT/JP2003/015228
Other languages
French (fr)
Japanese (ja)
Inventor
Shoriki Narita
Kanji Hata
Shuichi Hirata
Satoshi Shida
Mamolu Nakao
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Priority to US10/537,406 priority Critical patent/US7731469B2/en
Priority to JP2004556853A priority patent/JP4425146B2/en
Publication of WO2004051730A1 publication Critical patent/WO2004051730A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Definitions

  • the present invention provides a wafer supply plate on which a plurality of wafer supply components among components mounted on a substrate are placed, and a tray for placing a component supply tray on which a plurality of tray supply components are placed.
  • the wafer supply parts and tray supply parts can be mounted on the component mounting device by using the plate for supplying light.
  • the present invention relates to a component supply device for supplying a component.
  • a wafer supply plate on which a wafer on which a plurality of wafer supply components among components mounted on a substrate are arranged, or a plurality of tray supply components is provided. Either one of the tray supply plates on which the arranged component supply trays are placed is selectively housed, and the wafer supply plate or the tray supply plate is taken out, and each of the tray supply plates is taken out. Wafer supply components or tray supply components are supplied to a mounting section of a component mounting apparatus or the like (see, for example, Japanese Patent Application Laid-Open No. 2000-91385).
  • the dicing wafer is used. It is necessary to expand. Therefore, the component supply device is provided with a device for performing the expanding. Further, it is necessary that the wafer supply component supplied from the expanded wafer is pushed up from the lower surface thereof so that it can be taken out. Therefore, the above-mentioned component supply device is also provided with a push-up device for performing this push-up operation.
  • the above-mentioned component supply tray placed on the above-mentioned component supply plate is set so that the respective tray supply components can be supplied. In such a case, it is not necessary to perform an operation such as expanding the wafer as described above.
  • the operation of enabling the supply of each component is different between the case where the wafer supply plate is stored in the component supply device and the case where the tray supply plate is stored in the component supply device.
  • the conventional component supply device there is no way to automatically cope with such a difference in the operation of supplying the respective wafer supply components and the operation of supplying the respective tray supply components.
  • the device for performing the expansion or the push-up device is not operated or the relevant device is not operated.
  • the problem was that the production efficiency in parts supply was significantly reduced because the operation was not affected by the operation and the components were replaced by the operator.
  • the wafer supply component or the tray supply component is mounted on the board first depends on the type of the board, etc.
  • the work of replacing the above-mentioned components in the above-mentioned component supply device and the respective plates stored in the above-mentioned component supply device are moved between the above-mentioned wafer supply plate and the above-mentioned tray supply plate.
  • the exchange work of replacement is performed, and there is a problem that such an operation is very troublesome for an operator, and significantly reduces the work efficiency.
  • the supply height position of each wafer supply component on the wafer supply plate and the tray is not the same height position. Therefore, it is necessary to supply the parts with the same supply height position even in the V and shift plates in a state where the respective parts can be supplied.
  • an object of the present invention is to solve the above-mentioned problem, and to provide a wafer supply plate for mounting a wafer on which a plurality of wafer supply components among components mounted on a substrate are arranged, and a plurality of trays.
  • a component for supplying the respective wafer supply components and the respective tray supply components to a mounting unit of the component mounting apparatus so that components can be mounted on the tray supply plate on which the component supply tray on which the supply components are arranged is placed.
  • the wafer supply plate and the tray supply plate can be mixed and stored, and the plate selected from the respective plates is the wafer supply plate or the tray supply plate. Regardless of which of the above, the above-mentioned parts can be automatically supplied from the above-mentioned selected plate.
  • An object of the present invention is to provide a component supply device capable of efficiently supplying components that can maintain good maintenance.
  • the present invention is configured as follows.
  • a wafer supply plate for mounting a wafer on which a plurality of wafer supply components among components mounted on a substrate are arranged, and a component supply plate on which a plurality of tray supply components are arranged
  • a component supply device that supplies the respective wafer supply components and the respective tray supply components in a component mountable manner by using a tray supply plate on which a tray is placed.
  • a plate placement device for enabling the tray supply components to be supplied comprising: a supply height of each of the wafer supply components by the wafer supply plate; and a respective one of the tray supply plates by the tray supply plate.
  • a component supply device that arranges and holds the above-mentioned plate so that the supply height of the tray supply component is substantially the same.
  • the plate placement device includes:
  • An elastic support member capable of supporting the placed plate from the lower surface side in the vicinity of an outer peripheral portion thereof, and having a variable support height position;
  • a plate pressing body for holding the plate by pressing the plate supported by the elastic support member from above in the vicinity of the outer peripheral portion so as to sandwich the plate between the elastic support member and the plate;
  • the pressing body elevating unit includes a supply height of each wafer supply component by the wafer supply plate supported by the elastic support member, and a supply height of each tray supply component by the tray supply plate.
  • the component supply device in which the plate pressing body is moved up and down so that the height is substantially the same, and the support height position of the elastic support member is changed.
  • the plate disposing device further includes a restricting portion for selectively restricting a lowering position of the plate pressing member by the pressing member elevating portion.
  • the restricting portion controls the plate pressing member so that the supply height of each tray supply component is substantially the same as the supply height of each wafer supply component.
  • a wafer supply plate for mounting a wafer on which a plurality of wafer supply components are arranged among components mounted on a substrate, and a component supply on which a plurality of tray supply components are arranged
  • a plate moving device that holds the plate releasably, removes the plate from the plate storage portion, and moves the plate disposing device so that it can be retained.
  • a plurality of elastic support members capable of supporting the arranged plate from the lower surface side in the vicinity of an outer peripheral portion thereof, and having a variable support height position;
  • a pressing body elevating unit that moves the plate pressing body up and down
  • a regulating unit for selectively regulating a lowering position of the plate pressing body by the pressing body elevating unit
  • the lowering position of the plate pressing body is regulated by the restricting portion, and the support height of the tray supply plate by the respective elastic support members is adjusted. Can be maintained,
  • the restriction of the lowering position by the restriction unit is released, and the respective elastic support members support the wafer supply plate.
  • a component supply device capable of lowering the plate pressing body by the pressing body elevating unit and expanding the wafer placed on the wafer supply plate.
  • the wafer supply plate comprises:
  • a wafer sheet to which the above-mentioned diced wafer is attached is attached,
  • the plate disposing device may be configured such that, in the wafer supply plate in a state where the wafer ring is supported by the respective elastic support members, an outer periphery of the wafer and the gap are provided.
  • An expanding member having an annular abutting portion capable of abutting on the lower surface of the wafer sheet between the inner periphery of the haring and the lower surface of the wafer sheet;
  • the plate pressing body is lowered by the pressing body elevating unit while the annular contact part of the expanding member is used as a fulcrum, and the wafer ring is pressed down to radially extend the wafer sheet, thereby obtaining the wafer.
  • a component supply device according to a fourth aspect, wherein the component supply device can be expanded.
  • the plate moving device comprises:
  • a holding unit moving unit that moves the holding unit so as to move the plate held by the holding unit from the plate storage unit to the plate placement device, based on a shape of the holding unit of the plate;
  • a plate identification unit for identifying whether the plate to be held is the wafer supply plate or the tray supply plate,
  • the component supply device according to a fourth aspect, wherein the regulation unit in the plate placement device regulates the lowered position of the plate pressing body based on the identification result of the plate identification unit.
  • the tray supply plate comprises:
  • the tray ring is supported by the respective elastic support members, and the tray ring is pressed between the plate pressing body and the respective elastic support members so as to sandwich the tray ring.
  • the tray supply plate can be held, and the restricting portion is configured to prevent the lower surface of the tray supply plate from coming into contact with the expanse member so that the plate pressing member is moved by the pressing member elevating portion.
  • a component supply device according to a fifth aspect, which regulates a lowered position.
  • the tray mounting part is
  • a fixed-side holding member capable of abutting on one end of the substantially square shape in the component supply tray having a substantially square shape in plan view; The end of the component supply tray in a state where the one end is in contact with the fixed-side holding member can be brought into contact with the end facing the one end, and the end is fixed.
  • a movable holding member that is movable to be biased toward the side holding member
  • the component supply device according to a seventh aspect, wherein the component supply tray is held at the tray mounting portion so that the component supply tray is held between the fixed-side holding member and the movable-side holding member.
  • At least one of the plurality of elastic support members has an end at an end thereof which is in contact with an end of the supported plate, and
  • the component supply device according to the fourth aspect having an inclined end for regulating a support position in a direction along the surface.
  • a contact portion capable of contacting a lower portion of the plate pressing member, wherein the contact portion is capable of regulating a lowering position of the plate pressing member by the contact;
  • a contact portion moving mechanism that moves the contact portion between a contact position where the contact portion contacts the plate pressing body and the ⁇ position where the contact is retracted;
  • a component supply device according to a fourth aspect is provided.
  • the pressing body elevating unit includes:
  • a cylinder section for raising or lowering the plate pressing body by supplying or discharging compressed air
  • An ascending and descending compressed air supply unit capable of supplying ascending or descending ascending or descending compressed air to the cylinder as the compressed air
  • the compressed air for holding which has a lower pressure than the compressed air for raising and lowering and holds the stop position of the plate pressing body when the lifting or lowering of the plate pressing body is stopped,
  • a holding compressed air supply unit that can be supplied to the cylinder unit as
  • a component supply device comprising: a compressed air selection valve that selectively supplies the compressed air for lifting or the compressed air for holding or the compressed air for holding to the cylinder portion.
  • the compressed air selection valve comprises: The mechanical contact makes it possible to detect the upper end position of the lifting and lowering of the plate pressing body, and when the upper end position is detected, selects the holding compressed air instead of the lifting and lowering compressed air.
  • the component supply device according to the eleventh aspect, wherein the component supply device is a mechanical lock valve for supplying the cylinder lock to the cylinder unit.
  • the plate storage section includes:
  • a storage unit elevating unit that raises and lowers the storage unit and positions one of the plates stored in the storage unit at a height position that can be held by the holding unit of the plate moving device.
  • the plate placement device is
  • the plate has a plate outlet opening through which the held one plate can pass together with the holding portion, and each of the plates stored in the storage body of the plate storage portion other than the one plate is the above-described plate.
  • the component supply device further comprising: a pop-out prevention plate having a plate regulating portion formed around the above-mentioned outlet portion, which can prevent the pop-out portion from being protruded from the storage body.
  • a supply device is provided.
  • the base is
  • An engagement portion that can be selectively engaged with the translation guide portion and the rotation guide portion; and the engagement portion is engaged with the translation guide portion, so that the base can be linearly moved. Movement is possible,
  • a component supply device according to a fourth aspect is provided.
  • the storage body of the plate storage portion individually supports each of the opposite ends of each of the plates, and removes each of the plates.
  • a plurality of sets of support guides disposed opposite to each other for guiding movement of the plate in a direction along the surface;
  • an inclined portion with respect to the direction of movement is formed at the insertion end of each of the support guide portions of the respective sets so as to correct the positional deviation between the support guide portions of the respective sets.
  • the hardness of the respective plates and the respective support guides at the mutual contact surfaces of the respective support guides is lower than that of the respective plates.
  • the present invention further provides the component supply device according to the sixteenth aspect or the seventeenth aspect, wherein the respective contact surfaces are formed.
  • the hardness of each of the plates and the respective supporting guides at the contact surface of each other is lower than that of the respective supporting guides.
  • the present invention further provides the component supply device according to the sixteenth aspect or the seventeenth aspect, wherein the respective contact surfaces are formed.
  • each of the support guide portions includes a roller portion rotatable along the surface of the end portion while supporting the end portion of each plate.
  • the plate pressing body has, on its lower surface, a plurality of support members that support the plate supplied to the plate placement device so as to be able to take out the plate,
  • a fourth embodiment further comprising: a plurality of biasing members for constantly biasing the plate to the respective support members or the respective elastic support members, regardless of the lowering position of the plate pressing body by the pressing body lifting / lowering unit.
  • a component supply device according to (1).
  • each of the biasing members enables the plate to be moved by the plate moving device, and biases the plates supported by the respective support members.
  • 21. The component supply device according to the 21st aspect, further comprising an urging roller portion rotatable along a surface of the plate.
  • each of the plates has an engagement portion engageable with the holding portion at a holding position on the upper surface side by the holding portion.
  • the storage body is disposed between the support guide portions of the respective sets, and is engaged with the respective plates, whereby the horizontal direction of the respective plates is improved.
  • the component supply device according to a sixteenth aspect, further comprising a plurality of posture guide units for guiding a supporting posture.
  • the storage body has a replacement door portion for each of the openable and closable plates, and each of the posture guide portions is provided inside the door portion.
  • a component supply device according to a twenty-fourth aspect is provided.
  • the component supply device according to the twenty-fifth aspect, wherein the storage body includes an open / close detection sensor for detecting opening / closing of the door.
  • the storage body has a plurality of fixing portions for fixing the support on the support surface to the base, and at least one of the fixing portions is formed of a conductive material.
  • a component supply device according to the fifteenth aspect, which has a function as a ground terminal portion.
  • the vertical position of the plate pressing body in the plate arranging device of the component supply device can be adjusted by the pressing body elevating unit.
  • the support height position of the elastic support member can be changed according to the type of the plate to be formed. Therefore, regardless of whether the plate to be arranged and supplied is a wafer supply plate force or a tray supply plate, the above described arrangement is performed with the supply heights of the components arranged on the respective plates being substantially the same. Each component can be supplied. Therefore, it is possible to selectively and automatically supply parts in an appropriate state according to the type of the plate while mixing the respective plates, and it is possible to efficiently supply the parts. it can.
  • the lowering position of the plate pressing body in the plate placement device can be selectively regulated by the regulation portion, the type of the plate placed in the plate placement device can be controlled. Accordingly, the lowering position can be regulated, and the supply heights of the wafer supply component and the tray supply component can be made substantially the same.
  • the lowering position of the plate pressing body in the plate placement device of the component supply device can be selectively regulated by the regulation portion, the plate placed in the plate placement device described above is provided.
  • the lowering position of the tray supplying plate can be reliably held by regulating the lowering position.
  • the lowering position of the wafer supplying plate can be controlled. By releasing the restriction on the position, it is possible to expand the wafer while securely holding the wafer supply plate. Therefore, irrespective of whether the plate to be arranged and supplied is the tray supply plate or the wafer supply plate, the above-mentioned respective plates are mixed and the appropriate plate is selected according to the type of the plate.
  • the holding operation and the expanding operation can be selectively and automatically performed, and the parts can be efficiently supplied.
  • the type of the plate is identified based on the shape of the holding portion of the plate when the plate is held and taken out of the plate storage unit. Can be performed. Further, based on the identification result, the lowering position of the plate pressing member can be selectively restricted in the restricting portion.
  • the lowering position of the plate pressing body is regulated so that the expanding member for expanding the wafer does not contact the lower surface of the tray supply plate, it is possible to prevent the expanding member from being damaged. Can be.
  • the plate disposing device since the plurality of elastic supporting members whose supporting height positions are variable are provided, the respective plates are supported in the vicinity of the outer peripheral portions of the respective plates. In addition to this, it is possible to freely change the supporting height position while performing the support in accordance with the elevating operation of the plate pressing body, and the above-described effect can be achieved.
  • at least one of the plurality of elastic support members is supported by an end portion of the supported plate at an end thereof, and a support position in a direction along a surface of the plate is provided. With the inclined end portion that regulates, the plate can be reliably and accurately held.
  • the tray mounting portion includes a fixed-side holding member and a movable-side holding member
  • the component-supply tray is held by the fixed-side holding member and the movable-side holding member from above the mounting position.
  • the component supply tray can be placed at the placement position described above, and the placement position can be maintained. Therefore, the area accommodation ratio of the component supply tray to the tray mounting portion of the tray supply plate can be improved, and more efficient component supply can be performed.
  • the pop-out prevention plate is installed on the plate disposing device side and is capable of opening and closing, the pop-out prevention plate can be moved by opening and closing, thereby improving maintainability. Can be done.
  • the ejecting portion is provided with a projection detecting portion capable of detecting the plate located in the extracting portion, the ejecting prevention plate is opened and moved during the maintenance or the like, and the ejection preventing plate is moved. Even if the function cannot be performed, the plate protruding from the storage body can be detected, and the maintenance can be improved while improving the safety.
  • a mechanism is provided that can perform a combination of linear movement and rotation when mounting or dismounting the plate storage unit in the component supply device. It is possible to securely accommodate and equip the storage section, or to easily and smoothly pull out the plate storage section from the space. Therefore, even when such a component supply device is arranged in a more compact space, the plate storage portion can be easily and smoothly put in and out, and the maintainability can be improved. it can.
  • the contact portions of the respective plates with the respective support guide portions have the smooth surface portion, the frictional force generated at the contact portions can be reduced, and the cut due to the contact wear. Generation of powder or the like can be prevented.
  • the generation of such swarf reduces the maintainability of the component supply device.
  • functional problems such as contamination of the mounting surface of each component with respect to the substrate or the like may occur, so that the frequency of occurrence of such problems can be significantly reduced.
  • a component supply device is provided. This makes it possible to improve the maintainability of the system and to achieve efficient parts supply.
  • the inclined portion with respect to the moving direction is formed at the insertion end portion of each set of support guide portions, the insertion position of each plate and the support by each support guide portion are formed. It is possible to correct the positional deviation between the position and the position, and to reliably and stably store the respective plates in the plate storage portion.
  • the formation of the above-mentioned inclined portion makes it possible to smoothly insert and move the above-mentioned plate along the above-mentioned respective support guide portions, and also to reduce the amount of the above-mentioned chips. Can contribute.
  • the respective support guides are arranged such that the hardness of the respective plates at the contact surfaces of the respective plates with the respective support guides is lower than that of the respective plates. Due to the formed whiskers, the amount of chips generated due to mutual contact can be reduced.
  • each of the support guides has a roller that can rotate along the surface of the end while supporting the end of the plate, the insertion movement of the plate can be performed more smoothly. can do.
  • the respective biasing members provided in the plate pressing member are configured such that the plate is always attached to the respective support member or the respective elastic supporting member regardless of the lowering position of the plate pressing member by the pressing member elevating unit.
  • the plate supported by the plate pressing body can be reliably prevented from vibrating due to the elevation of the plate pressing body. Therefore, the part jumps out due to the vibration. And the like can be reliably prevented, and stable component supply can be realized.
  • each of the urging members includes an urging roller, the urging does not hinder the movement of the plate.
  • each of the plates is provided with an engaging portion capable of engaging with the holding portion at a holding position on the upper surface side by the holding portion, the holding of the plate by the holding portion is further improved. It can be assured.
  • the storage body is disposed between the sets of the respective support guide portions, and is engaged with the respective plates, so that a plurality of postures that define the horizontal support posture of the respective plates are provided.
  • the guide portion With the provision of the guide portion, the storage posture of the plate in the storage body can be maintained in a normal state, and the storage and removal of the respective plates from the storage body can be performed smoothly.
  • each of the above-mentioned posture guide portions is provided inside the door portion of the above-mentioned storage body, by closing the door, the respective plates and the above-mentioned posture guide portions are connected.
  • the horizontal posture can be brought into a normal state.
  • the respective plates are stored in a normal posture only when the closing of the door is detected by the opening / closing detection sensor.
  • the storage posture of the plate can be efficiently managed.
  • the storage body has a plurality of fixing portions for fixing the support to a support surface to the base, and at least one of the fixing portions is formed of a conductive material and serves as a ground terminal portion.
  • FIG. 1 is a perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention
  • FIG. 2 is an enlarged semi-transparent perspective view of a component supply device included in the electronic component mounting device of FIG. 1,
  • FIG. 3 is a semi-transparent perspective view of a magazine cassette in the lifter device of the component supply device.
  • FIG. 4 is a perspective view of a wafer supply plate handled by the component supply device.
  • FIG. 5 is a perspective view of a tray supply plate handled by the component supply device
  • FIG. 6 is a perspective view of a cassette elevating unit in the lifter device.
  • FIG. 7 is a perspective view of a plate arrangement device of the component supply device.
  • FIG. 8 is a cross-sectional view showing a state where the wafer supply plate is arranged in the plate arrangement device.
  • FIG. 9 is a cross-sectional view showing a state in which the tray supply plate is arranged in the plate arrangement device.
  • FIG. 10 is a partially enlarged perspective view of the plate arrangement device
  • FIG. 11 is a schematic explanatory view of an intermediate stopper driving unit in the plate arrangement device
  • FIG. 12 is a perspective view showing a mounted state of the mechanical lock valve in the plate disposing device.
  • FIG. 13 is an air circuit of the lifting / lowering portion of the pressing body in the plate placement device.
  • FIG. 14 is a perspective view of a plate moving device in the component supply device.
  • FIG. 15 is a perspective view of the tray supply plate. It is a partial enlarged perspective view,
  • FIG. 16 is a schematic sectional view of the tray supply plate
  • FIG. 17 is a partially enlarged perspective view of the tray supply plate
  • FIG. 18 is a perspective view of the component supply device.
  • FIG. 19 is a perspective view of the protrusion prevention plate of the component supply unit.
  • FIG. 20 is a perspective view of the component supply device with the door provided with the pop-out prevention plate closed.
  • Fig. 21 shows the component supply device with the door provided with the pop-out prevention plate open.
  • FIG. 22 is a perspective view showing a relationship between a base and a base support frame in the lifter device
  • FIG. 23 is a schematic plan view showing the trajectory of the pull-out operation of the base
  • FIG. 24 is an enlarged semi-transparent perspective view of the component supply device according to the second embodiment of the present invention.
  • FIG. 25 is a sectional view of the side wall of the magazine cassette provided in the component supply device of FIG.
  • FIGS. 26A and 26B each show the groove of the magazine cassette
  • FIG. 26A is a side view of the groove
  • FIG. 26B is a front view of the groove of FIG. 26A.
  • FIG. 27 is an external perspective view of the tray supply plate.
  • FIG. 28 is a schematic cross-sectional view showing a state where the tray supply plate of FIG. 27 is supported by the grooves.
  • FIG. 29 is a partial cross-sectional view showing a form of a groove according to a modification of the second embodiment, showing a form of a groove provided with a roller,
  • FIG. 30 is a partial cross-sectional view showing a state in which a roller portion is provided on a plate pressing body.
  • FIG. 31 is a schematic cross-sectional view showing a state in which a tray supply plate is supported on each supporting portion of the plate pressing body. Yes,
  • FIG. 32 is a schematic cross-sectional view showing a state in which the tray supply plate is supported by the plate support section.
  • FIG. 33 is a schematic cross-sectional view showing a state in which the support of the tray supply plate by the plate support unit is released, and parts jump out.
  • FIG. 34 is a schematic cross-sectional view showing a state in which the tray supply plate is no longer supported by the plate support portion and a component jumps out.
  • FIG. 35 is an external perspective view of the plate placement device.
  • FIG. 36 is an external perspective view of an urging portion provided in the plate pressing body.
  • FIG. 37 is a schematic cross-sectional view showing a support state of the tray supply plate when the biasing unit of FIG. 36 is provided, showing a state in which the tray supply plate is supported by each support unit
  • FIG. 38 is a schematic cross-sectional view showing a support state of the tray supply plate when the urging unit of FIG. 36 is provided, and shows a state in which the tray supply plate is supported by each plate support unit.
  • FIG. 39 is a plan view of a tray supply plate having a long hole
  • FIG. 40 is a plan view of a chuck portion having a projection
  • FIG. 41 is a cross-sectional view at the tip of the chuck portion of FIG. 40.
  • FIG. 42 is a perspective view of a tray supply plate according to a modification of the second embodiment
  • FIG. 43 is a side view of the tray supply plate of FIG.
  • Fig. 44 Fig. 4 is a schematic explanatory view for explaining a problem that may occur when the plate is taken out by random access, in a state where the plate is inclined in the horizontal direction with respect to the plate taking out direction. Indicates that the plate has been removed,
  • FIG. 45 is a schematic explanatory view showing a state where the plate is accommodated in the magazine cassette in an oblique posture.
  • FIG. 46 is a schematic side view of a magazine cassette according to the third embodiment of the present invention.
  • FIG. 47 is an enlarged plan view of the attitude guide portion provided in the magazine cassette of FIG.
  • FIG. 48 is a side view of the magazine cassette of FIG.
  • FIG. 49 is a sectional view of the magazine cassette of FIG. 48 taken along the line V--Vf.
  • FIG. 50 is a schematic explanatory view showing a state where the plate stored in the magazine cassette of FIG. 46 is taken out.
  • FIG. 51 is a schematic perspective view of a comparative magazine cassette for describing a configuration of a magazine cassette according to a modification of the third embodiment.
  • FIG. 52 is a schematic perspective view of a magazine cassette according to a modification of the third embodiment
  • FIG. 53 is a schematic sectional view showing the configuration of the magazine cassette of FIG.
  • FIGS. 54A and 54B are views showing respective open ends for the opening / closing cover of the main body of the magazine cassette.
  • FIG. 54A shows the left end
  • FIG. 54B Indicates the right end
  • FIG. 55 is a flowchart showing the procedure of the plate replacement work process
  • FIG. 56 is a view showing the bottom of the magazine cassette.
  • FIG. 57 shows a modification of the work of attaching the component supply tray to the tray supply plate of FIG.
  • FIG. 58 is an enlarged side view of the tapered support portion.
  • An electronic component mounting apparatus which is an example of a component mounting apparatus that includes a component supply apparatus 4 that is an example of a component supply apparatus according to the first embodiment of the present invention and that mounts components supplied from the component supply apparatus 4 on a substrate
  • a perspective view of 101 is shown in FIG.
  • the overall configuration and operation of the electronic component mounting device 101 including the component supply device 4 will be described with reference to FIG. This is performed using
  • the electronic component mounting apparatus 101 is an apparatus that performs an mounting operation of mounting an electronic component 2 such as a chip component or a bare IC chip, which is an example of a component, on a substrate.
  • the electronic device 1 includes a component supply device 4 that accommodates the electronic components 2 in a supplyable manner, and a mounting unit 5 that performs a mounting operation of mounting each electronic component 2 supplied from the component supply device 4 on a substrate.
  • a wafer on which a plurality of wafer supply components 2w (an example of components) of a large number of electronic components 2 mounted on a substrate are placed is mounted on the upper surface thereof.
  • Supply plate and tray of many electronic components 2 above A part supply tray 2t (an example of a part) is arranged on a grid and a plurality of parts supply trays are placed on top of the tray.
  • a lifter device which is an example of a plate storage portion that is stored so that it can be supplied to the component supply device, is installed on the near side in the illustrated Y-axis direction of the component supply device 4.
  • the wafer supply plate or the tray supply plate when the wafer supply plate or the tray supply plate is not used in a limited manner, it is described as the respective plate, and the wafer supply component 2w or the tray supply component is used. If 2t is not used in a limited manner, it is described as electronic component 2.
  • the wafer supply component 2 w includes a bare IC chip formed mainly by dicing a wafer
  • the tray supply component 2 t includes the bare IC chip and the bare IC chip other than the bare IC chip.
  • IC chips for example, packaged IC chips
  • chip components for example, packaged IC chips
  • the component supply device 4 is provided with a plate disposition device 12 for disposing the respective plates selectively supplied from the lifter device 10 so that the electronic components 2 can be taken out from the respective components. I have.
  • the wafer supply plate is supplied from the lifter device 10 and placed on the plate placement device 12, the wafer supply plate is placed on the wafer supply plate in the plate placement device 12. The expanding operation is performed on the wafer that is in operation.
  • the component supply device 4 individually suctions and holds the electronic components 2 from the wafer or the component supply tray placed on the plate selectively placed on the plate placement device 12.
  • a reversing head device 14 is provided for moving the electronic component 2 held by suction in the vertical direction while moving it along the X-axis direction in the figure toward the mounting portion 5. Note that, instead of the case where the component supply device 4 is provided with such a reversing head device 14, an electronic component mounting device 100 is provided together with the component supply device 4 as a device having a different configuration from the component supply device 4. It may be the case that is provided for.
  • the mounting section 5 is provided with a mounting head section 20 for holding the electronic component 2 by suction and mounting it on a substrate. Also arranged along the X-axis direction The component supply position where the electronic component 2 held by the reversing head device 14 can be transferred to the mounting head unit 20 and the mounting operation of the electronic component 2 on the board
  • the mounting head unit 20 can be driven up and down by a moving means such as a voice coil motor, and can be pressed, moved by ultrasonic vibration energy, heat energy, etc.
  • a holding portion (not shown) configured to be able to apply the bonding energy of the electronic component 2 to the bonding portion between the electronic component 2 and the substrate, and applying the bonding energy while pressing the electronic component 2 against the substrate.
  • the X-axis opening pot 22 is provided with a moving mechanism (not shown) using, for example, a pole screw shaft portion and a nut portion screwed to the pole screw shaft portion. Further, as shown in FIG.
  • the substrate is moved in the X-axis direction and the Y-axis direction on the base 24 of the mounting section 5 below the mounting head section 20 and the X-axis opening pot 22.
  • An XY table 26 is provided, which is possible and positions the electronic component 2 on the board with respect to the mounting head 20.
  • the XY table 26 can be moved and driven by, for example, a servomotor in each of the X-axis direction and the Y-axis direction in the figure, and can be positioned by full-closed control using a rear air scale.
  • a substrate holding table 28 for removably holding and fixing the substrate is provided on the upper surface of the XY tape holder 26, a substrate holding table 28 for removably holding and fixing the substrate is provided.
  • the X-axis direction and the Y-axis direction are directions along the surface of the substrate and directions orthogonal to each other.
  • the electronic component mounting apparatus 101 includes a substrate transporting machine in a leftward direction in the X-axis direction at the end on the upper side of the base 24 in the Y-axis direction.
  • a substrate transfer device 30 that transfers the substrate along the direction B and supplies the substrate to the substrate holder 28 and discharges the substrate from the substrate holder 28 is provided.
  • the board transfer device 30 is an example of a loader unit that transfers and supplies a board from the right end of the electronic component mounting apparatus 101 in the illustrated X-axis direction to the board holding table 28 on the XY table 26.
  • an unloader 34 that is an example of an unloader section that transports and discharges the substrate to the end of the unloader 34.
  • the present embodiment is an example in which the XY tape holder 26 in the electronic component mounting apparatus 101 is also used as a substrate holding / moving device included in the substrate transfer device 30. Further, it is an example of a substrate holding / moving device for performing the above-described movement and holding of the XY table 26, the substrate support 28, and the force substrate. Further, instead of such a case where the substrate is shared, a substrate holding / moving device is provided in the substrate carrying device 30 separately from the XY table 26 in the electronic component mounting device 101. It may be.
  • the electronic component mounting apparatus 101 shown in FIG. 1 is a perspective view in a state where a casing cover covering the entire upper surface of the base 24 has been removed for the sake of convenience of description of the configuration. ing.
  • the board holding table 28 is moved by the XY table 26 so as to be located between the loader 32 and the unloader 34 on the base 24.
  • the board on which each of the electronic components 2 is to be mounted by the electronic component mounting apparatus 101 is, for example, mounted on the board transfer apparatus 30 by another apparatus adjacent to the electronic component mounting apparatus 101.
  • the substrate is supplied to the loader 32, the substrate is transported in the substrate transport direction B by the loader 32, and the substrate is supplied to and held on the substrate holding table 28.
  • the XY table 26 is moved in the illustrated X-axis direction or Y-axis direction, and the board is moved to the board mounting area.
  • one plate is selected and taken out from each of the plates stored in the lifter device 10 by the component supply device 4 and placed in the plate placement device 12.
  • the electronic component 2 is sucked and held by the reversing head device 14 from the placed plate and taken out, and the electronic component 2 is reversed and moved to the component supply position.
  • the mounting head 20 is moved to the component supply position by the X-axis robot 22 in the mounting unit 5, and the mounting head 20 receives the electronic component 2 from the reversing head device 14 ′. Passed. Thereafter, the mounting head portion 20 in a state where the electronic component 2 thus received is sucked and held is moved by the X-axis opening pot 22. It is moved above the substrate mounting area.
  • the XY table 2 aligns the electronic component 2 sucked and held by the mounting head unit 20 with the position where the electronic component 3 is to be mounted on the board held by the board holding table 28. This is done by moving 6. After this alignment, the mounting head 20 is moved up and down, and the electronic component 2 is mounted on the board. In the case where the mounting operation of the plurality of electronic components 2 is performed, the mounting operation of each electronic component 2 is performed by repeating the above operations.
  • the board on which each electronic component 2 is mounted is moved to the loader 3 2 and the unloader 34 by the XY tape notch 26 together with the board holding table 28.
  • the substrate is transferred to the unloader 34 from the substrate holding table 28, and the substrate is transported along the substrate transport direction B by the unloader 34.
  • the substrate is discharged from 01.
  • the discharged board is supplied to, for example, another apparatus that is installed adjacent to the electronic component mounting apparatus 101 and performs the next processing after the above-described component mounting, or is used as a component-mounted board. It is stored in a substrate storage device or the like.
  • the mounting operation of each electronic component 2 on the board is performed. After the board on which each of the electronic components 2 is mounted is discharged by the unloader 34, another new board is supplied by the loader 32, so that each of the sequentially supplied boards is supplied to the corresponding board. The electronic component 2 is mounted.
  • FIG. 2 is a semi-transparent perspective view of the lifter device 10 and the plate disposing device 12 in the component supply device 4.
  • the component supply device 4 holds and removes each plate stored in the lifter device 10 in addition to the lifter device 1 ⁇ and the plate placement device 12 described above.
  • the above plate is placed on the plate
  • a plate moving device 40 for moving the plate is provided. Further, the plate moving device 40 can move the plate such that the plate placed on the plate placing device 12 is held and stored in the lifter device 10 again.
  • the lifter device 10 is a magazine that is an example of a storage box having a box-like shape in which a plurality of the wafer supply plates and a plurality of the tray supply plates are mixed and vertically stacked.
  • a cassette elevating unit 51 which is an example of a storage unit elevating unit that is positioned at an elevating height position that can be taken out by the plate moving device 40, and a cassette elevating unit 51, to which a cassette elevating unit 5 is attached.
  • a base 52 capable of guiding the ascending and descending operation of the magazine cassette 50 by the use of the base 52.
  • FIG. 3 an enlarged perspective view (semi-transparent perspective view) of the magazine cassette 50 is shown in FIG.
  • the direction C in the drawing is the direction in which the respective plates are taken out to the plate placement device ft12 (hereinafter referred to as the plate taking out direction C).
  • the magazine cassette 50 is provided with side wall portions 50a so as to face each other in a direction orthogonal to the plate removing direction C.
  • a plurality of grooves 50b are formed along the plate extracting direction.
  • Each of the above plates (hereinafter, referred to as plate 6) has a groove at each side wall 50a at both ends facing each other.
  • each of the side wall portions 50a the respective groove portions 50b are formed at a constant pitch, and while being engaged with and held by the respective groove portions 50b, the plate 6 The surface is in a substantially horizontal state. Further, each plate 6 is capable of moving forward and backward (that is, slide) along the plate removing direction while being guided along the direction in which each groove 50b is formed. Further, in the magazine cassette 50, since each of the stored plates 6 is taken out, no side wall portion is provided on the plate taking-out direction C side so as not to obstruct the taking-out. It is always open.
  • the plate 6 housed in the upper part of the figure is a wafer supply plate 6w, and the plate 6 housed in the lower part of the figure is a tray supply plate 6t.
  • FIG. 4 a perspective view of the wafer supply plate 6w is shown in FIG. 4, and a perspective view of the tray supply plate 6t is shown in FIG. 5, and the structure of each plate will be described.
  • the wafer supply plate 6w has a substantially disk shape having an outer peripheral portion in which a linear portion and a curved portion are combined. Further, respective ends facing each other with the plate removal direction C interposed therebetween are considered to be engaged with the respective groove portions 50b of the magazine cassette 50, and serve as the linear outer peripheral portions. I have.
  • the wafer supply plate 6 w is a sheet having elasticity, and a wafer sheet 8 on which a diced wafer 7 is attached and placed on the upper surface thereof, and an annular sheet. And a plate ring 9 for holding the wafer 8 near its outer peripheral end so that the wafer 7 is positioned inside the plate.
  • the wafer sheet 8 is radially stretched, so that the arrangement positions of the wafer supply parts 2 w arranged in a grid 3 are also radial. It can be stretched, and so-called expanding can be performed.
  • the tray supply plate 6t has the same outer diameter as the above-described wafer supply plate 6w. This makes it possible to mix and store the wafer supply plate 6 w and the tray supply plate 6 t in the common magazine force set 50. Further, as shown in FIG. 5, the tray supply plate 6 t has a substantially same outer peripheral shape as the wafer ring 9, and is a circular plate having a substantially square inner peripheral hole. And a tray mounting portion 58 which is formed to be attached to the inner peripheral hole portion of the mounting portion 59 and on which a plurality of component supply trays 57 are removably mounted.
  • the tray mounting portion 58 is formed so as to be one step lower than the surface of the tray ring 59, and is stored in the component supply tray 57 when the component supply tray 57 is mounted.
  • the height of the upper surface of each tray supply component 2t is formed so as to be substantially the same as the height of the surface of the tray ring 59. With such a configuration, the height position of the tray supply part 2 t on the tray supply plate 6 t is set to the wafer supply plate. The height position is almost the same as the height position of the wafer supply part 2 w at point 6 w.
  • four component supply trays 57 each having a substantially square planar shape are arranged in two rows and placed on the tray placement unit 58.
  • the tray mounting section 58 is It may be a case where they are formed integrally.
  • the position near the end of the tray ring 59 on the tray supply plate 6 t in the plate removal direction C side is the holding position of the tray supply plate 6 t by the plate moving device 40.
  • an identification hole 56 for identifying the tray supply plate 6t is formed in this portion. Note that, also in the wafer supply plate 6w in FIG. 4, the corresponding portion is at the holding position, but the identification hole 56 for identification is not provided. As described later, this is because the tray supply plate 6t and the wafer supply plate 6w are distinguished by the difference in the presence or absence of the identification holes 56.
  • the cassette elevating unit 51 of the lifter device 10 is provided with a cassette support base 51a for arranging and holding the magazine cassette 50 on its upper surface.
  • the magazine cassette 50 handled in the lifter device 10 has a plurality of sizes, for example, a 6-inch size, an 8-inch size, or a 12-inch size. is there.
  • the magazines arranged on the upper surface of the cassette support table 51a are detected by detecting the differences in their planar sizes.
  • a 6-inch cassette detection sensor 53a, an 8-inch cassette detection sensor 53b, and a 12-inch cassette detection sensor 53c capable of detecting the size of the cassette 50 are provided respectively.
  • the plate placement device 12 includes a plurality of elastic support members that can support the plate 6 to be placed from the lower surface near the outer periphery thereof, and have a variable support height position.
  • the plate support 60 which is an example of the above, and the plate 6 supported by the plate support 60 are sandwiched between the upper ends of the respective plate supports 60 so as to be sandwiched between the outer peripheral portions thereof. Press from the top side to maintain the support position of this plate 6.
  • a plate pressing member 61 for holding the plate, and a pressing member lifting / lowering portion 62 for raising and lowering the plate pressing member 61 are provided.
  • the plate pressing body 61 has a symmetrical shape having a semicircular cutout portion, and the cutout portions are arranged so as to face each other on the same plane. Plate-shaped body.
  • each plate pressing member 61 abuts only the upper surface of the wafer ring 9 of the wafer supply plate 6 w and the lower surface thereof. It is possible to press only the upper surface of the tray ring 59 of the tray supply plate 6t with its lower surface in contact. .
  • the plate placement device 12 for example, four plate supports 60 are provided, and each plate support 60 is provided with a wafer ring 9 or a tray of each plate pressing body 61.
  • the ring 59 is disposed below the portion pressing the ring 59. Thereby, the wafer ring 9 or the trailing ring 59 can be supported on the lower surface side by the respective plate support portions 60. In addition, it is desirable that the respective plate supporting portions 60 are disposed at substantially equal intervals along the outer periphery of the wafer ring 9 or the tray ring 59 disposed thereon. As shown in FIG. 7, the plate placement device 12 has a tapered shape at the top end on the left side in the Y-axis direction near the circumference where the respective plate support portions 60 are placed. And a tapered support portion 65 which is an example of another elastic support member with which the end portion of the plate 6 abuts at the inclined end portion.
  • the plate placement device 12 includes a wafer supply plate 6 w in a state where the wafer ring 9 is supported by the respective plate support portions 60, and a wafer between the outer periphery of the wafer 7 and the inner periphery of the wafer ring 9.
  • An expandable member 63 provided at its upper end with an annular contact portion capable of contacting the lower surface of the seat 8, and an arrangement frame 64 fixedly supporting the expandable member 63 on its upper surface are provided.
  • two pressing body lifting / lowering portions 62 are provided by being attached to the placement frame 64.
  • the respective side surfaces of the placement frame 64 in the illustrated X-axis direction are provided. Attached to.
  • the respective plate pressing members 61 are integrally moved up and down by the respective pressing member lifting units 62. I have.
  • FIG. 8 shows an enlarged cross-sectional view of the arrangement portion where the wafer supply plate 6 w is arranged in the plate arrangement device 12 having such a configuration, and FIG. 8 shows a state where the tray supply plate 6 t is arranged.
  • FIG. 9 shows an enlarged cross-sectional view of the arrangement portion.
  • the expanding member 63 having an annular shape is provided with a flange portion 63 b formed in the lower part toward the outer peripheral direction, and the plate supporting portion 60 and the tapered supporting member 60 are provided.
  • the part 65 is attached to the flange part 63 b so as to be able to move up and down.
  • the plate supporting portion 60 has a shaft-shaped supporting pin 60 b having a supporting end portion 60 a having a flat or gentle raised shape at the upper end thereof, and a flange portion 63 b.
  • a biasing spring 60c is provided on the outer periphery of the support pin 60b so as to constantly bias the support pin 60b upward.
  • the upper limit position in the upward biasing of the support pin 60b by the biasing spring 60c is mechanically limited.
  • the plate supporting portion 60 is attached to the flange portion 63 b of the expanding member 63 via the attaching member 66, and a pin hole formed in the attaching member 66 is provided.
  • the vertical movement of the support pin 60b can be guided along the inner peripheral surface of the part 66a. Therefore, when an external force is applied downward to the support end portion 60a, the biasing spring 60c is contracted, and the support pin 60b force pin hole 6
  • the tapered support portion 65 also has a mechanism based on the same concept as the respective plate support portions 60, as shown in FIGS. 7, 8, and 58. , Support pin 65b, biasing spring 65c, mounting member 67, and pin hole 6
  • the upper end portion is an inclined end portion 65 a having a tapered shape, and the outer peripheral end portion of the wafer ring 9 is brought into contact with the slope around the inclined end portion 65 a.
  • the tapered support portion 65 is provided with a guide portion 65d for guiding the lifting and lowering of the support pin 65b. Also, as shown in FIG.
  • the member 63 has an annular tip 63 a formed at its upper part, and this tip 63 a is formed on the lower surface of the wafer sheet 8 between the outer periphery of the wafer 7 and the inner periphery of the wafer ring 9. Contact is possible.
  • FIG. 9 shows a state where the tray supply plate 6t is arranged in the plate arrangement device 12 having the above-described configuration.
  • the tray supply plate 6 is sandwiched between the respective plate pressing members 61 and the support ends 60a of the respective plate support portions 60 so as to sandwich the tray ring 59. t is supported.
  • the trailing 59 is in contact with the inclined surface of the inclined end 65 a of the tapered supporting portion 65, the trailing 59 is supported in the direction along the surface by angular resistance. Position is maintained.
  • the tray mounting portion 58 located at a height one step lower than the trailing 59 is arranged inside the annular expanding member 63.
  • An intermediate stopper driving section 69 as an example of the section is provided.
  • the intermediate stopper driving unit 69 is provided with an intermediate stopper 69 a which is an example of a contact portion disposed near the left front end on the upper surface of the arrangement frame 64, and an intermediate stopper 69 a which is an end of the intermediate stopper 69 a.
  • a stopper moving portion 69b which is an example of a contact portion moving mechanism that moves along the portion.
  • the stopper moving section 69b is attached to a cylinder that can be driven vertically by supply and exhaust of compressed air and the cylinder, and the intermediate stopper 69a is used to mechanically drive the cylinder. It is composed of a link mechanism that transmits information in a timely manner.
  • FIG. 11 is a schematic explanatory view for explaining the operation of the intermediate stopper driving section 69.
  • a regulating pin 61 a is provided below the plate pressing body 61.
  • the restricting pin 61 a is arranged so that the lower end of the plate pressing body 61 can contact the upper end of the intermediate stopper 69 a at the lower end thereof.
  • the stopper moving portion 69b is located below the regulating pin 61a along the upper surface of the placement frame 64, and the intermediate stopper 69a can be brought into contact with the regulating pin 61a.
  • the intermediate stopper 69a moves forward and backward between the contact position and the ⁇ position where the intermediate stopper 69a can make contact with the restriction pin 61a even when the regulating pin 61a is lowered. It is possible to make it.
  • each of the intermediate stopper driving units 69 is individually provided so as to be able to regulate the lower limit position of the lowering of the plate pressing member 61 when descending. 9 are driven synchronously with each other.
  • FIG. 13 shows a pneumatic circuit diagram of the pressing body elevating unit 62.
  • the pressing body elevating unit 62 includes a plurality of cylinder units 71 that can be driven by supply and exhaust of compressed air, and is an example of an elevating compression air supply unit.
  • the air supplied from the air supply line 73 is selectively passed through the ascending regulator 75 or the descending regulator 76 by the solenoid valve 77 to be supplied to the respective cylinder portions 71. This makes it possible to selectively perform the ascending or descending operation.
  • a lifting mechanism using compressed air how to perform an emergency stop for safety is a problem.
  • each of the plate pressing members 61 is erroneously pinched by a member positioned below the plate pressing member 61, for example, a hand of an operator, or a plate 6 that has been transported halfway due to a movement error or the like. Problems can occur, which can be very dangerous.
  • each of the plate pressing members 61 positioned above can be held at the position without being lowered by an emergency stop.
  • a mechanical opening valve 70 which is an example of a compressed air selection valve
  • the switch section 70a of the mechanical opening valve 70a mechanically enters each cylinder through the ascending regulator 75.
  • the compressed air line 7 3 is supplied with compressed air from the lifting / lowering compressed air line 7 3, and another compressed air line with a lower pressure than the lifting / lowering compressed air 7 2
  • each cylinder section 71 is supplied through a holding regulator 74.
  • the pressure of the compressed air for holding is such a pressure that can hold the ascending / descending position of each plate pressing member 61 and that cannot be increased.
  • the holding regulator 74 is an example of a holding compressed air supply unit.
  • Such a mechanical lock valve 70 is fixed to an arrangement frame 64 with its switch portion 70a facing downward, as shown in FIG. 10 and FIG. 12 which is a partially enlarged perspective view of FIG.
  • a contact bar 78 having a contact portion capable of pressing the switch portion 70a is attached to the plate pressing member 61.
  • the plate pressing body 61 When the plate pressing body 61 is located above the vertical movement range, the contact portion of the contact bar 78 presses the switch portion 70a, and the switch portion 70a is pressed.
  • the contact portion of the contact bar 78 does not come into contact with the switch portion 70a. a is not in the state.
  • the compressed air line 7 2 Compressed air for holding is supplied to the respective cylinders 71 through the holding regulator 74 and the female lock pulp 70 from the outside, while the plate pressing body 61 is moved downward in the vertical range.
  • the ascending and descending air is selectively passed from the ascending and descending compressed air line 73 through the ascending regulator 75 or descending regulator 76 by the solenoid valve 77. Compressed air is supplied.
  • FIG. 14 a perspective view of the plate moving device 40 is shown in FIG.
  • a chuck portion 41 which is an example of a holding portion for releasably holding the plate 6, and an arm having a substantially L-shaped planar shape and having the chuck portion 41 attached to a tip end thereof.
  • a mechanism 42 and a moving unit 44 as an example of a holding unit moving unit for moving the arm mechanism 42 forward and backward in the illustrated Y-axis direction are provided.
  • the moving part 44 has a ball screw shaft part 44a arranged in the Y-axis direction in the figure, a nut part 44b screwed to the pole screw shaft part 44a, and one end of the ball screw shaft part.
  • the motor 4 is fixed, and rotates the pole screw shaft part 4 4a around its axis to move the nut part 4 4b forward and backward in the Y-axis direction. 4c.
  • the end of the arm mechanism 42 on the side where the chuck portion is not attached is fixed to the LM block 43a, and the LM block 43a is an LM rail 43b arranged in the Y-axis direction in the figure.
  • the LM block 43a is fixed to the nut part 44b, and is moved together with the nut part 44b. The movement of item 2 is possible.
  • a plate identification sensor 41b which is an example of a plate identification unit that identifies whether the plate 6t is for use, is attached to the arm mechanism 42.
  • the plate identification sensor 41b is not formed in the wafer ring 9 in FIG. 4, but identifies the presence or absence of the identification hole 56 formed in the tray ring 59 in FIG. 5 using a transmission sensor. In this way, the plate 6 is identified.
  • a plate presence / absence detection sensor 41a for detecting whether the chuck part 41 holds the plate 6 is provided with an arm mechanism 42. Attached to.
  • the plate presence / absence detection sensor 41a uses a transmission type sensor to detect the presence / absence of the plate 6 based on whether or not the light blocking of the sensor is detected by the end of the ring 9 or the trailing ring 59. are doing.
  • the movement position of the intermediate stopper 69a by the intermediate stopper drive unit 69 in the plate placement device 12 is determined based on the identification result of the plate identification sensor 41b.
  • the arm mechanism 42 automatically centers the position of the chuck portion 41 in the X-axis direction while mechanically converging the swing in the X-axis direction.
  • An X-axis direction centering part 42a is provided. It should be noted that such a centering mechanism is not limited to the illustrated X-axis direction, and may be a mechanism that performs centering in the illustrated Y-axis direction.
  • the arm mechanism 42 includes a collision detection sensor 42b on the far side in the Y-axis direction in the drawing, which can detect that the arm mechanism 42 has interfered (collimated) with another constituent member. When the collision is detected by the collision sensor 42b, the movement of the moving part 44 is stopped, It is intended to prevent failure of the device due to the collision, damage to the respective electronic components 2 held, and the like.
  • FIG. 15 is a partially enlarged perspective view of the tray mounting portion 58
  • FIG. 16 is a schematic explanatory view of a cross section of the tray mounting portion 58.
  • the tray mounting portion 58 is disposed parallel to each other along a direction orthogonal to the plate unloading direction C, and abuts with each end of the component supply tray 57 facing each other. Then, two holding members capable of holding the arrangement position are attached so as to sandwich the component supply tray 57. Further, the holding member, which is arranged on the side of the plate removal direction C of the two holding members, biases the component supply tray 57 to an end on the contact side with the component supply tray 57. And a slide-side holding member 80 (which is an example of a movable-side holding member) having two slide portions 80 a that can be individually slidably mounted on the component supply tray 57.
  • a fixed-side holding member 81 for fixing the position of the component supply tray 57 is provided.
  • each slide portion 80a of the slide-side holding member 80 is slid in the plate removal direction C.
  • the component supply tray 57 is moved to the tray mounting portion 58.
  • the component supply tray 57 can be mounted on the tray mounting portion 58 by being inserted from above and sandwiched between the slide-side holding member 80 and the fixed-side holding member 81.
  • the contact portions of the slide-side holding member 80 and the fixed-side holding member 81 with the end of the component supply tray 57 are slanted so as to face each other.
  • each slide section 80a of the slide-side holding member 80 is provided, and the component supply tray 57 and the plate removal direction C are provided. It is configured to also have a function as a slide-side holding member 80 for another component supply tray 57 (not shown) that is arranged adjacent to the tray.
  • the present invention is applicable to a case where each slide portion 80a is individually slidably provided on the slide-side holding member 80.
  • a case may be adopted in which a slide portion 80b having two contact portions is integrally provided. Further, a case may be employed in which an opening mechanism capable of locking the sliding operation of each slide portion 80a provided in the slide-side holding member 80 is provided.
  • a component supply tray 57 in which the minute components 2 are disposed is disposed.
  • minute components 2 may jump out of the component supply tray 57 even if only a minute vibration is applied to the component supply tray 57. Care must be taken when placing the tray on the tray 6 t.
  • the operator holds the component supply tray 57 with one hand and slides the slide-side holding member 80 with the other hand.
  • the work state becomes unstable, which may cause vibration to the component supply tray 57. Therefore, for example, as shown in FIG. 57, the operator slides the slide-side holding member 80 at the end of the component supply tray 57 while holding the component supply tray 57 with one hand or both hands. Then, when the component supply tray 57 is placed, the placing operation can be performed in a more stable state.
  • tray supply plate 6 t it may be necessary for the operator to hold the tray supply plate 6 t with the other hand, so that the work is placed near the center of the tray supply plate 206 t as shown in Fig. 39. It is also possible to form a plurality of holding holes 293 that allow a person's finger to enter. In such a case, more reliable holding can be performed, and protrusion of minute components can be reliably prevented.
  • the magazine cassette 50 is raised or lowered by the cassette lifting / lowering unit 51 of the lifter device 10, and the plate 6 to be taken out from the magazine cassette 50 is moved to the chuck unit 4 of the plate moving device 40.
  • the plate disposing device 12 each plate pressing member 61 is raised by the pressing member lifting / lowering portion 62 to the upper limit position of the lifting and stopping.
  • the switch portion 70a of the mechanical lock valve 70 is pressed by the contact bar 78 so that the switch portion 70a is in the state, and the compressed air for holding is pressed.
  • the elevating position of the respective plate pressing members 61 is held at the upper limit position of the elevating.
  • the arm mechanism 44 is moved leftward in the Y-axis direction in FIG. 2 by the moving section 44 of the plate moving device 40, and the chuck section 41 is moved into the magazine cassette 50. Thereafter, when the vicinity of the outer periphery of the plate 6 to be taken out of the magazine cassette 50 is detected by the plate presence / absence detection sensor 41a installed adjacent to the chuck portion 41, the vicinity of the outer periphery is detected. It is held by the chuck part 41.
  • the plate identification sensor 4 lb installed adjacent to the chuck unit 41 determines whether the held plate 6 is the force that is the wafer supply plate 6 w or the tray supply plate 6 t. Is identified. Thereafter, the movement of the arm mechanism 42 to the right in the illustrated Y-axis direction by the moving unit 44 is started, and the plate 6 held above is moved along the respective groove portions 50b of the magazine cassette 50. Taken out.
  • the plates 6 held by the chuck portions 41 are moved so as to pass between the respective plate pressing members 61 of the plate placement device 12 and the respective plate supporting portions 60, and the respective plates are moved.
  • the plate 6 is stopped at a position where the plate 6 can be supported by the support portion 60.
  • the respective plate pressing members 61 are lowered by the pressing member lifting / lowering portions 62, and the upper surface of the outer peripheral portion of the plate 6 is pushed down, and the lower surface of the outer peripheral portion is pressed to the respective plate supporting portions 60.
  • the plate 6 is held so as to be in contact with the upper end of the plate 6 and sandwiched between the respective plate pressing members 61 and the respective plate support portions 60.
  • the holding of the plate by the chuck 41 is released, and the arm mechanism 42 is moved to the right in the Y-axis direction in FIG. Stop at a position where there is no interference with the planar position.
  • the movement position of the intermediate stopper 69 a is determined by the intermediate stopper drive unit 69.
  • the intermediate stopper 69a is moved to the position » and the respective regulating pins 61a and the intermediate stopper 69a are moved. Is in a state of contact.
  • each of the plate pressing members 61 is further lowered, and each of the plate supporting portions 60 is pressed down, and the wafer sheet 8 is stretched with the leading end 63 a of the expanding member 63 as a fulcrum. The expansion takes place.
  • each of the plate pressing members 61 being lowered is brought into contact with each of the lower limit stoppers 68 of the expander, and the lower limit position in the lowering thereof is regulated. In this state, each of the plate pressing members 61 is lowered. The descent is stopped. In such a state, each wafer supply part 2 w can be taken out and supplied from the wafer supply plate 6 w, and each wafer supply part 2 w is pushed up from below the wafer sheet 8 and pushed up. Each of the wafer supply parts 2w is taken out by holding and taking out the wafer supply parts 2w thus obtained by the reversing head device 14.
  • the intermediate stopper 69 a is moved to the contact position, and the respective regulating pins 61 a and the intermediate stopper 69 are moved. It is in a state where abutment of a is possible. After that, each plate pressing body 61 is further lowered, and each plate supporting portion 60 is pushed down.1 Each of the regulating pins 61 and each of the intermediate stoppers 69a are brought into contact with each other, and The lowering position of the rate pressing body 61 is regulated. In this state, as shown in FIG. 9, a space is secured between the lower surface of the tray ring 59 and the distal end portion 63 a of the expanding member 63 so as not to contact each other.
  • the lowering of the respective plate pressing members 61 is stopped, and the respective tray supply parts 2t can be taken out from the tray supply plate 6t.
  • the reversing head device 14 takes out the respective tray supply components 2 t from the respective component supply trays 57 mounted on the tray mounting portion 58 by holding them.
  • the plate for preventing the plate 6 from being ejected from the magazine cassette 50 of the respective plates 6 stored in the magazine cassette 50 of the lifter device 10 will be described. Note that, in the electronic component mounting apparatus 101 shown in FIG. 1, a state in which a projection preventing plate having a conventional configuration is attached to the lifter apparatus 10 is shown.
  • the component supply device 4 is roughly divided into a movable lifter device 10 and other portions, and the other portions are separated by a casing 82. Covered.
  • a door 83 that can be opened and closed in a flip-up manner is provided on the lifter device 10 side of the casing 82.
  • a protrusion prevention plate 84 (also an example of a plate regulating portion) is attached to a lower portion of the door 83.
  • FIG. 19 shows an explanatory diagram of a schematic cross section near the door 83.
  • FIG. 19 As shown in FIG. 19, with the door 83 closed, the pop-out prevention plate 84 is attached to each of the plates 6 except for the one plate 6 to be removed which is stored in the magazine cassette 50.
  • a plate outlet portion 84a is provided below the protrusion preventing plate 84, and the one plate 6 to be taken out passes through the plate outlet portion 84a, It can be placed on the plate placement device 12.
  • a plate outlet portion 86a is provided below another protrusion prevention plate 86.
  • a pop-out detector 85 capable of detecting the plate 6 passing through the plate outlet 86a can be provided.
  • the pop-out detecting unit 85 is provided, as shown in FIG. 21, the door 83 is opened and the pop-out prevention plate 84 performs the function during maintenance or the like. Even if it is not possible, the plate 6 that has jumped out of the magazine cassette 50 can be detected.
  • a configuration for mounting and releasing the lifter device 10 to and from the component supply device 4 will be described.
  • the lifter device 10 includes a base 52 that supports the force set elevating unit 51 together with the magazine cassette 50, and a base unit 52 when the base unit 52 is mounted on the component supply device 4.
  • a base holding frame 91 which is an example of a base holding unit that can hold the arrangement position and can release the holding and release the equipment, is provided. Note that the base holding frame 91 can hold the base 52 by contacting the base 52 in three directions except the front part at the lower part thereof. Further, as shown in FIG. 22, the base holding frame 91 is engaged with a lower side surface on the right side in the X-axis direction of the base 52 in the illustrated X-axis direction, so that the base 52 is moved linearly. It is equipped with a mechanism for guiding linear movement and rotation, which is movement while rotating. The mechanism will be described below.
  • the base holding frame 91 serves as the mechanism when the base 52 is released from the equipment, that is, when the base 52 is moved from the component supply device 4.
  • This is an example of a linear motion guide portion capable of guiding the linear motion of the base 52, and includes a linear motion guide rail 93 arranged in the Y-axis direction near a lower portion thereof, and a linear motion guide rail 93.
  • a rotation guide rail 94 which is an example of a rotation guide unit capable of pivoting a base 52 arranged adjacent to the left end in the Y-axis direction in the figure, is provided.
  • the linear motion is guided in a state where the linear motion guide rail 93 is in contact with the linear motion guide rail 93.
  • a first guide roller 92 which is an example of an engagement portion whose rotation is guided in a state in which it is engaged, is attached.
  • two LM rails 96 provided along the Y-axis direction in the figure are fixed to the side surface of the base 52. Further, the two LM rails 96 are respectively engaged with LM blocks 97 so as to be movable along the respective LM rails 96.
  • Each of the LM blocks 97 is fixed to a rotating shaft 98 attached to the base support frame 91, and is rotatable around the axis of the rotating shaft 98 as a rotation center. ing.
  • four moving rollers 99 are provided on the bottom surface of the base 52, and the base 52 is movably supported by the respective moving rollers 99. Further, on the outside of the rotation guide rail 94, the above-described side of the base 52 is provided. A second guide port 99 for guiding the linear motion of the base 52 is provided, while being able to contact the lower surface.
  • FIG. 23 shows such a series of operation states superimposed on a plane.
  • the first guide roller 92 is located at the back of the linear guide rail 3 ⁇ 43.
  • the LM blocks 97 are in contact with each other near the ends, and the respective LM blocks 97 are located near the front ends of the respective LM rails 96.
  • the holding position is fixed by a holding mechanism of the base holding frame 91 (not shown).
  • the holding by the holding mechanism is released. Thereafter, the movement of the base 52 released from the holding is started so as to be pulled out to the left in the direction of the ⁇ axis in FIG.
  • the first guide roller 92 is guided in such a manner that the first guide roller 92 is rotated while traveling in contact with the linear motion guide rail 94, and the linear motion of the base 52 is contemplated.
  • the second guide roller 95 is also rotated while traveling in contact with the side surface of the base 52 to guide the linear motion of the base 52.
  • Each LM Renole 96 runs while being guided by each LM block 97. At this time, since the rotation of the base 52 is restricted by the first guide rail 92 and the linear guide rail 93, the rotation shaft 98 cannot rotate.
  • the rotation guide rail 93 is also released.
  • the first guide roller 92 is engaged with the roller 94.
  • the restricted rotation is enabled, and the base 52 is rotated while the first guide roller 92 is guided by the rotation guide rail 94.
  • the LM block 97 is fixed to the rotation shaft 98, the LM block 97 is rotated around the center of rotation.
  • the base 52 is thus rotated, and as shown in FIG. 23, the base 52 is pulled out from the component supply device 4 while being rotated approximately 90 degrees in a plane. It can be made.
  • the plate stopper device 12 is placed in the plate placement device 12.
  • the wafer sheet 8 can be stretched and expanded. Therefore, an appropriate holding operation or expanding operation can be selectively and automatically performed according to the type of the plate 6 to be arranged and supplied, and it is possible to efficiently supply components. .
  • the type of the plate 6 is identified by the fact that when each plate 6 mixedly loaded in the magazine cassette 50 is taken out by the plate moving device 40, the plate 6 is adjacent to the chuck portion 41 that grips the end of the plate 6. This can be performed by using the provided plate identification sensor 41b. Specifically, an identification hole 56 is provided at the end of the plate 6 only for the tray supply plate 6t, and the presence or absence of the identification hole 56 is identified by the plate identification sensor 41b. Thus, the type of the plate 6 can be identified. Also, by determining the moving position of the intermediate stopper 69a by the intermediate stopper driving part 69 based on the identification result, it is possible to selectively restrict the lowering position of each plate pressing body 61. it can.
  • the plate placement device 12 is provided with a plurality of plate support portions 60 whose support height positions are variable, so that each plate 6 is placed near the outer peripheral portion of each plate 6.
  • the supporting height position can be freely changed while performing the above-mentioned support in accordance with the elevating operation of each plate pressing body 61, and the above-mentioned effect can be achieved. Becoming You.
  • the end of the plate 6 is brought into contact with the inclined end portion 65 a by providing the tapered support portion 65 having an inclined end portion 65 a at the end thereof, and the plate resistance is changed by the angle resistance.
  • the support position in the direction along the surface of No. 6 can be held, and reliable and accurate holding is possible.
  • the slide-side holding member 80 and the fixed-side holding member 81 are provided in a direction orthogonal to the plate removing direction C,
  • the component supply tray 57 is placed on the placement position from substantially above the placement position, and the component supply tray 57 is held between the slide-side holding member 80 and the fixed-side holding member 81. Therefore, the space required for mounting the component supply tray 57 can be reduced. Therefore, a total of four component supply trays 57 can be placed in two rows on the tray mounting portion 58 of the tray supply plate 6 t, and the area of the component supply tray 57 in the tray supply plate 6 t can be accommodated. Rate can be improved.
  • a protruding prevention plate for preventing each plate from protruding from the magazine cassette is attached to the lifter device, so that the protruding preventing plate becomes a hindrance during maintenance. Therefore, there is a problem that it is difficult to perform maintenance such as a plate disposing device.
  • the pop-out preventing plate 84 is provided on the door 83, the pop-out preventing plate 84 can be moved by opening and closing the door 83, thereby improving maintainability. Can be improved.
  • a pop-out detecting section 85 that can detect the plate 6 passing through the plate outlet section 86a is provided at both ends of the plate outlet section 86a, the door can be used during maintenance or the like. Even if 8 3 is opened and the pop-out prevention plate 8 4 cannot perform its function, the plate 6 that has popped out of the magazine cassette 50 can be detected, improving maintainability while improving safety. Can be planned.
  • a mechanism is provided that can move the lifter device 10 to the component supply device 4 in a combination of linear motion and rotation when mounting or dismounting the lifter device 10, so that the lifter can be installed in a narrower space. Ensure that the device 10 is housed and fitted, or The lifter device 10 can be easily and smoothly pulled out from the space. Therefore, even when such a component supply device 4 is arranged in a more compact space, the lifter device 10 can be easily and smoothly put in and out, and the maintainability can be improved.
  • the present invention is not limited to the above embodiment, and can be implemented in various other modes.
  • a component supply device according to a second embodiment of the present invention will be described below.
  • the component supply device of the second embodiment differs from the component supply device 4 of the first embodiment in the following partial configuration, but has the same basic configuration.
  • the same reference numerals are given to the same components as those of the component supply device 4 of the first embodiment.
  • the lifter device 10 includes a magazine cassette 250 containing a plurality of the wafer supply plates and a plurality of the tray supply plates in a mixed manner.
  • the magazine cassettes 250 are provided with side walls 250a so as to face each other in a direction orthogonal to the plate removing direction C, and each of the magazine cassettes 250 faces each other.
  • a plurality of grooves 250b are formed along the plate extracting direction C.
  • the respective plates are supported at their opposite end portions by engagement of respective sets of groove portions 250b of the respective side wall portions 250a which are arranged opposite to each other.
  • each groove portion 250b is formed at a constant pitch, and in a state where each groove portion 250b is engaged with and held by each groove portion 250b, The plate has a substantially horizontal surface. Further, each plate is set in a state in which it can move forward and backward (that is, slide) along the plate taking-out direction C while being guided along the forming direction of the pair of grooves 50b facing each other.
  • FIG. 25 is a partial cross-sectional view of the side wall portion 250a of the magazine cassette 250.
  • the side wall portion 250a is made of aluminum which is a metal material.
  • This duracon has the characteristic that it has a lower surface hardness than the stainless steel material (for example, JIS standard: SUS304), which is the material for forming the tray ring 59 and the wafer ring 9, and is a soft material.
  • each of the groove portions 250b and the material for forming the trailing 59 or the like is not limited to the above combination. It is only necessary that the hardness of the material forming the groove 250b be low with respect to the material forming the tray ring 59, and various other combinations can be employed under such conditions. .
  • groove portion 250 showing a more detailed structure of each such groove portion 250b.
  • Figure 26A shows the side view of 0b
  • Figure 26B shows its front view.
  • each groove 250b is formed integrally, in order to facilitate understanding of the structure of the groove 250b below, FIGS. 26A and 26B are used.
  • B the one groove portion 250b is cut out and displayed.
  • the end of the groove 250b on the plate removal direction C side that is, the insertion end 250d of each plate 6 is provided with respect to the plate removal direction C.
  • a slightly inclined surface is formed.
  • the inclined surface is a lower inclined surface 250 e inclined downward in the drawing, which is a direction orthogonal to the surface of the plate 6 with respect to the plate removing direction C.
  • the plate 6 is constituted by a side inclined surface 250 f inclined leftward in the drawing, which is a direction substantially along the surface of the plate 6.
  • the illustrated plate Even if plate 6 is inserted in the opposite direction to exit direction C, plate 6 Can reduce friction caused by contact between the end of the plate and the insertion end 250 d of each groove 250 b for supporting and guiding the plate 6, thereby realizing a smooth insertion of the plate 6. Can be.
  • the support position of the plate 6 by the respective groove portions 250b and the position of the plate 6 into the respective groove portions 250b are determined. Even if there is a misalignment with the entry position, insert while guiding the plate 6 using the lower inclined surface 250 e and the side inclined surface 250 f. Thus, there is also an effect that the above-mentioned positional deviation can be corrected.
  • FIG. 27 shows an external perspective view of the tray supply plate 6t.
  • Figure 27 shows the connection of the four opposite ends (linearly formed ends) and partially arcuate ends along the plate removal direction C of the tray ring 59 of the tray supply plate 6 t shown in Fig. 27
  • a corner portion of the lower surface end is cut off to form a smooth surface portion 59a constituted by a smooth curve. Since each of these connecting portions R is a contact portion with each set of grooves 250b of the magazine cassette 250, as shown in FIG. Even if the tray supply plate 6t moves forward and backward along the plate unloading direction C while being supported, friction between each smooth surface portion 59a and the groove portion 250b The force can be reduced.
  • the formation of the smooth surface portion 59a in the tray supply plate 6t is effective when applied to the tray supply plate 6t having a feature that its weight is heavier than the wafer supply plate 6w. A certain force may be such that the respective smooth surface portions are formed on the wafer supply plate 6 w to further reduce the amount of chips generated.
  • each of the grooves 250 b of the magazine cassette 250 supports each of the plates 6, and is an example of a rotating member that guides the movement along the plate removing direction C.
  • a plurality of roller portions 250 g are provided.
  • the provision of the respective rollers 250 g makes it possible to significantly reduce the frictional force caused by the contact between the respective plates 6 and the grooves 250 b. The generation of chips and the like due to the contact can be suppressed.
  • each of the roller portions 26 1 a is formed on the lower surface of the plate pressing body 26 1 of the plate placing device 2 12 into which each plate 6 is inserted.
  • a case may be employed in which each plate 6 is provided to support it. In such a case, not only the magazine cassette 250 but also the plate placement device 12 can reduce the amount of chips and the like caused by the contact wear of each plate 6.
  • each groove portion 25 Ob is formed on a plate 250 c made of Anoremini using a DURACON which is a thermoplastic resin, and the trailing portion 5 a is formed.
  • a plate 250 c made of Anoremini using a DURACON which is a thermoplastic resin which is a thermoplastic resin
  • the trailing portion 5 a is formed.
  • each of the plates 6 is formed so as to have a lower surface hardness than the material of each groove 250b in the magazine cassette 250 so as to have a lower surface hardness.
  • the same effect as the above effect can be obtained. Specifically, as shown in the perspective view of the plate of FIG. 42, for example, the tray supply plate 360 t, the opposite ends 359 of the tray ring 359 along the plate removal direction C are shown.
  • each groove 35 Ob is formed of aluminum.
  • the main body portion 359 a of the trailing portion 359 is formed of, for example, an aluminum plate, and each end portion of the main body portion 359 a is bent.
  • a step portion 359c is formed, and a plate made of PEEK resin is attached to each step portion 359c, for example, by screwing, so that each end portion 359b is formed. Have been.
  • the magazine cassettes requiring versatility can be mutually connected without special specifications. It is possible to reduce the amount of chips and the like generated due to contact abrasion.
  • a simple surface treatment may be applied to the surface of the end portion 359b of the trailing member 359 or the surface of each groove portion 350b of the magazine cassette.
  • the lower surface of the plate pressing body 26 1 of the plate disposing device 21 is provided with a plate disposing device 21 as shown in the schematic diagram of FIG.
  • a support portion 261b which is an example of a support member that supports the plate 6 supplied to the plate 2 at each of its opposite ends, is provided.
  • each of these support portions 26 1 b constitutes a concave portion in which the surfaces facing each other with the lower surface of the plate pressing body 26 1 are opened, and the end of the plate 6 is inserted in this concave portion.
  • each of the above-mentioned parts is provided with a plate 6 so that the plate 6 whose end is inserted and supported in the recess can be easily slide-moved. It is formed so as to have a sufficient margin with respect to its thickness.
  • the tray supply plate 6t supplied to the plate placement device 2 12 is set in a state of being supported by the respective support portions 26 1 b of the plate pressing body 26 1.
  • the upper surface of the end portion of the tray supply plate 6t and the lower surface of each plate pressing member 261 are in a state where a gap is secured without being in contact with each other.
  • the respective plate pressing members 26 1 are lowered by the pressing member lifting / lowering portions 62, the lower surfaces of the end portions of the tray supply plates 6 t come into contact with the respective plate supporting portions 60.
  • the tray supply plate as shown in Figure 32
  • the end of 6t is supported in a state of being sandwiched between the lower surface of each plate pressing member 261 and each plate support portion 60.
  • the end of the tray supply plate 6t is in a state of being lifted up from the respective support portions 261b.
  • the respective plate pressing members 26 1 are raised from such a state, as shown in FIG. 33, the lower surface of the tray supply plate 6 t is supported by each plate. Force to be lifted from the part 60 At that time, the tray supply plate 6t vibrates in the vertical direction in each of the concave portions. In such a case, as shown in FIGS. 33 and 34, the vibration may cause a problem that the tray supply component 2t jumps out of the component supply tray 57. In such a case, smooth parts supply will be hindered.
  • each plate pressing body 261 of the plate placement device 2 12 is in a state of being supported by each support portion 26 1 b or supported by each plate support portion 60.
  • a power section 26 1 c is provided.
  • Each of the urging portions 26 1 c is provided two in each of the plate pressing members 26 1.
  • FIG. 36 an enlarged external view of the biasing part 26 1 c is shown in FIG.
  • the urging portion 2 61 c is in contact with the upper surface of the tray supply plate 6 t, and the urging roller portion 26 2 is rotatable along the plate removal direction C.
  • a rod member rotatably provided at one end thereof with the urging roller portion 26 2, the rotatable member 26 being rotatably supported in a plane substantially orthogonal to the plate 6 with an intermediate position as a fulcrum.
  • the rotating member 2 63 is fixed to the plate pressing body 26 1, and the biasing roller portion 26 2 is constantly urged downward with the intermediate position as a fulcrum. 6 3 and a fixing member 2 6 4 for urging the rotation.
  • the provision of such a biasing portion 261 c ensures that the tray is always irrespective of the position where the respective plate pressing members 26 1 are moved up and down. Since the lower surface of the end portion of the supply plate 6t can be pressed and urged so as to be in contact with the respective support portion 26 1b or the plate support portion 60, the inside of the concave portion moves up and down by vibration. Such a situation can be reliably prevented. Therefore, the vertical movement of the tray supply plate 6 t accompanying the lifting and lowering of the plate pressing member 26 1 can be reliably prevented, and the occurrence of the tray supply component 2 t from the component supply tray 57 can be reliably prevented. can do.
  • the urging roller unit 26 2 is urged so that the upper surface of the tray supply plate 6 t is pressed downward via the urging roller unit 26 2.
  • the tray can be rotated along the surface of the tray, and the direction of the rotation is along the plate removal direction C. Placement device 2 1
  • the respective urging roller portions 262 do not hinder the respective operations.
  • the tray supply plate 6t having the characteristic that the weight is relatively heavy among the respective plates 6 has been described.
  • the same can be applied to the wafer supply plate 6w.
  • the number of the urging portions 261c is not limited to the above four, and it is preferable to provide three or more in order to stably support a flat surface.
  • the shape of the biasing part in the biasing part has a relatively large area, such as a bar or U-shape, even if only one or two are installed Good.
  • FIG. 39 shows a plan view of the tray supply plate 206 t
  • FIG. 40 shows a plan view of the chuck portion 241 for holding the tray supply plate 206 t releasably.
  • FIG. 41 is a cross-sectional view of the tip portion of the chuck portion 241 shown in FIG.
  • an elongated slot 2 is provided at the upper end of the tray ring 255 in the tray supply plate 206 t.
  • 9 1 (which is an example of an engaging portion) is further formed.
  • the elongated hole portion 29 is further formed.
  • a projection 241c that can be engaged with 1 is formed.
  • a plate presence / absence detection sensor 241 a and a plate identification sensor 241 b are provided as in the first embodiment.
  • the long hole portion 291 is formed, and the long hole portion 291 is formed at the tip of the chuck portion 241.
  • the weight of the tray supply plate 206 t can be held by the chuck part 241 in a state where it is engaged with the projection part 241 c formed on the This makes it possible to reliably hold the tray supply plate 206 t having the characteristic of heavy weight.
  • the wafer supply plate 6 w is also reliably formed. Can be held.
  • the protrusion of the chuck portion 241 is formed only on the side that comes into contact with the upper surface of the wafer supply plate 6 w, the engagement does not damage the wafer sheet 7. .
  • the weight of the tray supply plate 206 t can be reduced.
  • the tray supply plate 6 t having the characteristic that the weight is heavier than the wafer supply plate 6 w is inserted into the magazine cassette 250 and stored, or Even when the groove 25 is taken out from 0 or when the respective groove portions 25Ob and the plate 6 are moved in contact with each other, the amount of chips generated due to sliding wear can be significantly reduced.
  • the tray supply plate 6- has a configuration in which many types of components can be mixed and stored in one tray supply plate 6t, Each time the unloading is completed, the tray supply plate 6t is stored in the magazine cassette 250, and when a different part is to be removed from the stored tray supply plate 6t, the tray supply plate 6t is removed again from the magazine cassette 250. It also has the feature that the frequency of loading and unloading to and from the magazine cassette 250 is high.
  • the vibration generated in the tray supply plate 6t due to the lifting and lowering operation of the respective plate pressing members 261 is provided by providing the plate pressing members 261 with the urging portions 2661c in the respective plate pressing members.
  • the chuck portion can be engaged with each other while being engaged with each other.
  • the tray supply plate 206t can be held, and the tray supply plate 206t characterized by its relatively heavy weight can be reliably and stably held.
  • the component supply device of the third embodiment differs from the component supply device 4 of the first embodiment in the following partial configuration, but has the same basic configuration.
  • the same reference numerals are given to the same components as those of the component supply device 4 of the first embodiment.
  • each plate 6 stored in the magazine cassette 50 is taken out and moved while being held by the plate moving device 40, and the plate placement device 1 is moved.
  • the plate 6 has a force as shown in the schematic view of FIG. 44 because the plate 6 has a substantially disk shape.
  • the magazine may be housed in a posture inclined horizontally, and in such a case, contact (or collision) between the periphery of the plate 6 and the groove of the magazine cassette 50 occurs, and 6 rattling may occur.
  • the plate 6 is a tray supply plate 6 t on which a plurality of tray supply parts 2 t are placed on the upper surface
  • the plate 6 is placed above due to the occurrence of rattling.
  • each tray supply part 2 t scatters from the tray supply plate 6 t.
  • the magazine cassette 50 has an interval of each groove 50 b.
  • the pitch narrower By making the pitch narrower, the number of grooves 50b formed can be increased, and a larger number of plates 6 can be stored. While the force is being applied, such a narrow pitching of the gaps between the respective groove portions 50b is caused by the worker's accommodation of the respective plates 6 in the magazine cassette 50, as shown in FIG. As shown in the figure, it is difficult to support and accommodate the plate 6 in the grooves 50b facing each other, and it is difficult to accommodate the plate 6 in the magazine cassette 50 in a horizontal supporting posture (that is, in the obliquely inserted state). ). In such a case, there is a problem in taking out the plate 6 from the magazine cassette 50.
  • the third embodiment it is possible to solve the various problems caused by the storage posture of each plate 6 in the magazine cassette 50 and to smoothly take out each plate 6 from the magazine cassette 50.
  • the following describes how to make random access more effective.
  • FIG. 46 is a schematic explanatory view of the magazine cassette 450 viewed from the front side with the magazine cassette 450 provided in the component supply device according to the third embodiment as the front side with the plate removal direction C as the front side. .
  • a number of grooves 450 b arranged opposite to each other are formed inside each side wall 450 a of the magazine cassette 450.
  • the respective ends of the plate 6 are supported by the grooves 450 b of each set, so that the plate 6 can be accommodated while maintaining a substantially horizontal posture.
  • a rear side wall portion 450 c is also provided on the rear side in the drawing of the magazine cassette 450, and the rear side wall portion 450 c is engaged with an end of the plate 6,
  • a posture guide section 490 is provided to enable the horizontal posture of the plate 6 and the horizontal posture with respect to the plate unloading direction C to be maintained in a normal posture.
  • the end of the tray supply plate 6t on the opposite side to the plate removal direction C (that is, the tray At the lower surface of the ring 59), a posture guide block 59a that can be engaged with the posture guide portion 49 is formed.
  • FIG. 47 shows an enlarged plan view of this state.
  • FIG. 48 shows a detailed front view of the magazine cassette 450 in the same direction as FIG. 46
  • FIG. 49 shows a cross-sectional view of the magazine cassette 450 in FIG. .
  • the plurality of posture guide portions 490 are arranged in a line in the vertical direction. Further, as shown in FIG. 47, the posture guide portion 490 is arranged so that the two pin-shaped members 490 in the bent state face each other and are spaced apart from each other by a predetermined distance, for example, It is formed by being attached to the side wall surface 450c by screwing or the like.
  • the predetermined interval between the respective pin-shaped members 491 is approximately the same as the formation width of the attitude guide block 59a of the tray supply plate 6t near the rear side wall portion 450c. It is formed so that the above-mentioned interval becomes wider as the distance from the inner side wall portion 450c increases.
  • each of the magazine cassettes 450 is provided with the respective attitude guide portions 490
  • each of the tray supply plates 6t is provided with the attitude guide block 59a.
  • the tray supply plate 6t whose opposite ends are supported by the pair of groove portions 450b of the opposing pair, and the posture guide block 59a and the posture guide portion as shown in FIG. 47. Engage with 490 By doing so, the tray supply plate 6t can be maintained in a normal posture in the horizontal direction with respect to the plate unloading direction C, and the support posture of each groove 450b can be maintained in a horizontal posture.
  • the distance between the respective pin-shaped members 491 in the posture guide portion 49 0 is tapered as shown in FIG.
  • each plate 6 accommodated in the magazine cassette 450 Since the support posture of each plate 6 accommodated in the magazine cassette 450 is maintained in a normal state in this way, as shown in the schematic diagram of FIG. Each of the plates 6 can be taken out smoothly, and it is possible to prevent the parts 2 from jumping out of the tray supply plate 6t. Therefore, random access to each plate 6 accommodated in the magazine cassette 450 can be efficiently performed, and efficient component supply can be realized.
  • the plate 6 is the S-tray supply plate 6 t is described as a representative, but the same configuration can be adopted for the wafer supply plate 6 w.
  • the charging of the magazine cassette 450 may affect the respective components 2.
  • the charge amount is usually about 400 V to 600 V.
  • a connection block 4 71 (fixed portion) for connecting (fixing) the magazine cassette 450 and the base 52 to the bottom of the magazine cassette 450 is provided. 1) For example, three are provided. In order to prevent the influence of such electrification on the parts, for example, by forming at least one of the three connection blocks 471 1 from a conductive material, grounding is performed.
  • the magazine cassette 450 can be grounded by providing a function as a terminal portion, and the charge amount can be reduced to about several V, for example, about 2 V.
  • the third embodiment is such a case. It is not limited only to the case. In place of such a case, a magazine cassette which can further improve the workability while obtaining the effect of the above-described posture guide unit 490 will be described below as a modification of the fourth embodiment. .
  • the magazine cassette 500 when viewed from the plate removing direction C of the magazine cassette 500, the rear side wall surface 5OO c is formed by the magazine cassette 500.
  • the magazine cassette 500 is fixed to the main body, and in order to exchange each plate 6, the magazine cassette 500 is positioned at a predetermined position by the cassette elevating unit 51, and the magazine cassette 500 is moved from the base 52. It is necessary to remove and exchange each plate 6 from the opening of the magazine cassette 500 in the plate removal direction C side.
  • such magazine cassettes generally have a large weight, for example, a weight of about 20 to 30 kg. It is a factor that hinders the improvement of quality.
  • removing the magazine cassette 500 also stops the operation of the component supply device, and from such a viewpoint, improvement in working efficiency is desired. The purpose of this modification is to solve such problems in random access and to achieve further improvement in work efficiency.
  • FIG. 52 a schematic ⁇ view of the magazine cassette 550 according to the present modification is shown in FIG. 52, and a schematic explanatory view of a cross-sectional view of the magazine cassette 550 is shown in FIG. .
  • an opening / closing cover portion 5 which is an example of a door portion that can be opened and closed with respect to the plate removing direction C is provided. It has a configuration different from that of the magazine cassette 450 of the third embodiment in that it is set to 50c. Also, inside the opening / closing cover 550c, like the rear side wall surface 450c of the magazine cassette 450, the support posture of each plate 6 is maintained in a normal posture. An attitude guide section 590 is provided.
  • the opening / closing cover section 550c By providing the opening / closing cover section 550c in this manner, by opening the opening / closing cover section 550c without removing the magazine cassette 550 from the base 52, Each plate 6 can be replaced. Therefore, workability in such replacement work can be significantly improved.
  • the opening / closing cover section 550c is provided with the respective attitude guide sections 590, after the respective plates 6 are stored in the magazine cassette 550, the opening / closing cover section 550c is provided. By closing, the posture guide block of each plate 6 and the posture guide portion 590 of the opening / closing cover 550c can be engaged, and the posture of each plate 6 is normal by the engagement. Can be kept.
  • an open / close detection sensor 5 capable of detecting the open / closed state of the open / close cover 550 c is used. 80 may be provided.
  • the open / close cover 550 c is provided with the detected part 580 a of the open / close detection sensor 580, and the open / close cover 550 c is closed.
  • the detection section 580b can be provided on the main body side of the magazine cassette 550 so that the detection section 580a can be detected.
  • the plate moving device 4 is placed at a position where the respective plates 6 storing the magazine cassettes 55 can be exchanged by the cassette elevating unit 51, for example, at the origin position.
  • a plate accommodating section 570 is provided at the lower portion of the magazine cassette 550 so that the plate 6 can be inserted into and taken out of the magazine cassette 550 by the number 0.
  • the plate 6 accommodated in the plate accommodating section 570 is taken out by the plate moving device 40 to supply the component 2, and the component 2 is supplied.
  • the plate 6 can be accommodated in the plate accommodating section 570.
  • FIGS. 54A and 54B are partially enlarged views of the respective side walls 550a at the opening end of the opening / closing cover 550c of the main body of the magazine cassette 550 (left and right sides).
  • a step number can be displayed for each of the opposing sets in each of the groove portions 550b provided inside the magazine cassette 550. In such a case, when the operator accommodates each plate 6 in the magazine cassette 550, it is possible to prevent the right and left grooves 550b from being mistaken in the number of steps.
  • step S1 the plate exchange operation is started.
  • the start of this work is performed, for example, by setting the control device of the component mounting It can be done by operating.
  • step S2 the magazine force set 550 is moved up and down by the cassette elevating unit 51 to be positioned at the origin position.
  • step S3 the opening / closing cover portion 55 Oc of the magazine cassette 550 is opened, and each plate 6 is replaced.
  • the plate 6 is moved to the plate receiving portion by the plate moving device 40. It can be accommodated in 570 (step S4).
  • step S5 the stage number in which each plate 6 is housed is checked, and it is confirmed that the plate 6 is not housed in an oblique posture. Then, by closing the opening / closing cover portion 550c and confirming this closure, it can be confirmed and confirmed that each plate 6 has been housed in a normal posture. The confirmation of the closing can also be performed by the open / close detection sensor 580 as described above. This completes the plate exchange operation (Step S7).

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Wire Bonding (AREA)

Abstract

A parts feeder (4), wherein a tray feeding plate (6t) is surely held by restricting the lowering position of a plate pressing body (61) and a wafer feeding plate (6w) is expanded to a wafer while surely holding the wafer holding plate by releasing the restriction of the lowering position according to the types of the plates (6, 6w, 6t) disposed on a plate arrangement device (12), whereby proper holding operation and expanding operation can be selectively and automatically performed according to the types of the plates.

Description

部品供給装置 技術分野 Parts supply equipment Technical field
本発明は、 基板に実装される部品のうちの複数のウェハ供給部品が配置された ウェハを載置するウェハ供給用プレートと、 複数のトレイ供給部品が配置された 部品供給トレイを載置するトレ明イ供給用プレートとより、 上記夫々のウェハ供給 部品及び上記夫々のトレイ供給部品を部品実装可能に部品実装装置における実装 細 1  The present invention provides a wafer supply plate on which a plurality of wafer supply components among components mounted on a substrate are placed, and a tray for placing a component supply tray on which a plurality of tray supply components are placed. The wafer supply parts and tray supply parts can be mounted on the component mounting device by using the plate for supplying light.
部に供給する部品供給装置に関する。 The present invention relates to a component supply device for supplying a component.
食  Food
背景技術 Background art
従来、 このような部品供給装置においては、 基板に実装される部品のうちの複 数のウェハ供給部品が配置されたウェハが載置されたウェハ供給用プレート、 又 は、 複数のトレイ供給部品が配置された部品供給トレイが載置されたトレイ供給 用プレートのうちのいずれか一方が選択的に収納されて、 上記ウェハ供給用プレ ―ト又は上記トレイ供給用プレートが取り出されて、 上記夫々のウェハ供給部品 又は上記トレイ供給部品の部品実装装置の実装部等への供給が行なわれている (例えば、 特開 2 0 0 0— 9 1 3 8 5号公報参照） 。  Conventionally, in such a component supply apparatus, a wafer supply plate on which a wafer on which a plurality of wafer supply components among components mounted on a substrate are arranged, or a plurality of tray supply components is provided. Either one of the tray supply plates on which the arranged component supply trays are placed is selectively housed, and the wafer supply plate or the tray supply plate is taken out, and each of the tray supply plates is taken out. Wafer supply components or tray supply components are supplied to a mounting section of a component mounting apparatus or the like (see, for example, Japanese Patent Application Laid-Open No. 2000-91385).
また、 このような部品供給装置において、 上記ウェハ供給用プレート上に載置 された上記ウエノ、より上記夫々のゥェハ供給部品を供給可能な状態とさせるため には、 ダイシングが施された上記ウェハをエキスパンドさせることが必要である。 そのため、 上記部品供給装置には、 このエキスパンドを行う装置が備えられてい る。 さらに、 当該エキスパンドが施された上記ウェハより供給される上記ウェハ 供給部品を、 その下面より突き上げて取り出し可能な状態とさせることも必要で ある。 そのため、 上記部品供給装置には、 この突き上げ動作を行う突き上げ装置 も備えられている。  Further, in such a component supply apparatus, in order to make the wafers placed on the wafer supply plate more capable of supplying the respective wafer supply components, the dicing wafer is used. It is necessary to expand. Therefore, the component supply device is provided with a device for performing the expanding. Further, it is necessary that the wafer supply component supplied from the expanded wafer is pushed up from the lower surface thereof so that it can be taken out. Therefore, the above-mentioned component supply device is also provided with a push-up device for performing this push-up operation.
一方、 上記部品供給装置において、 上記部品供給用プレート上に載置された上 記部品供給トレイより上記夫々のトレイ供給部品を供給可能な状態とさせるため には、 上記ウェハに対するようなエキスパンドゃ突き上げ等の動作を行う必要は ない。 On the other hand, in the above-mentioned component supply device, the above-mentioned component supply tray placed on the above-mentioned component supply plate is set so that the respective tray supply components can be supplied. In such a case, it is not necessary to perform an operation such as expanding the wafer as described above.
従って、 上記部品供給装置において上記ウェハ供給用プレートが収納されてい る場合と、 上記トレィ供給用プレートが収納されている場合とで、 夫々の部品を 供給可能させる動作が異なることとなる。  Therefore, the operation of enabling the supply of each component is different between the case where the wafer supply plate is stored in the component supply device and the case where the tray supply plate is stored in the component supply device.
現在、 部品実装においては、 1枚の基板に様々な種類の部品が実装されること により生産されるマルチチップ実装基板の生産が主流となってきており、 このよ うなマルチチップ実装基板に実装される上記様々な種類の部品の中には、 上記ゥ ェハ供給部品や上記トレィ供給部品も多く含まれる。 また、 その一方で、 このよ うなマルチチップ実装基板の生産における生産†生の向上も強く望まれている。 発明の開示  Currently, in component mounting, the production of multi-chip mounting boards, which are produced by mounting various types of components on a single board, has become the mainstream, and mounting on such multi-chip mounting boards has become mainstream. Among the various types of parts described above, many of the wafer supply parts and the tray supply parts are also included. On the other hand, there is a strong demand for improvement in production productivity in the production of such multi-chip mounting boards. Disclosure of the invention
しかしながら、 従来の部品供給装置においては、 このような上記夫々のウェハ 供給部品の供給動作と、 上記夫々のトレイ供給部品の供給動作との動作の相違に 自動的に対応するすべがなく、 上記部品が上記ウェハ供給用プレートから供給さ れるのか、 又は、 上記トレイ供給用プレートから供給されるのかというような上 記部品の供給形態によって、 上記エキスパンドを行う装置や上記突き上げ装置等 を作動させない若しくは当該作動により影響を受けないようにしたり、 夫々の装 置等の構成部品を作業者が取り替えたりすることで対応していたため、 部品供給 における生産効率が著しく低下しているという問題がある。  However, in the conventional component supply device, there is no way to automatically cope with such a difference in the operation of supplying the respective wafer supply components and the operation of supplying the respective tray supply components. Depending on the supply form of the above components, such as whether the wafer is supplied from the wafer supply plate or the tray supply plate, the device for performing the expansion or the push-up device is not operated or the relevant device is not operated. The problem was that the production efficiency in parts supply was significantly reduced because the operation was not affected by the operation and the components were replaced by the operator.
また、 部品実装の現場では、 上記ウェハ供給部品又は上記トレィ供給部品のい ずれが先に基板に実装されるのかということが、 上記基板の種類等によっても異 なり、 そのために、 上記部品の供給形態に応じて、 上記部品供給装置における上 記構成部品の取り替えの作業や、 上記部品供給装置に収納される夫々の上記プレ ートを上記ウェハ供給用プレートと上記トレイ供給用プレートとの間で交換する という交換作業が行われることとなり、 このような作業が作業者にとつて非常に 手間となって、 その作業効率を著しく低下させるという問題点もある。  Also, at the component mounting site, whether the wafer supply component or the tray supply component is mounted on the board first depends on the type of the board, etc. Depending on the form, the work of replacing the above-mentioned components in the above-mentioned component supply device and the respective plates stored in the above-mentioned component supply device are moved between the above-mentioned wafer supply plate and the above-mentioned tray supply plate. The exchange work of replacement is performed, and there is a problem that such an operation is very troublesome for an operator, and significantly reduces the work efficiency.
さらに、 上記ウェハや上記部品供給トレイの形状の相違により、 上記ウェハ供 給用プレートにおける上記夫々のゥェハ供給部品の供給高さ位置と、 上記トレィ 供給用プレートにおける上記夫々のトレイ供給部品の供給高さ位置とが同じ高さ 位置とはなっていない。 従って、 上記夫々の部品が供給可能とされた状態にて、 V、ずれの上記プレートにおいても上記夫々の供給高さ位置を同じとさせて当該部 品の供給を行う必要があり、 上記部品供給装置において上記夫々のプレートを支 持する支持部分の高さ位置を、 上記部品の供給形態により調整する作業 （例えば、 上記支持部分の部品の交換等） が必要であり、 さらに作業効率を低下させている という問題もある。 Further, due to the difference in the shape of the wafer and the component supply tray, the supply height position of each wafer supply component on the wafer supply plate and the tray The supply height position of each tray supply component on the supply plate is not the same height position. Therefore, it is necessary to supply the parts with the same supply height position even in the V and shift plates in a state where the respective parts can be supplied. In the apparatus, it is necessary to adjust the height position of the supporting portions supporting the respective plates according to the supply form of the components (for example, replacing the components of the supporting portions, etc.). There is also a problem.
また、 その他、 上記部品供給装置におけるメンテナンスにおいても後述するよ うな種々の問題があり、 上記部品供給装置のメンテナンス性が良好なものではな く、 効率的な部品供給を行うことができないという問題もある。  In addition, there are various problems as described later in the maintenance of the above-mentioned component supply device, and the maintenance performance of the above-mentioned component supply device is not good, and there is also a problem that efficient component supply cannot be performed. is there.
従って、 本発明の目的は、 上記問題を解決することにあって、 基板に実装され る部品のうちの複数のウェハ供給部品が配置されたウェハを載置するウェハ供給 用プレートと、 複数のトレイ供給部品が配置された部品供給トレイを载置するト レイ供給用プレートとより、 上記夫々のウェハ供給部品及び上記夫々のトレイ供 給部品を部品実装可能に部品実装装置における実装部に供給する部品供給装置に おいて、 上記ウェハ供給用プレート及び上記トレイ供給用プレートを混載して収 納可能であるとともに、 上記夫々のプレートより選択される上記プレートが上記 ウェハ供給用プレート又は上記トレイ供給用プレートのいずれであるかに拘らず、 上記選択されたプレートより上記部品を自動的に供給可能とさせることができ、 さらにメンテナンス性も良好とすることができる効率的な部品供給を行うことが できる部品供給装置を提供することにある。  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problem, and to provide a wafer supply plate for mounting a wafer on which a plurality of wafer supply components among components mounted on a substrate are arranged, and a plurality of trays. A component for supplying the respective wafer supply components and the respective tray supply components to a mounting unit of the component mounting apparatus so that components can be mounted on the tray supply plate on which the component supply tray on which the supply components are arranged is placed. In the supply device, the wafer supply plate and the tray supply plate can be mixed and stored, and the plate selected from the respective plates is the wafer supply plate or the tray supply plate. Regardless of which of the above, the above-mentioned parts can be automatically supplied from the above-mentioned selected plate. An object of the present invention is to provide a component supply device capable of efficiently supplying components that can maintain good maintenance.
上記目的を達成するために、 本発明は以下のように構成する。  In order to achieve the above object, the present invention is configured as follows.
本発明の第 1態様によれば、 基板に実装される部品のうちの複数のゥェハ供給 部品が配置されたウェハを載置するウェハ供給用プレートと、 複数のトレイ供給 部品が配置された部品供給トレイを載置するトレイ供給用プレートとより、 上記 夫々のウェハ供給部品及び上記夫々のトレイ供給部品を部品実装可能に供給する 部品供給装置において、  According to the first aspect of the present invention, a wafer supply plate for mounting a wafer on which a plurality of wafer supply components among components mounted on a substrate are arranged, and a component supply plate on which a plurality of tray supply components are arranged A component supply device that supplies the respective wafer supply components and the respective tray supply components in a component mountable manner by using a tray supply plate on which a tray is placed.
上記夫々のプレートのうちのいずれかの上記プレートを選択的に配置させて保 持し、 上記ウェハより上記夫々のウェハ供給部品を、 又は、 上記部品供給トレィ より上記トレイ供給部品を供給可能な状態とさせるプレート配置装置を備え、 当該プレート配置装置は、 上記ウェハ供給用プレートによる上記夫々のウェハ 供給部品の供給高さと、 上記トレィ供給用プレートによる上記夫々のトレイ供給 部品の供給高さとが略同じとなるように、 上記プレートを配置させて保持する部 品供給装置を提供する。 Any one of the plates is selectively disposed and held, and the respective wafer supply parts or the component supply trays are provided from the wafer. A plate placement device for enabling the tray supply components to be supplied, the plate placement device comprising: a supply height of each of the wafer supply components by the wafer supply plate; and a respective one of the tray supply plates by the tray supply plate. Provided is a component supply device that arranges and holds the above-mentioned plate so that the supply height of the tray supply component is substantially the same.
本発明の第 2態様によれば、 上記プレート配置装置は、  According to a second aspect of the present invention, the plate placement device includes:
上記配置されるプレートをその外周部近傍における下面側より支持可能、 かつ、 その支持高さ位置が可変する弾性支持部材と、  An elastic support member capable of supporting the placed plate from the lower surface side in the vicinity of an outer peripheral portion thereof, and having a variable support height position;
上記弾性支持部材に支持された上記プレートを、 上記弾性支持部材との間で挟 むように、 その上記外周部近傍における上面側より押圧して、 上記プレートの保 持を行うプレート押圧体と、  A plate pressing body for holding the plate by pressing the plate supported by the elastic support member from above in the vicinity of the outer peripheral portion so as to sandwich the plate between the elastic support member and the plate;
上記プレート押圧体の昇降を行う押圧体昇降部とを備え、  Comprising a pressing body elevating unit for elevating the plate pressing body,
上記押圧体昇降部は、 上記弾性支持部材により支持された状態の上記ゥェハ供 給用プレートによる上記夫々のウェハ供給部品の供給高さと、 上記トレイ供給用 プレートによる上記夫々のトレイ供給部品の供給高さとが略同じとなるように、 上記プレート押圧体の昇降を行ない、 上記弾性支持部材の支持高さ位置を可変さ せる第 1態様に記載の部品供給装置を提供する。  The pressing body elevating unit includes a supply height of each wafer supply component by the wafer supply plate supported by the elastic support member, and a supply height of each tray supply component by the tray supply plate. The component supply device according to the first aspect, in which the plate pressing body is moved up and down so that the height is substantially the same, and the support height position of the elastic support member is changed.
本発明の第 3態様によれば、 上記プレート配置装置は、 上記押圧体昇降部によ る上記プレート押圧体の下降位置を選択的に規制する規制部をさらに備え、 上記プレート配置装置に、 上記トレィ供給用プレートが配置された場合に、 上 記夫々のトレイ供給部品の供給高さが、 上記夫々のゥェハ供給部品の供給高さと 略同じとなるように、 上記規制部により上記プレート押圧体の下降位置を規制す る第 2態様に記載の部品供給装置を提供する。  According to a third aspect of the present invention, the plate disposing device further includes a restricting portion for selectively restricting a lowering position of the plate pressing member by the pressing member elevating portion. When the tray supply plate is arranged, the restricting portion controls the plate pressing member so that the supply height of each tray supply component is substantially the same as the supply height of each wafer supply component. The component supply device according to the second aspect, which regulates the lowering position, is provided.
本発明の第 4態様によれば、 基板に実装される部品のうちの複数のウェハ供給 部品が配置されたウェハを載置するウェハ供給用プレートと、 複数のトレイ供給 部品が配置された部品供給トレイを載置するトレイ供給用プレートとより、 上記 夫々のゥェハ供給部品及び上記夫々のトレイ供給部品を部品実装可能に供給する 部品供給装置において、  According to the fourth aspect of the present invention, a wafer supply plate for mounting a wafer on which a plurality of wafer supply components are arranged among components mounted on a substrate, and a component supply on which a plurality of tray supply components are arranged A tray supply plate on which a tray is placed, a component supply device that supplies the respective wafer supply components and the respective tray supply components in a mountable manner.
複数の上記ウェハ供給用プレートと複数の上記トレイ供給用プレートを取り出 し可能に収納するプレート収納部と、 Take out multiple wafer supply plates and multiple tray supply plates And a plate storage section for storing
上記夫々のプレートのうちのいずれかの上記プレートを選択的に配置させて保 持し、 上記ウェハより上記夫々のウェハ供給部品を、 又は、 上記部品供給トレィ より上記トレイ供給部品を供給可能な状態とさせるプレート配置装置と、  A state in which any one of the respective plates is selectively arranged and held, and the respective wafer supply components can be supplied from the wafer or the tray supply components can be supplied from the component supply tray. A plate arrangement device for
上記プレートを解除可能に保持して、 上記プレート収納部から取り出すととも に、 上記プレート配置装置に保持可能に移動させるプレート移動装置とを備え、 上記プレート配置装置は、  A plate moving device that holds the plate releasably, removes the plate from the plate storage portion, and moves the plate disposing device so that it can be retained.
上記配置されるプレートをその外周部近傍における下面側より支持可能、 かつ、 その支持高さ位置が可変する複数の弾性支持部材と、  A plurality of elastic support members capable of supporting the arranged plate from the lower surface side in the vicinity of an outer peripheral portion thereof, and having a variable support height position;
上記夫々の弾性支持部材に支持された上記プレートを、 上記夫々の弾性支持部 材との間で挟むように、 その上記外周部近傍における上面側より押圧して、 上記 プレートの保持を行うプレート押圧体と、  A plate pressing for holding the plate by pressing the plate supported by the respective elastic support members from above in the vicinity of the outer peripheral portion so as to be sandwiched between the respective elastic support members. Body and
上記プレート押圧体の昇降を行う押圧体昇降部と、  A pressing body elevating unit that moves the plate pressing body up and down,
上記押圧体昇降部による上記プレート押圧体の下降位置を選択的に規制する規 制部とを備え、  A regulating unit for selectively regulating a lowering position of the plate pressing body by the pressing body elevating unit,
上記プレート配置装置に、 上記トレィ供給用プレートが配置された場合に、 上 記規制部により上記プレート押圧体の下降位置を規制して、 上記夫々の弾性支持 部材による上記トレイ供給用プレートの支持高さを保持可能であり、  When the tray supply plate is disposed in the plate disposition device, the lowering position of the plate pressing body is regulated by the restricting portion, and the support height of the tray supply plate by the respective elastic support members is adjusted. Can be maintained,
上記プレート配置装置に、 上記ウェハ供給用プレートが配置された場合に、 上 記規制部による上記下降位置の規制を解除して、 上記夫々の弾性支持部材に上記 ウェハ供給用プレートを支持させながら、 上記押圧体昇降部により上記プレート 押圧体を下降させて、 上記ウェハ供給用プレートに載置された上記ウェハのェキ スパンドが可能である部品供給装置を提供する。  When the wafer supply plate is disposed on the plate disposing device, the restriction of the lowering position by the restriction unit is released, and the respective elastic support members support the wafer supply plate. Provided is a component supply device capable of lowering the plate pressing body by the pressing body elevating unit and expanding the wafer placed on the wafer supply plate.
本発明の第 5態様によれば、 上記ウェハ供給用プレートは、  According to a fifth aspect of the present invention, the wafer supply plate comprises:
ダイシングが施された上記ウェハが貼着されたウェハシートと、  A wafer sheet to which the above-mentioned diced wafer is attached,
環状プレートであって、 その内側に上記ウェハが位置されるように、 上記ゥェ ハシートを保持するウェハリングとを備え、  A wafer ring holding the wafer sheet so that the wafer is positioned inside the annular plate,
上記プレート配置装置は、 上記ウェハリングが上記夫々の弾性支持部材に支持 された状態の上記ウェハ供給用プレートにおいて、 上記ウェハの外周と上記ゥェ ハリングの内周との間における上記ウェハシートの下面に当接可能な環状の当接 部を有するエキスパンド部材をさらに備え、 The plate disposing device may be configured such that, in the wafer supply plate in a state where the wafer ring is supported by the respective elastic support members, an outer periphery of the wafer and the gap are provided. An expanding member having an annular abutting portion capable of abutting on the lower surface of the wafer sheet between the inner periphery of the haring and the lower surface of the wafer sheet;
上記エキスパンド部材における上記環状の当接部を支点としながら、 上記押圧 体昇降部により上記プレート押圧体を下降させて、 上記ウェハリングを押し下げ て、 上記ウェハシートを放射状に延伸させることにより、 上記ウェハのエキスパ ンドが可能である第 4態様に記載の部品供給装置を提供する。  The plate pressing body is lowered by the pressing body elevating unit while the annular contact part of the expanding member is used as a fulcrum, and the wafer ring is pressed down to radially extend the wafer sheet, thereby obtaining the wafer. A component supply device according to a fourth aspect, wherein the component supply device can be expanded.
本発明の第 6態様によれば、 上記プレート移動装置は、  According to a sixth aspect of the present invention, the plate moving device comprises:
上記プレートを解除可能に保持する保持部と、  A holding portion for holding the plate releasably,
上記保持部により保持された上記プレートを上記プレート収納部から上記プレ ート配置装置に移動させるように、 上記保持部の移動を行う保持部移動部と、 上記プレートの保持部分の形状に基づいて、 上記保持されるプレートが、 上記 ウェハ供給用プレート又は上記トレイ供給用プレートのいずれであるかを識別す るプレート識別部とを備え、  A holding unit moving unit that moves the holding unit so as to move the plate held by the holding unit from the plate storage unit to the plate placement device, based on a shape of the holding unit of the plate; A plate identification unit for identifying whether the plate to be held is the wafer supply plate or the tray supply plate,
上記プレート配置装置における上記規制部は、 上記プレート識別部の上記識別 結果に基づいて、 上記プレート押圧体の上記下降位置を規制する第 4態様に記載 の部品供給装置を提供する。  The component supply device according to a fourth aspect, wherein the regulation unit in the plate placement device regulates the lowered position of the plate pressing body based on the identification result of the plate identification unit.
本発明の第 7態様によれば、 上記トレイ供給用プレートは、  According to a seventh aspect of the present invention, the tray supply plate comprises:
複数の上記部品供給トレイが着脱可能に載置されるトレイ載置部と、 上記トレイ載置部の周囲に形成された環状プレートであるトレイリングとを備 え、  A tray mounting portion on which the plurality of component supply trays are removably mounted, and a tray ring which is an annular plate formed around the tray mounting portion;
上記プレート配置装置において、 上記夫々の弾性支持部材により上記トレイリ ングが支持されるとともに、 上記プレート押圧体と上記夫々の弾性支持部材との 間で、 上記トレイリングを挟むように押圧して、 上記トレィ供給用プレートの保 持が可能であって、 上記規制部は、 上記トレィ供給用プレートの下面が、 上記ェ キスパンド部材に当接しないように、 上記押圧体昇降部による上記プレート押圧 体の上記下降位置の規制を行う第 5態様に記載の部品供給装置を提供する。 本菜明の第 8態様によれば、 上記トレィ載置部は、  In the plate disposition device, the tray ring is supported by the respective elastic support members, and the tray ring is pressed between the plate pressing body and the respective elastic support members so as to sandwich the tray ring. The tray supply plate can be held, and the restricting portion is configured to prevent the lower surface of the tray supply plate from coming into contact with the expanse member so that the plate pressing member is moved by the pressing member elevating portion. A component supply device according to a fifth aspect, which regulates a lowered position. According to an eighth aspect of the present invention, the tray mounting part is
平面的に略四角形状の形状を有する上記部品供給トレイにおける上記略四角形 状の一の端部に当接可能な固定側保持部材と、 上記固定側保持部材に上記一の端部が当接された状態の上記部品供給トレイに おける上記一の端部に対向する端部に当接可能であって、 かつ、 当該端部を上記 固定側保持部材に向けて付勢可能に可動する可動側保持部材とを備え、 A fixed-side holding member capable of abutting on one end of the substantially square shape in the component supply tray having a substantially square shape in plan view; The end of the component supply tray in a state where the one end is in contact with the fixed-side holding member can be brought into contact with the end facing the one end, and the end is fixed. A movable holding member that is movable to be biased toward the side holding member,
上記固定側保持部材及ぴ上記可動側保持部材により上記部品供給トレイを挟む ようにして、 上記トレイ載置部における上記部品供給トレイの载置位置が保持さ れる第 7態様に記載の部品供給装置を提供する。 '  The component supply device according to a seventh aspect, wherein the component supply tray is held at the tray mounting portion so that the component supply tray is held between the fixed-side holding member and the movable-side holding member. I will provide a. '
本発明の第 9態様によれば、 上記複数の弾性支持部材のうちの少なくとも 1つ の弾性支持部材は、 その先端において、 上記支持されるプレートの端部が当接さ れて、 上記プレートの表面沿いの方向における支持位置を規制する傾斜端部を有 している第 4態様に記載の部品供給装置を提供する。  According to a ninth aspect of the present invention, at least one of the plurality of elastic support members has an end at an end thereof which is in contact with an end of the supported plate, and The component supply device according to the fourth aspect, having an inclined end for regulating a support position in a direction along the surface.
本発明の第 1 0態様によれば、 上記規制部は、  According to a tenth aspect of the present invention,
上記プレート押圧体の下部と当接可能であって、 上記当接により上記プレート 押圧体の下降位置を規制可能な当接部と、  A contact portion capable of contacting a lower portion of the plate pressing member, wherein the contact portion is capable of regulating a lowering position of the plate pressing member by the contact;
上記当接部が上記プレート押圧体と上記当接される当接位置と、 上記当接が退 避される β位置との間で、 上記当接部を移動させる当接部移動機構とを備える 第 4態様に記載の部品供給装置を提供する。  A contact portion moving mechanism that moves the contact portion between a contact position where the contact portion contacts the plate pressing body and the β position where the contact is retracted; A component supply device according to a fourth aspect is provided.
本発明の第 1 1態様によれば、 上記プレート配置装置における上記押圧体昇降 部は、  According to the eleventh aspect of the present invention, in the plate disposing device, the pressing body elevating unit includes:
圧縮空気の給気又は排気により、 上記プレート押圧体を上昇又は下降させるシ リンダ部と、  A cylinder section for raising or lowering the plate pressing body by supplying or discharging compressed air;
上記シリンダ部に上記圧縮空気として上記上昇又は上記下降を行う昇降用圧縮 空気を供給可能な昇降用圧縮空気供給部と、  An ascending and descending compressed air supply unit capable of supplying ascending or descending ascending or descending compressed air to the cylinder as the compressed air;
上記昇降用圧縮空気よりも低い圧力を有して、 上記プレート押圧体の上記昇降 又は上記下降の停止の際に、 上記プレート押圧体の上記停止位置を保持する保持 用圧縮空気を、 上記圧縮空気として上記シリンダ部に供給可能な保持用圧縮空気 供給部と、  The compressed air for holding, which has a lower pressure than the compressed air for raising and lowering and holds the stop position of the plate pressing body when the lifting or lowering of the plate pressing body is stopped, A holding compressed air supply unit that can be supplied to the cylinder unit as
上記昇降用圧縮空気又は上記保持用圧縮空気を選択的に上記シリンダ部に供給 する圧縮空気選択弁とを備える第4態様に記載の部品供給装置を提供する。 本発明の第 1 2態様によれば、 上記圧縮空気選択弁は、 上記プレート押圧体と 機械的に接触されることにより、 上記プレート押圧体の上記昇降の上端位置を検 出可能であって、 上記上端位置の検出時に、 上記昇降用圧縮空気に代えて上記保 持用圧縮空気を選択的に上記シリンダ部に供給するメカロックバルブである第 1 1態様に記載の部品供給装置を提供する。 A component supply device according to a fourth aspect, comprising: a compressed air selection valve that selectively supplies the compressed air for lifting or the compressed air for holding or the compressed air for holding to the cylinder portion. According to a 12th aspect of the present invention, the compressed air selection valve comprises: The mechanical contact makes it possible to detect the upper end position of the lifting and lowering of the plate pressing body, and when the upper end position is detected, selects the holding compressed air instead of the lifting and lowering compressed air. The component supply device according to the eleventh aspect, wherein the component supply device is a mechanical lock valve for supplying the cylinder lock to the cylinder unit.
本発明の第 1 3態様によれば、 上記プレート収納部は、  According to a thirteenth aspect of the present invention, the plate storage section includes:
上記夫々のプレートを積層させて収納する収納体と、  A storage body for stacking and storing the respective plates,
上記収納体を昇降させて、 上記収納体に収納されている夫々のプレートのうち の 1つのプレートを、 上記プレート移動装置の上記保持部により保持可能な昇降 高さ位置に位置させる収納体昇降部とを備え、  A storage unit elevating unit that raises and lowers the storage unit and positions one of the plates stored in the storage unit at a height position that can be held by the holding unit of the plate moving device. With
上記プレート配置装置は、  The plate placement device is
上記保持部とともに上記保持された 1つのプレートが通過可能なプレート取出 口部を有し、 かつ、 上記 1つのプレート以外の上記プレート収納部の上記収納体 に収納されている上記夫々のプレートが上記収納体より飛び出すことを防止可能 な上記取出口部の周囲に形成されたプレート規制部を有する飛び出し防止板を開 閉移動可能に備えている第 6態様に記載の部品供給装置を提供する。  The plate has a plate outlet opening through which the held one plate can pass together with the holding portion, and each of the plates stored in the storage body of the plate storage portion other than the one plate is the above-described plate. The component supply device according to the sixth aspect, further comprising: a pop-out prevention plate having a plate regulating portion formed around the above-mentioned outlet portion, which can prevent the pop-out portion from being protruded from the storage body.
本発明の第 1 4態様によれば、 上記プレート配置装置は、 上記飛び出し防止板 における上記取出口部内に位置された上記プレートを検出可能な飛び出し検出部 をさらに備える第 1 3態様に記載の部品供給装置を提供する。  According to a 14th aspect of the present invention, the component according to the 13th aspect, wherein the plate disposing device further comprises: a pop-out detecting unit that can detect the plate positioned in the outlet portion of the pop-out preventing plate. A supply device is provided.
本発明の第 1 5態様によれば、 上記プレート収納部は、 '  According to a fifteenth aspect of the present invention,
上記収納体と上記収納体昇降部を支持する基台と、  A base supporting the storage body and the storage body elevating unit,
上記基台の配置位置の保持が可能であって、 上記保持を解除して、 上記基台の 直線的な移動を案内する直動案内部と、 上記基台を回転させながらの移動を案内 する回動案内部とを有する基台保持部とを備え、  It is possible to hold the arrangement position of the base, release the holding, guide the linear movement of the base, and guide the movement while rotating the base. And a base holding part having a rotation guide part,
上記基台は、  The base is
上記直動案内部及び上記回動案内部と選択的に係合可能な係合部を有し、 上記係合部が上記直動案内部と係合されることにより、 上記基台の直線的な移 動が可能であって、  An engagement portion that can be selectively engaged with the translation guide portion and the rotation guide portion; and the engagement portion is engaged with the translation guide portion, so that the base can be linearly moved. Movement is possible,
上記の係合部と上記直動案内部との係合が解除され、 かつ、 上記係合部が上記 回動案内部と係合されることにより、 上記基台の回転させながらの移動が可能で ある第 4態様に記載の部品供給装置を提供する。 The engagement between the engagement portion and the linear motion guide portion is released, and the engagement portion is engaged with the rotation guide portion, so that the base can be moved while rotating. so A component supply device according to a fourth aspect is provided.
本発明の第 1 6態様によれば、 上記プレート収納部の上記収納体は、 上記夫々 のプレートの互いに対向する夫々の端部を個別に支持し、 かつ、 上記夫々のプレ 一トの取出における上記プレートの表面沿いの方向への移動を案内する互いに対 向して配置された複数の組の支持ガイド部を備え、  According to a sixteenth aspect of the present invention, the storage body of the plate storage portion individually supports each of the opposite ends of each of the plates, and removes each of the plates. A plurality of sets of support guides disposed opposite to each other for guiding movement of the plate in a direction along the surface;
上記夫々のプレートにおける上記各々の支持ガイド部との接触部分が、 滑面部 を有している第 4態様に記載の部品供給装置を提供する。  The component supply device according to a fourth aspect, wherein a contact portion of each of the plates with the support guide portion has a smooth surface portion.
本発明の第 1 7態様によれば、 上記夫々のプレートの上記移動の方向と略直交 する方向における上記夫々の組の支持ガイド部への上記夫々のプレートの揷入位 置と、 上記夫々の組の支持ガイド部による支持位置との間の位置ズレを補正可能 に、 上記夫々の組の支持ガイド部の挿入端部に、 上記移動の方向に対する傾斜部 が形成されている第 1 6態様に記載の部品供給装置を提供する 6 According to a seventeenth aspect of the present invention, the positions of the respective plates inserted into the respective sets of support guide portions in a direction substantially orthogonal to the direction of the movement of the respective plates; In a sixteenth aspect, an inclined portion with respect to the direction of movement is formed at the insertion end of each of the support guide portions of the respective sets so as to correct the positional deviation between the support guide portions of the respective sets. Provide the parts supply device described 6
本発明の第 1 8態様によれば、 上記夫々のプレートと上記夫々の支持ガイド部 との互いの接触表面における夫々の硬度が、 上記夫々のプレートよりも上記夫々 の支持ガイド部が低くなるように、 上記夫々の接触表面が形成される第 1 6態様 又は第 1 7態様に記載の部品供給装置を提供する。  According to the eighteenth aspect of the present invention, the hardness of the respective plates and the respective support guides at the mutual contact surfaces of the respective support guides is lower than that of the respective plates. The present invention further provides the component supply device according to the sixteenth aspect or the seventeenth aspect, wherein the respective contact surfaces are formed.
本発明の第 1 9態様によれば、 上記夫々のプレートと上記夫々の支持ガイド部 との互いの接触表面における夫々の硬度が、 上記夫々の支持ガイド部よりも上記 夫々のプレートが低くなるように、 上記夫々の接触表面が形成される第 1 6態様 又は第 1 7態様に記載の部品供給装置を提供する。  According to the nineteenth aspect of the present invention, the hardness of each of the plates and the respective supporting guides at the contact surface of each other is lower than that of the respective supporting guides. The present invention further provides the component supply device according to the sixteenth aspect or the seventeenth aspect, wherein the respective contact surfaces are formed.
本発明の第 2 0態様によれば、 上記夫々の支持ガイド部は、 上記夫々のプレー トの端部を支持しながら、 当該端部の表面に沿って回転可能なローラ部を備える 第 1 6態様又は第 1 7態様に記載の部品供給装置を提供する。  According to a twenty-fifth aspect of the present invention, each of the support guide portions includes a roller portion rotatable along the surface of the end portion while supporting the end portion of each plate. An aspect or a component supply device according to the seventeenth aspect is provided.
本発明の第 2 1態様によれば、 上記プレート押圧体は、 その下面において、 上記プレート配置装置に供給された上記プレートを取出し可能に支持する複数 の支持部材と、  According to a twenty-first aspect of the present invention, the plate pressing body has, on its lower surface, a plurality of support members that support the plate supplied to the plate placement device so as to be able to take out the plate,
上記押圧体昇降部による上記プレート押圧体の下降位置に拘らず、 上記夫々の 支持部材又は上記夫々の弾性支持部材に上記プレートを常時付勢する複数の付勢 部材とを、 さらに備える第 4態様に記載の部品供給装置を提供する。 本発明の第 2 2態様によれば、 上記夫々の付勢部材は、 上記プレート移動装置 による上記プレートの移動を可能に、 上記夫々の支持部材により支持された上記 プレートを付勢しながら、 当該プレートの表面に沿って回転可能な付勢ローラ部 を備える第 2 1態様に記載の部品供給装置を提供する。 A fourth embodiment further comprising: a plurality of biasing members for constantly biasing the plate to the respective support members or the respective elastic support members, regardless of the lowering position of the plate pressing body by the pressing body lifting / lowering unit. And a component supply device according to (1). According to the twenty-second aspect of the present invention, each of the biasing members enables the plate to be moved by the plate moving device, and biases the plates supported by the respective support members. 21. The component supply device according to the 21st aspect, further comprising an urging roller portion rotatable along a surface of the plate.
本発明の第 2 3態様によれば、 上記夫々のプレートは、 上記保持部による上面 側の保持位置に、 当該保持部と係合可能な係合部を有する第 6態様に記載の部品 供給装置を提供する。  According to a twenty-third aspect of the present invention, the component supply device according to the sixth aspect, wherein each of the plates has an engagement portion engageable with the holding portion at a holding position on the upper surface side by the holding portion. I will provide a.
本発明の第 2 4態様によれば、 上記収納体は、 上記夫々の組の支持ガイド部の 間に配置され、 上記夫々のプレートと係合されることで、 上記夫々のプレートの 水平方向の支持姿勢を案内する複数の姿勢ガイド部をさらに備える第 1 6態様に 記載の部品供給装置を提供する。  According to the twenty-fourth aspect of the present invention, the storage body is disposed between the support guide portions of the respective sets, and is engaged with the respective plates, whereby the horizontal direction of the respective plates is improved. The component supply device according to a sixteenth aspect, further comprising a plurality of posture guide units for guiding a supporting posture.
本発明の第 2 5態様によれば、 上記収納体は、 開閉可能な上記夫々のプレート の交換用の扉部を有し、 上記夫々の姿勢ガイド部は当該扉部の内側に備えられて いる第 2 4態様に記載の部品供給装置を提供する。  According to the twenty-fifth aspect of the present invention, the storage body has a replacement door portion for each of the openable and closable plates, and each of the posture guide portions is provided inside the door portion. A component supply device according to a twenty-fourth aspect is provided.
本発明の第 2 6態様によれば、 上記収納体は、 上記扉部の開閉を検出する開閉 検出センサを備える第 2 5態様に記載の部品供給装置を提供する。  According to a twenty-sixth aspect of the present invention, there is provided the component supply device according to the twenty-fifth aspect, wherein the storage body includes an open / close detection sensor for detecting opening / closing of the door.
本発明の第 2 7態様によれば、 上記収納体は、 上記基台への支持面に当該支持 を固定する複数の固定部を有し、 少なくとも 1つの上記固定部が、 導電性材料で 形成され、 接地端子部としての機能を有する第 1 5態様に記載の部品供給装置を 提供する。  According to a twenty-seventh aspect of the present invention, the storage body has a plurality of fixing portions for fixing the support on the support surface to the base, and at least one of the fixing portions is formed of a conductive material. And a component supply device according to the fifteenth aspect, which has a function as a ground terminal portion.
本発明の上記第 1態様又は第 2態様によれば、 部品供給装置のプレート配置装 置におけるプレート押圧体の昇降位置を押圧体昇降部により調整することができ るため、 上記プレート配置装置に配置されるプレートの種類に応じて、 上記弾性 支持部材の支持高さ位置を可変させることができる。 従って、 配置供給されるプ レートがウェハ供給用プレートなの力 又は、 トレイ供給用プレートなのかに拘 らず、 上記夫々のプレートに配置された部品の供給高さを略同じとした状態で上 記夫々の部品の供給を可能とすることができる。 よって、 上記夫々のプレートを 混載しながら、 上記プレートの種類に応じて、 選択的にかつ自動的に適切な状態 で部品の供給を可能とすることができ、 部品供給を効率的に行うことができる。 本発明の上記第 3態様によれば、 上記プレート配置装置における上記プレート 押圧体の下降位置を規制部により選択的に規制することができるため、 上記プレ 一ト配置装置に配置されるプレートの種類に応じて、 下降位置を規制することが でき、 上記ウェハ供給部品と上記トレィ供給部品の供給高さを略同じとすること ができる。 According to the first aspect or the second aspect of the present invention, the vertical position of the plate pressing body in the plate arranging device of the component supply device can be adjusted by the pressing body elevating unit. The support height position of the elastic support member can be changed according to the type of the plate to be formed. Therefore, regardless of whether the plate to be arranged and supplied is a wafer supply plate force or a tray supply plate, the above described arrangement is performed with the supply heights of the components arranged on the respective plates being substantially the same. Each component can be supplied. Therefore, it is possible to selectively and automatically supply parts in an appropriate state according to the type of the plate while mixing the respective plates, and it is possible to efficiently supply the parts. it can. According to the third aspect of the present invention, since the lowering position of the plate pressing body in the plate placement device can be selectively regulated by the regulation portion, the type of the plate placed in the plate placement device can be controlled. Accordingly, the lowering position can be regulated, and the supply heights of the wafer supply component and the tray supply component can be made substantially the same.
本発明の上記第 4態様によれば、 部品供給装置のプレート配置装置におけるプ レート押圧体の下降位置を規制部により選択的に規制することができるため、 上 記プレート配置装置に配置されるプレートの種類に応じて、 トレイ供給用プレー トに対しては、 上記下降位置の規制を行うことにより、 その保持を確実に行うこ とができ、 一方、 ウェハ供給用プレートに対しては、 上記下降位置の規制を解除 することにより、 上記ウェハ供給用プレートを確実に保持しながら、 ウェハへの エキスパンドを行うことができる。 従って、 配置供給されるプレートが上記トレ ィ供給用プレートなのか、 又は、 上記ウェハ供給用プレートなのかに拘らず、 上 記夫々のプレートを混載しながら、 上記プレートの種類に応じて、 適切な保持動 作やエキスパンド動作を選択的にかつ自動的に行うことができ、 部品供給を効率 的に行うことを可能とすることができる。  According to the fourth aspect of the present invention, since the lowering position of the plate pressing body in the plate placement device of the component supply device can be selectively regulated by the regulation portion, the plate placed in the plate placement device described above is provided. Depending on the type of the tray, the lowering position of the tray supplying plate can be reliably held by regulating the lowering position. On the other hand, the lowering position of the wafer supplying plate can be controlled. By releasing the restriction on the position, it is possible to expand the wafer while securely holding the wafer supply plate. Therefore, irrespective of whether the plate to be arranged and supplied is the tray supply plate or the wafer supply plate, the above-mentioned respective plates are mixed and the appropriate plate is selected according to the type of the plate. The holding operation and the expanding operation can be selectively and automatically performed, and the parts can be efficiently supplied.
また、 本発明のその他の夫々の態様によれば、 上記プレートの種類の識別は、 プレート収納部から上記プレートを保持して取り出す際に、 上記プレートの保持 部分の形状に基づいて、 プレート識別部により行うことができる。 また、 この識 別結果に基づいて、 上記規制部において、 上記プレート押圧体の上記下降位置の 規制を選択的に行うことができる。  According to each of the other aspects of the present invention, the type of the plate is identified based on the shape of the holding portion of the plate when the plate is held and taken out of the plate storage unit. Can be performed. Further, based on the identification result, the lowering position of the plate pressing member can be selectively restricted in the restricting portion.
また、 上記ウェハのエキスパンドを行うエキスパンド部材が、 上記トレィ供給 用プレートの下面に接触しないように、 上記プレート押圧体の下降位置が規制さ れているため、 上記エキスパンド部材を傷付けることを防止することができる。 また、 上記プレート配置装置においては、 その支持高さ位置が可変可能とされ た複数の弾性支持部材が備えられていることにより、 夫々の上記プレートの外周 部近傍において上記夫々のプレートを支持することができるとともに、 上記プレ 一ト押圧体の昇降動作に合わせて、 上記支持を行いながらその支持高さ位置を自 由に可変することができ、 上述の効果を達成することが可能となっている。 また、 上記複数の弾性支持部材のうちの少なくとも 1つの弹'生支持部材が、 そ の先端部において上記支持されるプレートの端部が当接されて、 上記プレートの 表面沿いの方向における支持位置を規制する傾斜端部を有していることにより、 確実かつ正確な上記プレートの保持が可能となる。 Further, since the lowering position of the plate pressing body is regulated so that the expanding member for expanding the wafer does not contact the lower surface of the tray supply plate, it is possible to prevent the expanding member from being damaged. Can be. Further, in the plate disposing device, since the plurality of elastic supporting members whose supporting height positions are variable are provided, the respective plates are supported in the vicinity of the outer peripheral portions of the respective plates. In addition to this, it is possible to freely change the supporting height position while performing the support in accordance with the elevating operation of the plate pressing body, and the above-described effect can be achieved. . In addition, at least one of the plurality of elastic support members is supported by an end portion of the supported plate at an end thereof, and a support position in a direction along a surface of the plate is provided. With the inclined end portion that regulates, the plate can be reliably and accurately held.
また、 上記トレィ載置部が、 固定側保持部材と可動側保持部材とを備えている ことにより、 その載置位置の上方より上記固定側保持部材及び上記可動側保持部 材により上記部品供給トレイを挟むようにして、 上記載置位置に上記部品供給ト レイを載置させて、 その載置位置を保持することができる。 従って、 上記トレイ 供給用プレートの上記トレイ載置部への上記部品供給トレイの面積収容率を向上 させることができ、 より効率的な部品供給を行うことができる。  In addition, since the tray mounting portion includes a fixed-side holding member and a movable-side holding member, the component-supply tray is held by the fixed-side holding member and the movable-side holding member from above the mounting position. The component supply tray can be placed at the placement position described above, and the placement position can be maintained. Therefore, the area accommodation ratio of the component supply tray to the tray mounting portion of the tray supply plate can be improved, and more efficient component supply can be performed.
また、 上記飛び出し防止板を上記プレート配置装置側に設置して、 開閉移動可 能とさせていることにより、 上記開閉移動させることで、 上記飛び出し防止板を 移動させることができ、 メンテナンス性を向上させることができる。 さらに、 取 出口部に、 上記取出口部内に位置された上記プレートを検出可能な飛び出し検出 部を設けているため、 当該メンテナンス時等において、 上記飛び出し防止板が開 放移動されて当該飛び出し防止板が機能を果たすことができない場合であっても、 上記収納体から飛び出した上記プレートを検出することができ、 安全性を高めな がらメンテナンス性の向上を図ることができる。  In addition, since the pop-out prevention plate is installed on the plate disposing device side and is capable of opening and closing, the pop-out prevention plate can be moved by opening and closing, thereby improving maintainability. Can be done. Further, since the ejecting portion is provided with a projection detecting portion capable of detecting the plate located in the extracting portion, the ejecting prevention plate is opened and moved during the maintenance or the like, and the ejection preventing plate is moved. Even if the function cannot be performed, the plate protruding from the storage body can be detected, and the maintenance can be improved while improving the safety.
また、 上記部品供給装置への上記プレート収納部の装備又は装備解除を行う際 の移動を直動及び回動を組み合わせて行うことができる機構を備えさせているた め、 より狭い空間に上記プレート収納部を確実に収めて装備させること、 あるい は、 当該空間からより簡単かつ円滑に上記プレート収納部を引き出すことが可能 となる。 従って、 このような上記部品供給装置をよりコンパクトな空間に配置さ せるような場合であっても、 上記プレート収納部の出し入れを容易かつ円滑に行 うことができ、 メンテナンス性を向上させることができる。  In addition, a mechanism is provided that can perform a combination of linear movement and rotation when mounting or dismounting the plate storage unit in the component supply device. It is possible to securely accommodate and equip the storage section, or to easily and smoothly pull out the plate storage section from the space. Therefore, even when such a component supply device is arranged in a more compact space, the plate storage portion can be easily and smoothly put in and out, and the maintainability can be improved. it can.
また、 上記夫々のプレートにおける上記各々の支持ガイド部との接触部分が、 上記滑面部を有していることにより、 上記接触部分に生じる摩擦力を低減するこ とができ、 当該接触磨耗により切粉等が発生することを防止することができる。 このような切粉の発生は、 部品供給装置におけるメンテナンス性を低下させると ともに、 夫々の部品の基板等に対する実装面を汚染する等の機能的問題をも発生 する場合があるため、 このような問題の発生頻度を著しく低減することができる。 上記ウェハ供給用プレートと、 その重量が比較的重く、 上記切粉の発生を引き起 こす恐れのある上記トレイ供給用プレートとを、 混載して供給するような場合で あっても、 部品供給装置におけるメンテナンス性の向上を図ることができ、 効率 的な部品供給を実現することができる。 In addition, since the contact portions of the respective plates with the respective support guide portions have the smooth surface portion, the frictional force generated at the contact portions can be reduced, and the cut due to the contact wear. Generation of powder or the like can be prevented. The generation of such swarf reduces the maintainability of the component supply device. In both cases, functional problems such as contamination of the mounting surface of each component with respect to the substrate or the like may occur, so that the frequency of occurrence of such problems can be significantly reduced. Even when the wafer supply plate and the tray supply plate having a relatively heavy weight and possibly causing the generation of chips are mixed and supplied, a component supply device is provided. This makes it possible to improve the maintainability of the system and to achieve efficient parts supply.
また、 夫々の組の支持ガイド部の揷入端部に、 上記移動の方向に対する傾斜部 が形成されていることにより、 上記夫々のプレートの揷入位置と、 上記夫々の支 持ガイド部による支持位置との間の位置ズレを捕正することができ、 上記プレー ト収納部への確実かつ安定した上記夫々のプレートの収納を実現することができ る。 また、 このような上記傾斜部の形成は、 上記夫々の支持ガイド部に沿った上 記プレートの挿入移動を滑らかなものとすることができ、 上記切粉の発生量を低 減することにも寄与し得る。  In addition, since the inclined portion with respect to the moving direction is formed at the insertion end portion of each set of support guide portions, the insertion position of each plate and the support by each support guide portion are formed. It is possible to correct the positional deviation between the position and the position, and to reliably and stably store the respective plates in the plate storage portion. In addition, the formation of the above-mentioned inclined portion makes it possible to smoothly insert and move the above-mentioned plate along the above-mentioned respective support guide portions, and also to reduce the amount of the above-mentioned chips. Can contribute.
また、 上記夫々のプレートを上記夫々の支持ガイド部との互いの接触表面にお ける硬度が、 上記夫々のプレートよりも上記夫々の支持ガイド部を低くするよう に、 上記夫々の支持ガイド部が形成されるヒとにより、 互いの接触による切粉の 発生量を低減することができる。  Further, the respective support guides are arranged such that the hardness of the respective plates at the contact surfaces of the respective plates with the respective support guides is lower than that of the respective plates. Due to the formed whiskers, the amount of chips generated due to mutual contact can be reduced.
また、 逆に、 上記夫々の硬度が、 上記夫々の支持ガイド部よりも上記夫々のプ レートを低くするように、 上記夫々のプレートが形成されることでも同様な効果 を得ることができるとともに、 汎用性が要求される上記収納体の形成材料を標準 仕様のままとすることができる。  Conversely, a similar effect can be obtained by forming the respective plates so that the respective hardnesses are lower than the respective support guide portions, respectively. The material for forming the above-mentioned container, which requires versatility, can be kept at the standard specification.
また、 上記夫々の支持ガイド部が、 上記夫々のプレートの端部を支持しながら、 当該端部の表面に沿って回転可能なローラ部を備えることにより、 上記プレート の揷入移動をより円滑にすることができる。  In addition, since each of the support guides has a roller that can rotate along the surface of the end while supporting the end of the plate, the insertion movement of the plate can be performed more smoothly. can do.
また、 上記プレート押圧体が備える上記夫々の付勢部材が、 上記押圧体昇降部 による上記プレート押圧体の下降位置に拘らず、 上記夫々の支持部材又は上記 夫々の弾性支持部材に上記プレートを常時付勢することにより、 上記プレート押 圧体に支持された上記プレートが、 上記プレート押圧体の昇降により振動するこ とを確実に防止することができる。 従って、 当該振動に起因する部品の飛び出し 等の発生を確実に防止することができ、 安定した部品供給を実現することができ る。 In addition, the respective biasing members provided in the plate pressing member are configured such that the plate is always attached to the respective support member or the respective elastic supporting member regardless of the lowering position of the plate pressing member by the pressing member elevating unit. By the biasing, the plate supported by the plate pressing body can be reliably prevented from vibrating due to the elevation of the plate pressing body. Therefore, the part jumps out due to the vibration. And the like can be reliably prevented, and stable component supply can be realized.
また、 上記夫々の付勢部材が付勢ローラを備えていることにより、 上記付勢が 上記プレートの移動を阻害することはない。  In addition, since each of the urging members includes an urging roller, the urging does not hinder the movement of the plate.
また、 上記夫々のプレートが、 上記保持部による上面側の保持位置に、 当該保 持部と係合可能な係合部を備えていることにより、 上記保持部による上記夫々の プレートの保持をより確実なものとすることができる。  Further, since each of the plates is provided with an engaging portion capable of engaging with the holding portion at a holding position on the upper surface side by the holding portion, the holding of the plate by the holding portion is further improved. It can be assured.
また、 上記収納体が、 上記夫々の支持ガイド部の組の間に配置され、 上記夫々 のプレートと係合されることで、 上記夫々のプレートの水平方向の支持姿勢を案 内する複数の姿勢ガイド部をさらに備えることで、 上記収納体への上記プレート の収納姿勢を正常な状態に保持することができ、 上記収納体に対する上記夫々の プレートの収納及び取り出しを円滑に行なうことができる。  Further, the storage body is disposed between the sets of the respective support guide portions, and is engaged with the respective plates, so that a plurality of postures that define the horizontal support posture of the respective plates are provided. With the provision of the guide portion, the storage posture of the plate in the storage body can be maintained in a normal state, and the storage and removal of the respective plates from the storage body can be performed smoothly.
また、 このような上記夫々の姿勢ガイド部が、 上記収納体の扉部の内側に備え られていることにより、 上記扉の閉止を行なうことで、 上記夫々のプレートと上 記姿勢ガイド部とを係合させることができ、 上記水平方向の姿勢を正常な状態と することができる。  Further, since each of the above-mentioned posture guide portions is provided inside the door portion of the above-mentioned storage body, by closing the door, the respective plates and the above-mentioned posture guide portions are connected. The horizontal posture can be brought into a normal state.
また、 上記扉部の開閉を検出する開閉検出センサをさらに備えることにより、 当該開閉検出センサにより上記扉の閉止が検出された場合にのみ、 上記夫々のプ レートが正常な姿勢で収納されたものと判断することができ、 上記プレートの収 納姿勢を効率的に管理することができる。  Further, by further comprising an opening / closing detection sensor for detecting opening / closing of the door portion, the respective plates are stored in a normal posture only when the closing of the door is detected by the opening / closing detection sensor. Thus, the storage posture of the plate can be efficiently managed.
また、 上記収納体が、 上記基台への支持面に当該支持を固定する複数の固定部 を有し、 少なくとも 1つの上記固定部が、 導電性材料で形成されて接地端子部と しての機能を有することにより、 上記収納体の帯電量を低減させることができ、 部品供給を円滑かつ効率的に行なうことができる。 図面の簡単な説明  Further, the storage body has a plurality of fixing portions for fixing the support to a support surface to the base, and at least one of the fixing portions is formed of a conductive material and serves as a ground terminal portion. By having the function, the charge amount of the storage body can be reduced, and components can be supplied smoothly and efficiently. BRIEF DESCRIPTION OF THE FIGURES
本発明のこれらと他の目的と特徴は、 添付された図面についての好ましい実施 形態に関連した次の記述から明らかになる。 この図面においては、  These and other objects and features of the present invention will become apparent from the following description in connection with the preferred embodiments of the accompanying drawings. In this drawing,
図 1は、 本発明の第 1実施形態にかかる電子部品実装装置の斜視図であり、 図 2は、 図 1の電子部品実装装置が備える部品供給装置の拡大半透過斜視図で あり、 FIG. 1 is a perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention, FIG. 2 is an enlarged semi-transparent perspective view of a component supply device included in the electronic component mounting device of FIG. 1,
図 3は、 上記部品供給装置のリフター装置におけるマガジンカセットの半透過 斜視図であり、  FIG. 3 is a semi-transparent perspective view of a magazine cassette in the lifter device of the component supply device.
図 4は、 上記部品供給装置にて取り扱われるウェハ供給用プレートの斜視図で あり、  FIG. 4 is a perspective view of a wafer supply plate handled by the component supply device.
図 5は、 上記部品供給装置にて取り扱われるトレイ供給用プレートの斜視図で あり、  FIG. 5 is a perspective view of a tray supply plate handled by the component supply device,
図 6は、 上記リフター装置におけるカセット昇降部の斜視図であり、 図 7は、 上記部品供給装置のプレート配置装置の斜視図であり、  FIG. 6 is a perspective view of a cassette elevating unit in the lifter device. FIG. 7 is a perspective view of a plate arrangement device of the component supply device.
図 8は、 上記プレート配置装置に上記ウェハ供給用プレートが配置された状態 の断面図であり、  FIG. 8 is a cross-sectional view showing a state where the wafer supply plate is arranged in the plate arrangement device.
図 9は、 上記プレート配置装置に上記トレイ供給用プレートが配置された状態 の断面図であり、  FIG. 9 is a cross-sectional view showing a state in which the tray supply plate is arranged in the plate arrangement device.
図 1 0は、 上記プレート配置装置の部分拡大斜視図であり、  FIG. 10 is a partially enlarged perspective view of the plate arrangement device,
図 1 1は、 上記プレート配置装置における中間ストッパー駆動部の模式説明図 であり、  FIG. 11 is a schematic explanatory view of an intermediate stopper driving unit in the plate arrangement device,
図 1 2は、 上記プレート配置装置におけるメカロックバルブの取り付け状態と 示す斜視図であり、  FIG. 12 is a perspective view showing a mounted state of the mechanical lock valve in the plate disposing device.
図 1 3は、 上記プレート配置装置における押圧体昇降部の空気回路であり、 図 1 4は、 上記部品供給装置におけるプレート移動装置の斜視図であり、 図 1 5は、 上記トレイ供給用プレートの部分拡大斜視図であり、  FIG. 13 is an air circuit of the lifting / lowering portion of the pressing body in the plate placement device. FIG. 14 is a perspective view of a plate moving device in the component supply device. FIG. 15 is a perspective view of the tray supply plate. It is a partial enlarged perspective view,
図 1 6は、 上記トレイ供給用プレートの模式断面図であり、  FIG. 16 is a schematic sectional view of the tray supply plate,
図 1 7は、 上記トレイ供給用プレートの部分拡大斜視図であり、  FIG. 17 is a partially enlarged perspective view of the tray supply plate,
図 1 8は、 上記部品供給装置の斜視図であり、  FIG. 18 is a perspective view of the component supply device.
図 1 9は、 上記部品供給部の飛び出し防止板の斜視図であり、  FIG. 19 is a perspective view of the protrusion prevention plate of the component supply unit.
図 2 0は、 上記飛び出し防止板が備えられた扉が閉止状態の上記部品供給装置 の斜視図であり、  FIG. 20 is a perspective view of the component supply device with the door provided with the pop-out prevention plate closed.
図 2 1は、 上記飛び出し防止板が備えられた扉が開放状態の上記部品供給装置 の斜視図であり、 Fig. 21 shows the component supply device with the door provided with the pop-out prevention plate open. FIG.
図 2 2は、 上記リフター装置における基台と基台支持フレームとの関係を示す 斜視図であり、  FIG. 22 is a perspective view showing a relationship between a base and a base support frame in the lifter device,
図 2 3は、 上記基台の引き出し動作の軌跡を示す模式平面図であり、 図 2 4は、 本発明の第 2実施形態にかかる部品供給装置の拡大半透過斜視図で あり、  FIG. 23 is a schematic plan view showing the trajectory of the pull-out operation of the base, and FIG. 24 is an enlarged semi-transparent perspective view of the component supply device according to the second embodiment of the present invention.
図 2 5は、 図 1の部品供給装置が備えるマガジンカセットの側壁部の断面図で あり、  FIG. 25 is a sectional view of the side wall of the magazine cassette provided in the component supply device of FIG.
図 2 6 A及び図 2 6 Bの夫々は、 マガジンカセットの溝部を示し、 図 2 6 Aは 溝部の側面図、 図 2 6 Bは、 図 2 6 Aの溝部の正面図であり、  FIGS. 26A and 26B each show the groove of the magazine cassette, FIG. 26A is a side view of the groove, and FIG. 26B is a front view of the groove of FIG. 26A.
図 2 7は、 トレイ供給プレートの外観斜視図であり、  FIG. 27 is an external perspective view of the tray supply plate.
図 2 8は、 図 2 7のトレイ供給プレートが溝部により支持された状態を示す模 式断面図であり、  FIG. 28 is a schematic cross-sectional view showing a state where the tray supply plate of FIG. 27 is supported by the grooves.
図 2 9は、 上記第 2実施形態の変形例にかかる溝部の形態を示す部分断面図で あり、 ローラ部を備える溝部の形態を示し、  FIG. 29 is a partial cross-sectional view showing a form of a groove according to a modification of the second embodiment, showing a form of a groove provided with a roller,
図 3 0は、 プレート押圧体にローラ部が備えられた状態の部分断面図であり、 図 3 1は、 プレート押圧体の夫々の支持部にトレイ供給プレートが支持された 状態の模式断面図であり、  FIG. 30 is a partial cross-sectional view showing a state in which a roller portion is provided on a plate pressing body. FIG. 31 is a schematic cross-sectional view showing a state in which a tray supply plate is supported on each supporting portion of the plate pressing body. Yes,
図 3 2は、 プレート支持部により トレイ供給プレートが支持された状態の模式 断面図であり、  FIG. 32 is a schematic cross-sectional view showing a state in which the tray supply plate is supported by the plate support section.
図 3 3は、 プレート支持部によるトレィ供給プレートの支持が解除されて、 部 品飛び出しが発生している状態の模式断面図であり、  FIG. 33 is a schematic cross-sectional view showing a state in which the support of the tray supply plate by the plate support unit is released, and parts jump out.
図 3 4は、 プレート支持部によるトレィ供給プレートの支持が解除されて、 部 品飛び出しが発生している状態の模式断面図であり、  FIG. 34 is a schematic cross-sectional view showing a state in which the tray supply plate is no longer supported by the plate support portion and a component jumps out.
図 3 5は、 プレート配置装置の外観斜視図であり、  FIG. 35 is an external perspective view of the plate placement device.
図 3 6は、 プレート押圧体が備える付勢部の外観斜視図であり、  FIG. 36 is an external perspective view of an urging portion provided in the plate pressing body.
図 3 7は、 図 3 6の付勢部が装備されている場合におけるトレイ供給プレート の支持状態を示す模式断面図であり、 トレイ供給プレートが夫々の支持部により 支持されている状態を示し、 図 3 8は、 図 3 6の付勢部が装備されている場合におけるトレイ供給プレート の支持状態を示す模式断面図であり、 トレイ供給プレートが夫々のプレート支持 部により支持されている状態を示し、 FIG. 37 is a schematic cross-sectional view showing a support state of the tray supply plate when the biasing unit of FIG. 36 is provided, showing a state in which the tray supply plate is supported by each support unit, FIG. 38 is a schematic cross-sectional view showing a support state of the tray supply plate when the urging unit of FIG. 36 is provided, and shows a state in which the tray supply plate is supported by each plate support unit. ,
図 3 9は、 長孔部を備えるトレイ供給プレートの平面図であり、  FIG. 39 is a plan view of a tray supply plate having a long hole,
図 4 0は、 突起部を備えるチャック部の平面図であり、  FIG. 40 is a plan view of a chuck portion having a projection,
図 4 1は、 図 4 0のチャック部の先端における断面図であり、  FIG. 41 is a cross-sectional view at the tip of the chuck portion of FIG. 40,
図 4 2は、 上記第 2実施形態の変形例にかかるトレイ供給プレートの斜視図で あり、  FIG. 42 is a perspective view of a tray supply plate according to a modification of the second embodiment,
図 4 3は、 図 4 2のトレイ供給プレートの側面図であり、  FIG. 43 is a side view of the tray supply plate of FIG.
図 4 4は、 ランダムアクセスによるプレートの取出しを行なう場合において、 発生する恐れがある問題点を説明するための模式説明図であり、 プレート取出方 向に対して水平方向にプレートが傾斜された状態で、 当該プレートが取り出され ている状態を示しており、  Fig. 44 Fig. 4 is a schematic explanatory view for explaining a problem that may occur when the plate is taken out by random access, in a state where the plate is inclined in the horizontal direction with respect to the plate taking out direction. Indicates that the plate has been removed,
図 4 5は、 マガジンカセットに斜めの姿勢でプレートが収容された状態を示す 模式説明図であり、  FIG. 45 is a schematic explanatory view showing a state where the plate is accommodated in the magazine cassette in an oblique posture.
図 4 6は、 本発明の第 3実施形態にかかるマガジンカセットの模式的な側面図 であり、  FIG. 46 is a schematic side view of a magazine cassette according to the third embodiment of the present invention,
図 4 7は、 図 4 6のマガジンカセットが備える姿勢ガイド部の拡大平面図であ り、  FIG. 47 is an enlarged plan view of the attitude guide portion provided in the magazine cassette of FIG.
図 4 8は、 図 4 6のマガジンカセットのプレート取出方向側から見た側面図で あり、  FIG. 48 is a side view of the magazine cassette of FIG.
図 4 9は、 図 4 8のマガジンカセットの V— Vf泉断面図であり、  FIG. 49 is a sectional view of the magazine cassette of FIG. 48 taken along the line V--Vf.
図 5 0は、 図 4 6のマガジンカセットに収納されたプレートが取出される状態 を示す模式説明図であり、  FIG. 50 is a schematic explanatory view showing a state where the plate stored in the magazine cassette of FIG. 46 is taken out.
図 5 1は、 上記第 3実施形態の変形例にかかるマガジンカセットの構成を説明 するための比較対象のマガジンカセットの模 斜視図であり、  FIG. 51 is a schematic perspective view of a comparative magazine cassette for describing a configuration of a magazine cassette according to a modification of the third embodiment.
図 5 2は、 上記第 3実施形態の変形例にかかるマガジンカセットの模式斜視図 であり、  FIG. 52 is a schematic perspective view of a magazine cassette according to a modification of the third embodiment,
図 5 3は、 図 5 2のマガジンカセットの構成を示す断面図的な模式図であり、 図 5 4 A及ぴ図 5 4 Bの夫々は、 マガジンカセットの本体における開閉カバー 部用の夫々の開口端部を示す図であり、 図 5 4 Aが左側端部を示し、 図 5 4 Bが 右側端部を示し、 FIG. 53 is a schematic sectional view showing the configuration of the magazine cassette of FIG. FIGS. 54A and 54B are views showing respective open ends for the opening / closing cover of the main body of the magazine cassette. FIG. 54A shows the left end, and FIG. 54B. Indicates the right end,
図 5 5は、 プレート交換作業工程の手順を示すフローチャートであり、 図 5 6は、 マガジンカセットの底部を示す図であり、  FIG. 55 is a flowchart showing the procedure of the plate replacement work process, and FIG. 56 is a view showing the bottom of the magazine cassette.
図 5 7は、 図 1 6のトレイ供給プレートへの部品供給トレイの取り付け作業の 変形例を示し、  FIG. 57 shows a modification of the work of attaching the component supply tray to the tray supply plate of FIG.
図 5 8は、 テーパ支持部の拡大側面図である。 発明を実施するための最良の形態  FIG. 58 is an enlarged side view of the tapered support portion. BEST MODE FOR CARRYING OUT THE INVENTION
本発明の記述を続ける前に、 添付図面において同じ部品については同じ参照符 号を付している。  Before continuing the description of the present invention, the same parts are denoted by the same reference numerals in the accompanying drawings.
以下に、 本発明にかかる実施の形態を図面に基づいて詳細に説明する。  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(第 1実施形態）  (First Embodiment)
本発明の第 1の実施形態にかかる部品供給装置の一例である部品供給装置 4を 備え、 この部品供給装置 4から供給された部品を基板に実装する部品実装装置の 一例である電子部品実装装置 1 0 1の斜視図を図 1に示す。 部品供給装置 4につ いての詳細な構造や動作の説明を行うに先だって、 このような部品供給装置 4を 備える電子部品実装装置 1 0 1の全体的な構成及び動作についての説明を、 図 1 を用いて行う。  An electronic component mounting apparatus, which is an example of a component mounting apparatus that includes a component supply apparatus 4 that is an example of a component supply apparatus according to the first embodiment of the present invention and that mounts components supplied from the component supply apparatus 4 on a substrate A perspective view of 101 is shown in FIG. Prior to describing the detailed structure and operation of the component supply device 4, the overall configuration and operation of the electronic component mounting device 101 including the component supply device 4 will be described with reference to FIG. This is performed using
(電子部品実装装置について）  (About electronic component mounting equipment)
図 1に示すように、 電子部品実装装置 1 0 1は、 部品の一例であるチップ部品 やベア I Cチップ等の電子部品 2を基板に実装する実装動作を行う装置であり、 大別して、 複数の電子部品 2を供給可能に収容する部品供給装置 4と、 この部品 供給装置 4から供給される各電子部品 2を基板に実装する実装動作を行う実装部 5とを備えている。  As shown in FIG. 1, the electronic component mounting apparatus 101 is an apparatus that performs an mounting operation of mounting an electronic component 2 such as a chip component or a bare IC chip, which is an example of a component, on a substrate. The electronic device 1 includes a component supply device 4 that accommodates the electronic components 2 in a supplyable manner, and a mounting unit 5 that performs a mounting operation of mounting each electronic component 2 supplied from the component supply device 4 on a substrate.
図 1に示す部品供給装置 4においては、 基板に実装される多数の電子部品 2の うちのウェハ供給部品 2 w (部品の一例である） が複数配置されたウェハをその 上面に載置するウェハ供給用プレートと、 上記多数の電子部品 2のうちのトレイ 供給部品 2 t (部品の一例である） が格子上に配列されて収容配置された部品供 給トレイをその上面に複数載置するトレイ供給用プレートとを混載して上記夫々 のプレートを選択的に供給可能に収納しているプレート収納部の一例であるリフ ター装置 1 0力 部品供給装置 4の図示 Y軸方向手前側に設置されている。 なお、 以降の説明において、 上記ウェハ供給用プレート又は上記トレイ供給用プレート を限定して用いない場合には、 上記夫々のプレートとして記載するものとし、 ま た、 ウェハ供給部品 2 w又はトレイ供給部品 2 tを限定して用いない場合には、 電子部品 2として記载するものとする。 なお、 上記夫々のプレート等の構成の説 明については、 後述するものとする。 また、 ウェハ供給部品 2 wとしては、 主に ウェハがダイシングされることにより形成されるベア I Cチップ等があり、 また、 トレイ供給部品 2 tとしては、 上記ベア I Cチップ及び上記ベア I Cチップ以外 の I Cチップ （例えば、 パッケージが施された I Cチップ等） やチップ部品等が ある。 In the component supply device 4 shown in FIG. 1, a wafer on which a plurality of wafer supply components 2w (an example of components) of a large number of electronic components 2 mounted on a substrate are placed is mounted on the upper surface thereof. Supply plate and tray of many electronic components 2 above A part supply tray 2t (an example of a part) is arranged on a grid and a plurality of parts supply trays are placed on top of the tray. A lifter device, which is an example of a plate storage portion that is stored so that it can be supplied to the component supply device, is installed on the near side in the illustrated Y-axis direction of the component supply device 4. In the following description, when the wafer supply plate or the tray supply plate is not used in a limited manner, it is described as the respective plate, and the wafer supply component 2w or the tray supply component is used. If 2t is not used in a limited manner, it is described as electronic component 2. The description of the configuration of each of the above-mentioned plates and the like will be described later. In addition, the wafer supply component 2 w includes a bare IC chip formed mainly by dicing a wafer, and the tray supply component 2 t includes the bare IC chip and the bare IC chip other than the bare IC chip. There are IC chips (for example, packaged IC chips) and chip components.
また、 部品供給装置 4には、 リフター装置 1 0から選択的に供給される上記 夫々のプレートを配置して、 夫々より電子部品 2を取り出し可能な状態とさせる プレート配置装置 1 2が備えられている。 なお、 リフター装置 1 0から上記ゥェ ハ供給用プレートが供給されて、 プレート配置装置 1 2に配置されるような場合 には、 プレート配置装置 1 2において、 上記ウェハ供給用プレートに載置されて いるウェハに対してエキスパンド動作が施される。  Further, the component supply device 4 is provided with a plate disposition device 12 for disposing the respective plates selectively supplied from the lifter device 10 so that the electronic components 2 can be taken out from the respective components. I have. When the wafer supply plate is supplied from the lifter device 10 and placed on the plate placement device 12, the wafer supply plate is placed on the wafer supply plate in the plate placement device 12. The expanding operation is performed on the wafer that is in operation.
さらに、 部品供給装置 4には、 プレート配置装置 1 2上に選択的に配置された 上記プレート上に載置されている上記ウェハあるいは上記部品供給トレイから電 子部品 2を個別に吸着保持して、 実装部 5に向けて図示 X軸方向沿いに移動させ るとともに、 上記吸着保持した電子部品 2を上下方向に反転させる反転へッド装 置 1 4が備えられている。 なお、 このような反転ヘッド装置 1 4を部品供給装置 4が備えている場合に代えて、 部品供給装置 4とは別の構成の装置として、 部品 供給装置 4とともに、 電子部品実装装置 1 0 1に備えられているような場合であ つてもよい。  Further, the component supply device 4 individually suctions and holds the electronic components 2 from the wafer or the component supply tray placed on the plate selectively placed on the plate placement device 12. A reversing head device 14 is provided for moving the electronic component 2 held by suction in the vertical direction while moving it along the X-axis direction in the figure toward the mounting portion 5. Note that, instead of the case where the component supply device 4 is provided with such a reversing head device 14, an electronic component mounting device 100 is provided together with the component supply device 4 as a device having a different configuration from the component supply device 4. It may be the case that is provided for.
また、 図 1に示すように、 実装部 5には、 電子部品 2を吸着保持して基板に実 装する実装ヘッド部 2 0が備えられている。 また、 互いに図示 X軸方向沿いに配 置された位置であって、 反転へッド装置 1 4により保持された電子部品 2が実装 へッド部 2 0に受渡し可能な位置である部品供給位置と、 基板に対する電子部品 2の実装動作が行われる基板実装領域との間で、 実装へッド部 2 0を支持しなが ら、 図示 X軸方向に沿って進退移動させる移動装置の一例である X軸ロボット 2 2が、 さらに実装部 5に備えられている。 Further, as shown in FIG. 1, the mounting section 5 is provided with a mounting head section 20 for holding the electronic component 2 by suction and mounting it on a substrate. Also arranged along the X-axis direction The component supply position where the electronic component 2 held by the reversing head device 14 can be transferred to the mounting head unit 20 and the mounting operation of the electronic component 2 on the board The X-axis robot 22, which is an example of a moving device that moves forward and backward along the X-axis direction while supporting the mounting head portion 20 with the board mounting area where Provided in part 5.
なお、 実装ヘッド部 2 0は、 ボイスコイルモータ等の移動手段にて昇降駆動可 能であり、 力つ、 吸着保持した電子部品 2を介して、 押圧エネルギーや超音波振 動エネルギーや熱エネルギー等の接合エネルギーを、 電子部品 2と基板の接合部 に付与できるように構成された保持部 （図示しない） を備えており、 電子部品 2 を基板に対して加圧しながら上記接合エネルギーを付与することが可能となって いる。 また、 X軸口ポット 2 2は、 例えば、 ポールねじ軸部とこのポールねじ軸 部に螺合されたナット部とを用いた移動機構 （図示しない） が備えられている。 また、 図 1に示すように、 実装ヘッド部 2 0及び X軸口ポット 2 2の下方にお ける実装部 5の基台 2 4上には、 基板を図示 X軸方向及び Y軸方向に移動可能で あって、 かつ、 実装ヘッド部 2 0に対する基板上における電子部品 2が実装され る位置の位置決めを行う X Yテーブル 2 6が配設されている。 この X Yテーブル 2 6は、 図示 X軸方向と Y軸方向との夫々に、 例えばサーポモータにて移動駆動 するとともに、 リエアスケールを用いてフルクローズ制御にて位置決めすること が可能となっている。 また、 この X Yテープノレ 2 6の上面には、 基板を解除可能 に保持して固定する基板保持台 2 8が設置されている。 なお、 図 1において、 X 軸方向と Y軸方向は、 基板の表面沿いの方向であって、 かつ、 互いに直交する方 向である。  The mounting head unit 20 can be driven up and down by a moving means such as a voice coil motor, and can be pressed, moved by ultrasonic vibration energy, heat energy, etc. A holding portion (not shown) configured to be able to apply the bonding energy of the electronic component 2 to the bonding portion between the electronic component 2 and the substrate, and applying the bonding energy while pressing the electronic component 2 against the substrate. Is possible. The X-axis opening pot 22 is provided with a moving mechanism (not shown) using, for example, a pole screw shaft portion and a nut portion screwed to the pole screw shaft portion. Further, as shown in FIG. 1, the substrate is moved in the X-axis direction and the Y-axis direction on the base 24 of the mounting section 5 below the mounting head section 20 and the X-axis opening pot 22. An XY table 26 is provided, which is possible and positions the electronic component 2 on the board with respect to the mounting head 20. The XY table 26 can be moved and driven by, for example, a servomotor in each of the X-axis direction and the Y-axis direction in the figure, and can be positioned by full-closed control using a rear air scale. Further, on the upper surface of the XY tape holder 26, a substrate holding table 28 for removably holding and fixing the substrate is provided. In FIG. 1, the X-axis direction and the Y-axis direction are directions along the surface of the substrate and directions orthogonal to each other.
また、 図 1に示すように、 電子部品実装装置 1 0 1には、 基台 2 4の上面にお ける図示 Y軸方向手前側の端部において、 図示 X軸方向左向きの方向である基板 搬送方向 Bに沿って基板を搬送し、 基板保持台 2 8への基板の供給及ぴ基板保持 台 2 8からの基板の排出を行う基板搬送装置 3 0が備えられている。 基板搬送装 置 3 0は、 電子部品実装装置 1 0 1の図示 X軸方向右側の端部から XYテーブル 2 6上の基板保持台 2 8にまで、 基板を搬送して供給するローダ部の一例である ローダ 3 2と、 基板保持台 2 8から電子部品実装装置 1 0 1の図示 X軸方向左側 の端部にまで、 基板を搬送して排出するアンローダ部の一例であるアンローダ 3 4とを備えている。 なお、 本実施形態においては、 電子部品実装装置 1 0 1にお ける XYテープノレ 2 6が、 基板搬送装置 3 0が備える基板保持移動装置と兼用さ れている例となっている。 また、 XYテーブル 2 6と基板支持台 2 8と力 基板 の上記移動及び保持を行う基板保持移動装置の一例となっている。 また、 このよ うに兼用されているような場合に代えて、 電子部品実装装置 1 0 1における XY テーブル 2 6とは別に、 基板保持移動装置が基板搬送装置 3 0に備えられている ような場合であってもよい。 In addition, as shown in FIG. 1, the electronic component mounting apparatus 101 includes a substrate transporting machine in a leftward direction in the X-axis direction at the end on the upper side of the base 24 in the Y-axis direction. A substrate transfer device 30 that transfers the substrate along the direction B and supplies the substrate to the substrate holder 28 and discharges the substrate from the substrate holder 28 is provided. The board transfer device 30 is an example of a loader unit that transfers and supplies a board from the right end of the electronic component mounting apparatus 101 in the illustrated X-axis direction to the board holding table 28 on the XY table 26. From the loader 3 2 and the board holder 28 to the electronic component mounting apparatus 101 on the left side in the X-axis direction And an unloader 34 that is an example of an unloader section that transports and discharges the substrate to the end of the unloader 34. The present embodiment is an example in which the XY tape holder 26 in the electronic component mounting apparatus 101 is also used as a substrate holding / moving device included in the substrate transfer device 30. Further, it is an example of a substrate holding / moving device for performing the above-described movement and holding of the XY table 26, the substrate support 28, and the force substrate. Further, instead of such a case where the substrate is shared, a substrate holding / moving device is provided in the substrate carrying device 30 separately from the XY table 26 in the electronic component mounting device 101. It may be.
なお、 図 1に示す電子部品実装装置 1 0 1は、 当該構成の説明の便宜を考慮し て、 基台 2 4の上面全体を覆っているケーシングカバーが取り外された状態の斜 視図となっている。  Note that the electronic component mounting apparatus 101 shown in FIG. 1 is a perspective view in a state where a casing cover covering the entire upper surface of the base 24 has been removed for the sake of convenience of description of the configuration. ing.
次に、 このような構成を有する電子部品実装装置 1 0 1における電子部品 2の 基板への実装動作について説明する。  Next, the operation of mounting the electronic component 2 on the substrate in the electronic component mounting apparatus 101 having such a configuration will be described.
図 1の電子部品実装装置 1 0 1において、 基台 2 4上におけるローダ 3 2及び アンローダ 3 4の間に位置するように、 基板保持台 2 8が X Yテーブル 2 6によ り移動される。 それとともに、 電子部品実装装置 1 0 1にて夫々の電子部品 2の 実装が行われるべき基板が、 例えば、 電子部品実装装置 1 0 1に隣接する他の装 置等より基板搬送装置 3 0のローダ 3 2に供給されて、 ローダ 3 2にて基板搬送 方向 Bに基板が搬送されて、 この基板が基板保持台 2 8に供給されて保持される。 その後、 XYテーブル 2 6が図示 X軸方向又は Y軸方向に移動されて、 基板が上 記基板実装領域に移動される。  In the electronic component mounting apparatus 101 of FIG. 1, the board holding table 28 is moved by the XY table 26 so as to be located between the loader 32 and the unloader 34 on the base 24. At the same time, the board on which each of the electronic components 2 is to be mounted by the electronic component mounting apparatus 101 is, for example, mounted on the board transfer apparatus 30 by another apparatus adjacent to the electronic component mounting apparatus 101. The substrate is supplied to the loader 32, the substrate is transported in the substrate transport direction B by the loader 32, and the substrate is supplied to and held on the substrate holding table 28. After that, the XY table 26 is moved in the illustrated X-axis direction or Y-axis direction, and the board is moved to the board mounting area.
一方、 部品供給装置 4にて、 リフター装置 1 0に収納されている夫々のプレー トより 1枚のプレートが選択されて取り出され、 プレート配置装置 1 2に配置さ れる。 その後、 上記配置されたプレートより電子部品 2が反転へッド装置 1 4に より吸着保持されて取り出されるとともに、 当該電子部品 2が、 反転されて上記 部品供給位置にまで移動される。 また、 実装部 5にて実装ヘッド部 2 0が、 X軸 ロボット 2 2により、 上記部品供給位置にまで移動されて、 反転ヘッド装置 1 4 ' 力 ら実装ヘッド部 2 0に電子部品 2が受け渡される。 その後、 上記受け渡された 電子部品 2を吸着保持した状態の実装へッド部 2 0が、 X軸口ポット 2 2により、 上記基板実装領域の上方へと移動される。 On the other hand, one plate is selected and taken out from each of the plates stored in the lifter device 10 by the component supply device 4 and placed in the plate placement device 12. After that, the electronic component 2 is sucked and held by the reversing head device 14 from the placed plate and taken out, and the electronic component 2 is reversed and moved to the component supply position. The mounting head 20 is moved to the component supply position by the X-axis robot 22 in the mounting unit 5, and the mounting head 20 receives the electronic component 2 from the reversing head device 14 ′. Passed. Thereafter, the mounting head portion 20 in a state where the electronic component 2 thus received is sucked and held is moved by the X-axis opening pot 22. It is moved above the substrate mounting area.
その後、 実装へッド部 2 0により吸着保持されている電子部品 2と、 基板保持 台 2 8により保持されている基板における電子部品 3が実装されるべき位置との 位置合わせが、 XYテーブル 2 6の移動により行われる。 この位置合わせの後、 実装へッド部 2 0の昇降動作等が行われて、 電子部品 2の基板への実装動作が行 われる。 複数の電子部品 2の上記実装動作が行われるような場合にあっては、 上 記夫々の動作が繰り返して行うことにより、 夫々の電子部品 2の実装動作が行わ れる。  Thereafter, the XY table 2 aligns the electronic component 2 sucked and held by the mounting head unit 20 with the position where the electronic component 3 is to be mounted on the board held by the board holding table 28. This is done by moving 6. After this alignment, the mounting head 20 is moved up and down, and the electronic component 2 is mounted on the board. In the case where the mounting operation of the plurality of electronic components 2 is performed, the mounting operation of each electronic component 2 is performed by repeating the above operations.
その後、 夫々の電子部品 2の上記実装動作が終了すると、 夫々の電子部品 2が 実装された状態の基板が、 基板保持台 2 8とともに、 XYテープノレ 2 6により、 ローダ 3 2とアンローダ 3 4との上記間の位置にまで移動されて、 基板保持台 2 8より基板がアンローダ 3 4に受け渡され、 アンローダ 3 4にて基板が基板搬送 方向 Bに沿って搬送されて、 電子部品実装装置 1 0 1より基板が排出される。 上 記排出された基板は、 例えば、 電子部品実装装置 1 0 1に隣接して設置されてい る上記部品実装の次の処理等を行う他の装置に供給されたり、 部品実装済みの基 板として基板収納装置等に収納されたりする。  After that, when the above mounting operation of each electronic component 2 is completed, the board on which each electronic component 2 is mounted is moved to the loader 3 2 and the unloader 34 by the XY tape notch 26 together with the board holding table 28. The substrate is transferred to the unloader 34 from the substrate holding table 28, and the substrate is transported along the substrate transport direction B by the unloader 34. The substrate is discharged from 01. The discharged board is supplied to, for example, another apparatus that is installed adjacent to the electronic component mounting apparatus 101 and performs the next processing after the above-described component mounting, or is used as a component-mounted board. It is stored in a substrate storage device or the like.
このようにして、 電子部品実装装置 1 0 1において、 夫々の電子部品 2の基板 への実装動作が行われる。 なお、 夫々の電子部品 2が実装された基板がアンロー ダ 3 4により排出された後、 新たな別の基板がローダ 3 2により供給されること により、 順次供給される夫々の基板に対して夫々の電子部品 2の実装が行われる。  In this way, in the electronic component mounting apparatus 101, the mounting operation of each electronic component 2 on the board is performed. After the board on which each of the electronic components 2 is mounted is discharged by the unloader 34, another new board is supplied by the loader 32, so that each of the sequentially supplied boards is supplied to the corresponding board. The electronic component 2 is mounted.
(部品供給装置について）  (About parts supply equipment)
次に、 このような構成及び部品実装動作を行う電子部品実装装置 1 0 1が備え る部品供給装置 4の詳細な構成について、 特に、 リフター装置 1 0及びプレート 配置装置 1 2とこれらに関連する構成を中心に説明する。 また、 このような部品 供給装置 4におけるリフタ一装置 1 0及びプレート配置装置 1 2の半透過斜視図 を図 2に示す。  Next, regarding the detailed configuration of the component supply device 4 provided in the electronic component mounting apparatus 101 that performs such a configuration and component mounting operation, in particular, the lifter device 10 and the plate placement device 12 and the related components The configuration will be mainly described. FIG. 2 is a semi-transparent perspective view of the lifter device 10 and the plate disposing device 12 in the component supply device 4.
図 2に示すように、 部品供給装置 4は、 上述したリフター装置 1◦とプレート 配置装置 1 2に加えて、 さらに、 リフター装置 1 0に収納されている夫々のプレ ートを保持して取り出し、 プレート配置装置 1 2に配置させるように、 上記プレ ートの移動を行うプレート移動装置 4 0を備えている。 また、 プレート移動装置 4 0は、 プレート配置装置 1 2に酉己置されたプレートを保持して、 再びリフター 装置 1 0に収納するように、 上記プレートの移動を行うことが可能となっている。 まず、 リフター装置 1 0は、 複数の上記ウェハ供給用プレート及び複数の上記 トレイ供給用プレートを混載して、 上下方向に積層的に収納する箱体状の形状を 有する収納体の一例であるマガジンカセット 5 0と、 このマガジンカセット 5 0 を支持するとともに、 マガジンカセット 5 0の昇降動作を行って、 マガジンカセ ット 5 0に収納されている上記夫々のプレートのうちの 1枚のプレートを、 プレ 一ト移動装置 4 0により取り出し可能な昇降高さ位置に位置させる収納体昇降部 の一例であるカセット昇降部 5 1と、 カセット昇降部 5 1を取り付けられて、 力 つ、 カセット昇降部 5 1によるマガジンカセット 5 0の昇降動作を案内可能な基 台 5 2とを備えている。 As shown in FIG. 2, the component supply device 4 holds and removes each plate stored in the lifter device 10 in addition to the lifter device 1 ◦ and the plate placement device 12 described above. The above plate is placed on the plate A plate moving device 40 for moving the plate is provided. Further, the plate moving device 40 can move the plate such that the plate placed on the plate placing device 12 is held and stored in the lifter device 10 again. . First, the lifter device 10 is a magazine that is an example of a storage box having a box-like shape in which a plurality of the wafer supply plates and a plurality of the tray supply plates are mixed and vertically stacked. The cassette 50 and the magazine cassette 50 are supported, and the magazine cassette 50 is moved up and down so that one of the plates stored in the magazine cassette 50 is replaced with one of the plates described above. A cassette elevating unit 51, which is an example of a storage unit elevating unit that is positioned at an elevating height position that can be taken out by the plate moving device 40, and a cassette elevating unit 51, to which a cassette elevating unit 5 is attached. And a base 52 capable of guiding the ascending and descending operation of the magazine cassette 50 by the use of the base 52.
ここで、 マガジンカセット 5 0の拡大斜視図 （半透過斜視図） を図 3に示す。 図 3に示すように、 マガジンカセット 5 0においては、 図示 C方向がプレート配 置装 ft 1 2への上記夫々のプレートの取り出し方向 （以降、 プレート取出方向 C とする） となっている。 また、 マガジンカセット 5 0は、 プレート取出方向 Cと 直交する方向において、 互いに対向するように側壁部 5 0 aが夫々設けられてお り、 夫々の側壁部 5 0 aの互いに対向する側面において、 プレート取出方向に沿 つて複数の溝部 5 0 bが形成されている。 上記夫々のプレート （以降、 プレート 6とする） は、 その互いに対向する両端部において、 夫々の側壁部 5 0 aの溝部 Here, an enlarged perspective view (semi-transparent perspective view) of the magazine cassette 50 is shown in FIG. As shown in FIG. 3, in the magazine cassette 50, the direction C in the drawing is the direction in which the respective plates are taken out to the plate placement device ft12 (hereinafter referred to as the plate taking out direction C). Further, the magazine cassette 50 is provided with side wall portions 50a so as to face each other in a direction orthogonal to the plate removing direction C. On the side surfaces of the side wall portions 50a facing each other, A plurality of grooves 50b are formed along the plate extracting direction. Each of the above plates (hereinafter, referred to as plate 6) has a groove at each side wall 50a at both ends facing each other.
5 0 bと係合されることにより、 マガジンカセット 5 0に保持されて収納されて いる。 なお、 夫々の側壁部 5 0 aにおいて夫々の溝部 5 0 bは一定の間隔ピッチ でもつて形成されており、 夫々の溝部 5 0 bに係合されて保持された状態で、 プ レート 6はその表面が略水平な状態とされている。 さらに、 夫々のプレート 6は、 夫々の溝部 5 0 bの形成方向に沿って案内されながら、 プレート取出方向沿いに 進退移動 （すなわち、 スライド移動） 可能な状態とされている。 また、 マガジン カセット 5 0においては、 収納されている夫々のプレート 6の取り出しが行われ るため、 上記取り出しの障害とならないように、 プレート取出方向 C側には側壁 部が設けられておらず、 常時開放された状態とされている。 なお、 図 3において は、 図示上方に収納されているプレート 6がウェハ供給用プレート 6 wであり、 図示下方に収納されているプレート 6力 トレイ供給用プレート 6 tである。 By being engaged with 50b, the magazine cassette 50 is held and stored. In each of the side wall portions 50a, the respective groove portions 50b are formed at a constant pitch, and while being engaged with and held by the respective groove portions 50b, the plate 6 The surface is in a substantially horizontal state. Further, each plate 6 is capable of moving forward and backward (that is, slide) along the plate removing direction while being guided along the direction in which each groove 50b is formed. Further, in the magazine cassette 50, since each of the stored plates 6 is taken out, no side wall portion is provided on the plate taking-out direction C side so as not to obstruct the taking-out. It is always open. In Figure 3, The plate 6 housed in the upper part of the figure is a wafer supply plate 6w, and the plate 6 housed in the lower part of the figure is a tray supply plate 6t.
次に、 ウェハ供給用プレート 6 wの斜視図を図 4に、 トレイ供給用プレート 6 tの斜視図を図 5に示し、 夫々のプレートの構造について説明する。  Next, a perspective view of the wafer supply plate 6w is shown in FIG. 4, and a perspective view of the tray supply plate 6t is shown in FIG. 5, and the structure of each plate will be described.
図 4に示すように、 ウェハ供給用プレート 6 wは、 直線状の部分と曲線状の部 分とが組み合わされた外周部分を有する大略円盤状の形状を有している。 また、 プレート取出方向 Cを挟んで互いに対向される夫々の端部は、 マガジンカセット 5 0の夫々の溝部 5 0 bと係合されることが考慮されて、 上記直線状の外周部分 となっている。 また、 図 4に示すように、 ウェハ供給プレート 6 wは、 伸縮性を 有するシートであって、 ダイシングが施されたウェハ 7がその上面に貼着されて 載置されたウェハシート 8と、 環状プレートであって、 その環状の内側にウェハ 7が位置されるように、 ゥェハシ一ト 8をその外周端部近傍において保持するゥ ェハリング 9とを備えている。 このようにウェハ供給用プレート 6 wが形成され ていることにより、 ウェハシート 8を放射状に延伸させることで、 格子状に酉 3置 されている夫々のゥェハ供給部品 2 wの配置位置も放射状に延伸させることがで き、 いわゆるエキスパンドを行うことが可能となっている。  As shown in FIG. 4, the wafer supply plate 6w has a substantially disk shape having an outer peripheral portion in which a linear portion and a curved portion are combined. Further, respective ends facing each other with the plate removal direction C interposed therebetween are considered to be engaged with the respective groove portions 50b of the magazine cassette 50, and serve as the linear outer peripheral portions. I have. As shown in FIG. 4, the wafer supply plate 6 w is a sheet having elasticity, and a wafer sheet 8 on which a diced wafer 7 is attached and placed on the upper surface thereof, and an annular sheet. And a plate ring 9 for holding the wafer 8 near its outer peripheral end so that the wafer 7 is positioned inside the plate. Since the wafer supply plate 6 w is formed in this way, the wafer sheet 8 is radially stretched, so that the arrangement positions of the wafer supply parts 2 w arranged in a grid 3 are also radial. It can be stretched, and so-called expanding can be performed.
一方、 図 5に示すように、 トレイ供給用プレート 6 tは、 上述したウェハ供給 用プレート 6 wと同様な外径形状を有している。 これにより、 共通のマガジン力 セット 5 0に、 ウェハ供給用プレート 6 wとトレイ供給用プレート 6 tとを混載 して収納することが可能となっている。 また、 図 5に示すように、 トレイ供給用 プレート 6 tは、 ウェハリング 9と略同じ外周形状を有するとともに、 略正方形 状の内周孔部を有する環状プレートであるトレイリング 5 9と、 このトレイリン グ 5 9の上記内周孔部分に取り付けられて形成され、 複数の部品供給トレィ 5 7 を着脱可能に載置するトレィ載置部 5 8とを備えている。 トレィ載置部 5 8は、 トレイリング 5 9の表面よりも一段低くなるように形成されており、 部品供給ト レイ 5 7が載置された場合に、 その部品供給トレイ 5 7に収納されている夫々の トレイ供給部品 2 tの上面高さ位置が、 トレイリング 5 9の表面高さ位置と略同 じとなるように形成されている。 このように形成されていることで、 トレイ供給 用プレート 6 tにおけるトレイ供給部品 2 tの高さ位置を、 ウェハ供給用プレー ト 6 wにおけるゥェハ供給部品 2 wの高さ位置と略同じ高さ位置とされている。 なお、 図 5においては、 略正方形状の平面形状を有する 4つの部品供給トレィ 5 7が 2列に配列されて、 トレィ載置部 5 8に載置されている。 なお、 トレィ载置 部 5 8力 Sトレイリング 5 9と別に形成されて、 トレイリング 5 9の内側に取り付 けられるような場合に代えて、 トレィ载置部 5 8がトレイリング 5 9と一体的に 形成されるような場合であってもよい。 また、 図 5に示すように、 トレイ供給用 プレート 6 tにおけるトレイリング 5 9のプレート取出方向 C側の端部近傍位置 力 プレート移動装置 4 0によるトレイ供給用プレート 6 tの保持位置となって おり、 また、 この部分には、 トレイ供給用プレート 6 tを識別するための識別孔 5 6が形成されている。 なお、 図 4のウェハ供給用プレート 6 wにおいても、 当 該部分が上記保持位置となっているものの、 上記識別のための識別孔 5 6は設け られていない。 後述するように、 識別孔 5 6の有無の相違により、 トレイ供給用 プレート 6 tとウェハ供給用プレート 6 wとを識別するためである。 On the other hand, as shown in FIG. 5, the tray supply plate 6t has the same outer diameter as the above-described wafer supply plate 6w. This makes it possible to mix and store the wafer supply plate 6 w and the tray supply plate 6 t in the common magazine force set 50. Further, as shown in FIG. 5, the tray supply plate 6 t has a substantially same outer peripheral shape as the wafer ring 9, and is a circular plate having a substantially square inner peripheral hole. And a tray mounting portion 58 which is formed to be attached to the inner peripheral hole portion of the mounting portion 59 and on which a plurality of component supply trays 57 are removably mounted. The tray mounting portion 58 is formed so as to be one step lower than the surface of the tray ring 59, and is stored in the component supply tray 57 when the component supply tray 57 is mounted. The height of the upper surface of each tray supply component 2t is formed so as to be substantially the same as the height of the surface of the tray ring 59. With such a configuration, the height position of the tray supply part 2 t on the tray supply plate 6 t is set to the wafer supply plate. The height position is almost the same as the height position of the wafer supply part 2 w at point 6 w. In FIG. 5, four component supply trays 57 each having a substantially square planar shape are arranged in two rows and placed on the tray placement unit 58. In addition, instead of being formed separately from the S traying 59 and being installed inside the trailing 59, the tray mounting section 58 is It may be a case where they are formed integrally. Further, as shown in FIG. 5, the position near the end of the tray ring 59 on the tray supply plate 6 t in the plate removal direction C side is the holding position of the tray supply plate 6 t by the plate moving device 40. Further, an identification hole 56 for identifying the tray supply plate 6t is formed in this portion. Note that, also in the wafer supply plate 6w in FIG. 4, the corresponding portion is at the holding position, but the identification hole 56 for identification is not provided. As described later, this is because the tray supply plate 6t and the wafer supply plate 6w are distinguished by the difference in the presence or absence of the identification holes 56.
さらに、 図 6に示すように、 リフター装置 1 0におけるカセット昇降部 5 1は、 その上面にマガジンカセット 5 0を配置させて保持するカセット支持台 5 1 aが 備えられている。 ここでリフター装置 1 0において取り扱われるマガジンカセッ ト 5 0には、 複数の種類のサイズのものがあり、 例えば、 6インチサイズのもの、 8インチサイズのもの、 又は、 1 2インチサイズのものがある。 このような夫々 のマガジンカセット 5 0のサイズの相違を検出するために、 カセット支持台 5 1 aの上面には、 夫々の平面的な大きさの相違を検出することでもって、 配置され たマガジンカセット 5 0のサイズを検出可能な 6インチカセット検出センサ 5 3 a、 8インチカセット検出センサ 5 3 b、 及び 1 2インチカセット検出センサ 5 3 cが夫々設置されている。  Further, as shown in FIG. 6, the cassette elevating unit 51 of the lifter device 10 is provided with a cassette support base 51a for arranging and holding the magazine cassette 50 on its upper surface. Here, the magazine cassette 50 handled in the lifter device 10 has a plurality of sizes, for example, a 6-inch size, an 8-inch size, or a 12-inch size. is there. In order to detect such a difference in the size of each of the magazine cassettes 50, the magazines arranged on the upper surface of the cassette support table 51a are detected by detecting the differences in their planar sizes. A 6-inch cassette detection sensor 53a, an 8-inch cassette detection sensor 53b, and a 12-inch cassette detection sensor 53c capable of detecting the size of the cassette 50 are provided respectively.
次に、 プレート配置装置 1 2の半透過斜視図を図 7に示す。 図 7に示すように、 プレート配置装置 1 2は、 配置されるプレート 6をその外周部近傍における下面 側より支持可能であって、 かつ、 その支持高さ位置が可変する複数の弾性支持部 材の一例であるプレート支持部 6 0と、 これらのプレート支持部 6 0により支持 されたプレート 6を、 夫々のプレート支持部 6 0の上端との間で挟むように、 そ の上記外周部近傍における上面側より押圧して、 このプレート 6の支持位置の保 持を行うプレート押圧体 6 1と、 このプレート押圧体 6 1の昇降動作を行う押圧 体昇降部 6 2とを備えている。 Next, a semi-transparent perspective view of the plate placement device 12 is shown in FIG. As shown in FIG. 7, the plate placement device 12 includes a plurality of elastic support members that can support the plate 6 to be placed from the lower surface near the outer periphery thereof, and have a variable support height position. The plate support 60, which is an example of the above, and the plate 6 supported by the plate support 60 are sandwiched between the upper ends of the respective plate supports 60 so as to be sandwiched between the outer peripheral portions thereof. Press from the top side to maintain the support position of this plate 6. A plate pressing member 61 for holding the plate, and a pressing member lifting / lowering portion 62 for raising and lowering the plate pressing member 61 are provided.
また、 図 7に示すように、 プレート押圧体 6 1は、 半円状の切り欠き部分を有 して、 当該切り欠き部分が互いに同一平面状において対向するように配置された 対称形状を有する一対の板状体となっている。 また、 このように上記半円状の切 り欠き部分が形成されているため、 夫々のプレート押圧体 6 1は、 ウェハ供給用 プレート 6 wのウェハリング 9の上面のみに、 その下面が当接されて押圧するこ とが可能となっており、 またトレィ供給用プ ^一ト 6 tのトレイリング 5 9の上 面のみに、 その下面が当接されて押圧することが可能となっている。 また、 プレ ート配置装置 1 2においては、 例えば、 4本のプレート支持部 6 0が設けられて おり、 夫々のプレート支持部 6 0は、 夫々のプレート押圧体 6 1のウェハリング 9又はトレイリング 5 9を押圧する部分の下方に配置されている。 これにより、 夫々のプレート支持部 6 0により、 ウェハリング 9又はトレィリング 5 9を夫々 の下面側において支持することが可能となっている。 なお、 夫々のプレート支持 部 6 0は、 その上部に配置されるウェハリング 9又はトレイリング 5 9の外周に 沿って、 大略均等な間隔にて配置されていることが望ましい。 また、 図 7に示す ように、 プレート配置装置 1 2は、 夫々のプレート支持部 6 0が配置されている 円周上近傍における図示 Y軸方向左側において、 その上端側の先端部に、 テーパ 形状の傾斜端部を有し、 当該傾斜端部においてプレート 6の端部が当接される別 の弾性支持部材の一例であるテーパ支持部 6 5を備えている。  Further, as shown in FIG. 7, the plate pressing body 61 has a symmetrical shape having a semicircular cutout portion, and the cutout portions are arranged so as to face each other on the same plane. Plate-shaped body. In addition, since the semicircular notch is formed as described above, each plate pressing member 61 abuts only the upper surface of the wafer ring 9 of the wafer supply plate 6 w and the lower surface thereof. It is possible to press only the upper surface of the tray ring 59 of the tray supply plate 6t with its lower surface in contact. . Further, in the plate placement device 12, for example, four plate supports 60 are provided, and each plate support 60 is provided with a wafer ring 9 or a tray of each plate pressing body 61. The ring 59 is disposed below the portion pressing the ring 59. Thereby, the wafer ring 9 or the trailing ring 59 can be supported on the lower surface side by the respective plate support portions 60. In addition, it is desirable that the respective plate supporting portions 60 are disposed at substantially equal intervals along the outer periphery of the wafer ring 9 or the tray ring 59 disposed thereon. As shown in FIG. 7, the plate placement device 12 has a tapered shape at the top end on the left side in the Y-axis direction near the circumference where the respective plate support portions 60 are placed. And a tapered support portion 65 which is an example of another elastic support member with which the end portion of the plate 6 abuts at the inclined end portion.
さらに、 プレート配置装置 1 2は、 ウェハリング 9が夫々のプレート支持部 6 0に支持された状態のウェハ供給用プレート 6 wにおいて、 ウェハ 7の外周とゥ ェハリング 9の内周との間におけるウェハシート 8の下面に当接可能な環状の当 接部分をその上端に備えるエキスパンド部材 6 3と、 このエキスパンド部材 6 3 をその上面において固定して支持する配置フレーム 6 4とを備えている。 なお、 プレート配置装置 1 2においては、 2つの押圧体昇降部 6 2が、 配置フレーム 6 4に取り付けられて備えられており、 図 7において、 配置フレーム 6 4の図示 X 軸方向における夫々の側面に取り付けられている。 また、 夫々の押圧体昇降部 6 2より、 夫々のプレート押圧体 6 1の昇降動作が一体的に行われることとなって いる。 Further, the plate placement device 12 includes a wafer supply plate 6 w in a state where the wafer ring 9 is supported by the respective plate support portions 60, and a wafer between the outer periphery of the wafer 7 and the inner periphery of the wafer ring 9. An expandable member 63 provided at its upper end with an annular contact portion capable of contacting the lower surface of the seat 8, and an arrangement frame 64 fixedly supporting the expandable member 63 on its upper surface are provided. In the plate placement device 12, two pressing body lifting / lowering portions 62 are provided by being attached to the placement frame 64. In FIG. 7, the respective side surfaces of the placement frame 64 in the illustrated X-axis direction are provided. Attached to. In addition, the respective plate pressing members 61 are integrally moved up and down by the respective pressing member lifting units 62. I have.
次に、 このような構成のプレート配置装置 1 2にウェハ供給用プレート 6 wが 配置された状態の当該配置部分の拡大断面図を図 8に、 トレイ供給用プレート 6 tが配置された状態の当該配置部分の拡大断面図を図 9に示す。  Next, FIG. 8 shows an enlarged cross-sectional view of the arrangement portion where the wafer supply plate 6 w is arranged in the plate arrangement device 12 having such a configuration, and FIG. 8 shows a state where the tray supply plate 6 t is arranged. FIG. 9 shows an enlarged cross-sectional view of the arrangement portion.
まず、 図 8に示すように、 環状形状を有するエキスパンド部材 6 3は、 下部に 外周方向に向けて形成されたフランジ部 6 3 bを備えており、 夫々のプレート支 持部 6 0及びテーパ支持部 6 5は、 このフランジ部 6 3 bに昇降可能に取り付け られている。 プレート支持部 6 0は、 その上部先端にフラット状または緩やかな 隆起状の形状を有する支持端部 6 0 aを備える軸状の支持ピン 6 0 bと、 フラン ジ部 6 3 bに対してこの支持ピン 6 0 bを常時上方に付勢するように、 支持ピン 6 0 bの外周に配置された付勢バネ 6 0 cとを備えている。 なお、 この付勢バネ 6 0 cによる支持ピン 6 0 bの上方への付勢における上限位置は機械的に制限さ れている。 また、 図 8においては、 プレート支持部 6 0は、 エキスパンド部材 6 3のフランジ部 6 3 bに取付部材 6 6を介して取り付けられており、 この取付部 材 6 6に形成されているピン孔部 6 6 aの内周面に沿って、 支持ピン 6 0 bの昇 降が案内可能となっている。 従って、 支持端部 6 0 aに下方に向けて外力が加え られることにより、 付勢バネ 6 0 cが縮められて支持ピン 6 0 b力 ピン孔部 6 First, as shown in FIG. 8, the expanding member 63 having an annular shape is provided with a flange portion 63 b formed in the lower part toward the outer peripheral direction, and the plate supporting portion 60 and the tapered supporting member 60 are provided. The part 65 is attached to the flange part 63 b so as to be able to move up and down. The plate supporting portion 60 has a shaft-shaped supporting pin 60 b having a supporting end portion 60 a having a flat or gentle raised shape at the upper end thereof, and a flange portion 63 b. A biasing spring 60c is provided on the outer periphery of the support pin 60b so as to constantly bias the support pin 60b upward. Note that the upper limit position in the upward biasing of the support pin 60b by the biasing spring 60c is mechanically limited. In FIG. 8, the plate supporting portion 60 is attached to the flange portion 63 b of the expanding member 63 via the attaching member 66, and a pin hole formed in the attaching member 66 is provided. The vertical movement of the support pin 60b can be guided along the inner peripheral surface of the part 66a. Therefore, when an external force is applied downward to the support end portion 60a, the biasing spring 60c is contracted, and the support pin 60b force pin hole 6
6 aの内周面に沿って下降され、 上記外力が弱められる若しくは解除されること により、 縮められていた付勢バネ 6 0 cが伸ばされて支持ピン 6 0 bが、 ピン孔 部 6 6 aの内周面に沿って上昇されることになる。 6A is lowered along the inner peripheral surface of the a, and the external force is weakened or released, whereby the contracted biasing spring 60c is extended, and the support pin 60b becomes the pin hole portion 66. It will be raised along the inner peripheral surface of a.
また、 テーパ支持部 6 5も、 その上端部分の形状を除いては、 夫々のプレート 支持部 6 0と同様な考え方に基づく機構を備えており、 図 7、 図 8及び図 5 8に 示すように、 支持ピン 6 5 b、 付勢バネ 6 5 c、 取付部材 6 7、 及びピン孔部 6 Except for the shape of the upper end portion, the tapered support portion 65 also has a mechanism based on the same concept as the respective plate support portions 60, as shown in FIGS. 7, 8, and 58. , Support pin 65b, biasing spring 65c, mounting member 67, and pin hole 6
7 aを備えている。 また、 その上端部分は、 テーパ状の形状を有する傾斜端部 6 5 aとなっており、 この傾斜端部 6 5 aのィ頃斜面にウェハリング 9の外周端部が 当接されることにより、 この角度抵抗を利用して、 ウェハリング 9の表面沿いの 方向における支持位置を保持することが可能となっている。 なお、 図 7、 図 8、 及び図 5 8に示すように、 テーパ支持部 6 5には、 支持ピン 6 5 bの昇降を案内 するガイド部 6 5 dが備えられている。 また、 図 8に示すように、 エキスパンド 部材 6 3はその上部に環状の先端部 6 3 a ^形成されており、 この先端部 6 3 a がウェハ 7の外周部とウェハリング 9の内周部との間におけるウェハシート 8の 下面に当接可能となっている。 Has 7A. In addition, the upper end portion is an inclined end portion 65 a having a tapered shape, and the outer peripheral end portion of the wafer ring 9 is brought into contact with the slope around the inclined end portion 65 a. By using this angular resistance, it is possible to maintain a supporting position in a direction along the surface of the wafer ring 9. As shown in FIGS. 7, 8, and 58, the tapered support portion 65 is provided with a guide portion 65d for guiding the lifting and lowering of the support pin 65b. Also, as shown in FIG. The member 63 has an annular tip 63 a formed at its upper part, and this tip 63 a is formed on the lower surface of the wafer sheet 8 between the outer periphery of the wafer 7 and the inner periphery of the wafer ring 9. Contact is possible.
このような構成において、 夫々のプレート押圧体 6 1の下面と夫々のプレート 支持部 6 0との間で挟まれて支持された状態のゥェハリング 9を、 押圧体昇降部 6 2による夫々のプレート押圧体 6 1の下降動作によって下降させることにより、 エキスパンド部材 6 3の先端部 6 3 aをウェハシート 8の下面に当接させながら、 当該当接位置を支点として、 ウェハリング 9の下降とともに、 ウェハシート 8を 放射状に延伸させることができる。 これにより、 ウェハシート 8の上面に貝占着さ れている夫々のウェハ供給部品 2 wの配置位置も放射状に延伸させられて、 いわ ゆるウェハ 7のエキスパンドを行うことができる。 なお、 図 7にしめすように、 配置フレーム 6 4の上面おける夫々のプレート押圧体 6 1の下方には、 下降され る夫々のプレート押圧体 6 1の下面と当接されることにより、 その下降の下限位 置を規制可能な複数のエキスパンド下限ストッパー 6 8力 S取り付けられており、 このように下限位置が規制されることで、 当該エキスパンドにおけるウェハシー ト 8の延伸の範囲を規制可能としている。  In such a configuration, the peg ring 9 sandwiched and supported between the lower surface of each plate pressing member 61 and each plate supporting portion 60 is pressed by the pressing member elevating portion 62 to press each plate. The lowering of the body 61 causes the leading end 6 3 a of the expanding member 63 to abut against the lower surface of the wafer sheet 8. Sheet 8 can be stretched radially. Thereby, the arrangement position of each wafer supply component 2 w occupied by the shell on the upper surface of the wafer sheet 8 is also radially extended, so that the so-called wafer 7 can be expanded. As shown in FIG. 7, the lower part of each plate pressing member 61 on the upper surface of the placement frame 64 is brought into contact with the lower surface of each plate pressing member 61 to be lowered. A plurality of expandable lower-limit stoppers 68 are provided to control the lower-limit position of the wafer sheet. By restricting the lower-limit position in this way, the range of extension of the wafer sheet 8 in the expandable state can be controlled.
次に、 図 9は上述のような構成を有するプレート配置装置 1 2に、 トレイ供給 用プレート 6 tが配置された状態を示している。 図 9に示すように、 夫々のプレ 一ト押圧体 6 1と、 夫々のプレート支持部 6 0の支持端部 6 0 aとの間で、 トレ ィリング 5 9を挟むようにして、 トレイ供給用プレート 6 tが支持されている。 また、 テーパ支持部 6 5の傾斜端部 6 5 aの傾斜面にトレイリング 5 9の外周端 部が当接されていることにより、 角度抵抗によってトレイリング 5 9のその表面 沿いの方向の支持位置が保持されている。 また、 トレイリング 5 9よりも一段下 がった高さ位置に位置されているトレィ载置部 5 8は環状のエキスパンド部材 6 3の内側に配置されている。 さらに、 このトレイ供給用プレート 6 tの保持状態 において、 エキスパンド部材 6 3の先端部 6 3 aと、 その上方に位置されている トレイリング 5 9の下面との間には、 互いに接触しないような隙間が確保されて レ、る。 これにより、 先端部 6 3 aがトレイリング 5 9に接触することにより、 当 該先端部 6 3 aが傷付けられることを防止することが可能となっている。 また、 このような上記隙間の確保は、 夫々のプレート押圧体 6 1の下降位置が、 他の部 材により規制されることにより行なわれている。 この規制方法について、 図 1 0 に示すプレート配置装置 1 2の部分拡大斜視図を用いて説明する。 Next, FIG. 9 shows a state where the tray supply plate 6t is arranged in the plate arrangement device 12 having the above-described configuration. As shown in FIG. 9, the tray supply plate 6 is sandwiched between the respective plate pressing members 61 and the support ends 60a of the respective plate support portions 60 so as to sandwich the tray ring 59. t is supported. In addition, since the outer peripheral end of the trailing 59 is in contact with the inclined surface of the inclined end 65 a of the tapered supporting portion 65, the trailing 59 is supported in the direction along the surface by angular resistance. Position is maintained. In addition, the tray mounting portion 58 located at a height one step lower than the trailing 59 is arranged inside the annular expanding member 63. Furthermore, in the holding state of the tray supply plate 6 t, the leading end 63 a of the expanding member 63 and the lower surface of the tray ring 59 located above the expanding member 63 do not contact each other. A gap is secured. This makes it possible to prevent the tip 63 a from being damaged by the tip 63 a coming into contact with the trailing 59. Also, Such a clearance is ensured by restricting the lowering position of each plate pressing member 61 by another member. This restriction method will be described with reference to a partially enlarged perspective view of the plate placement device 12 shown in FIG.
図 1 0に示すように、 プレート酉己置装置 1 2の配置フレーム 6 4の上面におけ る図示手前の端部近傍には、 夫々のプレート押圧体 6 1の上記下降位置を規制す る規制部の一例である中間ストッパー駆動部 6 9が備えられている。 この中間ス トッパー駆動部 6 9は、 配置フレーム 6 4の上面における図示左手前側端部近傍 に配置された当接部の一例である中間ストッパー 6 9 aと、 この中間ストッパー 6 9 aを当該端部に沿って移動させる当接部移動機構の一例であるストッパー移 動部 6 9 bとを備えている。 なお、 このストッパー移動部 6 9 bは、 例えば、 圧 縮空気の給排気でもって上下方向に駆動可能なシリンダとそのシリンダに取り付 けられて、 中間ストッパー 6 9 aに当該シリンダの駆動を機械的に伝達するリン ク機構とにより構成されている。 ここで、 この中間ストッパー駆動部 6 9の動作 を説明する模式説明図を図 1 1に示す。  As shown in FIG. 10, near the end in front of the drawing on the upper surface of the arrangement frame 64 of the plate rooster device 12, there is a regulation that regulates the lowering position of each plate pressing body 61. An intermediate stopper driving section 69 as an example of the section is provided. The intermediate stopper driving unit 69 is provided with an intermediate stopper 69 a which is an example of a contact portion disposed near the left front end on the upper surface of the arrangement frame 64, and an intermediate stopper 69 a which is an end of the intermediate stopper 69 a. And a stopper moving portion 69b, which is an example of a contact portion moving mechanism that moves along the portion. The stopper moving section 69b is attached to a cylinder that can be driven vertically by supply and exhaust of compressed air and the cylinder, and the intermediate stopper 69a is used to mechanically drive the cylinder. It is composed of a link mechanism that transmits information in a timely manner. Here, FIG. 11 is a schematic explanatory view for explaining the operation of the intermediate stopper driving section 69.
図 1 1に示すように、 プレート押圧体 6 1の下部に規制ピン 6 1 aが設けられ ている。 この規制ピン 6 1 aはプレート押圧体 6 1の下降によって、 その下端に おいて中間ストッパー 6 9 aの上端と当接可能に配置されている。 一方、 ストツ パー移動部 6 9 bは、 配置フレーム 6 4の上面に沿って、 規制ピン 6 1 aの下方 の位置であり、 中間ストッパー 6 9 aが規制ピン 6 1 aと当接可能な当接位置と、 規制ピン 6 1 aが下降されても、 中間ストッパー 6 9 aが規制ピン 6 1 aとの当 接を することができる β位置との間で、 中間ストッパー 6 9 aを進退移動 させることが可能となっている。 従って、 中間ストッパー 6 9 aを上記 位置 に位置させた状態で、 夫々のプレート押圧体 6 1を下降させることにより、 図 8 に示すウェハ供給用プレート 6 wの状態を成し得、 また、 中間ストッパー 6 9 a を上記当接位置に位置させた状態で、 夫々のプレート押圧体 6 1を下降させるこ とにより、 中間ストッパー 6 9 aと規制ピン 6 1 aとを当接させて、 夫々のプレ 一ト押圧体 6 1の下降位置を規制して、 図 9に示すトレイ供給用プレート 6 tの 状態を成し得る。 すなわち、 中間ストッパー 6 9 aと規制ピン 6 1 aとが当接さ れた状態で、 図 9に示すように、 トレイリング 5 9とエキスパンド部材 6 3の先 端部 6 3 aとの間に上記隙間が確保されるようになっている。 なお、 プレート配 置装置 1 2において、 夫々のプレート押圧体 6 1の下降における下限位置を規制 可能に、 個別に中間ストッパー駆動部 6 9が夫々に設けられており、 夫々の中間 ストッパー駆動部 6 9は互いに同期されて駆動される。 As shown in FIG. 11, a regulating pin 61 a is provided below the plate pressing body 61. The restricting pin 61 a is arranged so that the lower end of the plate pressing body 61 can contact the upper end of the intermediate stopper 69 a at the lower end thereof. On the other hand, the stopper moving portion 69b is located below the regulating pin 61a along the upper surface of the placement frame 64, and the intermediate stopper 69a can be brought into contact with the regulating pin 61a. The intermediate stopper 69a moves forward and backward between the contact position and the β position where the intermediate stopper 69a can make contact with the restriction pin 61a even when the regulating pin 61a is lowered. It is possible to make it. Therefore, by lowering the respective plate pressing members 61 with the intermediate stopper 69a positioned at the above position, the state of the wafer supply plate 6w shown in FIG. 8 can be achieved. By lowering each plate pressing body 61 with the stopper 69a positioned at the contact position, the intermediate stopper 69a and the regulating pin 61a are brought into contact with each other. By restricting the lowering position of the plate pressing body 61, the state of the tray supply plate 6t shown in FIG. 9 can be achieved. That is, in a state where the intermediate stopper 69 a and the regulating pin 61 a are in contact with each other, as shown in FIG. The above gap is secured between the end portion 63a. In the plate placement device 12, each of the intermediate stopper driving units 69 is individually provided so as to be able to regulate the lower limit position of the lowering of the plate pressing member 61 when descending. 9 are driven synchronously with each other.
ここで、 押圧体昇降部 6 2における空気回路図を図 1 3に示す。 図 1 3に示す ように、 押圧体昇降部 6 2は、 圧縮空気の給排気によって駆動可能な複数のシリ ンダ部 7 1を備えており、 昇降用圧縮空気供給部の一例である昇降用圧縮空気供 給ライン 7 3より供給された空気が、 電磁弁 7 7により選択的に上昇用レギユレ ータ 7 5又は下降用レギユレータ 7 6を通過されて、 夫々のシリンダ部 7 1に供 給されることにより、 選択的に上昇又は下降動作を行うことが可能となっている。 一方、 このような圧縮空気を用いた昇降機構においては、 安全性を図るための 非常停止をどのように行うかが問題となる。 一般的には、 非常停止の際には、 昇 降用圧縮空気供給ライン 7 3よりの圧縮空気の供給を停止させるとともに、 夫々 のシリンダ部 7 1内の圧縮空気を全て抜いてしまうという対策が採られている。 このような対策を採ることで、 夫々のプレート押圧体 6 1が下方に下がっている ときに、 急に上昇させることができないようにすることができるという利点があ る。 しかしながら、 夫々のプレート押圧体 6 1が上方に位置されている場合には、 このような対策を採ると、 上記非常停止を行った結果、 夫々のプレート押圧体 6 1が下方に移動してしまうことになる。 これでは、 夫々のプレート押圧体 6 1に より、 その下方に位置されているもの、 例えば、 作業者の手や、 移動エラー等に より途中まで搬送された状態のプレート 6等を誤って挟んでしまうという問題が 起り得、 非常に危険なものとなってしまう。  Here, FIG. 13 shows a pneumatic circuit diagram of the pressing body elevating unit 62. As shown in FIG. 13, the pressing body elevating unit 62 includes a plurality of cylinder units 71 that can be driven by supply and exhaust of compressed air, and is an example of an elevating compression air supply unit. The air supplied from the air supply line 73 is selectively passed through the ascending regulator 75 or the descending regulator 76 by the solenoid valve 77 to be supplied to the respective cylinder portions 71. This makes it possible to selectively perform the ascending or descending operation. On the other hand, in such a lifting mechanism using compressed air, how to perform an emergency stop for safety is a problem. In general, at the time of an emergency stop, the measures to stop the supply of the compressed air from the lifting / lowering compressed air supply line 73 and to remove all the compressed air from each cylinder part 71 are taken. Has been adopted. By taking such a measure, there is an advantage that it is possible to prevent a sudden rise when each plate pressing body 61 is lowered. However, when the respective plate pressing members 61 are positioned above, if such measures are taken, as a result of the emergency stop, the respective plate pressing members 61 move downward. Will be. In this case, each of the plate pressing members 61 is erroneously pinched by a member positioned below the plate pressing member 61, for example, a hand of an operator, or a plate 6 that has been transported halfway due to a movement error or the like. Problems can occur, which can be very dangerous.
そのため、 本実施形態においては、 上方に位置されている状態の夫々のプレー ト押圧体 6 1を非常停止により下降させることなく、 その位置を保持することが できるという構成を採っている。 具体的には、 圧縮空気選択弁の一例であるメカ 口ックバルブ 7 0を用いて、 メカ口ックバルブ 7 0のスィツチ部 7 0 aが機械的 に入ることにより上昇用レギユレータ 7 5を通しての夫々のシリンダ部 7 1への 昇降用圧縮空気ライン 7 3よりの圧縮空気の供給を行なうようにしており、 また、 上記昇降用圧縮空気よりも低い圧力の別の圧縮空気を保持用圧縮空気ライン 7 2 より保持用レギユレータ 7 4を通して夫々のシリンダ部 7 1に供給するようにし ている。 このような保持用の圧縮空気の圧力は、 夫々のプレート押圧体 6 1の昇 降位置を保持することができる圧力であって、 かつ、 上昇させることができない ような圧力が用いられている。 また、 保持用レギュレータ 7 4が保持用圧縮空気 供給部の一例となっている。 For this reason, in the present embodiment, a configuration is adopted in which each of the plate pressing members 61 positioned above can be held at the position without being lowered by an emergency stop. Specifically, using a mechanical opening valve 70, which is an example of a compressed air selection valve, the switch section 70a of the mechanical opening valve 70a mechanically enters each cylinder through the ascending regulator 75. The compressed air line 7 3 is supplied with compressed air from the lifting / lowering compressed air line 7 3, and another compressed air line with a lower pressure than the lifting / lowering compressed air 7 2 Further, each cylinder section 71 is supplied through a holding regulator 74. The pressure of the compressed air for holding is such a pressure that can hold the ascending / descending position of each plate pressing member 61 and that cannot be increased. The holding regulator 74 is an example of a holding compressed air supply unit.
このようなメカロックバルブ 7 0は、 図 1 0及び図 1 0の部分拡大斜視図であ る図 1 2に示すように、 そのスィッチ部 7 0 aを下向きとして、 配置フレーム 6 4に固定されており、 また、 プレート押圧体 6 1には、 このスィッチ部 7 0 aを 押圧可能な当接部分を有する当接バー 7 8が取り付けられている。 また、 プレー ト押圧体 6 1がその昇降範囲における上方に位置されている場合には、 当接バー 7 8の上記当接部分がスィツチ部 7 0 aを押圧して、 スィッチ部 7 0 aが入った 状態とされ、 一方、 上記昇降範囲の下方に位置されている場合には、 当接バー 7 8の上記当接部分がスィツチ部 7 0 aに当接されることなく、 スィツチ部 7 0 a は入っていない状態とされている。 このように構成されていることにより、 プレ 一ト押圧体 6 1がその昇降範囲における上方 （例えば、 上限位置） に位置されて いる場合には、 図 1 3において、 保持用圧縮空気ライン 7 2から保持用レギユレ ータ 7 4及びメ力ロックパルプ 7 0を通して、 夫々のシリンダ部 7 1に保持用の 圧縮空気が供給され、 一方、 プレート押圧体 6 1がその昇降範囲における下方 Such a mechanical lock valve 70 is fixed to an arrangement frame 64 with its switch portion 70a facing downward, as shown in FIG. 10 and FIG. 12 which is a partially enlarged perspective view of FIG. In addition, a contact bar 78 having a contact portion capable of pressing the switch portion 70a is attached to the plate pressing member 61. When the plate pressing body 61 is located above the vertical movement range, the contact portion of the contact bar 78 presses the switch portion 70a, and the switch portion 70a is pressed. When it is positioned below the elevating range, the contact portion of the contact bar 78 does not come into contact with the switch portion 70a. a is not in the state. With this configuration, when the plate pressing body 61 is positioned above the ascending / descending range (for example, the upper limit position), the compressed air line 7 2 Compressed air for holding is supplied to the respective cylinders 71 through the holding regulator 74 and the female lock pulp 70 from the outside, while the plate pressing body 61 is moved downward in the vertical range.
(例えば、 上記上限位置以外の位置） に位置されている場合には、 昇降用圧縮空 気ライン 7 3から電磁弁 7 7により選択的に上昇用レギユレータ 7 5又は下降用 レギユレータ 7 6を通して、 昇降用の圧縮空気が供給される。 (For example, if the position is other than the above upper limit position), the ascending and descending air is selectively passed from the ascending and descending compressed air line 73 through the ascending regulator 75 or descending regulator 76 by the solenoid valve 77. Compressed air is supplied.
次に、 プレート移動装置 4 0の斜視図を図 1 4に示す。 図 1 4に示すように、 プレート 6を解除可能に保持する保持部の一例であるチヤック部 4 1と、 チヤッ ク部 4 1がその先端に取り付けられた平面的に略 L字形状を有するアーム機構 4 2と、 アーム機構 4 2を図示 Y軸方向に進退移動させる保持部移動部の一例であ る移動部 4 4とを備えている。 移動部 4 4は、 図示 Y軸方向に配置されたボール ねじ軸部 4 4 aと、 ポールねじ軸部 4 4 aに螺合されたナツト部 4 4 bと、 ボー ルねじ軸部の一端に固定されて、 ポールねじ軸部 4 4 aをその軸心回りに回転さ せることにより、 ナット部 4 4 bを図示 Y軸方向に進退移動させる移動モータ 4 4 cとを備えている。 また、 アーム機構 4 2のチャック部が取り付けられていな い側の端部は LMブロック 4 3 aに固定されており、 LMブロック 4 3 aは図示 Y軸方向に配置された LMレール 4 3 bに沿って、 アーム機構 4 2の移動を案内 可能とされているとともに、 LMブロック 4 3 aがナツト部 4 4 bに固定されて、 ナット部 4 4 bとともに移動されることにより、 アーム機構 4 2の当該移動が可 能となっている。 Next, a perspective view of the plate moving device 40 is shown in FIG. As shown in FIG. 14, a chuck portion 41 which is an example of a holding portion for releasably holding the plate 6, and an arm having a substantially L-shaped planar shape and having the chuck portion 41 attached to a tip end thereof. A mechanism 42 and a moving unit 44 as an example of a holding unit moving unit for moving the arm mechanism 42 forward and backward in the illustrated Y-axis direction are provided. The moving part 44 has a ball screw shaft part 44a arranged in the Y-axis direction in the figure, a nut part 44b screwed to the pole screw shaft part 44a, and one end of the ball screw shaft part. The motor 4 is fixed, and rotates the pole screw shaft part 4 4a around its axis to move the nut part 4 4b forward and backward in the Y-axis direction. 4c. The end of the arm mechanism 42 on the side where the chuck portion is not attached is fixed to the LM block 43a, and the LM block 43a is an LM rail 43b arranged in the Y-axis direction in the figure. Along with the arm mechanism 42, the LM block 43a is fixed to the nut part 44b, and is moved together with the nut part 44b. The movement of item 2 is possible.
また、 図 1 4に示すように、 チャック部 4 1に隣接して、 プレート 6の端部の 形状に基づいて、 保持されるプレート 6がウェハ供給用プレート 6 wなの力 \ 又 は、 トレイ供給用プレート 6 tなのかを識別するプレート識別部の一例であるプ レート識別センサ 4 1 bがアーム機構 4 2に取り付けられている。 このプレート 識別センサ 4 1 bは、 図 4におけるウェハリング 9に形成されていなくて、 図 5 におけるトレイリング 5 9に形成されている識別孔 5 6の有無を、 透過型センサ を用いて識別することでもって、 上記プレート 6の識別を行っている。 また、 チ ャック部 4 1を挟んでプレート識別センサ 4 1 bと逆側には、 チャック部 4 1が プレート 6を保持しているかどうかを検出するプレート有無検出センサ 4 1 aが アーム機構 4 2に取り付けられている。 このプレート有無検出センサ 4 1 aは透 過型センサを用いて、 ウエノヽリング 9又はトレィリング 5 9の端部によりセンサ の光の遮光が検出されるかどうかでもって、 上記プレート 6の有無を検出してい る。 なお、 プレート識別センサ 4 1 bの識別結果に基づいて、 プレート配置装置 1 2における中間ストッパー駆動部 6 9による中間ストッパー 6 9 aの移動位置 が決定される。  In addition, as shown in FIG. 14, adjacent to the chuck portion 41, based on the shape of the end of the plate 6, the plate 6 to be held is the force of the wafer supply plate 6w or the tray supply A plate identification sensor 41b, which is an example of a plate identification unit that identifies whether the plate 6t is for use, is attached to the arm mechanism 42. The plate identification sensor 41b is not formed in the wafer ring 9 in FIG. 4, but identifies the presence or absence of the identification hole 56 formed in the tray ring 59 in FIG. 5 using a transmission sensor. In this way, the plate 6 is identified. Further, on the opposite side of the plate identification sensor 41b with respect to the chuck part 41, a plate presence / absence detection sensor 41a for detecting whether the chuck part 41 holds the plate 6 is provided with an arm mechanism 42. Attached to. The plate presence / absence detection sensor 41a uses a transmission type sensor to detect the presence / absence of the plate 6 based on whether or not the light blocking of the sensor is detected by the end of the ring 9 or the trailing ring 59. are doing. The movement position of the intermediate stopper 69a by the intermediate stopper drive unit 69 in the plate placement device 12 is determined based on the identification result of the plate identification sensor 41b.
また、 図 1 4に示すように、 アーム機構 4 2は、 チャック部 4 1を図示 X軸方 向における揺れを機械的に収束させながら、 その X軸方向における位置のセンタ リングを自動的に行う X軸方向センタリング部 4 2 aを備えている。 なお、 この ようなセンタリング機構は、 図示 X軸方向に限定されるものではなく、 図示 Y軸 方向におけるセンタリングが行われるようなものであってもよい。 さらに、 ァー ム機構 4 2は、 図示 Y軸方向奥側にアーム機構 4 2が他の構成部材に干渉 （衝 突） したことを検出可能な衝突検出センサ 4 2 bを備えている。 この衝突センサ 4 2 bにより上記衝突が検出された場合には、 移動部 4 4の移動を停止させて、 当該衝突による装置の故障や保持している夫々の電子部品 2の破損等の防止を図 つている。 Further, as shown in FIG. 14, the arm mechanism 42 automatically centers the position of the chuck portion 41 in the X-axis direction while mechanically converging the swing in the X-axis direction. An X-axis direction centering part 42a is provided. It should be noted that such a centering mechanism is not limited to the illustrated X-axis direction, and may be a mechanism that performs centering in the illustrated Y-axis direction. Further, the arm mechanism 42 includes a collision detection sensor 42b on the far side in the Y-axis direction in the drawing, which can detect that the arm mechanism 42 has interfered (collimated) with another constituent member. When the collision is detected by the collision sensor 42b, the movement of the moving part 44 is stopped, It is intended to prevent failure of the device due to the collision, damage to the respective electronic components 2 held, and the like.
次に、 トレイ供給プレート 6 tへの夫々の部品供給トレイ 5 7の載置方法につ いて説明する。 また、 図 1 5にトレィ載置部 5 8の部分拡大斜視図を示し、 図 1 6にトレイ載置部 5 8の断面の模式説明図を示す。  Next, a method of mounting the respective component supply trays 57 on the tray supply plate 6t will be described. FIG. 15 is a partially enlarged perspective view of the tray mounting portion 58, and FIG. 16 is a schematic explanatory view of a cross section of the tray mounting portion 58.
図 1 5に示すように、 トレィ載置部 5 8には、 プレート取出方向 Cと直交する 方向沿いに互いに平行に配置されて、 部品供給トレィ 5 7の互いに対向する夫々 の端部と当接されて、 部品供給トレイ 5 7を挟むように、 その配置位置を保持可 能な 2つの保持部材が取り付けられている。 また、 上記 2つの保持部材のうちの プレート取出方向 C側に配置されている上記保持部材は、 その部品供給トレイ 5 7との当接側端部に、 部品供給トレイ 5 7を付勢するように個別にスライド可能 な 2つのスライド部 8 0 aを備えたスライド側保持部材 8 0 (可動側保持部材の 一例である） となっており、 他方の上記保持部材はその部品供給トレイ 5 7の当 接側端部において、 当該部品供給トレイ 5 7の配置位置を固定する固定側保持部 材 8 1となっている。 このように構成されていることにより、 スライ ド側保持部 材 8 0の夫々のスライド部 8 0 aをプレート取出方向 Cにスライドさせるように. 部品供給トレイ 5 7をトレイ載置部 5 8の上方から揷入して、 スライド側保持部 材 8 0と固定側保持部材 8 1とで挟んで、 部品供給トレイ 5 7をトレイ载置部 5 8に載置することができる。 なお、 図 1 6に示すように、 スライド側保持部材 8 0と固定側保持部材 8 1とにおける部品供給トレイ 5 7の端部との当接部分は、 互いに向き合うようにィ頃斜されており、 このような {頃斜によって、 部品供給トレ ィ 5 7のトレィ載置部 5 8からの飛び出しを防止している。 なお、 図 1 5におい ては、 トレイ載置部 5 8には、 2列に配列されて合計 4個の部品供給トレイ 5 7 が载置されることから、 固定側保持部材 8 1の上記部品供給トレィ 5 7との当接 側端部と逆側の端部に、 スライド側保持部材 8 0の夫々のスライド部 8 0 aを備 えさせて、 上記部品供給トレィ 5 7とプレート取出方向 Cにおいて隣接されて配 置される別の部品供給トレイ 5 7 (図示しない） に対してのスライド側保持部材 8 0としての機能を併せ持つように構成されている。 また、 スライド側保持部材 8 0に夫々のスライド部 8 0 aが個別にスライド可能に備えられている場合に代 えて、 図 1 7に示すように、 2つの当接部分を有するスライ ド部 8 0 bが一体的 に備えられているような場合であってもよい。 また、 スライ ド側保持部材 8 0に おいて備えられている夫々のスライド部 8 0 aのスライド動作をロック可能な口 ック機構が備えられているような場合であってもよい。 As shown in FIG. 15, the tray mounting portion 58 is disposed parallel to each other along a direction orthogonal to the plate unloading direction C, and abuts with each end of the component supply tray 57 facing each other. Then, two holding members capable of holding the arrangement position are attached so as to sandwich the component supply tray 57. Further, the holding member, which is arranged on the side of the plate removal direction C of the two holding members, biases the component supply tray 57 to an end on the contact side with the component supply tray 57. And a slide-side holding member 80 (which is an example of a movable-side holding member) having two slide portions 80 a that can be individually slidably mounted on the component supply tray 57. At the end on the contact side, a fixed-side holding member 81 for fixing the position of the component supply tray 57 is provided. With this configuration, each slide portion 80a of the slide-side holding member 80 is slid in the plate removal direction C. The component supply tray 57 is moved to the tray mounting portion 58. The component supply tray 57 can be mounted on the tray mounting portion 58 by being inserted from above and sandwiched between the slide-side holding member 80 and the fixed-side holding member 81. As shown in FIG. 16, the contact portions of the slide-side holding member 80 and the fixed-side holding member 81 with the end of the component supply tray 57 are slanted so as to face each other. However, such a slant prevents the parts supply tray 57 from jumping out of the tray mounting portion 58. In FIG. 15, since a total of four component supply trays 57 arranged in two rows are placed on the tray mounting portion 58, the components of the fixed side holding member 8 1 At the end opposite to the end on the contact side with the supply tray 57, each slide section 80a of the slide-side holding member 80 is provided, and the component supply tray 57 and the plate removal direction C are provided. It is configured to also have a function as a slide-side holding member 80 for another component supply tray 57 (not shown) that is arranged adjacent to the tray. In addition, the present invention is applicable to a case where each slide portion 80a is individually slidably provided on the slide-side holding member 80. Alternatively, as shown in FIG. 17, a case may be adopted in which a slide portion 80b having two contact portions is integrally provided. Further, a case may be employed in which an opening mechanism capable of locking the sliding operation of each slide portion 80a provided in the slide-side holding member 80 is provided.
また、 このようなトレイ供給プレート 6 tには、 微小な部品 2が配置された部 品供給トレィ 5 7が载置されるような場合もある。 特に、 このような微小な部品 2は、 部品供給トレイ 5 7に微小な振動が与えられるだけでも、 部品供給トレイ 5 7から飛び出してしまう場合も考えられ、 このような部品供給トレィ 5 7のト レイ供給プレート 6 tへの載置作業には注意が必要である。  Further, in such a tray supply plate 6t, there may be a case where a component supply tray 57 in which the minute components 2 are disposed is disposed. In particular, such minute components 2 may jump out of the component supply tray 57 even if only a minute vibration is applied to the component supply tray 57. Care must be taken when placing the tray on the tray 6 t.
特に、 図 1 6に示すような部品供給トレイ 5 7の載置方法では、 作業者が一方 の手で部品供給トレイ 5 7を保持しながら、 他方の手でスライド側保持部材 8 0 をスイライドさせるというように、 両手を用いた作業が必要となり、 作業状態が 不安定となって、 部品供給トレィ 5 7に対して振動を与えてしまう恐れもある。 そのため、 例えば、 図 5 7に示すように、 作業者が一方の手、 あるいは両手で 部品供給トレイ 5 7を保持しながら、 部品供給トレイ 5 7の端部で、 スィライド 側保持部材 8 0をスライ ドさせて、 部品供給トレイ 5 7を載置すれば、 より安定 した状態で当該載置作業を行なうことができる。  In particular, in the mounting method of the component supply tray 57 shown in FIG. 16, the operator holds the component supply tray 57 with one hand and slides the slide-side holding member 80 with the other hand. Thus, work using both hands is required, and the work state becomes unstable, which may cause vibration to the component supply tray 57. Therefore, for example, as shown in FIG. 57, the operator slides the slide-side holding member 80 at the end of the component supply tray 57 while holding the component supply tray 57 with one hand or both hands. Then, when the component supply tray 57 is placed, the placing operation can be performed in a more stable state.
なお、 作業者が他方の手でトレイ供給プレート 6 tを保持する必要がある場合 も考えられるため、 図 3 9に示すトレィ供給プレート 2 0 6 tのように、 その中 央部分近傍に、 作業者の指が入る程度の複数の保持用穴 2 9 3が形成されるよう にすることもできる。 このような場合にあっては、 より確実な保持ができ、 微小 部品の飛び出しを確実に防止することができる。  In some cases, it may be necessary for the operator to hold the tray supply plate 6 t with the other hand, so that the work is placed near the center of the tray supply plate 206 t as shown in Fig. 39. It is also possible to form a plurality of holding holes 293 that allow a person's finger to enter. In such a case, more reliable holding can be performed, and protrusion of minute components can be reliably prevented.
(部品供給装置の動作について）  (About the operation of the parts supply device)
次に、 このような構成を有する部品供給装置 4におけるマガジンカセット 5 0 より夫々のプレート 6を取り出して、 プレート配置装置 1 2に夫々の電子部品 2 を取り出し可能に配置させるまでの動作について説明する。  Next, the operation of taking out each plate 6 from the magazine cassette 50 in the component supply device 4 having such a configuration and arranging each electronic component 2 in the plate placement device 12 so as to be able to be taken out will be described. .
まず、 図 2において、 リフター装置 1 0のカセット昇降部 5 1によりマガジン カセット 5 0を上昇又は下降させて、 マガジンカセット 5 0より取り出されるべ きプレート 6を、 プレート移動装置 4 0のチャック部 4 1の高さ位置に位置させ る。 それとともに、 プレート配置装置 1 2において押圧体昇降部 6 2により夫々 のプレート押圧体 6 1をその昇降の上限位置に上昇させて停止させる。 なお、 こ のとき、 メカロックバルブ 7 0のスィツチ部 7 0 aが当接バー 7 8により押圧さ れて、 スィッチ部 7 0 aが入った状態とされており、 保持用の圧縮空気が押圧体 昇降部 6 2の夫々のシリンダ部 7 1に供給されて、 夫々のプレート押圧体 6 1の 昇降位置が上記昇降の上限位置にて保持された状態となっている。 First, in FIG. 2, the magazine cassette 50 is raised or lowered by the cassette lifting / lowering unit 51 of the lifter device 10, and the plate 6 to be taken out from the magazine cassette 50 is moved to the chuck unit 4 of the plate moving device 40. At the height of 1 You. At the same time, in the plate disposing device 12, each plate pressing member 61 is raised by the pressing member lifting / lowering portion 62 to the upper limit position of the lifting and stopping. At this time, the switch portion 70a of the mechanical lock valve 70 is pressed by the contact bar 78 so that the switch portion 70a is in the state, and the compressed air for holding is pressed. Supplied to the respective cylinder portions 71 of the elevating section 62, the elevating position of the respective plate pressing members 61 is held at the upper limit position of the elevating.
次に、 プレート移動装置 4 0における移動部 4 4によりアーム機構 4 4が図 2 の図示 Y軸方向左向きに移動されて、 チャック部 4 1がマガジンカセット 5 0内 に移動される。 その後、 マガジンカセット 5 0より取り出されるべきプレート 6 の外周端部近傍が、 チャック部 4 1に隣接して設置されているプレート有無識別 検出センサ 4 1 aにより検出されると、 当該外周部近傍がチャック部 4 1により 保持される。 それとともに、 チャック部 4 1に隣接して設置されているプレート 識別センサ 4 l bにより、 当該保持されたプレート 6が、 ウェハ供給用プレート 6 wである力 又は、 トレイ供給用プレート 6 tであるかが識別される。 その後、 移動部 4 4によるアーム機構 4 2の図示 Y軸方向右向きの移動が開始されて、 上 記保持されたプレート 6がマガジンカセット 5 0の夫々の溝部 5 0 bに沿って移 動されて取り出される。  Next, the arm mechanism 44 is moved leftward in the Y-axis direction in FIG. 2 by the moving section 44 of the plate moving device 40, and the chuck section 41 is moved into the magazine cassette 50. Thereafter, when the vicinity of the outer periphery of the plate 6 to be taken out of the magazine cassette 50 is detected by the plate presence / absence detection sensor 41a installed adjacent to the chuck portion 41, the vicinity of the outer periphery is detected. It is held by the chuck part 41. At the same time, the plate identification sensor 4 lb installed adjacent to the chuck unit 41 determines whether the held plate 6 is the force that is the wafer supply plate 6 w or the tray supply plate 6 t. Is identified. Thereafter, the movement of the arm mechanism 42 to the right in the illustrated Y-axis direction by the moving unit 44 is started, and the plate 6 held above is moved along the respective groove portions 50b of the magazine cassette 50. Taken out.
その後、 チャック部 4 1により保持されたプレート 6が、 プレート配置装置 1 2の夫々のプレート押圧体 6 1と夫々のプレート支持部 6 0との間を通過するよ うに移動されて、 夫々のプレート支持部 6 0によりプレート 6が支持可能となる 位置に位置されて停止される。 その後、 押圧体昇降部 6 2により夫々のプレート 押圧体 6 1が下降されて、 プレート 6の外周部分の上面を下方に押し下げるとと もに、 上記外周部分の下面を夫々のプレート支持部 6 0の上端に当接させて、 夫々のプレート押圧体 6 1と夫々のプレート支持部 6 0にて挟むようにしてプレ ート 6が保持される。 それとともに、 チャック部 4 1によるプレートの保持が解 除されて、 移動部 4 4によりアーム機構 4 2が図 2の図示 Y軸方向右側に移動さ れて、 チャック部 4 1とプレート 6との平面的な位置の干渉がなくなる位置にて 停止される。  Thereafter, the plates 6 held by the chuck portions 41 are moved so as to pass between the respective plate pressing members 61 of the plate placement device 12 and the respective plate supporting portions 60, and the respective plates are moved. The plate 6 is stopped at a position where the plate 6 can be supported by the support portion 60. Thereafter, the respective plate pressing members 61 are lowered by the pressing member lifting / lowering portions 62, and the upper surface of the outer peripheral portion of the plate 6 is pushed down, and the lower surface of the outer peripheral portion is pressed to the respective plate supporting portions 60. The plate 6 is held so as to be in contact with the upper end of the plate 6 and sandwiched between the respective plate pressing members 61 and the respective plate support portions 60. At the same time, the holding of the plate by the chuck 41 is released, and the arm mechanism 42 is moved to the right in the Y-axis direction in FIG. Stop at a position where there is no interference with the planar position.
一方、 プレート識別センサ 4 1 bによるプレート 6の種類の識別結果を受けて、 中間ストッパー駆動部 6 9により中間ストッパー 6 9 aの移動位置が決定される。 まず、 当該プレート 6が、 ウェハ供給用プレート 6 wであるような場合にあって は、 中間ストッパー 6 9 aが上記 »位置に移動されて、 夫々の規制ピン 6 1 a と中間ストッパー 6 9 aの当接が ϋ¾された状態とされる。 その後、 夫々のプレ 一ト押圧体 6 1がさらに下降されて、 夫々のプレート支持部 6 0が押し下げられ て、 エキスパンド部材 6 3の先端部 6 3 aを支点として、 ウェハシート 8の延伸 が行われて、 エキスパンドが行われる。 なお、 下降されている夫々のプレート押 圧体 6 1は、 夫々のエキスパンド下限ストッパー 6 8に当接されてその下降にお ける下限位置が規制され、 この状態で夫々のプレート押圧体 6 1の下降が停止さ れる。 このような状態において、 ウェハ供給用プレート 6 wより、 夫々のウェハ 供給部品 2 wの取り出し供給が可能なり、 ウェハシート 8の下方より、 夫々のゥ ェハ供給部品 2 wを突き上げて、 突き上げられたウェハ供給部品 2 wを反転へッ ド装置 1 4にて保持して取り出すことにより、 夫々のウェハ供給部品 2 wの取り 出しが行われる。 On the other hand, in response to the identification result of the type of plate 6 by the plate identification sensor 41b, The movement position of the intermediate stopper 69 a is determined by the intermediate stopper drive unit 69. First, when the plate 6 is the wafer supply plate 6w, the intermediate stopper 69a is moved to the position », and the respective regulating pins 61a and the intermediate stopper 69a are moved. Is in a state of contact. Thereafter, each of the plate pressing members 61 is further lowered, and each of the plate supporting portions 60 is pressed down, and the wafer sheet 8 is stretched with the leading end 63 a of the expanding member 63 as a fulcrum. The expansion takes place. Further, each of the plate pressing members 61 being lowered is brought into contact with each of the lower limit stoppers 68 of the expander, and the lower limit position in the lowering thereof is regulated. In this state, each of the plate pressing members 61 is lowered. The descent is stopped. In such a state, each wafer supply part 2 w can be taken out and supplied from the wafer supply plate 6 w, and each wafer supply part 2 w is pushed up from below the wafer sheet 8 and pushed up. Each of the wafer supply parts 2w is taken out by holding and taking out the wafer supply parts 2w thus obtained by the reversing head device 14.
一方、 当該プレート 6が、 トレイ供給用プレート 6 tであるような場合にあつ ては、 中間ストッパー 6 9 aが上記当接位置に移動されて、 夫々の規制ピン 6 1 aと中間ストッパー 6 9 aの当接が可能な状態とされる。 その後、 夫々のプレー ト押圧体 6 1がさらに下降されて、 夫々のプレート支持部 6 0が押し下げられる 1 夫々の規制ピン 6 1と夫々の中間ストッパー 6 9 aが当接されて、 夫々のプ レート押圧体 6 1の下降位置が規制された状態とされる。 この状態において、 図 9に示すように、 トレイリング 5 9の下面と、 エキスパンド部材 6 3の先端部 6 3 aとの間に互いに当接しないような隙間が確保された状態とされる。 また、 こ のような状態とされると、 夫々のプレート押圧体 6 1の下降が停止されて、 トレ ィ供給用プレート 6 tより、 夫々のトレイ供給部品 2 tが取り出し可能な状態と なる。 このような状態において、 反転ヘッド装置 1 4により、 トレィ載置部 5 8 に載置された夫々の部品供給トレイ 5 7より夫々のトレイ供給部品 2 tの保持に よる取り出しが行われる。  On the other hand, when the plate 6 is the tray supply plate 6 t, the intermediate stopper 69 a is moved to the contact position, and the respective regulating pins 61 a and the intermediate stopper 69 are moved. It is in a state where abutment of a is possible. After that, each plate pressing body 61 is further lowered, and each plate supporting portion 60 is pushed down.1 Each of the regulating pins 61 and each of the intermediate stoppers 69a are brought into contact with each other, and The lowering position of the rate pressing body 61 is regulated. In this state, as shown in FIG. 9, a space is secured between the lower surface of the tray ring 59 and the distal end portion 63 a of the expanding member 63 so as not to contact each other. Further, in such a state, the lowering of the respective plate pressing members 61 is stopped, and the respective tray supply parts 2t can be taken out from the tray supply plate 6t. In this state, the reversing head device 14 takes out the respective tray supply components 2 t from the respective component supply trays 57 mounted on the tray mounting portion 58 by holding them.
なお、 上述のようにウェハ供給用プレート 6 w又はトレイ供給用プレート 6 t より夫々の電子部品 2の取り出しが行われた後、 夫々のプレート 6が上述の手順 の逆を追って、 プレート移動装置 4 0によりマガジンカセット 5 0に移動されて 収納される。 After the respective electronic components 2 are taken out from the wafer supply plate 6 w or the tray supply plate 6 t as described above, each plate 6 In the reverse order, the plate is moved to and stored in the magazine cassette 50 by the plate moving device 40.
次に、 部品供給装置 4におけるメンテナンス性を良好とさせる構成について説 明する。  Next, a configuration for improving the maintainability of the component supply device 4 will be described.
まず、 リフター装置 1 0のマガジンカセット 5 0に収納されている夫々のプレ 一ト 6のマガジンカセット 5 0からの飛び出し防止板について説明する。 なお、 図 1に示す電子部品実装装置 1 0 1においては、 従来の構成の飛び出し防止板が リフタ一装置 1 0に取り付けられている状態を示している。  First, the plate for preventing the plate 6 from being ejected from the magazine cassette 50 of the respective plates 6 stored in the magazine cassette 50 of the lifter device 10 will be described. Note that, in the electronic component mounting apparatus 101 shown in FIG. 1, a state in which a projection preventing plate having a conventional configuration is attached to the lifter apparatus 10 is shown.
図 1 8に示すように、 部品供給装置 4は、 移動可能なリフタ一装置 1 0と、 そ れ以外の部分とに大別されており、 上記それ以外に部分は、 ケーシング 8 2によ り覆われている。 また、 ケーシング 8 2のリフタ一装置 1 0側には、 跳ね上げ式 に開閉可能な扉 8 3が設置されている。 この扉 8 3の下方部分に飛び出し防止板 8 4 (プレート規制部の一例でもある） が取り付けられている。 ここで、 図 1 9 にこの扉 8 3付近の模式的な断面の説明図を示す。 図 1 9に示すように、 扉 8 3 が閉止された状態で、 飛び出し防止板 8 4が、 マガジンカセット 5 0に収納され ている取出されるべき 1枚のプレート 6を除いた夫々のプレート 6が、 マガジン カセット 5 0より飛び出さないように、 マガジンカセット 5 0の図示左側前面に 配置されている。 また、 飛び出し防止板 8 4の下方には、 プレート取出口部 8 4 aが設けられており、 このプレート取出口部 8 4 aに、 上記取出されるべき 1枚 のプレート 6が通過されて、 プレート配置装置 1 2に配置可能とされている。 また、 図 2 0及び図 2 1に示すように、 扉 8 3の下方にさらに別の飛び出し防 止板 8 6が設けられているような場合であってもよい。 このような場合にあって は、 別の飛び出し防止板 8 6の下方にプレート取出口部 8 6 aが設けられること になる。 さらに、 プレート取出口部 8 6 aの両端部に、 プレート取出口部 8 6 a を通過するプレート 6を検出可能な飛び出し検出部 8 5を設けることができる。 このように、 飛び出し検出部 8 5が設けられているような場合には、 図 2 1に示 すように、 メンテナンス時等において、 扉 8 3が開放されて飛び出し防止板 8 4 が機能を果たすことができない場合であっても、 マガジンカセット 5 0から飛ぴ 出したプレート 6を検出することができる。 次に、 リフタ一装置 1 0の部品供給装置 4への装備及び装備解除を行う構成に ついて説明する。 As shown in FIG. 18, the component supply device 4 is roughly divided into a movable lifter device 10 and other portions, and the other portions are separated by a casing 82. Covered. In addition, a door 83 that can be opened and closed in a flip-up manner is provided on the lifter device 10 side of the casing 82. A protrusion prevention plate 84 (also an example of a plate regulating portion) is attached to a lower portion of the door 83. Here, FIG. 19 shows an explanatory diagram of a schematic cross section near the door 83. FIG. As shown in FIG. 19, with the door 83 closed, the pop-out prevention plate 84 is attached to each of the plates 6 except for the one plate 6 to be removed which is stored in the magazine cassette 50. Is located on the left front side of the magazine cassette 50 so that it does not protrude from the magazine cassette 50. In addition, a plate outlet portion 84a is provided below the protrusion preventing plate 84, and the one plate 6 to be taken out passes through the plate outlet portion 84a, It can be placed on the plate placement device 12. Further, as shown in FIGS. 20 and 21, a case in which another projection prevention plate 86 is provided below the door 83 may be adopted. In such a case, a plate outlet portion 86a is provided below another protrusion prevention plate 86. Further, at both ends of the plate outlet 86a, a pop-out detector 85 capable of detecting the plate 6 passing through the plate outlet 86a can be provided. In this way, in the case where the pop-out detecting unit 85 is provided, as shown in FIG. 21, the door 83 is opened and the pop-out prevention plate 84 performs the function during maintenance or the like. Even if it is not possible, the plate 6 that has jumped out of the magazine cassette 50 can be detected. Next, a configuration for mounting and releasing the lifter device 10 to and from the component supply device 4 will be described.
図 2 2に示すように、 リフター装置 1 0は、 マガジンカセット 5 0とともに力 セット昇降部 5 1を支持する基台 5 2と、 この基台 5 2の部品供給装置 4への装 備時における配置位置の保持が可能であって、 上記保持を解除して、 上記装備解 除を行うことが可能な基台保持部の一例である基台保持フレーム 9 1とを備えて いる。 なお、 基台保持フレーム 9 1は、 基台 5 2をその下部における前面部を除 く 3方向において接されるようにして、 基台 5 2の保持を行うことが可能となつ ている。 また、 図 2 2に示すように、 基台保持フレーム 9 1は、 基台 5 2の図示 X軸方向右側の下部側面と係合されることにより、 基台 5 2の直線的な移動であ る直動や、 回転させながらの移動である回動を案内する機構を備えている。 以下 に、 この機構について説明する。  As shown in FIG. 22, the lifter device 10 includes a base 52 that supports the force set elevating unit 51 together with the magazine cassette 50, and a base unit 52 when the base unit 52 is mounted on the component supply device 4. A base holding frame 91, which is an example of a base holding unit that can hold the arrangement position and can release the holding and release the equipment, is provided. Note that the base holding frame 91 can hold the base 52 by contacting the base 52 in three directions except the front part at the lower part thereof. Further, as shown in FIG. 22, the base holding frame 91 is engaged with a lower side surface on the right side in the X-axis direction of the base 52 in the illustrated X-axis direction, so that the base 52 is moved linearly. It is equipped with a mechanism for guiding linear movement and rotation, which is movement while rotating. The mechanism will be described below.
図 2 2に示すように、 基台保持フレーム 9 1は、 上記機構として、 基台 5 2の 上記装備解除を行う際、 すなわち、 部品供給装置 4より基台 5 2を移動させる場 合に、 その基台 5 2の直動を案内可能な直動案内部の一例であって、 その下部近 傍における Y軸方向に配置された直動案内レール 9 3と、 この直動案内レール 9 3の図示 Y軸方向左側の端部に隣接されるように配置された基台 5 2の回動を案 内可能な回動案内部の一例である回動案内レール 9 4とを備えている。 また、 基 台 5 2におけるその上記機構と接される側の側面下方においては、 直動案内レー ル 9 3に当接された状態でその直動が案内され、 また、 回動案内レール 9 4と係 合された状態でその回動が案内される係合部の一例である第 1の案内ローラ 9 2 が取り付けられている。 さらに、 基台 5 2の上記側面には、 図示 Y軸方向沿いに 配設された 2本の LMレール 9 6が固定されている。 また、 この 2本の LMレー ル 9 6には、 夫々に LMブロック 9 7が係合されて、 夫々の LMレール 9 6に沿 つて移動可能とされている。 また、 この夫々の LMプロック 9 7は、 基台支持フ レーム 9 1に取り付けられた回動軸 9 8に固定されており、 回動軸 9 8の軸心を 回転中心として回動可能とされている。 また、 基台 5 2の底面には、 4つの移動 ローラ 9 9が設置されており、 夫々の移動ローラ 9 9により基台 5 2が移動可能 に支持されている。 さらに、 回動案内レール 9 4の外側には、 基台 5 2の上記側 面下部と当接可能であるとともに、 基台 5 2の上記直動を案内する第 2の案内口 ーラ 9 9が設置されている。 As shown in FIG. 22, the base holding frame 91 serves as the mechanism when the base 52 is released from the equipment, that is, when the base 52 is moved from the component supply device 4. This is an example of a linear motion guide portion capable of guiding the linear motion of the base 52, and includes a linear motion guide rail 93 arranged in the Y-axis direction near a lower portion thereof, and a linear motion guide rail 93. A rotation guide rail 94, which is an example of a rotation guide unit capable of pivoting a base 52 arranged adjacent to the left end in the Y-axis direction in the figure, is provided. In addition, below the side surface of the base 52 on the side in contact with the above mechanism, the linear motion is guided in a state where the linear motion guide rail 93 is in contact with the linear motion guide rail 93. A first guide roller 92, which is an example of an engagement portion whose rotation is guided in a state in which it is engaged, is attached. Further, two LM rails 96 provided along the Y-axis direction in the figure are fixed to the side surface of the base 52. Further, the two LM rails 96 are respectively engaged with LM blocks 97 so as to be movable along the respective LM rails 96. Each of the LM blocks 97 is fixed to a rotating shaft 98 attached to the base support frame 91, and is rotatable around the axis of the rotating shaft 98 as a rotation center. ing. In addition, four moving rollers 99 are provided on the bottom surface of the base 52, and the base 52 is movably supported by the respective moving rollers 99. Further, on the outside of the rotation guide rail 94, the above-described side of the base 52 is provided. A second guide port 99 for guiding the linear motion of the base 52 is provided, while being able to contact the lower surface.
このような構成において、 基台保持フレーム 9 1に保持されている状態の基台 5 2を、 上記保持を解除して部品供給装置 4から引き出す動作について説明する。 また、 このような一連の動作状態を平面的に重ねて表示したものを図 2 3に示す。 図 2 2及び図 2 3に示すように、 基台 5 2が基台保持フレーム 9 1に保持され ている状態においては、 第 1の案内ローラ 9 2は直動案内レール ¾ 3の奥側の端 部近傍において当接された状態にあり、 また、 夫々の LMブロック 9 7は、 夫々 の LMレール 9 6の手前側の端部近傍に位置されている。 なお、 この状態におい ては、 基台 5 2の後側の側面において、 図示しない基台保持フレーム 9 1が備え る保持機構によりその保持位置が固定された状態とされている。  In such a configuration, an operation of releasing the base 52 held in the base holding frame 91 from the component supply device 4 by releasing the holding will be described. FIG. 23 shows such a series of operation states superimposed on a plane. As shown in FIGS. 22 and 23, when the base 52 is held by the base holding frame 91, the first guide roller 92 is located at the back of the linear guide rail ¾3. The LM blocks 97 are in contact with each other near the ends, and the respective LM blocks 97 are located near the front ends of the respective LM rails 96. In this state, on the rear side surface of the base 52, the holding position is fixed by a holding mechanism of the base holding frame 91 (not shown).
基台 5 2の移動を開始するには、 まず、 上記保持機構による保持の解除を行う。 その後、 保持が解除された基台 5 2を、 図 2 2の Υ軸方向左向きに引き出すよう に移動を開始させる。 これにより、 第 1の案内ローラ 9 2が直動案内レール 9 4 に当接されたまま、 回転走行されるようにして案内されて、 基台 5 2の直動が案 内される。 また、 第 2の案内ローラ 9 5も基台 5 2の側面に当接されたまま、 回 転走行されて基台 5 2の上記直動を案内する。 また、 夫々の LMレーノレ 9 6が、 夫々の LMブロック 9 7に案内されながら走行される。 このとき、 第 1の案内レ ール 9 2と直動案内レール 9 3により基台 5 2の回動が規制されているため、 回 動軸 9 8は回動することができない。  In order to start the movement of the base 52, first, the holding by the holding mechanism is released. Thereafter, the movement of the base 52 released from the holding is started so as to be pulled out to the left in the direction of the 方向 axis in FIG. As a result, the first guide roller 92 is guided in such a manner that the first guide roller 92 is rotated while traveling in contact with the linear motion guide rail 94, and the linear motion of the base 52 is contemplated. In addition, the second guide roller 95 is also rotated while traveling in contact with the side surface of the base 52 to guide the linear motion of the base 52. Each LM Renole 96 runs while being guided by each LM block 97. At this time, since the rotation of the base 52 is restricted by the first guide rail 92 and the linear guide rail 93, the rotation shaft 98 cannot rotate.
その後、 第 1の案内ローラ 9 2が直動案内レール 9 3の手前側の端部を通過し て、 直動案内レール 9 3との当接が解除されると、 それとともに、 回動案内レー ル 9 4に第 1の案内ローラ 9 2が係合される。 これにより、 規制されていた回動 が可能な状態とされ、 第 1の案内ローラ 9 2が回動案内レール 9 4に案内されな がら基台 5 2の回動が行われる。 なお、 このとき、 LMブロック 9 7は回動軸 9 8に固定されているため、 その回転中心周りに回動される。 このようにして基台 5 2の回動が行われて、 図 2 3に示すように、 基台 5 2が平面的に略 9 0度回動 されながら、 部品供給装置 4より引き出された状態とさせることができる。  After that, when the first guide roller 92 passes through the front end of the linear guide rail 93 and the contact with the linear guide rail 93 is released, the rotation guide rail 93 is also released. The first guide roller 92 is engaged with the roller 94. As a result, the restricted rotation is enabled, and the base 52 is rotated while the first guide roller 92 is guided by the rotation guide rail 94. At this time, since the LM block 97 is fixed to the rotation shaft 98, the LM block 97 is rotated around the center of rotation. The base 52 is thus rotated, and as shown in FIG. 23, the base 52 is pulled out from the component supply device 4 while being rotated approximately 90 degrees in a plane. It can be made.
(実施形態による効果） 上記実施形態によれば、 以下のような種々の効果を得ることができる。 (Effects of Embodiment) According to the above embodiment, the following various effects can be obtained.
まず、 部品供給装置 4のプレート配置装置 1 2における夫々のプレート押圧体 6 1の下降位置を中間ストッパー駆動部 6 9により選択的に規制することができ るため、 プレート配置装置 1 2に配置されるプレート 6の種類に応じて、 上記下 降位置の規制を行うことにより、 トレイ供給用プレート 6 tの保持を確実に行う ことができ、 上記下降位置の規制を解除することにより、 ウェハ供給用プレート 6 wを確実に保持しながら、 ウェハシート 8の延伸を行ってエキスパンドを行う ことができる。 従って、 配置供給されるプレート 6の種類に応じて、 適切な保持 動作やエキスパンド動作を選択的にかつ自動的に行うことができ、 部品供給を効 率的に行うことを可能とすることができる。  First, since the lowering position of each plate pressing body 61 in the plate placement device 12 of the component supply device 4 can be selectively regulated by the intermediate stopper drive unit 69, the plate stopper device 12 is placed in the plate placement device 12. By regulating the lowering position according to the type of the plate 6 to be held, it is possible to reliably hold the tray supply plate 6t. While securely holding the plate 6 w, the wafer sheet 8 can be stretched and expanded. Therefore, an appropriate holding operation or expanding operation can be selectively and automatically performed according to the type of the plate 6 to be arranged and supplied, and it is possible to efficiently supply components. .
また、 上記プレート 6の種類の識別は、 マガジンカセット 5 0に混載されてい る夫々のプレート 6をプレート移動装置 4 0により取り出す際に、 プレート 6の 端部を把持するチャック部 4 1に隣接して備えられているプレート識別センサ 4 1 bを用いて行うことができる。 具体的には、 プレート 6の端部に、 トレイ供給 用プレート 6 tの場合にのみ識別孔 5 6を設けて、 当該識別孔 5 6の有無をプレ 一ト識別センサ 4 1 bにより識別することにより、 上記プレート 6の種類の識別 行うことができる。 また、 この識別結果に基づいて中間ストッパー駆動部 6 9に よる中間ストッパー 6 9 aの移動位置を決定することにより、 夫々のプレート押 圧体 6 1の下降位置の規制を選択的に行うことができる。  In addition, the type of the plate 6 is identified by the fact that when each plate 6 mixedly loaded in the magazine cassette 50 is taken out by the plate moving device 40, the plate 6 is adjacent to the chuck portion 41 that grips the end of the plate 6. This can be performed by using the provided plate identification sensor 41b. Specifically, an identification hole 56 is provided at the end of the plate 6 only for the tray supply plate 6t, and the presence or absence of the identification hole 56 is identified by the plate identification sensor 41b. Thus, the type of the plate 6 can be identified. Also, by determining the moving position of the intermediate stopper 69a by the intermediate stopper driving part 69 based on the identification result, it is possible to selectively restrict the lowering position of each plate pressing body 61. it can.
また、 ウェハ供給用プレート 6 wのウェハシート 8に当接されることによりェ キスパンドを行うエキスパンド部材 6 3の先端部 6 3 a力 トレイ供給用プレー ト 6 tの下面に接触しないように、 上記夫々のプレート押圧体 6 1の下降位置が 規制されているため、 エキスパンド部材 6 3の先端部を傷付けることを防止する ことができる。  Also, the leading end 6 3 a of the expanding member 63 that performs expansion by abutting the wafer sheet 8 of the wafer supply plate 6 w 6 a force so as not to contact the lower surface of the tray supply plate 6 t. Since the lowering position of each plate pressing member 61 is regulated, it is possible to prevent the tip of the expanding member 63 from being damaged.
また、 プレート配置装置 1 2においては、 その支持高さ位置が可変可能とされ た複数のプレート支持部 6 0が備えられていることにより、 夫々のプレート 6の 外周部近傍において夫々のプレート 6を支持することができるとともに、 夫々の プレート押圧体 6 1の昇降動作に合わせて、 上記支持を行いながらその支持高さ 位置を自由に可変することができ、 上述の効果を達成することが可能となってい る。 Further, the plate placement device 12 is provided with a plurality of plate support portions 60 whose support height positions are variable, so that each plate 6 is placed near the outer peripheral portion of each plate 6. In addition to supporting, the supporting height position can be freely changed while performing the above-mentioned support in accordance with the elevating operation of each plate pressing body 61, and the above-mentioned effect can be achieved. Becoming You.
また、 その先端に傾斜端部 6 5 aを有するテーパ支持部 6 5が備えられている ことにより、 この傾斜端部 6 5 aにプレート 6の端部を当接させて、 角度抵抗に よりプレート 6の表面沿いの方向の支持位置の保持を行うことができ、 確実かつ 正確な保持が可能となる。  In addition, the end of the plate 6 is brought into contact with the inclined end portion 65 a by providing the tapered support portion 65 having an inclined end portion 65 a at the end thereof, and the plate resistance is changed by the angle resistance. The support position in the direction along the surface of No. 6 can be held, and reliable and accurate holding is possible.
また、 トレイ供給用プレート 6 tのトレィ載置部 5 8において、 プレート取出 方向 Cに直交する方向に、 スライド側保持部材 8 0と、 固定側保持部材 8 1とが 設けられていることにより、 部品供給トレィ 5 7をその载置位置の略上方より当 該載置位置に載置させて、 スライド側保持部材 8 0と固定側保持部材 8 1とで挟 むようにして部品供給トレイ 5 7を保持させることができるため、 部品供給トレ ィ 5 7の載置のために必要な空間を小さくすることができる。 従って、 トレィ供 給用プレート 6 tのトレイ载置部 5 8に 2列に合計 4つの部品供給トレイ 5 7を 載置させることができ、 トレイ供給プレート 6 tにおける部品供給トレイ 5 7の 面積収容率を向上させることができる。  Further, in the tray mounting portion 58 of the tray supply plate 6 t, the slide-side holding member 80 and the fixed-side holding member 81 are provided in a direction orthogonal to the plate removing direction C, The component supply tray 57 is placed on the placement position from substantially above the placement position, and the component supply tray 57 is held between the slide-side holding member 80 and the fixed-side holding member 81. Therefore, the space required for mounting the component supply tray 57 can be reduced. Therefore, a total of four component supply trays 57 can be placed in two rows on the tray mounting portion 58 of the tray supply plate 6 t, and the area of the component supply tray 57 in the tray supply plate 6 t can be accommodated. Rate can be improved.
また、 従来の部品供給装置においてはマガジンカセットからの夫々のプレート の飛び出しを防止する飛び出し防止板が、 リフタ一装置に取り付けられていたた め、 メンテナンスの際に、 当該飛び出し防止板が邪魔となって、 プレート配置装 置等のメンテナンスを行うことが困難であるという問題があった。 しかしながら、 本実施形態においては、 飛び出し防止板 8 4を扉 8 3に設ける構成としているこ とにより、 扉 8 3を開閉させることで、 飛び出し防止板 8 4を移動させることが でき、 メンテナンス性を向上させることができる。 さらに、 プレート取出口部 8 6 aの両端部に、 プレート取出口部 8 6 aを通過するプレート 6を検出可能な飛 び出し検出部 8 5を設けているため、 当該メンテナンス時等において、 扉 8 3が 開放されて飛び出し防止板 8 4が機能を果たすことができない場合であっても、 マガジンカセット 5 0から飛び出したプレート 6を検出することができ、 安全性 を高めながらメンテナンス性の向上を図ることができる。  In addition, in the conventional component supply device, a protruding prevention plate for preventing each plate from protruding from the magazine cassette is attached to the lifter device, so that the protruding preventing plate becomes a hindrance during maintenance. Therefore, there is a problem that it is difficult to perform maintenance such as a plate disposing device. However, in the present embodiment, since the pop-out preventing plate 84 is provided on the door 83, the pop-out preventing plate 84 can be moved by opening and closing the door 83, thereby improving maintainability. Can be improved. In addition, since a pop-out detecting section 85 that can detect the plate 6 passing through the plate outlet section 86a is provided at both ends of the plate outlet section 86a, the door can be used during maintenance or the like. Even if 8 3 is opened and the pop-out prevention plate 8 4 cannot perform its function, the plate 6 that has popped out of the magazine cassette 50 can be detected, improving maintainability while improving safety. Can be planned.
また、 部品供給装置 4へのリフタ一装置 1 0の装備又は装備解除を行う際の移 動を直動及び回動を組み合わせて行うことができる機構を備えさせているため、 より狭い空間にリフター装置 1 0を確実に収めて装備させること、 あるいは、 当 該空間からより簡単かつ円滑にリフタ一装置 1 0を引き出すことが可能となる。 従って、 このような部品供給装置 4をよりコンパクトな空間に配置させるような 場合であっても、 リフター装置 1 0の出し入れを容易かつ円滑に行うことができ、 メンテナンス性を向上させることができる。 In addition, a mechanism is provided that can move the lifter device 10 to the component supply device 4 in a combination of linear motion and rotation when mounting or dismounting the lifter device 10, so that the lifter can be installed in a narrower space. Ensure that the device 10 is housed and fitted, or The lifter device 10 can be easily and smoothly pulled out from the space. Therefore, even when such a component supply device 4 is arranged in a more compact space, the lifter device 10 can be easily and smoothly put in and out, and the maintainability can be improved.
(第 2実施形態）  (Second embodiment)
なお、 本発明は上記実施形態に限定されるものではなく、 その他種々の態様で 実施できる。 例えば、 本発明の第 2の実施形態にかかる部品供給装置について、 以下に説明する。 なお、 本第 2実施形態の部品供給装置は、 上記第 1実施形態の 部品供給装置 4と、 以下に示す部分的な構成が異なるもののその基本的な構成は 共通しているため、 以降の説明の理解を容易なものとすることを目的として、 上 記第 1実施形態の部品供給装置 4と同様な構成部分には、 同じ参照番号を付して いる。  It should be noted that the present invention is not limited to the above embodiment, and can be implemented in various other modes. For example, a component supply device according to a second embodiment of the present invention will be described below. The component supply device of the second embodiment differs from the component supply device 4 of the first embodiment in the following partial configuration, but has the same basic configuration. For the purpose of facilitating the understanding, the same reference numerals are given to the same components as those of the component supply device 4 of the first embodiment.
図 2 4に示す部品供給装置 2 0 4において、 リフタ一装置 1 0には、 複数の上 記ウェハ供給用プレート及ぴ複数の上記トレイ供給用プレートを混載して収納す るマガジンカセット 2 5 0が備えられている。 このマガジンカセット 2 5 0は、 上記第 1実施形態と同様に、 プレート取出方向 Cと直交する方向において、 互い に対向するように側壁部 2 5 0 aが夫々設けられており、 夫々の互いに対向する 側面において、 プレート取出方向 Cに沿って、 複数の溝部 2 5 0 bが形成されて いる。 また、 夫々のプレートは、 その互いに対向する両端部において、 夫々の側 壁部 2 5 0 aの互いに対向して配置された夫々の組の溝部 2 5 0 bの係合して支 持されることにより、 マガジンカセット 2 5 0に保持されて収納されており、 こ れら夫々の溝部 2 5 0 b力 支持ガイド部の一例となっている。 なお、 夫々の側 壁部 2 5 0 aにおいて夫々の溝部 2 5 0 bは一定の間隔ピッチでもって形成され ており、 夫々の溝部 2 5 0 bに係合されて保持された状態で、 夫々のプレートは その表面が略水平な状態とされている。 さらに、 夫々のプレートは、 上記互いに 対向する組の溝部 5 0 bの形成方向に沿って案内されながら、 プレート取出方向 C沿いに進退移動 （すなわち、 スライド移動） 可能な状態とされている。  In the component supply device 204 shown in FIG. 24, the lifter device 10 includes a magazine cassette 250 containing a plurality of the wafer supply plates and a plurality of the tray supply plates in a mixed manner. Is provided. As in the first embodiment, the magazine cassettes 250 are provided with side walls 250a so as to face each other in a direction orthogonal to the plate removing direction C, and each of the magazine cassettes 250 faces each other. On the side surface, a plurality of grooves 250b are formed along the plate extracting direction C. Further, the respective plates are supported at their opposite end portions by engagement of respective sets of groove portions 250b of the respective side wall portions 250a which are arranged opposite to each other. Thus, the magazine cassette 250 is held and housed, and is an example of each of the groove 250 b force support guides. In each side wall portion 250a, each groove portion 250b is formed at a constant pitch, and in a state where each groove portion 250b is engaged with and held by each groove portion 250b, The plate has a substantially horizontal surface. Further, each plate is set in a state in which it can move forward and backward (that is, slide) along the plate taking-out direction C while being guided along the forming direction of the pair of grooves 50b facing each other.
また、 ここで、 このマガジンカセット 2 5 0の側壁部 2 5 0 aの部分断面図を 図 2 5に示す。 図 2 5に示すように、 側壁部 2 5 0 aは、 金属材料であるアルミ -ゥム製のプレート 2 5 0 cに、 熱可塑性樹脂であるジユラコン （登録商標、 DURACON ： POM:ポリオキシメチレン（Polyoxymethylene) ) を用いて一体的に形成 された夫々の溝部 2 5 0 bが固定された構造を有している。 このジユラコンは、 トレイリング 5 9やウェハリング 9の形成材料であるステンレス材料 （例えば、 J I S規格： SUS304) よりもその表面硬度が低く、 軟らカ 、材料であるという特 徴を有しているため、 夫々の溝部 2 5 0 bとプレート 6とが、 互いに夫々の接触 表面において接触されるような場合であっても、 当該接触磨耗による切粉等の発 生量を低減させることができる。 また。 熱可塑性樹脂材料が用いられていること により、 複数の凹凸部が連続するような構造の夫々の溝部 2 5 0 bを容易に形成 することが可能となる。 なお、 このような夫々の溝部 2 5 0 bとトレイリング 5 9等の形成材料の組み合わせは、 上記組み合わせに限定されるものではない。 ト レイリング 5 9の形成材料に対して、 夫々の溝部 2 5 0 bの形成材料の硬度が低 ければよく、 このような条件のもとにおいてその他様々な組み合わせを採用する ことが可能である。 FIG. 25 is a partial cross-sectional view of the side wall portion 250a of the magazine cassette 250. As shown in FIG. 25, the side wall portion 250a is made of aluminum which is a metal material. Each of the grooves 250b formed integrally with the Duracon (registered trademark, DURACON: POM: Polyoxymethylene), a thermoplastic resin, is formed on a plate 250c made of -Pam. It has a fixed structure. This duracon has the characteristic that it has a lower surface hardness than the stainless steel material (for example, JIS standard: SUS304), which is the material for forming the tray ring 59 and the wafer ring 9, and is a soft material. Therefore, even when the respective grooves 250b and the plate 6 are in contact with each other on their respective contact surfaces, the amount of chips and the like generated due to the contact abrasion can be reduced. Also. The use of the thermoplastic resin material makes it possible to easily form the respective groove portions 250b having a structure in which a plurality of uneven portions are continuous. It should be noted that the combination of each of the groove portions 250b and the material for forming the trailing 59 or the like is not limited to the above combination. It is only necessary that the hardness of the material forming the groove 250b be low with respect to the material forming the tray ring 59, and various other combinations can be employed under such conditions. .
また、 このような夫々の溝部 2 5 0 bのさらに詳細な構造を示す一の溝部 2 5 Also, one groove portion 250 showing a more detailed structure of each such groove portion 250b.
0 bの側面図を図 2 6 Aに示し、 その正面図を図 2 6 Bに示す。 なお、 夫々の溝 部 2 5 0 bは一体的に形成されているものの、 以下における溝部 2 5 0 bの構造 の説明の理解を容易なものとするために、 図 2 6 A及び図 2 6 Bにおいては、 そ の上記一の溝部 2 5 0 bを切り出して表示した図としている。 Figure 26A shows the side view of 0b, and Figure 26B shows its front view. Although each groove 250b is formed integrally, in order to facilitate understanding of the structure of the groove 250b below, FIGS. 26A and 26B are used. In B, the one groove portion 250b is cut out and displayed.
図 2 6 Aに示すように、 溝部 2 5 0 bにおけるプレート取出方向 C側の端部、 すなわち、 夫々のプレート 6の挿入端部 2 5 0 dには、 プレート取出方向 Cに対 して、 僅かに傾斜された面である傾斜面 （滑面部の一例である） が形成されてい る。 また、 図 2 6 Bに示すように、 この傾斜面は、 プレート取出方向 Cに対して、 プレート 6の大略表面に直交する方向である図示下向きに傾斜された下部側傾斜 面 2 5 0 eと、 プレート 6の大略表面沿いの方向である図示左向きに傾斜された 側部側傾斜面 2 5 0 f とにより構成されている。  As shown in FIG. 26A, the end of the groove 250b on the plate removal direction C side, that is, the insertion end 250d of each plate 6 is provided with respect to the plate removal direction C. A slightly inclined surface (an example of a smooth surface portion) is formed. Further, as shown in FIG. 26B, the inclined surface is a lower inclined surface 250 e inclined downward in the drawing, which is a direction orthogonal to the surface of the plate 6 with respect to the plate removing direction C. The plate 6 is constituted by a side inclined surface 250 f inclined leftward in the drawing, which is a direction substantially along the surface of the plate 6.
このように夫々の溝部 2 5 0 bの揷入端部 2 5 0 dにおいて、 下部側傾斜面 2 5 0 e及び側部側傾斜面 2 5 0 fが形成されていることにより、 図示プレート取 出方向 Cと逆向きに、 プレート 6を揷入するような場合であっても、 プレート 6 の端部と、 このプレート 6を支持案内する夫々の溝部 2 5 0 bの挿入端部 2 5 0 dとの接触による摩擦を軽減することができ、 滑らかなプレート 6の揷入を実現 することができる。 また、 このプレート 6の揷入の際に、 プレート取出方向 Cと 直交する方向において、 夫々の溝部 2 5 0 bによるプレート 6の支持位置と、 夫々の溝部 2 5 0 bへのプレート 6の揷入位置との間に位置ズレが生じているよ うな場合であっても、 下部側傾斜面 2 5 0 eと側部側傾斜面 2 5 0 f とによりプ レート 6を案内しながら揷入して、 上記位置ズレを補正することができるという 効果もある。 As described above, since the lower inclined surface 250 e and the side inclined surface 250 f are formed at the insertion end portion 250 d of each groove portion 250 b, the illustrated plate Even if plate 6 is inserted in the opposite direction to exit direction C, plate 6 Can reduce friction caused by contact between the end of the plate and the insertion end 250 d of each groove 250 b for supporting and guiding the plate 6, thereby realizing a smooth insertion of the plate 6. Can be. When the plate 6 is inserted, in the direction orthogonal to the plate unloading direction C, the support position of the plate 6 by the respective groove portions 250b and the position of the plate 6 into the respective groove portions 250b are determined. Even if there is a misalignment with the entry position, insert while guiding the plate 6 using the lower inclined surface 250 e and the side inclined surface 250 f. Thus, there is also an effect that the above-mentioned positional deviation can be corrected.
次に、 図 2 7に、 トレイ供給プレート 6 tの外観斜視図を示す。 図 2 7に示す トレイ供給プレート 6 tのトレイリング 5 9のプレート取出方向 C沿いの互いに 対向する端部 （直線的に形成された端部） と部分円弧状の端部との 4箇所の連結 部分 （R) においては、 その下面端部の角部分が削り取られて滑らかな曲線によ り構成される滑面部 5 9 aとされている。 このような夫々の連結部分 Rは、 マガ ジンカセット 2 5 0の夫々の組の溝部 2 5 0 bとの接触部分であるため、 図 2 8 に示すように、 夫々の溝部 2 5 0 bに支持された状態で、 プレート取出方向 Cに 沿って、 トレイ供給プレート 6 tが進退移動されるような場合であっても、 夫々 の滑面部 5 9 aと溝部 2 5 0 bとの間の摩擦力を低減することができる。 従って、 マガジンカセット 2 5 0に対する夫々のトレイ供給プレート 6 tの揷入又は取出 しの際に、 トレイ供給プレート 6 tと夫々の溝部 2 5 0 bとの接触磨耗による切 粉等の発生量を低減することができる。 なお、 このようなトレイ供給プレート 6 tにおける滑面部 5 9 aの形成は、 その重量が、 ウェハ供給プレート 6 wに比し て重いという特徴を有するトレイ供給プレート 6 tに適用することが有効である 力 ウェハ供給プレート 6 wに対しても夫々の滑面部を形成し、 更なる切粉の発 生量を低減させるような場合であってもよい。  Next, FIG. 27 shows an external perspective view of the tray supply plate 6t. Figure 27 shows the connection of the four opposite ends (linearly formed ends) and partially arcuate ends along the plate removal direction C of the tray ring 59 of the tray supply plate 6 t shown in Fig. 27 In the portion (R), a corner portion of the lower surface end is cut off to form a smooth surface portion 59a constituted by a smooth curve. Since each of these connecting portions R is a contact portion with each set of grooves 250b of the magazine cassette 250, as shown in FIG. Even if the tray supply plate 6t moves forward and backward along the plate unloading direction C while being supported, friction between each smooth surface portion 59a and the groove portion 250b The force can be reduced. Therefore, when each tray supply plate 6 t is inserted into or taken out of the magazine cassette 250, the amount of chips and the like generated due to contact abrasion between the tray supply plate 6 t and each groove 250 b is reduced. Can be reduced. It should be noted that the formation of the smooth surface portion 59a in the tray supply plate 6t is effective when applied to the tray supply plate 6t having a feature that its weight is heavier than the wafer supply plate 6w. A certain force may be such that the respective smooth surface portions are formed on the wafer supply plate 6 w to further reduce the amount of chips generated.
また、 マガジンカセット 2 5 0の夫々の溝部 2 5 0 bにおいて、 図 2 9に示す ように、 夫々のプレート 6を支持するとともに、 そのプレート取出方向 C沿いの 移動を案内する回転部材の一例である複数のローラ部 2 5 0 gが備えられている ような場合であってもよい。 このような夫々のローラ部 2 5 0 gが備えられてい ることにより、 夫々のプレート 6と溝部 2 5 0 bとの間の接触による摩擦力を著 しく低減することができ、 上記接触による切粉等の発生を抑制することができる。 なお、 図 3 0に示すように、 このような夫々のローラ部 2 6 1 aは、 夫々のプレ ート 6が揷入配置されるプレート配置装置 2 1 2のプレート押圧体 2 6 1の下面 において、 夫々のプレート 6を支持するように備えられるような場合であっても よい。 このような場合にあっては、 マガジンカセット 2 5 0だけでなく、 プレー ト配置装置 1 2においても、 夫々のプレート 6の接触磨耗による切粉等の発生量 を低減させることが可能となる。 In addition, as shown in FIG. 29, each of the grooves 250 b of the magazine cassette 250 supports each of the plates 6, and is an example of a rotating member that guides the movement along the plate removing direction C. There may be a case where a plurality of roller portions 250 g are provided. The provision of the respective rollers 250 g makes it possible to significantly reduce the frictional force caused by the contact between the respective plates 6 and the grooves 250 b. The generation of chips and the like due to the contact can be suppressed. As shown in FIG. 30, each of the roller portions 26 1 a is formed on the lower surface of the plate pressing body 26 1 of the plate placing device 2 12 into which each plate 6 is inserted. In the above, a case may be employed in which each plate 6 is provided to support it. In such a case, not only the magazine cassette 250 but also the plate placement device 12 can reduce the amount of chips and the like caused by the contact wear of each plate 6.
ここで、 マガジンカセット 2 5 0の側壁部 2 5 0 aにおいて、 ァノレミニゥム製 のプレート 2 5 0 cに、 熱可塑性樹脂であるジユラコンを用いて夫々の溝部 2 5 O bが形成され、 トレイリング 5 9やウェハリング 9がステンレス材料により形 成されているような場合に代えて、 その他の材料により形成される場合について 説明する。  Here, in the side wall portion 250 a of the magazine cassette 250, each groove portion 25 Ob is formed on a plate 250 c made of Anoremini using a DURACON which is a thermoplastic resin, and the trailing portion 5 a is formed. The case where the wafer 9 and the wafer ring 9 are formed of other materials instead of the case where they are formed of a stainless material will be described.
上述のように、 夫々の溝部 2 5 0 bを樹脂で形成することにより、 夫々のプレ ート 6との接触による切粉等の発生量を低減させることができるが、 部品実装の 現場においては、 マガジンカセット 2 5 0の汎用性を考慮して、 マガジンカセッ ト 2 5 0をできるだけ標準仕様としたいという要望も多い。 このような場合にあ つては、 逆に、 マガジンカセット 2 5 0における夫々の溝部 2 5 0 bの形成材料 よりも、 夫々のプレート 6の形成材料を表面硬度を低くするように、 上記夫々の 形成材料の選定を行なうことで、 上記効果と同様な効果を得ることができる。 具体的には、 図 4 2のプレート、 例えば、 トレイ供給プレート 3 0 6 tの外観 斜視図に示すように、 トレイリング 3 5 9のプレート取出方向 C沿いの互いに対 向する端部 3 5 9 bを、 樹脂、 例えば P E E K樹脂にて形成する。 また、 図 4 2 におけるプレート取出方向 Cから見たマガジンカセットの夫々の溝部 3 5 O bに 支持された状態のトレイ供給プレート 3 0 6 tの側面図 （一部断面含む） に示す ように、 夫々の溝部 3 5 O bは、 アルミニウムで形成されている。 また、 図 4 3 に示すように、 トレイリング 3 5 9の本体部 3 5 9 aは、 例えば、 アルミェゥム 板で形成されており、 この本体部 3 5 9 aにおける夫々の端部が折り曲げられて 段部 3 5 9 cが形成され、 夫々の段部 3 5 9 cに P E E K樹脂にて形成された板 が例えばネジ止めにて取り付けられることにより、 夫々の端部 3 5 9 bが形成さ れている。 As described above, by forming each of the grooves 250b with resin, the amount of chips and the like generated due to contact with each of the plates 6 can be reduced, but in the field of component mounting, In view of the versatility of the magazine cassette 250, there are many requests to make the magazine cassette 250 as standard as possible. In such a case, conversely, each of the plates 6 is formed so as to have a lower surface hardness than the material of each groove 250b in the magazine cassette 250 so as to have a lower surface hardness. By selecting the forming material, the same effect as the above effect can be obtained. Specifically, as shown in the perspective view of the plate of FIG. 42, for example, the tray supply plate 360 t, the opposite ends 359 of the tray ring 359 along the plate removal direction C are shown. b is formed of a resin, for example, a PEEK resin. Further, as shown in the side view (including a partial cross section) of the tray supply plate 300 t supported by the respective grooves 35 Ob of the magazine cassette as viewed from the plate removal direction C in FIG. Each groove 35 Ob is formed of aluminum. Further, as shown in FIG. 43, the main body portion 359 a of the trailing portion 359 is formed of, for example, an aluminum plate, and each end portion of the main body portion 359 a is bent. A step portion 359c is formed, and a plate made of PEEK resin is attached to each step portion 359c, for example, by screwing, so that each end portion 359b is formed. Have been.
このようにトレイリング 3 5 9の端部 3 5 9 b及びマガジンカセットの夫々の 溝部 3 5 0 bが構成されることにより、 汎用性が求められるマガジンカセットを 特殊な仕様とすることなく、 互いの接触磨耗による切粉等の発生量を低減させる ことができる。 なお、 トレイリング 3 5 9の端部 3 5 9 bの表面、 あるいは、 マ ガジンカセットの夫々の溝部 3 5 0 bの表面において、 簡易的な表面処理を施す ような場合であってもよい。  By configuring the end portion 359b of the trailing 359 and the groove portion 350b of the magazine cassette in this manner, the magazine cassettes requiring versatility can be mutually connected without special specifications. It is possible to reduce the amount of chips and the like generated due to contact abrasion. A simple surface treatment may be applied to the surface of the end portion 359b of the trailing member 359 or the surface of each groove portion 350b of the magazine cassette.
次に、 本第 2実施形態の部品供給装置 2 0 4におけるトレイ供給プレート 6 t 力 のトレイ供給部品 2 tの飛び出し防止対策を実現する構成について説明する。 上記第 1実施形態においては詳細については説明しなかったが、 プレート配置 装置 2 1 2のプレート押圧体 2 6 1の下面には、 図 3 1の模式図に示すように、 プレート配置装置 2 1 2に供給されたプレート 6を、 その互いに対向する端部 夫々において支持する支持部材の一例である支持部 2 6 1 bが備えられている。 また、 これら夫々の支持部 2 6 1 bは、 プレート押圧体 2 6 1の下面とで互いに 対向する面が開放された凹部を構成しており、 この凹部内においてプレート 6の 端部を揷入して支持することが可能となっている。 また、 図 3 1に示すように、 上記凹部内にその端部が挿入して支持された状態のプレート 6が、 容易にスライ ド移動することができるように、 上記夫々の 部は、 プレート 6の厚みに対して 十分に余裕を持つように形成されている。  Next, a configuration for implementing a measure for preventing the tray supply component 2t with the force of the tray supply plate 6t from popping out in the component supply device 204 of the second embodiment will be described. Although the details have not been described in the first embodiment, the lower surface of the plate pressing body 26 1 of the plate disposing device 21 is provided with a plate disposing device 21 as shown in the schematic diagram of FIG. A support portion 261b, which is an example of a support member that supports the plate 6 supplied to the plate 2 at each of its opposite ends, is provided. Further, each of these support portions 26 1 b constitutes a concave portion in which the surfaces facing each other with the lower surface of the plate pressing body 26 1 are opened, and the end of the plate 6 is inserted in this concave portion. It is possible to support it. Further, as shown in FIG. 31, each of the above-mentioned parts is provided with a plate 6 so that the plate 6 whose end is inserted and supported in the recess can be easily slide-moved. It is formed so as to have a sufficient margin with respect to its thickness.
このような構成のプレート配置装置 2 1 2において、 後述する本第 2実施形態 の構成を有していない場合の動作及びその問題点について図 3 1〜図 3 4を用い て説明する。  The operation and problems of the plate arrangement device 212 having such a configuration in the case where the configuration of the second embodiment described later is not provided will be described with reference to FIGS. 31 to 34.
まず、 プレート配置装置 2 1 2に供給されたトレイ供給プレート 6 tは、 プレ 一ト押圧体 2 6 1の夫々の支持部 2 6 1 bにより支持された状態とされる。 この 状態においては、 トレイ供給プレート 6 tの端部の上面と、 夫々のプレート押圧 体 2 6 1の下面とは互いに接触されることなく、 隙間が確保された状態にある。 その後、 押圧体昇降部 6 2により夫々のプレート押圧体 2 6 1が下降されると、 トレイ供給プレート 6 tの端部下面が夫々のプレート支持部 6 0に当接されるこ ととなる。 さらに下降されることで、 図 3 2に示すように、 トレイ供給プレート 6 tの端部が夫々のプレート押圧体 2 6 1の下面と夫々のプレート支持部 6 0と で挟まれた状態で支持されることとなる。 なお、 このような状態においては、 ト レイ供給プレート 6 tの端部は夫々の支持部 2 6 1 bから浮き上げられた状態と なっている。 逆に、 このような状態から、 夫々のプレート押圧体 2 6 1を上昇さ せるような場合にあっては、 図 3 3に示すように、 トレイ供給プレート 6 tの下 面が夫々のプレート支持部 6 0より浮き上げられた状態とされる力 その際に、 上記夫々の凹部内において、 トレイ供給プレート 6 tが上下方向に振動すること となる。 このような場合にあっては、 図 3 3及び図 3 4に示すように、 当該振動 により部品供給トレイ 5 7より トレイ供給部品 2 tが飛び出してしまうという問 題が発生する場合がある。 このような場合にあっては、 円滑な部品供給が阻害さ れることとなる。 First, the tray supply plate 6t supplied to the plate placement device 2 12 is set in a state of being supported by the respective support portions 26 1 b of the plate pressing body 26 1. In this state, the upper surface of the end portion of the tray supply plate 6t and the lower surface of each plate pressing member 261 are in a state where a gap is secured without being in contact with each other. Thereafter, when the respective plate pressing members 26 1 are lowered by the pressing member lifting / lowering portions 62, the lower surfaces of the end portions of the tray supply plates 6 t come into contact with the respective plate supporting portions 60. By further lowering the tray supply plate as shown in Figure 32 The end of 6t is supported in a state of being sandwiched between the lower surface of each plate pressing member 261 and each plate support portion 60. Note that, in such a state, the end of the tray supply plate 6t is in a state of being lifted up from the respective support portions 261b. Conversely, when the respective plate pressing members 26 1 are raised from such a state, as shown in FIG. 33, the lower surface of the tray supply plate 6 t is supported by each plate. Force to be lifted from the part 60 At that time, the tray supply plate 6t vibrates in the vertical direction in each of the concave portions. In such a case, as shown in FIGS. 33 and 34, the vibration may cause a problem that the tray supply component 2t jumps out of the component supply tray 57. In such a case, smooth parts supply will be hindered.
このようなトレイ供給部品 2 tの飛び出し防止対策を達成する本第 2実施形態 における構成を以下に説明する。  A configuration in the second embodiment for achieving such a measure for preventing the tray supply component 2t from popping out will be described below.
図 3 5に示すように、 プレート配置装置 2 1 2における夫々のプレート押圧体 2 6 1には、 夫々の支持部 2 6 1 bにより支持された状態又は夫々のプレート支 持部 6 0により支持された状態のトレイ供給プレート 6 tを、 その上面から常に 下方に向けて押圧して、 夫々の支持部 2 6 1 b又はプレート支持部 6 0に付勢す る付勢部材の一例である付勢部 2 6 1 cが備えられている。 夫々の付勢部 2 6 1 cは、 夫々のプレート押圧体 2 6 1に 2個ずつ備えられている。  As shown in FIG. 35, each plate pressing body 261 of the plate placement device 2 12 is in a state of being supported by each support portion 26 1 b or supported by each plate support portion 60. Is an example of an urging member that urges the tray supply plate 6 t in the pressed state downward from the upper surface thereof to urge each of the support portions 26 1 b or the plate support portions 60. A power section 26 1 c is provided. Each of the urging portions 26 1 c is provided two in each of the plate pressing members 26 1.
ここで付勢部 2 6 1 cの拡大外観図を図 3 6に示す。 図 3 6に示すように、 付 勢部 2 6 1 cは、 トレイ供給プレート 6 tの上面に当接されるとともに、 プレー ト取出方向 Cに沿って回転可能な付勢ローラ部 2 6 2と、 この付勢ローラ部 2 6 2をその一端に回転可能に備える棒状部材であって、 その中間位置を支点として プレート 6と略直交する面内において回転可能に支持された回動部材 2 6 3と、 回動部材 2 6 3をプレート押圧体 2 6 1に固定するとともに、 上記中間位置を支 点として、 付勢ローラ部 2 6 2を常時下方に付勢されるように、 回動部材 2 6 3 を回動付勢する固定部材 2 6 4とを備えている。  Here, an enlarged external view of the biasing part 26 1 c is shown in FIG. As shown in FIG. 36, the urging portion 2 61 c is in contact with the upper surface of the tray supply plate 6 t, and the urging roller portion 26 2 is rotatable along the plate removal direction C. A rod member rotatably provided at one end thereof with the urging roller portion 26 2, the rotatable member 26 being rotatably supported in a plane substantially orthogonal to the plate 6 with an intermediate position as a fulcrum. The rotating member 2 63 is fixed to the plate pressing body 26 1, and the biasing roller portion 26 2 is constantly urged downward with the intermediate position as a fulcrum. 6 3 and a fixing member 2 6 4 for urging the rotation.
図 3 7及び図 3 8に示すように、 このような付勢部 2 6 1 cが備えられている ことにより、 夫々のプレート押圧体 2 6 1の昇降の位置に拘らず、 常に、 トレイ 供給プレート 6 tの端部下面を、 夫々の支持部 2 6 1 b又はプレート支持部 6 0 に当接されるように押圧付勢することができるため、 上記凹部内を振動により上 下動するようなことを、 確実に防止することができる。 従って、 プレート押圧体 2 6 1の昇降に伴うトレイ供給プレート 6 tの上記上下動を確実に防止すること ができ、 部品供給トレイ 5 7よりのトレイ供給部品 2 tの飛び出しの発生を確実 に防止することができる。 また、 付勢ローラ部 2 6 2を介して、 トレイ供給プレ ート 6 tの上面を下方に向けて押圧するように付勢した状態で、 付勢ローラ部 2 6 2がトレイ供給プレート 6 tの表面に沿って回転可能とされており、 さらに当 該回転の方向が、 プレート取出方向 C沿いであることにより、 プレート配置装置 2 1 2へのトレイ供給プレート 6 tの供給配置動作、 又はプレート配置装置 2 1As shown in FIG. 37 and FIG. 38, the provision of such a biasing portion 261 c ensures that the tray is always irrespective of the position where the respective plate pressing members 26 1 are moved up and down. Since the lower surface of the end portion of the supply plate 6t can be pressed and urged so as to be in contact with the respective support portion 26 1b or the plate support portion 60, the inside of the concave portion moves up and down by vibration. Such a situation can be reliably prevented. Therefore, the vertical movement of the tray supply plate 6 t accompanying the lifting and lowering of the plate pressing member 26 1 can be reliably prevented, and the occurrence of the tray supply component 2 t from the component supply tray 57 can be reliably prevented. can do. In addition, the urging roller unit 26 2 is urged so that the upper surface of the tray supply plate 6 t is pressed downward via the urging roller unit 26 2. The tray can be rotated along the surface of the tray, and the direction of the rotation is along the plate removal direction C. Placement device 2 1
2よりのトレイ供給プレート 6 tの取り出し動作の際に、 夫々の付勢ローラ部 2 6 2が上記夫々の動作を阻害しないようにされている。 なお、 上記においては、 夫々のプレート 6のうちの比較的その重量が重いという特徴を有するトレイ供給 プレート 6 tについて説明したが、 ウェハ供給プレート 6 wに対しても同様に適 用することができる。 なお、 付勢部 2 6 1 cの設置数は、 上記 4個の場合のみに 限られるものではなく、 平面を安定して支持するために、 3個以上設けることが 好ましい。 ただし、 付勢部における付勢部分の形状が、 例えば、 棒状あるいは U 字状等比較的大きな面積を有しているような場合にあっては、 1個又は 2個のみ が設置される場合でもよい。 When the tray supply plate 6t is taken out from the tray 2, the respective urging roller portions 262 do not hinder the respective operations. In the above description, the tray supply plate 6t having the characteristic that the weight is relatively heavy among the respective plates 6 has been described. However, the same can be applied to the wafer supply plate 6w. . Note that the number of the urging portions 261c is not limited to the above four, and it is preferable to provide three or more in order to stably support a flat surface. However, if the shape of the biasing part in the biasing part has a relatively large area, such as a bar or U-shape, even if only one or two are installed Good.
次に、 ウェハ供給プレート 6 wよりも、 その重量が比較的重いという特徴を有 するトレイ供給プレート 2 0 6 tを、 マガジンカセット 2 5 0より確実に引き出 すことができる構成について説明する。  Next, a description will be given of a configuration in which the tray supply plate 206 t having the characteristic that the weight is relatively heavier than the wafer supply plate 6 w can be reliably pulled out from the magazine cassette 250.
まず、 図 3 9にトレイ供給プレート 2 0 6 tの平面図を示し、 また、 このトレ ィ供給プレート 2 0 6 tを解除可能に保持するチャック部 2 4 1の平面図を図 4 0に、 図 4 0に示すチャック部 2 4 1の先端部における断面図を図 4 1に示す。 図 3 9に示すように、 トレイ供給プレート 2 0 6 tにおけるトレイリング 2 5 9 の図示上側の端部には、 上記第 1実施形態のトレイ供給プレート 6 tとは異なり、 細長い長孔部 2 9 1 (係合部の一例である） がさらに形成されている。 また、 図 4 0及び図 4 1に示すように、 チャック部 2 4 1の先端部には、 この長孔部 2 9. 1と係合可能な突起部 2 4 1 cが形成されている。 なお、 チャック部 2 4 1の両 側には、 上記第 1実施形態と同様に、 プレート有無検出センサ 2 4 1 aとプレー ト識別センサ 2 4 1 bとが備えられている。 First, FIG. 39 shows a plan view of the tray supply plate 206 t, and FIG. 40 shows a plan view of the chuck portion 241 for holding the tray supply plate 206 t releasably. FIG. 41 is a cross-sectional view of the tip portion of the chuck portion 241 shown in FIG. As shown in FIG. 39, unlike the tray supply plate 6 t of the first embodiment, an elongated slot 2 is provided at the upper end of the tray ring 255 in the tray supply plate 206 t. 9 1 (which is an example of an engaging portion) is further formed. In addition, as shown in FIGS. 40 and 41, at the tip of the chuck portion 241, the elongated hole portion 29. A projection 241c that can be engaged with 1 is formed. In addition, on both sides of the chuck portion 241, a plate presence / absence detection sensor 241 a and a plate identification sensor 241 b are provided as in the first embodiment.
このようにトレイ供給プレート 2 0 6 tのチャック部 2 4 1による保持位置に おいて、 長孔部 2 9 1が形成され、 かつ、 この長孔部 2 9 1がチャック部 2 4 1 の先端に形成された突起部 2 4 1 cと係合された状態で、 チャック部 2 4 1によ りトレイ供給プレート 2 0 6 tを保持することが可能とされていることにより、 その重量が比較的重いという特徴を有するトレイ供給プレート 2 0 6 tを確実に 保持することが可能となる。  In this manner, at the holding position of the tray supply plate 206 t by the chuck portion 241, the long hole portion 291 is formed, and the long hole portion 291 is formed at the tip of the chuck portion 241. The weight of the tray supply plate 206 t can be held by the chuck part 241 in a state where it is engaged with the projection part 241 c formed on the This makes it possible to reliably hold the tray supply plate 206 t having the characteristic of heavy weight.
また、 このようなチャック部 2 4 1の突起部 2 4 1 cに併せて、 ウェハ供給プ レート 6 wにも長孔部 2 9 1を形成することで、 ウェハ供給プレート 6 wをも確 実に保持することができる。 また、 このチャック部 2 4 1の突起部は、 ウェハ供 給プレート 6 wの上面に当接する側にのみ形成されていることより、 当該係合の 際に、 ウェハシート 7を損傷させることもない。  In addition, by forming a long hole portion 291 in the wafer supply plate 6 w in addition to such a projection portion 241 c of the chuck portion 241, the wafer supply plate 6 w is also reliably formed. Can be held. In addition, since the protrusion of the chuck portion 241 is formed only on the side that comes into contact with the upper surface of the wafer supply plate 6 w, the engagement does not damage the wafer sheet 7. .
なお、 図 3 7に示すように、 トレイ供給プレート 2 0 6 tにおいて、 複数の孔 2 9 2を形成することで、 トレイ供給プレート 2 0 6 tの軽量化を図ることもで さる。  As shown in FIG. 37, by forming a plurality of holes 292 in the tray supply plate 206 t, the weight of the tray supply plate 206 t can be reduced.
上記第 2実施形態によれば、 ウェハ供給プレート 6 wよりも、 その重量が重い という特徴を有するトレイ供給プレート 6 tを、 マガジンカセット 2 5 0に挿入 して収納させる場合、 あるいはマガジンカセット 2 5 0から取出すような場合で あっても、 夫々の溝部 2 5 O bとプレート 6とが接触移動されても、 その摺動磨 耗による切粉の発生量を著しく低減させることができる。  According to the second embodiment, when the tray supply plate 6 t having the characteristic that the weight is heavier than the wafer supply plate 6 w is inserted into the magazine cassette 250 and stored, or Even when the groove 25 is taken out from 0 or when the respective groove portions 25Ob and the plate 6 are moved in contact with each other, the amount of chips generated due to sliding wear can be significantly reduced.
また、 トレイ供給プレート 6- は、 ウェハ供給プレート 6 wと異なり、 多数の 種類の部品を 1枚のトレイ供給プレート 6 tに混載して収納可能な構成とされて いるため、 ある種類の部品の取出しが完了する度に、 当該トレィ供給プレート 6 tをマガジンカセット 2 5 0に収納し、 その後、 収納されたトレイ供給プレート 6 tから異なる部品を取り出す場合には、 マガジンカセット 2 5 0から再び取り 出すというように、 マガジンカセット 2 5 0に対する出し入れの頻度が多いとい う特徴も備えている。 このように出し入れの頻度が多いような場合であっても、 上記切粉の発生抑制対策が施されているため、 当該切粉発生による駆動トラブル の発生ゃメンテナンス性の低下等の併発を防止することができ、 ウェハ供給プレ ート 6 wとトレイ供給プレート 6 tとが混載された部品供給装置において、 メン テナンス性の向上を図り、 効率的な部品供給を実現することができる。 Also, unlike the wafer supply plate 6w, the tray supply plate 6- has a configuration in which many types of components can be mixed and stored in one tray supply plate 6t, Each time the unloading is completed, the tray supply plate 6t is stored in the magazine cassette 250, and when a different part is to be removed from the stored tray supply plate 6t, the tray supply plate 6t is removed again from the magazine cassette 250. It also has the feature that the frequency of loading and unloading to and from the magazine cassette 250 is high. Even in such a case where the frequency of in and out is high, Since the above-mentioned countermeasures against chip generation have been taken, it is possible to prevent the occurrence of drive troubles due to the generation of the chips, and to prevent concurrent reductions in maintenance, etc., and the wafer supply plate 6 w In a component supply device in which t is mixed, it is possible to improve maintainability and realize efficient component supply.
また、 夫々のプレート押圧体 2 6 1の昇降動作に伴ってトレイ供給プレート 6 tに発生する振動を、 夫々のプレート押圧体に 2 6 1に付勢部 2 6 1 cを備えさ せることで、 確実に防止することができ、 部品供給トレィ 5 7よりのトレイ供給 部品 2 tの飛び出しを確実に防止することができ、 ウェハ供給プレートとトレイ 供給プレートとを混載して供給することの弊害を防止することができ、 効率的な 部品供給を実現することができる。  In addition, the vibration generated in the tray supply plate 6t due to the lifting and lowering operation of the respective plate pressing members 261, is provided by providing the plate pressing members 261 with the urging portions 2661c in the respective plate pressing members. Can reliably prevent the tray supply component 2t from the component supply tray 57 from jumping out, and prevent the adverse effects of mixing and supplying the wafer supply plate and the tray supply plate. It is possible to realize efficient parts supply.
また、 トレイ供給プレート 2 0 6 tに、 チャック部 2 4 1の突起部 2 4 1 cと 係合可能な長孔部 2 9 1を形成することにより、 両者を互いに係合させながらチ ャック部 2 4 1により トレイ供給プレート 2 0 6 tの保持を行なうことができ、 比較的その重量が重いという特徴を有するトレイ供給プレート 2 0 6 tを確実か つ安定して保持することができる。  In addition, by forming a long hole portion 291, which can be engaged with the projection portion 2441c of the chuck portion 241, on the tray supply plate 206t, the chuck portion can be engaged with each other while being engaged with each other. By means of 241, the tray supply plate 206t can be held, and the tray supply plate 206t characterized by its relatively heavy weight can be reliably and stably held.
(第 3実施形態）  (Third embodiment)
次に、 本発明の第 3の実施形態にかかる部品供給装置について、 以下に説明す る。 本第 3実施形態の部品供給装置は、 上記第 1実施形態の部品供給装置 4と、 以下に示す部分的な構成が異なるものの、 その基本的な構成は共通しているため、 以降の説明の理解を容易なものとすることを目的として、 上記第 1実施形態の部 品供給装置 4と同様な構成部分には、 同じ参照番号を付している。  Next, a component supply device according to a third embodiment of the present invention will be described below. The component supply device of the third embodiment differs from the component supply device 4 of the first embodiment in the following partial configuration, but has the same basic configuration. For the purpose of facilitating understanding, the same reference numerals are given to the same components as those of the component supply device 4 of the first embodiment.
本第 3実施形態の部品供給装置についての説明を行なうに先だって、 上記第 1 実施形態の部品供給装置 4にて、 夫々のプレート 6へのランダムアクセスを行な う場合に生じる可能性があるいくつかの問題点について説明する。  Prior to describing the component supply device of the third embodiment, there are several possibilities that may occur when performing random access to each plate 6 in the component supply device 4 of the first embodiment. The problem will be described.
まず、 図 2の部品供給装置 4の斜視図に示すように、 マガジンカセット 5 0に 収納されている夫々のプレート 6を、 プレート移動装置 4 0により保持しながら 取出して移動させ、 プレート配置装置 1 2に配置させる際において、 例えば、 プ レート 6が大略円盤状の形状を有していることにより、 図 4 4の模式図に示すよ うに、 マガジンカセット 5 0内において、 プレート 6力 プレート取出方向 Cに 対して水平方向に傾斜した姿勢で収容されている場合があり、 このような場合に あっては、 プレート 6の周部とマガジンカセット 5 0の溝部との接触 （あるいは 衝突） が発生し、 プレート 6のガタツキが発生する場合がある。 特に、 プレート 6が、 その上面に複数のトレイ供給部品 2 tを載置するようなトレイ供給プレー ト 6 tであるような場合にあっては、 上記ガタツキの発生により、 上記載置され ている夫々のトレイ供給部品 2 tがトレイ供給プレート 6 tから飛び散る場合が める。 First, as shown in the perspective view of the component supply device 4 in FIG. 2, each plate 6 stored in the magazine cassette 50 is taken out and moved while being held by the plate moving device 40, and the plate placement device 1 is moved. For example, when the plate 6 is disposed in the magazine cassette 50, the plate 6 has a force as shown in the schematic view of FIG. 44 because the plate 6 has a substantially disk shape. C The magazine may be housed in a posture inclined horizontally, and in such a case, contact (or collision) between the periphery of the plate 6 and the groove of the magazine cassette 50 occurs, and 6 rattling may occur. In particular, when the plate 6 is a tray supply plate 6 t on which a plurality of tray supply parts 2 t are placed on the upper surface, the plate 6 is placed above due to the occurrence of rattling. In some cases, each tray supply part 2 t scatters from the tray supply plate 6 t.
また、 マガジンカセット 5 0に収容されている複数のプレート 6へのランダム アクセスを部品実装に対して、 より効果的なものとするため、 マガジンカセット 5 0には、 夫々の溝部 5 0 bの間隔の狭ピツチ化を行ない、 溝部 5 0 bの形成数 量の増大化を図って、 より多数のプレート 6の収納を可能としている。 し力 しな がら、 このような夫々の溝部 5 0 bの間隔の狭ピッチィ匕は、 作業者によるマガジ ンカセット 5 0への夫々のプレート 6の収容の際に、 図 4 5の模式説明図に示す ように、 互いに対向する溝部 5 0 bへのプレート 6の支持収容を困難なものとし、 マガジンカセット 5 0において、 プレート 6を水平な支持姿勢で収容させること が困難 （すなわち、 斜め入れ状態） となる場合がある。 このような場合にあって は、 マガジンカセット 5 0よりの当該プレート 6の取出し作業に障害が生じるこ ととなる。  In addition, in order to make random access to the plurality of plates 6 housed in the magazine cassette 50 more effective for component mounting, the magazine cassette 50 has an interval of each groove 50 b. By making the pitch narrower, the number of grooves 50b formed can be increased, and a larger number of plates 6 can be stored. While the force is being applied, such a narrow pitching of the gaps between the respective groove portions 50b is caused by the worker's accommodation of the respective plates 6 in the magazine cassette 50, as shown in FIG. As shown in the figure, it is difficult to support and accommodate the plate 6 in the grooves 50b facing each other, and it is difficult to accommodate the plate 6 in the magazine cassette 50 in a horizontal supporting posture (that is, in the obliquely inserted state). ). In such a case, there is a problem in taking out the plate 6 from the magazine cassette 50.
従って、 本第 3実施形態においては、 このようなマガジンカセット 5 0への 夫々のプレート 6の収容姿勢に起因する諸問題点を解決し、 マガジンカセット 5 0よりの夫々のプレート 6の取出しを円滑に行なうことができ、 ランダムァクセ スをさらに効果的なものとする工夫について説明する。  Therefore, in the third embodiment, it is possible to solve the various problems caused by the storage posture of each plate 6 in the magazine cassette 50 and to smoothly take out each plate 6 from the magazine cassette 50. The following describes how to make random access more effective.
本第 3実施形態にかかる部品供給装置が備えるマガジンカセット 4 5 0をプレ 一ト取出方向 Cを正面側として、 当該正面側より見たマガジンカセット 4 5 0の 模式説明図を図 4 6に示す。  FIG. 46 is a schematic explanatory view of the magazine cassette 450 viewed from the front side with the magazine cassette 450 provided in the component supply device according to the third embodiment as the front side with the plate removal direction C as the front side. .
図 4 6に示すように、 マガジンカセット 4 5 0における夫々の側壁部 4 5 0 a の内側には、 互いに対向して配置された多数の溝部 4 5 0 bが形成されており、. 互いに対向する夫々の組の溝部 4 5 0 bにプレート 6の夫々の端部が支持される ことで、 略水平な姿勢を保ちながら当該プレート 6を収容することが可能となつ ている。 さらに、 マガジンカセット 4 5 0における図示奥側にも奥側壁部 4 5 0 cが設けられており、 この奥側壁部 4 5 0 cには、 プレート 6の端部と係合され ることにより、 プレート 6の水平姿勢と、 プレート取出方向 Cに対する水平方向 の姿勢とを正常な姿勢に保つことを可能とする姿勢ガイド部 4 9 0が備えられて いる。 As shown in FIG. 46, a number of grooves 450 b arranged opposite to each other are formed inside each side wall 450 a of the magazine cassette 450. The respective ends of the plate 6 are supported by the grooves 450 b of each set, so that the plate 6 can be accommodated while maintaining a substantially horizontal posture. ing. Further, a rear side wall portion 450 c is also provided on the rear side in the drawing of the magazine cassette 450, and the rear side wall portion 450 c is engaged with an end of the plate 6, A posture guide section 490 is provided to enable the horizontal posture of the plate 6 and the horizontal posture with respect to the plate unloading direction C to be maintained in a normal posture.
さらに具体的に説明すると、 上記第 1実施形態においては詳細には説明しなか つたが、 図 5に示すように、 トレイ供給プレート 6 tにおけるプレート取出方向 Cと逆側の端部 （すなわち、 トレイリング 5 9の端部） の下面には、 姿勢ガイド 部 4 9 0と係合可能な姿勢ガイドプロック 5 9 aが形成されている。  More specifically, although not described in detail in the first embodiment, as shown in FIG. 5, the end of the tray supply plate 6t on the opposite side to the plate removal direction C (that is, the tray At the lower surface of the ring 59), a posture guide block 59a that can be engaged with the posture guide portion 49 is formed.
ここで、 このトレイ供給プレート 6 tに備えられた姿勢ガイドプロック 5 9 a と、 マガジンカセット 4 5 0の奥側壁部 4 5 0 cに備えられた姿勢ガイド部 4 9 0との互いの係合状態の拡大平面図を図 4 7に示す。 また、 マガジンカセット 4 5 0における図 4 6と同じ向きの詳細な正面図を図 4 8に示し、 図 4 8のマガジ ンカセット 4 5 0における V— V矢視断面図を図 4 9に示す。  Here, the mutual engagement between the attitude guide block 59 a provided on the tray supply plate 6 t and the attitude guide section 49 0 provided on the rear side wall 45 0 c of the magazine cassette 450. Fig. 47 shows an enlarged plan view of this state. Further, FIG. 48 shows a detailed front view of the magazine cassette 450 in the same direction as FIG. 46, and FIG. 49 shows a cross-sectional view of the magazine cassette 450 in FIG. .
図 4 8及ぴ図 4 9に示すように、 マガジンカセット 4 5 0の奥側壁面 4 5 0 c の略中央付近には、 夫々の溝部 4 5 0 bの形成間隔ピッチと同じ間隔ピッチにて、 複数の姿勢ガイド部 4 9 0力 上下方向に一列に配列されて備えられている。 ま た、 図 4 7に示すように、 姿勢ガイド部 4 9 0は、 折り曲げられた状態の 2つの ピン状部材 4 9 1力 互いに対向しかつ所定の間隔が保たれるように、 例えば、 奥側壁面 4 5 0 cにネジ止め等により取り付けられることにより形成されている。 また、 上記夫々のピン状部材 4 9 1の上記所定の間隔は、 奥側壁部 4 5 0 cの近 傍において、 トレイ供給プレート 6 tの姿勢ガイドブロック 5 9 aの形成幅と略 同じ寸法とされており、 奥側壁部 4 5 0 cから離れるに従って、 上記間隔が広く なるように形成されている。  As shown in FIG. 48 and FIG. 49, near the center of the rear side wall surface 450 c of the magazine cassette 450, at the same pitch as the formation pitch of the respective groove portions 450 b. The plurality of posture guide portions 490 are arranged in a line in the vertical direction. Further, as shown in FIG. 47, the posture guide portion 490 is arranged so that the two pin-shaped members 490 in the bent state face each other and are spaced apart from each other by a predetermined distance, for example, It is formed by being attached to the side wall surface 450c by screwing or the like. The predetermined interval between the respective pin-shaped members 491 is approximately the same as the formation width of the attitude guide block 59a of the tray supply plate 6t near the rear side wall portion 450c. It is formed so that the above-mentioned interval becomes wider as the distance from the inner side wall portion 450c increases.
このようにマガジンカセット 4 5 0において夫々の姿勢ガイド部 4 9 0が備え られ、 夫々のトレイ供給プレート 6 tに姿勢ガイドプロック 5 9 aが備えられて いることにより、 マガジンカセット 4 5 0の互いに対向する組の溝部 4 5 0 bに、 その互いに対向する端部が支持された状態のトレイ供給プレート 6 tを、 さらに、 図 4 7に示すように、 姿勢ガイドプロック 5 9 aと姿勢ガイド部 4 9 0とを係合 させることで、 トレイ供給プレート 6 tをプレート取出方向 Cに対して水平方向 に正常な姿勢に保つことができ、 さらに、 夫々の溝部 4 5 0 bによる支持姿勢を 水平な姿勢に保つことができる。 特に、 姿勢ガイド部 4 9 0における夫々のピン 状部材 4 9 1の間隔が、 図 4 7に示すようにテーパ状に形成されていることによ り、 姿勢ガイドブロック 5 9 aと姿勢ガイド部 4 9 0との係合を容易なものとす ることができるとともに、 プレート取出方向 Cに対して水平方向に傾斜されたト レイ供給プレート 6 tの姿勢を、 この係合過程において補正しながら係合するこ とが可能となる。 As described above, each of the magazine cassettes 450 is provided with the respective attitude guide portions 490, and each of the tray supply plates 6t is provided with the attitude guide block 59a. The tray supply plate 6t whose opposite ends are supported by the pair of groove portions 450b of the opposing pair, and the posture guide block 59a and the posture guide portion as shown in FIG. 47. Engage with 490 By doing so, the tray supply plate 6t can be maintained in a normal posture in the horizontal direction with respect to the plate unloading direction C, and the support posture of each groove 450b can be maintained in a horizontal posture. . Particularly, since the distance between the respective pin-shaped members 491 in the posture guide portion 49 0 is tapered as shown in FIG. 47, the posture guide block 59 a and the posture guide portion The engagement with the 490 can be facilitated, and the posture of the tray supply plate 6t, which is inclined in the horizontal direction with respect to the plate unloading direction C, is corrected in this engagement process. It becomes possible to engage.
このようにマガジンカセット 4 5 0に収容された夫々のプレート 6の支持姿勢 が正常な状態に保たれていることにより、 図 5 0の模式図に示すように、 マガジ ンカセット 4 5 0よりの夫々のプレート 6の取出しを円滑に行なうことができ、 トレイ供給プレート 6 tからの部品 2の飛び出しが発生することも防止すること ができる。 従って、 マガジンカセット 4 5 0に収容されている夫々のプレート 6 へのランダムアクセスを効率的に行なうことができ、 効率的な部品供給を実現す ることができる。  Since the support posture of each plate 6 accommodated in the magazine cassette 450 is maintained in a normal state in this way, as shown in the schematic diagram of FIG. Each of the plates 6 can be taken out smoothly, and it is possible to prevent the parts 2 from jumping out of the tray supply plate 6t. Therefore, random access to each plate 6 accommodated in the magazine cassette 450 can be efficiently performed, and efficient component supply can be realized.
なお、 上記説明においては、 プレート 6力 Sトレイ供給プレート 6 tである場合 について代表して説明したが、 ウェハ供給プレート 6 wについても同様な構成を 採ることができる。  In the above description, the case where the plate 6 is the S-tray supply plate 6 t is described as a representative, but the same configuration can be adopted for the wafer supply plate 6 w.
また、 このようなウェハ供給プレート 6 wゃトレイ供給プレート 6 tが収容さ れるマガジンカセット 4 5 0においては、 マガジンカセット 4 5 0の帯電による 夫々の部品 2への影響が懸念されることが考えられる。 例えば、 その帯電量は、 通常 4 0 0 V〜6 0 0 V程度となる。 また、 図 5 6に示すように、 マガジンカセ ット 4 5 0の底部には、 マガジンカセット 4 5 0と基台 5 2とを連結 （固定） す るための連結ブロック 4 7 1 (固定部の一例である） 1 例えば 3個備えられて いる。 このような帯電による部品への影響を防止するために、 例えば、 3個の連 結プロック 4 7 1のうちの少なくとも 1つの連結プロック 4 7 1を、 導電性材料 にて形成することで、 接地端子部としての機能を備えさせてマガジンカセット 4 5 0を接地することができ、 その帯電量を数 V程度、 例えば 2 V程度にまで低減 することができる。 上記説明においては、 マガジンカセット 4 5 0の奥側壁面 4 5 0 cに、 姿勢ガ ィド部 4 9 0が形成されるような場合について説明したが、 本第 3実施形態はこ のような場合にのみ限定されるものではない。 このような場合に代えて、 上述の 姿勢ガイド部 4 9 0の装備による効果を得ながら、 さらに作業性を改善すること ができるマガジンカセットについて、 本第 4実施形態の変形例として以下に説明 する。 In addition, in the magazine cassette 450 in which the wafer supply plate 6w and the tray supply plate 6t are accommodated, there is a possibility that the charging of the magazine cassette 450 may affect the respective components 2. Can be For example, the charge amount is usually about 400 V to 600 V. As shown in FIG. 56, a connection block 4 71 (fixed portion) for connecting (fixing) the magazine cassette 450 and the base 52 to the bottom of the magazine cassette 450 is provided. 1) For example, three are provided. In order to prevent the influence of such electrification on the parts, for example, by forming at least one of the three connection blocks 471 1 from a conductive material, grounding is performed. The magazine cassette 450 can be grounded by providing a function as a terminal portion, and the charge amount can be reduced to about several V, for example, about 2 V. In the above description, the case where the attitude guide portion 490 is formed on the rear side wall surface 450 c of the magazine cassette 450 has been described, but the third embodiment is such a case. It is not limited only to the case. In place of such a case, a magazine cassette which can further improve the workability while obtaining the effect of the above-described posture guide unit 490 will be described below as a modification of the fourth embodiment. .
多数のプレート 6を収容するマガジンカセットが用いられる部品供給装置や部 品実装装置においては、 マガジンカセット内に収容されている夫々のプレート 6 の交換や補給作業等を行なうことが必要となる。 従って、 効率的な部品実装や部 品供給にあっては、 このようなマガジンカセットに対するプレート 6の交換作業 における作業性を良好なものとすることが求められる。  In a component supply device or a component mounting device using a magazine cassette accommodating a large number of plates 6, it is necessary to exchange or replenish the respective plates 6 accommodated in the magazine cassette. Therefore, for efficient component mounting and component supply, it is required to improve workability in such a work of replacing the plate 6 with the magazine cassette.
し力 しながら、 図 5 1の模式図に示すようなマガジンカセット 5 0 0において は、 マガジンカセット 5 0 0のプレート取出方向 Cから見て、 奥側壁面 5 O O c がマガジンカセット 5 0 0の本体に固定されており、 夫々のプレート 6の交換等 のためには、 マガジンカセット 5 0 0をカセット昇降部 5 1により所定の場所に 位置させて、 基台 5 2よりマガジンカセット 5 0 0を取り外して、 マガジンカセ ット 5 0 0におけるプレート取出方向 C側の開口部より夫々のプレート 6の交換 作業等を行なう必要がある。 また、 このようなマガジンカセットは、 その重量も 総じて大きなものとなり、 例えば、 2 0〜3 0 k g程度の重量となるため、 この ような作業者によるマガジンカセット 5 0 0の脱着作業は、 作業効率の向上を阻 害する要因となる。 また、 マガジンカセット 5 0 0を取り外すことは、 部品供給 装置の稼動を停止させることにもなり、 このような観点からも、 作業効率の向上 が望まれている。 本変形例は、 このようなランダムアクセスにおける諸問題を解 決して、 さらなる作業効率の向上を実現することを目的としている。  However, in the magazine cassette 500 as shown in the schematic diagram of FIG. 51, when viewed from the plate removing direction C of the magazine cassette 500, the rear side wall surface 5OO c is formed by the magazine cassette 500. The magazine cassette 500 is fixed to the main body, and in order to exchange each plate 6, the magazine cassette 500 is positioned at a predetermined position by the cassette elevating unit 51, and the magazine cassette 500 is moved from the base 52. It is necessary to remove and exchange each plate 6 from the opening of the magazine cassette 500 in the plate removal direction C side. In addition, such magazine cassettes generally have a large weight, for example, a weight of about 20 to 30 kg. It is a factor that hinders the improvement of quality. In addition, removing the magazine cassette 500 also stops the operation of the component supply device, and from such a viewpoint, improvement in working efficiency is desired. The purpose of this modification is to solve such problems in random access and to achieve further improvement in work efficiency.
まず、 本変形例にかかるマガジンカセット 5 5 0の模式的な ^)·視図を図 5 2に 示し、 さらに、 このマガジンカセット 5 5 0の断面図的な模式説明図を図 5 3に 示す。  First, a schematic ^) view of the magazine cassette 550 according to the present modification is shown in FIG. 52, and a schematic explanatory view of a cross-sectional view of the magazine cassette 550 is shown in FIG. .
図 5 2及ぴ図 5 3に示すように、 マガジンカセット 5 5 0においては、 プレー ト取出方向 Cに対して奥側壁面が、 開閉可能な扉部の一例である開閉カバー部 5 5 0 cとなっている点において、 上記第 3実施形態のマガジンカセット 4 5 0と 異なる構成を有している。 また、 この開閉カバー部 5 5 0 cの内側には、 上記マ ガジンカセット 4 5 0の奥側壁面 4 5 0 cと同様に、 夫々のプレート 6の支持姿 勢を正常な姿勢に保っための姿勢ガイド部 5 9 0が備えられている。 As shown in FIG. 52 and FIG. 53, in the magazine cassette 550, an opening / closing cover portion 5 which is an example of a door portion that can be opened and closed with respect to the plate removing direction C is provided. It has a configuration different from that of the magazine cassette 450 of the third embodiment in that it is set to 50c. Also, inside the opening / closing cover 550c, like the rear side wall surface 450c of the magazine cassette 450, the support posture of each plate 6 is maintained in a normal posture. An attitude guide section 590 is provided.
このように開閉カバー部 5 5 0 cが設けられていることにより、 マガジンカセ ット 5 5 0を基台 5 2力 ら取り外すことなく、 開閉カバー部 5 5 0 cを開放させ ることで、 夫々のプレート 6の交換作業を行なうことが可能となる。 従って、 こ のような交換作業における作業性を著しく向上させることができる。 また、 開閉 カバー部 5 5 0 cに夫々の姿勢ガイド部 5 9 0が備えられていることにより、 マ ガジンカセット 5 5 0内に夫々のプレート 6を収容した後、 開閉カバー部 5 5 0 cを閉止することで、 夫々のプレート 6の姿勢ガイドブロックと開閉カバー部 5 5 0 cの姿勢ガイド部 5 9 0とを係合させることができ、 当該係合により夫々の プレート 6の姿勢を正常に保つことができる。  By providing the opening / closing cover section 550c in this manner, by opening the opening / closing cover section 550c without removing the magazine cassette 550 from the base 52, Each plate 6 can be replaced. Therefore, workability in such replacement work can be significantly improved. In addition, since the opening / closing cover section 550c is provided with the respective attitude guide sections 590, after the respective plates 6 are stored in the magazine cassette 550, the opening / closing cover section 550c is provided. By closing, the posture guide block of each plate 6 and the posture guide portion 590 of the opening / closing cover 550c can be engaged, and the posture of each plate 6 is normal by the engagement. Can be kept.
また、 マガジンカセット 5 5 0内にプレート 6が水平状態ではなく傾斜された 姿勢で収容された場合には、 姿勢ガイドブロックと姿勢ガイド部 5 9 0とが互い に係合することができず、 開閉カバー部 5 5 0 cを完全に閉止することができな いこととなる。 このような特徴を利用して、 作業者がマガジンカセット 5 5 0に おいて、 夫々のプレート 6の交換作業を終えた後、 開閉カバー部 5 5 0 cを閉止 する際に、 完全に閉止されたかどうかを確認することにより、 夫々のプレート 6 が正常な姿勢で収容されたかどうかを判断することが可能となる。 ' なお、 このように作業者が目視で開閉カバー部 5 5 0 cの開閉状態を確認する ような場合に代えて、 開閉カバー部 5 5 0 cに開閉状態を検出可能な開閉検出セ ンサ 5 8 0を備えさせるような場合であってもよい。 例えば、 図 5 2及び図 5 3 に示すように、 開閉カバー部 5 5 0 cに開閉検出センサ 5 8 0の被検出部 5 8 0 aを備えさせ、 開閉カバー部 5 5 0 cが閉止した際に、 この被検出部 5 8 0 aを 検出可能に、 マガジンカセット 5 5 0の本体側に検出部 5 8 0 bを備えさせるよ うにすることができる。  Further, when the plate 6 is accommodated in the magazine cassette 550 in an inclined posture instead of a horizontal state, the posture guide block and the posture guide portion 590 cannot engage with each other, As a result, the opening / closing cover 550c cannot be completely closed. Utilizing such a feature, when the operator closes the opening / closing cover 550c after completing the work of replacing each plate 6 in the magazine cassette 550, it is completely closed. It is possible to determine whether or not each plate 6 is stored in a normal posture by checking whether or not the plates 6 are accommodated. 'Instead of such a case where the operator visually checks the open / closed state of the open / close cover 550 c, an open / close detection sensor 5 capable of detecting the open / closed state of the open / close cover 550 c is used. 80 may be provided. For example, as shown in FIGS. 52 and 53, the open / close cover 550 c is provided with the detected part 580 a of the open / close detection sensor 580, and the open / close cover 550 c is closed. At this time, the detection section 580b can be provided on the main body side of the magazine cassette 550 so that the detection section 580a can be detected.
このように制御的に開閉を検出することで、 作業者の視認ミス等を防止するこ とができ、 確実な検出を行なうことができるとともに、 例えば、 この開閉検出セ ンサ 5 8 0による開閉カバー部 5 5 0 cの閉止を検出して初めて、 部品供給装置 を稼動させるというインター口ック回路を設けることもできる。 By detecting the opening and closing in a controlled manner in this way, it is possible to prevent a worker from visually recognizing errors and the like, and to perform a reliable detection. It is also possible to provide an interlock circuit that activates the component supply device only after detecting the closing of the open / close cover 550 c by the sensor 580.
また、 図 5 3に示すように、 カセット昇降部 5 1によりマガジンカセット 5 5 0が収納されている夫々のプレート 6を交換可能な位置、 例えば原点位置に位置 された状態において、 プレート移動装置 4 0によりマガジンカセット 5 5 0との 間でプレート 6の出し入れが可能なプレート収容部 5 7 0が、 マガジンカセット 5 5 0の下部に設けられている。 このプレート収容部 5 7 0には、 例えば、 1枚 のプレート 6のみが収容可能となっており、 上記原点位置に位置された状態のマ ガジンカセット 5 5 0に対して、 夫々のプレート 6の交換作業中であっても、 プ レート収容部 5 7 0に収容されたプレート 6を、 プレート移動装置 4 0により取 出して、 部品 2の供給を行なうこと、 及び、 部品 2の供給が行われたプレート 6 をプレート収容部 5 7 0に収容させることが可能となっている。  Further, as shown in FIG. 53, the plate moving device 4 is placed at a position where the respective plates 6 storing the magazine cassettes 55 can be exchanged by the cassette elevating unit 51, for example, at the origin position. A plate accommodating section 570 is provided at the lower portion of the magazine cassette 550 so that the plate 6 can be inserted into and taken out of the magazine cassette 550 by the number 0. For example, only one plate 6 can be accommodated in the plate accommodating section 570, and each of the plate cassettes 5 Even during the replacement work, the plate 6 accommodated in the plate accommodating section 570 is taken out by the plate moving device 40 to supply the component 2, and the component 2 is supplied. The plate 6 can be accommodated in the plate accommodating section 570.
このようなプレート収容部 5 7 0がマガジンカセット 5 5 0に備えられている ことにより、 マガジンカセット 5 5 0の収容されている夫々のプレート 6の交換 作業を行なっている間であっても、 プレート収容部 5 7 0に収容されたプレート 6を用いて、 部品供給を継続して行なうことができ、 効率的な部品供給を行なう ことができる。  Since such a plate storage section 570 is provided in the magazine cassette 550, even during the replacement work of the respective plates 6 in which the magazine cassette 550 is stored, By using the plate 6 housed in the plate housing section 570, component supply can be continuously performed, and efficient component supply can be performed.
また、 図 5 4 A、 図 5 4 Bは、 マガジンカセット 5 5 0の本体部における開閉 カバー部 5 5 0 cの開口端部における夫々の側壁部 5 5 0 aの部分拡大図 （左側、 右側） であるが、 これらに示すように、 マガジンカセット 5 5 0の内部に備えら れている夫々の溝部 5 5 0 bにおける互いに対向する組ごとに、 例えば段番号を 表示することもできる。 このような場合にあっては、 マガジンカセット 5 5 0内 に作業者が夫々のプレート 6を収容する場合に、 左右の溝部 5 5 0 bの段数を間 違うことを防止することができる。  FIGS. 54A and 54B are partially enlarged views of the respective side walls 550a at the opening end of the opening / closing cover 550c of the main body of the magazine cassette 550 (left and right sides). However, as shown in these figures, for example, a step number can be displayed for each of the opposing sets in each of the groove portions 550b provided inside the magazine cassette 550. In such a case, when the operator accommodates each plate 6 in the magazine cassette 550, it is possible to prevent the right and left grooves 550b from being mistaken in the number of steps.
上述のような夫々の構成を利用したマガジンカセット 5 5 0内に収容されてい る夫々のプレート 6の交換作業を、 プレート交換作業工程 （あるいは部品供給作 業工程） として、 図 5 5のフローチャートにその手順を示す。  The exchange work of each plate 6 housed in the magazine cassette 550 using the above-described respective configurations is referred to as a plate exchange work process (or a component supply work process) in the flowchart of FIG. The procedure will be described.
図 5 5に示すように、 ステップ S 1にて、 プレート交換作業を開始する。 この 作業開始は、 例えば交換作業モードとして、 部品実装装置が備える制御装置等を 操作することにより行なうことができる。 次に、 ステップ S 2にて、 マガジン力 セット 5 5 0力 カセット昇降部 5 1により昇降されて、 上記原点位置に位置さ れる。 As shown in FIG. 55, in step S1, the plate exchange operation is started. The start of this work is performed, for example, by setting the control device of the component mounting It can be done by operating. Next, in step S2, the magazine force set 550 is moved up and down by the cassette elevating unit 51 to be positioned at the origin position.
その後、 ステップ S 3において、 マガジンカセット 5 5 0の開閉カバー部 5 5 O cを開放して、 夫々のプレート 6の交換作業を行なう。 このとき、 プレート配 置装置 1 2において、 部品供給中のプレート 6があるような場合であって、 当該 部品供給が完了した場合には、 このプレート 6は、 プレート移動装置 4 0により プレート収容部 5 7 0に収容させることができる （ステップ S 4 ) 。  After that, in step S3, the opening / closing cover portion 55 Oc of the magazine cassette 550 is opened, and each plate 6 is replaced. At this time, in a case where there is a plate 6 during the component supply in the plate placement device 12 and when the component supply is completed, the plate 6 is moved to the plate receiving portion by the plate moving device 40. It can be accommodated in 570 (step S4).
夫々のプレート 6の交換作業が完了すると、 ステップ S 5において、 夫々のプ レート 6が収容された段番号の確認を行なって、 斜め姿勢にて収容されていない ことを確認、する。 その後、 開閉カバー部 5 5 0 cを閉止し、 この閉止を確認、する ことで、 夫々のプレート 6が正常な姿勢で収容されたことを確認、することができ る。 なお、 この閉止の確認は、 上述したように開閉検出センサ 5 8 0でもって行 なうこともできる。 これにより、 プレート交換作業が完了する （ステップ S 7 ) 。 このような手順にて上記プレート交換作業を行なうことにより、 部品供給装置 による部品供給作業を中断させることなく、 上記夫々のプレートの交換を、 円滑 力つ効率的に行なうことができ、 より効率的な部品供給を行なうことができる。 なお、 上記様々な実施形態のうちの任意の実施形態を適宜組み合わせることに より、 それぞれの有する効果を奏するようにすることができる。  When the replacement work of each plate 6 is completed, in step S5, the stage number in which each plate 6 is housed is checked, and it is confirmed that the plate 6 is not housed in an oblique posture. Then, by closing the opening / closing cover portion 550c and confirming this closure, it can be confirmed and confirmed that each plate 6 has been housed in a normal posture. The confirmation of the closing can also be performed by the open / close detection sensor 580 as described above. This completes the plate exchange operation (Step S7). By performing the above-described plate replacement work in such a procedure, each of the above-mentioned plates can be replaced smoothly and efficiently without interrupting the component supply work by the component supply device, and more efficiently. Parts can be supplied. Note that by appropriately combining any of the various embodiments described above, the effects of the respective embodiments can be achieved.
本発明は、 添付図面を参照しながら好ましい実施形態に関連して充分に記載さ れているが、 この技術の熟練した人々にとっては種々の変形や修正は明白である。 そのような変形や修正は、 添付した請求の範囲による本発明の範囲から外れない 限りにおいて、 その中に含まれると理解されるべきである。  While the present invention has been fully described in connection with the preferred embodiments thereof with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art. It is to be understood that such changes and modifications are intended to be included therein without departing from the scope of the invention as set forth in the appended claims.

Claims

請 求 の 範 囲 The scope of the claims
1. 基板に実装される部品 （2、 2w、 2 t) のうちの複数のウェハ供給部品 (2w) が配置されたウェハ （7) を載置するウェハ供給用プレート （6w) と、 複数のトレイ供給部品 （ 2 t ) が配置された部品供給トレイ （57) を载置する トレイ供給用プレート （6 t) とより、 上記夫々のウェハ供給部品及び上記夫々 のトレイ供給部品を部品実装可能に供給する部品供給装置 （4) において、 上記夫々のプレート （6、 6w、 6 t) のうちのいずれかの上記プレートを選 択的に配置させて保持し、 上記ウェハより上記夫々のウェハ供給部品を、 又は、 上記部品供給トレイより上記トレイ供給部品を供給可能な状態とさせるプレート 配置装置 （12) を備え、 1. A wafer supply plate (6w) on which a wafer (7) on which a plurality of wafer supply components (2w) among the components (2, 2w, 2t) mounted on the substrate are placed, and a plurality of With the tray supply plate (6 t) on which the component supply tray (57) on which the tray supply components (2 t) are arranged, the above-mentioned respective wafer supply components and the respective tray supply components can be mounted. In the component supply device (4) to be supplied, any one of the plates (6, 6w, 6t) is selectively disposed and held, and the respective wafer supply components are supplied from the wafer. Or a plate arrangement device (12) for enabling the tray supply components to be supplied from the component supply tray.
当該プレート配置装置は、 上記ゥェハ供給用プレートによる上記夫々のウェハ 供給部品の供給高さと、 上記トレィ供給用プレートによる上記夫々のトレイ供給 部品の供給高さとが略同じとなるように、 上記プレートを配置させて保持する部 品供給装置。  The plate arranging device is configured so that the supply height of each wafer supply component by the wafer supply plate is substantially the same as the supply height of each tray supply component by the tray supply plate. Component supply device that is placed and held.
2. 上記プレート配置装置は、  2. The above plate placement device
上記配置されるプレートをその外周部近傍における下面側より支持可能、 かつ、 その支持高さ位置が可変する弾性支持部材 （60、 65) と、  An elastic support member (60, 65) capable of supporting the plate to be disposed from the lower surface side in the vicinity of an outer peripheral portion thereof and having a variable support height position;
上記弾性支持部材に支持された上記プレートを、 上記弾性支持部材との間で挟 むように、 その上記外周部近傍における上面側より押圧して、 上記プレートの保 持を行うプレート押圧体 （61) と、  A plate pressing body (61) for holding the plate by pressing the plate supported by the elastic support member from above in the vicinity of the outer peripheral portion so as to be sandwiched between the elastic support member and the plate; ,
上記プレート押圧体の昇降を行う押圧体昇降部 （62) とを備え、  A pressing body elevating part (62) for elevating and lowering the plate pressing body,
上記押圧体昇降部は、 上記弾性支持部材により支持された状態の上記ウェハ供 給用プレートによる上記夫々のウェハ供給部品の供給高さと、 上記トレイ供給用 プレートによる上記夫々のトレイ供給部品の供給高さとが略同じとなるように、 上記プレート押圧体の昇降を行ない、 上記弾性支持部材の支持高さ位置を可変さ せる請求項 1に記載の部品供給装置。  The pressing body elevating unit includes a supply height of the respective wafer supply components by the wafer supply plate supported by the elastic support member, and a supply height of the respective tray supply components by the tray supply plate. 2. The component supply device according to claim 1, wherein the plate pressing body is moved up and down so that the height is substantially the same, and the support height position of the elastic support member is changed.
3. 上記プレート配置装置は、 上記押圧体昇降部による上記プレート押圧体の 下降位置を選択的に規制する規制部 （69) をさらに備え、 上記プレート配置装置に、 上記トレィ供給用プレートが配置された場合に、 上 記夫々のトレイ供給部品の供給高さが、 上記夫々のゥェハ供給部品の供給高さと 略同じとなるように、 上記規制部により上記プレート押圧体の下降位置を規制す る請求項 2に記載の部品供給装置。 3. The plate disposing device further includes a restricting portion (69) for selectively restricting a lowering position of the plate pressing member by the pressing member lifting / lowering portion, When the tray supply plate is placed in the plate placement device, the above-mentioned regulation is performed so that the supply height of each tray supply component is substantially the same as the supply height of each wafer supply component. 3. The component supply device according to claim 2, wherein a lowering position of the plate pressing body is regulated by a part.
4. 基板に実装される部品 （2、 2w、 2 t) のうちの複数のウェハ供給部品4. Multiple wafer supply components among components (2, 2w, 2t) mounted on the board
(2w) が配置されたウェハ （7) を載置するウェハ供給用プレート （6w) と、 複数のトレイ供給部品 （2 t) が配置された部品供給トレィ （57) を載置する トレイ供給用プレート （6 t) とより、 上記夫々のウェハ供給部品及び上記夫々 のトレイ供給部品を部品実装可能に供給する部品供給装置 （4) において、 複数の上記ウェハ供給用プレートと複数の上記トレイ供給用プレートを取り出 し可能に収納するプレート収納部 （10) と、 A wafer supply plate (6w) on which the wafer (7) on which the (2w) is placed is placed, and a tray supply tray on which a component supply tray (57) on which a plurality of tray supply parts (2t) are placed In the component supply device (4) that supplies the respective wafer supply components and the respective tray supply components in a mountable manner, the plurality of the plate for supplying the wafer and the plurality of the supply plates for the tray are provided. A plate storage part (10) for taking out and storing the plate,
上記夫々のプレート （6、 6 w 6 t) のうちのいずれかの上記プレートを選 択的に配置させて保持し、 上記ウェハより上記夫々のウェハ供給部品を、 又は、 上記部品供給トレイより上記トレイ供給部品を供給可能な状態とさせるプレート 配置装置 （12) と、  Any one of the respective plates (6, 6w6t) is selectively disposed and held, and the respective wafer supply components from the wafer or the above component supply trays from the component supply tray. A plate placement device (12) for enabling tray supply parts to be supplied,
上記プレートを解除可能に保持して、 上記プレート収納部から取り出すととも に、 上記プレート配置装置に保持可能に移動させるプレート移動装置 （40) と を備え、  A plate moving device (40) for holding the plate releasably, taking it out of the plate storage portion, and moving the plate disposing device to be able to hold the plate.
上記プレート配置装置は、  The plate placement device is
上記配置されるプレートをその外周部近傍における下面側より支持可能、 かつ、 その支持高さ位置が可変する複数の弾性支持部材 （60、 65) と、  A plurality of elastic support members (60, 65) capable of supporting the placed plate from the lower surface side in the vicinity of the outer periphery thereof and having variable support height positions;
上記夫々の弾性支持部材に支持された上記プレートを、 上記夫々の弾性支持部 材との間で挟むように、 その上記外周部近傍における上面側より押圧して、 上記 プレートの保持を行うプレート押圧体 （61) と、  A plate pressing for holding the plate by pressing the plate supported by the respective elastic support members from above in the vicinity of the outer peripheral portion so as to be sandwiched between the respective elastic support members. Body (61) and
上記プレート押圧体の昇降を行う押圧体昇降部 （62) と、  A pressing body lifting / lowering unit (62) for raising / lowering the plate pressing body;
上記押圧体昇降部による上記プレート押圧体の下降位置を選択的に規制する規 制部 （69) とを備え、  A regulating section (69) for selectively regulating a lowering position of the plate pressing body by the pressing body lifting / lowering section,
上記プレート配置装置に、 上記トレィ供給用プレートが配置された場合に、 上 記規制部により上記プレート押圧体の下降位置を規制して、 上記夫々の弾性支持 部材による上記トレイ供給用プレートの支持高さを保持可能であり、 When the tray supply plate is arranged in the plate disposing device, the lowering position of the plate pressing body is regulated by the regulating portion, and the respective elastic support members are supported. It is possible to hold the supporting height of the tray supply plate by the member,
上記プレート配置装置に、 上記ウェハ供給用プレートが配置された場合に、 上 記規制部による上記下降位置の規制を解除して、 上記夫々の弾性支持部材に上記 ウェハ供給用プレートを支持させながら、 上記押圧体昇降部により上記プレート 押圧体を下降させて、 上記ウェハ供給用プレートに载置された上記ウェハのェキ スパンドが可能である部品供給装置。  When the wafer supply plate is disposed on the plate disposing device, the restriction of the lowering position by the restriction unit is released, and the respective elastic support members support the wafer supply plate. A component supply device capable of lowering the plate pressing body by the pressing body raising / lowering portion to expand the wafer placed on the wafer supply plate.
5 . 上記ゥェハ供給用プレートは、  5. The wafer supply plate is
ダイシングが施された上記ウェハが貼着されたウェハシート （8 ) と、 環状プレートであって、 その内側に上記ウェハが位置されるように、 上記ゥェ ハシートを保持するウェハリング （9 ) とを備え、  A wafer sheet (8) to which the diced wafer is attached; and a wafer ring (9) which is an annular plate and holds the wafer sheet so that the wafer is positioned inside the annular plate. With
上記プレート配置装置は、 上記ウェハリングが上記夫々の弾性支持部材に支持 された状態の上記ウェハ供給用プレートにおいて、 上記ウェハの外周と上記ゥェ ハリングの内周との間における上記ウェハシートの下面に当接可能な環状の当接 部 （6 3 a ) を有するエキスパンド部材 （6 3 ) をさらに備え、  The plate disposing device may further include: a lower surface of the wafer sheet between an outer periphery of the wafer and an inner periphery of the wafer ring in the wafer supply plate in a state where the wafer ring is supported by the respective elastic support members. An expanding member (63) having an annular contact portion (63a) capable of contacting the
上記エキスパンド部材における上記環状の当接部を支点としながら、 上記押圧 体昇降部により上記プレート押圧体を下降させて、 上記ウェハリングを押し下げ て、 上記ウェハシートを放射状に延伸させることにより、 上記ウェハのエキスパ ンドが可能である請求項 4に記載の部品供給装置。  The plate pressing body is lowered by the pressing body elevating unit while the annular contact part of the expanding member is used as a fulcrum, and the wafer ring is pressed down to radially extend the wafer sheet, thereby obtaining the wafer. The component supply device according to claim 4, wherein the component supply device can be expanded.
6 . 上記プレート移動装置は、  6. The above plate moving device
上記プレートを解除可能に保持する保持部 （4 1 ) と、  A holding portion (4 1) for releasably holding the plate,
上記保持部により保持された上記プレートを上記プレート収納部から上記プレ ート配置装置に移動させるように、 上記保持部の移動を行う保持部移動部 （4 4 ) と、  A holding unit moving unit (44) for moving the holding unit so as to move the plate held by the holding unit from the plate storage unit to the plate placement device;
上記プレートの保持部分の形状に基づいて、 上記保持されるプレートが、 上記 ウェハ供給用プレート又は上記トレイ供給用プレートのいずれであるかを識別す るプレート識別部 （4 1 b ) とを備え、  A plate identification portion (41b) for identifying whether the plate to be held is the wafer supply plate or the tray supply plate based on the shape of the holding portion of the plate;
上記プレート配置装置における上記規制部は、 上記プレート識別部の上記識別 結果に基づいて、 上記プレート押圧体の上記下降位置を規制する請求項 4に記載 の部品供給装置。 5. The component supply device according to claim 4, wherein the regulating unit in the plate placement device regulates the lowered position of the plate pressing body based on the identification result of the plate identifying unit. 6.
7 . 上記トレィ供給用プレートは、 7. The tray supply plate is
複数の上記部品供給トレイが着脱可能に載置されるトレィ載置部 （5 8 ) と、 上記トレィ載置部の周囲に形成された環状プレートであるトレイリング （5 9 ) とを備え、  A tray mounting part (58) on which the plurality of component supply trays are detachably mounted, and a tray ring (59) which is an annular plate formed around the tray mounting part;
上記プレート配置装置において、 上記夫々の弾性支持部材により上記トレィリ ングが支持されるとともに、 上記プレート押圧体と上記夫々の弾性支持部材との 間で、 上記トレイリングを挟むように押圧して、 上記トレイ供給用プレートの保 持が可能であって、 上記規制部は、 上記トレィ供給用プレートの下面が、 上記ェ キスパンド部材に当接しないように、 上記押圧体昇降部による上記プレート押圧 体の上記下降位置の規制を行う請求項 5に記載の部品供給装置。  In the plate disposing device, the trailing is supported by the respective elastic support members, and the trailing is pressed between the plate pressing body and the respective elastic support members so as to sandwich the trailing member. The tray supply plate can be held, and the restricting portion is configured to prevent the lower surface of the tray supply plate from coming into contact with the expansive member by the pressing member lifting / lowering portion. The component supply device according to claim 5, wherein the lowering position is regulated.
8 . 上記トレィ載置部は、  8. The tray mounting part is
平面的に略四角形状の形状を有する上記部品供給トレイにおける上記略四角形 状の一の端部に当接可能な固定側保持部材 （8 1 ) と、  A fixed-side holding member (8 1) capable of contacting one end of the substantially square shape in the component supply tray having a substantially square shape in plan view;
上記固定側保持部材に上記一の端部が当接された状態の上記部品供給トレイに おける上記一の端部に対向する端部に当接可能であって、 かつ、 当該端部を上記 固定側保持部材に向けて付勢可能に可動する可動側保持部材 （8 0及び 8 0 a、 The end of the component supply tray in a state where the one end is in contact with the fixed-side holding member can be brought into contact with the end facing the one end, and the end is fixed. Movable side holding member (80 and 80 a,
8 0及ぴ 8 O b ) とを備え、 80 and 8 O b)
上記固定側保持部材及び上記可動側保持部材により上記部品供給トレイを挟む ようにして、 上記トレイ載置部における上記部品供給トレイの载置位置が保持さ れる請求項 7に記載の部品供給装置。  8. The component supply device according to claim 7, wherein the component supply tray is held by the fixed side holding member and the movable side holding member so as to hold the component supply tray at the tray mounting portion.
9 . 上記複数の弾性支持部材のうちの少なくとも 1つの弾性支持部材 （6 5 ) は、 その先端において、 上記支持されるプレートの端部が当接されて、 上記プレ ートの表面沿いの方向における支持位置を規制する傾斜端部 （6 5 a ) を有して Vヽる請求項 4に記載の部品供給装置。  9. At least one elastic support member (65) of the plurality of elastic support members has, at its tip, the end of the supported plate abutted, and a direction along the surface of the plate. The component supply device according to claim 4, wherein the component supply device has an inclined end (65a) that regulates a support position in the device.
1 0 . 上記規制部は、  10. The above regulatory department
上記プレート押圧体の下部 （6 1 a ) と当接可能であって、 上記当接により上 記プレート押圧体の下降位置を規制可能な当接部 （6 9 a ) と、  An abutting portion (69a) capable of contacting the lower portion (61a) of the plate pressing member and capable of restricting the lowering position of the plate pressing member by the contact;
上記当接部が上記プレート押圧体と上記当接される当接位置と、 上記当接が退 避される «位置との間で、 上記当接部を移動させる当接部移動機構 （6 9 b ) とを備える請求項 4に記載の部品供給装置。 A contact portion moving mechanism (69) that moves the contact portion between a contact position where the contact portion contacts the plate pressing body and the contact position where the contact is retracted; b) The component supply device according to claim 4, comprising:
1 1 . 上記プレート配置装置における上記押圧体昇降部は、  1 1. The pressing body elevating part in the plate placement device is
圧縮空気の給気又は排気により、 上記プレート押圧体を上昇又は下降させるシ リンダ部 ( 7 1 ) と、  A cylinder section (71) for raising or lowering the plate pressing body by supplying or discharging compressed air;
上記シリンダ部に上記圧縮空気として上記上昇又は上記下降を行う昇降用圧縮 空気を供給可能な昇降用圧縮空気供給部 （7 3 ) と、  An ascending and descending compressed air supply unit (73) capable of supplying the ascending or descending compressed air for ascending or descending as the compressed air to the cylinder unit;
上記昇降用圧縮空気よりも低い圧力を有して、 上記プレート押圧体の上記昇降 又は上記下降の停止の際に、 上記プレート押圧体の上記停止位置を保持する保持 用圧縮空気を、 上記圧縮空気として上記シリンダ部に供給可能な保持用圧縮空気 供給部 （7 4 ) と、  The compressed air for holding, which has a lower pressure than the compressed air for raising and lowering and holds the stop position of the plate pressing body when the lifting or lowering of the plate pressing body is stopped, A holding compressed air supply section (74) which can be supplied to the cylinder section as
上記昇降用圧縮空気又は上記保持用圧縮空気を選択的に上記シリンダ部に供給 する圧縮空気選択弁 （7 0 ) とを備える請求項 4に記載の部品供給装置。  The component supply device according to claim 4, further comprising a compressed air selection valve (70) for selectively supplying the compressed air for lifting or the compressed air for holding or the compressed air for holding to the cylinder portion.
1 2. 上記圧縮空気選択弁は、 上記プレート押圧体と機械的に接触されること により、 上記プレート押圧体の上記昇降の上端位置を検出可能であって、 上記上 端位置の検出時に、 上記昇降用圧縮空気に代えて上記保持用圧縮空気を選択的に 上記シリンダ部に供給するメカロックバルブ （7 0 ) である請求項 1 1に記載の 部品供給装置。  1 2. The compressed air selection valve is capable of detecting the upper end position of the lifting and lowering of the plate pressing body by being brought into mechanical contact with the plate pressing body. The component supply device according to claim 11, wherein the component supply device is a mechanical lock valve (70) that selectively supplies the holding compressed air to the cylinder portion instead of the lifting / lowering compressed air.
1 3 . 上記プレート収納部は、  1 3. The plate storage section
上記夫々のプレートを積層させて収納する収納体 （5 0 ) と、  A storage body (50) for stacking and storing the respective plates,
上記収納体を昇降させて、 上記収納体に収納されている夫々のプレートのうち の 1つのプレートを、 上記プレート移動装置の上記保持部により保持可能な昇降 高さ位置に位置させる収納体昇降部 （5 1 ) とを備え、  A storage unit elevating unit that raises and lowers the storage unit and positions one of the plates stored in the storage unit at a height position that can be held by the holding unit of the plate moving device. (5 1)
上記プレート配置装置は、  The plate placement device is
上記保持部とともに上記保持された 1つのプレートが通過可能なプレート取出 口部 （8 4 a、 8 6 a ) を有し、 つ、 上記 1つのプレート以外の上記プレート 収納部の上記収納体に収納されている上記夫々のプレートが上記収納体より飛び 出すことを防止可能な上記取出口部の周囲に形成されたプレート規制部を有する 飛び出し防止板 （8 4、 8 6 ) を開閉移動可能に備えている請求項 6に記載の部 品供給装置。 It has a plate outlet (84a, 86a) through which the one plate held above can pass along with the above-mentioned holding part, and is stored in the above-mentioned storage body of the above-mentioned plate storage part except the above-mentioned one plate A plate (84, 86) having a plate restricting portion formed around the outlet to prevent the respective plates from being ejected from the storage body. The component supply device according to claim 6, wherein
1 4 . 上記プレート配置装置は、 上記飛び出し防止板における上記取出口部内 に位置された上記プレートを検出可能な飛び出し検出部 （8 5 ) をさらに備える 請求項 1 3に記載の部品供給装置。 14. The component supply device according to claim 13, wherein the plate placement device further includes a protrusion detection unit (85) capable of detecting the plate positioned in the outlet portion of the protrusion prevention plate.
1 5 . 上記プレート収納部は、  1 5. The plate storage section is
上記収納体と上記収納体昇降部を支持する基台 （5 2 ) と、  A base (5 2) for supporting the storage body and the storage body elevating section;
上記基台の配置位置の保持が可能であって、 上記保持を解除して、 上記基台の 直線的な移動を案内する直動案内部 （9 3 ) と、 上記基台を回転させながらの移 動を案内する回動案内部 （9 4 ) とを有する基台保持部 （9 1 ) とを備え、 上記基台は、  It is possible to hold the position of the base, release the holding, and guide the linear movement of the base by linear movement (93), while rotating the base. A base holding part (91) having a rotation guide part (94) for guiding movement;
上記直動案内部及び上記回動案内部と選択的に係合可能な係合部 （9 2 ) を有 し、  An engagement portion (92) that can selectively engage with the linear motion guide portion and the rotation guide portion;
上記係合部が上記直動案内部と係合されることにより、 上記基台の直線的な移 動が可能であって、  When the engagement portion is engaged with the linear motion guide portion, the base can be moved linearly,
上記の係合部と上記直動案内部との係合が解除され、 カゝつ、 上記係合部が上記 回動案内部と係合されることにより、 上記基台の回転させながらの移動が可能で ある請求項 4に記載の部品供給装置。  The engagement between the engagement portion and the linear motion guide portion is released, and the engagement portion is engaged with the rotation guide portion, thereby moving the base while rotating. The component supply device according to claim 4, wherein the component supply device is capable of performing the following.
1 6 . 上記プレート収納部の上記収納体は、 上記夫々のプレートの互いに対向 する夫々の端部を個別に支持し、 かつ、 上記夫々のプレートの取出における上記 プレートの表面沿いの方向への移動を案内する互いに対向して配置された複数の 組の支持ガイド部 （2 5 0 b ) を備え、  16. The storage body of the plate storage portion individually supports the respective opposite ends of the respective plates, and moves in the direction along the surface of the plates when removing the respective plates. A plurality of sets of support guides (250b) arranged opposite to each other for guiding
上記夫々のプレートにおける上記各々の支持ガイド部との接触部分 （R) 力 滑面部 （5 9 a ) を有している請求項 4に記載の部品供給装置。  The component supply device according to claim 4, wherein the component supply device has a contact portion (R) with a smooth surface portion (59a) of each of the plates that contacts the support guide portion.
1 7 . 上記夫々のプレートの上記移動の方向 （C) と略直交する方向における 上記夫々の組の支持ガイド部への上記夫々のプレートの挿入位置と、 上記夫々の 組の支持ガイド部による支持位置との間の位置ズレを補正可能に、 上記夫々の組 の支持ガイド部の挿入端部 （2 5 0 d ) に、 上記移動の方向に対する傾斜部 （2 5 0 e、 2 5 0 f ) が形成されている請求項 1 6に記載の部品供給装置。  17. Insertion positions of the respective plates into the respective sets of support guides in a direction substantially perpendicular to the direction of movement (C) of the respective plates, and support by the respective sets of support guides In order to be able to correct the positional deviation from the position, the insertion end (250 d) of each of the above-mentioned sets of support guides has an inclined portion (250 e, 250 f) with respect to the direction of the movement. The component supply device according to claim 16, wherein a component is formed.
1 8 . 上記夫々のプレートと上記夫々の支持ガイド部との互いの接触表面にお ける夫々の硬度が、 上記夫々のプレートよりも上記夫々の支持ガイド部が低くな るように、 上記夫々の接触表面が形成される請求項 1 6又は 1 7に記載の部品供 給装置。 18. The hardness of the respective support guides at the contact surfaces of the respective plates and the respective support guides is lower than that of the respective plates. The component supply device according to claim 16 or 17, wherein the respective contact surfaces are formed as described above.
1 9. 上記夫々のプレートと上記夫々の支持ガイド部との互いの接触表面にお ける夫々の硬度が、 上記夫々の支持ガイド部よりも上記夫々のプレートが低くな るように、 上記夫々の接触表面が形成される請求項 1 6又は 1 7に記載の部品供 給装置。  1 9. Each of the above-mentioned plates and the above-mentioned respective supporting guide portions are so arranged that the hardness of each of the contact surfaces of the respective plates is lower than that of the above-mentioned respective supporting guide portions so that the respective plates are lower. The component supply device according to claim 16 or 17, wherein the contact surface is formed.
20. 上記夫々の支持ガイド部は、 上記夫々のプレートの端部を支持しながら、 当該端部の表面に沿って回転可能なローラ部 （26 1 a) を備える請求項 1 6又 は 1 7に記載の部品供給装置。  20. Each of the support guide portions includes a roller portion (261a) rotatable along the surface of the end while supporting the end of the plate. A component supply device according to item 1.
21. 上記プレート押圧体は、 その下面において、  21. The plate pressing body has
上記プレート配置装置に供給された上記プレートを取出し可能に支持する複数 の支持部材 （26 1 b) と、  A plurality of support members (261b) for removably supporting the plate supplied to the plate placement device;
上記押圧体昇降部による上記プレート押圧体の下降位置に拘らず、 上記夫々の 支持部材又は上記夫々の弾性支持部材に上記プレートを常時付勢する複数の付勢 部材 (26 1 c) とを、 さらに備える請求項 4に記載の部品供給装置。  A plurality of biasing members (261c) for constantly biasing the plate to the respective support members or the respective elastic support members, regardless of the lowering position of the plate pressing body by the pressing body elevating unit; The component supply device according to claim 4, further comprising:
22. 上記夫々の付勢部材は、 上記プレート移動装置による上記プレートの移 動を可能に、 上記夫々の支持部材により支持された上記プレートを付勢しながら、 当該プレートの表面に沿って回転可能な付勢ローラ部 （262) を備える請求項 22. Each of the urging members is rotatable along the surface of the plate while urging the plate supported by each of the supporting members so that the plate can be moved by the plate moving device. And a biasing roller section (262).
21に記載の部品供給装置。 22. The component supply device according to 21.
23. 上記夫々のプレートは、 上記保持部 （241) による上面側の保持位置 に、 当該保持部と係合可能な係合部 （29 1) を有する請求項 6に記載の部品供 給装置。  23. The component supply device according to claim 6, wherein each of the plates has an engaging portion (291) capable of engaging with the holding portion at a holding position on the upper surface side by the holding portion (241).
24. 上記収納体は、 上記夫々の支持ガイド部の組の間に配置され、 上記夫々 のプレートと係合されることで、 上記夫々のプレートの水平方向の支持姿勢を案 内する複数の姿勢ガイド部 （490、 5 90) をさらに備える請求項 1 6に記載 の部品供給装置。  24. The storage body is disposed between the respective sets of the support guides, and is engaged with the respective plates, so that a plurality of postures that define the horizontal support postures of the respective plates are provided. The component supply device according to claim 16, further comprising a guide portion (490, 590).
25. 上記収納体は、 開閉可能な上記夫々のプレートの交換用の扉部 （5 50 c) を有し、 上記夫々の姿勢ガイド部は当該扉部の内側に備えられている請求項 24に記載の部品供給装置。 25. The container according to claim 24, wherein the storage body has a door (550 c) for opening and closing the respective plates for replacement of the respective plates, and the respective posture guides are provided inside the doors. Component supply device as described.
26. 上記収納体は、 上記扉部の開閉を検出する開閉検出センサ （580) を 備える請求項 25に記載の部品供給装置。 26. The component supply device according to claim 25, wherein the housing includes an open / close detection sensor (580) for detecting opening / closing of the door.
27. 上記収納体は、 上記基台への支持面に当該支持を固定する複数の固定部 (471) を有し、 少なくとも 1つの上記固定部が、 導電性材料で形成され、 接 地端子部としての機能を有する請求項 15に記載の部品供給装置。  27. The storage body has a plurality of fixing portions (471) for fixing the support on the support surface to the base, at least one of the fixing portions is formed of a conductive material, and a ground terminal portion. The component supply device according to claim 15, having a function as a component.
PCT/JP2003/015228 2002-12-02 2003-11-28 Parts feeder WO2004051730A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/537,406 US7731469B2 (en) 2002-12-02 2003-11-28 Component feeder
JP2004556853A JP4425146B2 (en) 2002-12-02 2003-11-28 Parts supply device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002-350166 2002-12-02
JP2002350166 2002-12-02

Publications (1)

Publication Number Publication Date
WO2004051730A1 true WO2004051730A1 (en) 2004-06-17

Family

ID=32463069

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/015228 WO2004051730A1 (en) 2002-12-02 2003-11-28 Parts feeder

Country Status (6)

Country Link
US (1) US7731469B2 (en)
JP (1) JP4425146B2 (en)
KR (1) KR101072061B1 (en)
CN (1) CN100358117C (en)
TW (1) TW200420481A (en)
WO (1) WO2004051730A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034435A (en) * 2008-07-31 2010-02-12 Alpha- Design Kk Ring table device which can movably mount flat ring and grip ring

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8317450B2 (en) * 2008-10-30 2012-11-27 Lam Research Corporation Tactile wafer lifter and methods for operating the same
US7971704B2 (en) * 2009-05-19 2011-07-05 Yi-Ming Chi Micropipette sorting and packaging system
JP4991834B2 (en) * 2009-12-17 2012-08-01 シャープ株式会社 Vehicle headlamp
JP5232815B2 (en) * 2010-02-10 2013-07-10 シャープ株式会社 Vehicle headlamp
US8733996B2 (en) 2010-05-17 2014-05-27 Sharp Kabushiki Kaisha Light emitting device, illuminating device, and vehicle headlamp
US9816677B2 (en) 2010-10-29 2017-11-14 Sharp Kabushiki Kaisha Light emitting device, vehicle headlamp, illumination device, and laser element
KR101690711B1 (en) * 2011-08-19 2016-12-29 한화테크윈 주식회사 Tray feeder and parts providing method using the same
CN105336630B (en) * 2015-10-12 2018-03-13 高满珍 The chip pad erecting device of chip kludge
IL300011B2 (en) 2016-11-03 2024-03-01 Molecular Imprints Inc Substrate loading system
WO2018162082A1 (en) * 2017-03-10 2018-09-13 Osram Opto Semiconductors Gmbh Disk tray magazine for optoelectronic components
KR102316938B1 (en) * 2019-11-08 2021-10-25 세메스 주식회사 Die transfer module and die inspection apparatus having the same
JP2023046818A (en) * 2021-09-24 2023-04-05 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63244641A (en) * 1987-03-31 1988-10-12 Toshiba Corp Die feed and tray carrier die-feeder
JPH02155244A (en) * 1988-12-07 1990-06-14 Matsushita Electric Ind Co Ltd Feeder for chip
JPH05206699A (en) * 1992-01-29 1993-08-13 Matsushita Electric Ind Co Ltd Electronic part loading apparatus
JPH077294A (en) * 1993-06-17 1995-01-10 Matsushita Electric Ind Co Ltd Ic chip component supplying apparatus and isolating and partially releasing apparatus used for it
JPH08298282A (en) * 1995-04-26 1996-11-12 Hitachi Ltd Semiconductor wafer feed device and semiconductor manufacturing equipment provided therewith
JP2000327070A (en) * 1999-05-18 2000-11-28 Hitachi Ltd Packing method, carrying method and manufacture of semiconductor device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3766638A (en) * 1970-08-31 1973-10-23 Hugle Ind Inc Wafer spreader
JPH07109027A (en) 1993-10-13 1995-04-25 Ykk Kk Device for feeding multiple kind of part
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
TW401582B (en) * 1997-05-15 2000-08-11 Tokyo Electorn Limtied Apparatus for and method of transferring substrates
JP4141004B2 (en) 1998-03-04 2008-08-27 太陽誘電株式会社 Chip component supply device
JP3347295B2 (en) 1998-09-09 2002-11-20 松下電器産業株式会社 Component mounting tool and component mounting method and device using the same
KR100309920B1 (en) * 1998-12-16 2002-10-25 삼성전자 주식회사 An unloading apparatus of a substrate and unloading method thereof
US6344402B1 (en) * 1999-07-28 2002-02-05 Disco Corporation Method of dicing workpiece
JP2002164414A (en) * 2000-11-27 2002-06-07 Shinkawa Ltd Method and apparatus for processing semiconductor pellet

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63244641A (en) * 1987-03-31 1988-10-12 Toshiba Corp Die feed and tray carrier die-feeder
JPH02155244A (en) * 1988-12-07 1990-06-14 Matsushita Electric Ind Co Ltd Feeder for chip
JPH05206699A (en) * 1992-01-29 1993-08-13 Matsushita Electric Ind Co Ltd Electronic part loading apparatus
JPH077294A (en) * 1993-06-17 1995-01-10 Matsushita Electric Ind Co Ltd Ic chip component supplying apparatus and isolating and partially releasing apparatus used for it
JPH08298282A (en) * 1995-04-26 1996-11-12 Hitachi Ltd Semiconductor wafer feed device and semiconductor manufacturing equipment provided therewith
JP2000327070A (en) * 1999-05-18 2000-11-28 Hitachi Ltd Packing method, carrying method and manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034435A (en) * 2008-07-31 2010-02-12 Alpha- Design Kk Ring table device which can movably mount flat ring and grip ring

Also Published As

Publication number Publication date
KR20050083930A (en) 2005-08-26
JPWO2004051730A1 (en) 2006-04-06
TW200420481A (en) 2004-10-16
US7731469B2 (en) 2010-06-08
CN100358117C (en) 2007-12-26
US20060054656A1 (en) 2006-03-16
JP4425146B2 (en) 2010-03-03
CN1720609A (en) 2006-01-11
KR101072061B1 (en) 2011-10-10

Similar Documents

Publication Publication Date Title
JP4461150B2 (en) Parts supply device
KR101143138B1 (en) Plate storing body for supplying component and component supplying apparatus
WO2004051730A1 (en) Parts feeder
EP0756314B1 (en) Semiconductor wafer loading and unloading apparatus
US6941566B2 (en) Disc system
JP4510838B2 (en) Parts supply device
US20210139258A1 (en) Container supply device and container supply method
US7066708B1 (en) Methods and apparatus for retaining a tray stack having a plurality of trays for carrying microelectric devices
KR100720634B1 (en) Taping Device and Taping Method of Electron Parts
JP2009158948A (en) Device for supplying and discharging wafer ring
EP0681887B1 (en) Parts feeding apparatus and parts feeding process
EP3486180A1 (en) Bag stocker and bag supply method
US20030056471A1 (en) Wafer jar loader method, system and apparatus
JP4227804B2 (en) Component insertion head device, component insertion device, and component insertion method
JP4559883B2 (en) Parts supply device
JP3027119U (en) Parts feeder
US20240075571A1 (en) Pallet magazine
JP2003100051A (en) Method for assembling magnetic tape cartridge
US5868542A (en) Magazine conveying device
CN113307008A (en) Feeding device
KR950000422B1 (en) Auto-inserting device of cassette for auto-changer
JPH07237709A (en) Article housing box
JP2000299595A (en) Part-mounting device
JP2000124669A (en) Chip parts feeder
JPH06227725A (en) Automatic sorter for flat type workpiece

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN JP KR US

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1020057009118

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2004556853

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 20038A46835

Country of ref document: CN

ENP Entry into the national phase

Ref document number: 2006054656

Country of ref document: US

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 10537406

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 1020057009118

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 10537406

Country of ref document: US