JPH04173117A - Cleaning method of semiconductor resin sealing mold - Google Patents
Cleaning method of semiconductor resin sealing moldInfo
- Publication number
- JPH04173117A JPH04173117A JP29867890A JP29867890A JPH04173117A JP H04173117 A JPH04173117 A JP H04173117A JP 29867890 A JP29867890 A JP 29867890A JP 29867890 A JP29867890 A JP 29867890A JP H04173117 A JPH04173117 A JP H04173117A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- mold
- resin
- sheet
- cleaning sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 50
- 239000011347 resin Substances 0.000 title claims abstract description 30
- 229920005989 resin Polymers 0.000 title claims abstract description 30
- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000007789 sealing Methods 0.000 title abstract 2
- 238000000465 moulding Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1753—Cleaning or purging, e.g. of the injection unit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は半導体樹脂封止金型のクリ−ユング法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for cleaning a semiconductor resin mold.
第４図、第５図は従来の半導体樹脂封止金型のクリーニ
ング法を示す平面図で、第４図はクリーニング樹脂によ
る成形前、第５図は成形後の状態である。図において、
ｉｆは金型で、この金型ＩＩ＋はキャビティ）２）、ラ
ンナー（３１，ゲート（４）、ポット（５１で構成され
ている。（６１はクリーニング樹脂を成形する場合に使
用する工０１Ｊ−ドフレーム、（７１はキャビティ！２
１ Ｋより成形されたパッケージ、（８）は上下台型金
位置決めするガイドブロックである。FIGS. 4 and 5 are plan views showing a conventional cleaning method for a semiconductor resin-sealed mold. FIG. 4 shows the state before molding with the cleaning resin, and FIG. 5 shows the state after molding. In the figure,
if is a mold, and this mold II+ is composed of a cavity) 2), a runner (31, a gate (4), and a pot (51). (61 is a mold used for molding cleaning resin. Frame, (71 is cavity!2
The package is molded from 1K, and (8) is a guide block for positioning the upper and lower platform molds.
次に動作について説明する。Next, the operation will be explained.
まず、工Ｃリードフレーム（６）トクリ一二ｙ りａｔ
脂を金型（１１にセットし、金型＋１１の型締めを行な
う。次にポット−６１にセットされたクリーニング樹脂
は溶融加圧され、ランナー・３１、ゲート（４１を通り
キャビティ（２）に注入される。First, work C lead frame (6)
The resin is set in the mold (11) and the mold +11 is clamped. Next, the cleaning resin set in the pot 61 is melted and pressurized, passes through the runner 31 and the gate (41) and enters the cavity (2). Injected.
ｍＭ硬硬化合金型開き成形品を取り出す。Open the mm hardened alloy mold and take out the molded product.
従来の半導体樹脂封止金型のクリーニング法は以上のよ
うに構成されていたので、商価なＩＣリードフレームを
使用しなければならず作業においても、工Ｃリードフレ
ームのセット、成形品の取り出しに１時間全便し、また
、クリーニング樹脂は通常の成形樹脂に比べばりの光学
が多く、金型面にしみ出しやすく、その除去作業も困難
であるという問題点があった。Conventional cleaning methods for semiconductor resin encapsulation molds were constructed as described above, so commercially priced IC lead frames had to be used. In addition, the cleaning resin has a lot of optical fibers compared to ordinary molding resins, so it tends to seep onto the mold surface, making it difficult to remove it.
この発明は上記のような問題点を解消するためになされ
たもので、安価で作業性の良い半導体樹脂封止金型のク
リーニング法を得ること全目的とする。This invention was made to solve the above-mentioned problems, and its entire purpose is to provide a method for cleaning semiconductor resin molds that is inexpensive and easy to work with.
この発８Ａに係る半導体樹脂封止金型のクリーニング法
は、ＩＣリードフレームに替わる半導体樹脂封止金型の
クリーニング用シート全使用したものである。The cleaning method for a semiconductor resin encapsulation mold according to Issue 8A uses the entire cleaning sheet for a semiconductor resin encapsulation mold instead of an IC lead frame.
この発明における半導体樹脂封止金型のクリーニング用
シートに、ＩＣリードフレームに比べ安価に供給でき、
金型へのセット、取り出し作業も容易になり、またクリ
ーニング用シートに弾力性を有していることにより、金
型締付けの型当り全良好にし、ばりの発生を皆無にする
。The cleaning sheet for semiconductor resin molds in this invention can be supplied at a lower cost than IC lead frames,
The cleaning sheet can be easily set in and taken out from the mold, and since the cleaning sheet has elasticity, the mold can be tightened with good contact with the mold, and no burrs are generated.
以下、この発明の一実施例ケ図ＶＣついて説明する。 Hereinafter, one embodiment of the present invention will be described.
第１図は樹脂封止舎型上に、クリーニング用シートヲ塔
載した平面図、第２図はクリーニング樹脂による成形後
の平面図、第３図はクリーニング榴脂による成形後の断
面図に示ｔ０図ＶＣおいて、）ｌ；は金型、１２１はキ
ャビティ、（３）はランナー、（４）はゲート１．５１
はポット、（７）はパッケージ、（８）はガイドプロッ
タ、（９）はクリーニング用シート、 ＋１０＋はクリ
ーニング樹脂を通過させるための穴、ｄυはクリーニン
グ用シート（９）と金型＋１１を位置決めする穴、（＋
匂はクリーニング用樹脂、（Ｉ３１はクリーニング用倒
脂［１２１加圧注入するプランジャーである。Fig. 1 is a plan view of a cleaning sheet mounted on a resin-sealed mold, Fig. 2 is a plan view after molding with cleaning resin, and Fig. 3 is a cross-sectional view after molding with cleaning resin. In Figure VC, )l; is the mold, 121 is the cavity, (3) is the runner, and (4) is the gate 1.51.
is the pot, (7) is the package, (8) is the guide plotter, (9) is the cleaning sheet, +10+ is the hole for passing the cleaning resin, and dυ is for positioning the cleaning sheet (9) and the mold +11. Hole, (+
The odor is a cleaning resin, (I31 is a plunger that injects cleaning oil [121] under pressure.
次に動作について説明する。まずクリーニング用シート
（９）を金型１１１にセットし１次にクリーニング用樹
脂［１２１（ｆ−ポット（６）にセットする。Next, the operation will be explained. First, a cleaning sheet (9) is set in the mold 111, and then a cleaning resin [121] is set in the f-pot (6).
この状態で金型用の型締めを行ない、プランジャー（１
３１？動作させることにより、クリーニング樹脂ｕ匂は
ランナー（３）、ゲート１４１ｆｔ通りキャビティ１２
）に注入される。In this state, clamp the mold and use the plunger (1
31? By operating the cleaning resin u smell is removed from the runner (3), the gate 141ft and the cavity 12
).
さらに、クリーニング用樹脂隆はクリーニング用シート
（９）の穴ｔｌＯ１ｋ通り他方のキャビティ１２１ Ｖ
Ｃも注入される。Furthermore, the cleaning resin protrusion is inserted into the other cavity 121 V along the hole tlO1k of the cleaning sheet (9).
C is also injected.
クリーニング用シート（９）の金型への位置決めは、ガ
イドブロック（８）と、クリー二／グシートの穴けりで
行なわれる。The cleaning sheet (9) is positioned in the mold by using the guide block (8) and drilling holes in the cleaning sheet.
また、クリーニング用シート（９）は弾力性を有し、金
型型締め時に均一な型当りを得ることができる。In addition, the cleaning sheet (9) has elasticity and can achieve uniform mold contact during mold clamping.
ここで使用するクリーニング用シート（９）の材料は、
例えば段ボールであっても可能である。The material of the cleaning sheet (9) used here is:
For example, it is possible to use cardboard.
以上のようにこの発明ＶＣよれば、半導体樹脂封止金型
のクリーニング法において、クリーニング用シート全使
用したので、材料費を安価に、クリーニング作業も容易
に行、なうことができる効果がある。As described above, according to the VC of the present invention, the entire cleaning sheet is used in the cleaning method for the semiconductor resin-sealed mold, so the material cost can be reduced and the cleaning work can be easily performed. .
第１図、第２図、第８図はこの発明の一実施によるクリ
ーニング法を示し、第１図は収形前平向図、第２図は成
形後の平曲図、第８図は成形後の断面図、第４図、第５
図は従来のクリーニング法を示し、第４肉は成形前の平
曲図、第５図は成形後の平面図である。
図において、１１）金型、（２１キヤビテイ、（３１ラ
ンナー、１４１ゲート１，５１ポツト、１７）パッケー
ジ、（８）ガイドブロック、（９）クリーニング用シー
ト、 ＋Ｉ０１倒脂通過穴、同位置決め穴、１図クリー
ニング用樹脂、０段プランジャーを示す。
なお、図中、ｊｉｉＪ−符号は同一、又は相当部分を示
す。Figures 1, 2, and 8 show a cleaning method according to one embodiment of the present invention, in which Figure 1 is a plan view before compaction, Figure 2 is a flat curved view after molding, and Figure 8 is a flat view after molding. Later sectional view, Figures 4 and 5
The figure shows a conventional cleaning method, the fourth piece is a flat curved view before molding, and FIG. 5 is a plan view after molding. In the figure, 11) mold, (21 cavity, (31 runner, 141 gate, 51 pot, 17) package, (8) guide block, (9) cleaning sheet, +I01 fallen fat passage hole, same positioning hole, Figure 1 shows a cleaning resin and a 0-stage plunger. In the figure, jiiJ- symbols indicate the same or equivalent parts.
Claims (1)
ビティ内の手段として、クリーニング用樹脂を保持する
シートを使つたことを特徴とする半導体樹脂封止金型の
クリーニング法。1. A method for cleaning a semiconductor resin mold, which comprises using a sheet for holding a cleaning resin as a means in the cavity of the resin mold in resin molding of a semiconductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29867890A JPH04173117A (en) | 1990-11-02 | 1990-11-02 | Cleaning method of semiconductor resin sealing mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29867890A JPH04173117A (en) | 1990-11-02 | 1990-11-02 | Cleaning method of semiconductor resin sealing mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04173117A true JPH04173117A (en) | 1992-06-19 |
Family
ID=17862861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29867890A Pending JPH04173117A (en) | 1990-11-02 | 1990-11-02 | Cleaning method of semiconductor resin sealing mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04173117A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002011966A1 (en) * | 2000-08-04 | 2002-02-14 | Hitachi, Ltd. | Mold cleaning sheet and method of producing semiconductor devices using the same |
| JP2003033922A (en) * | 2001-05-18 | 2003-02-04 | Hitachi Ltd | Sheet for cleaning mold and method for manufacturing semiconductor device using the same |
| US6682331B1 (en) * | 2002-09-20 | 2004-01-27 | Agilent Technologies, Inc. | Molding apparatus for molding light emitting diode lamps |
| US7429342B2 (en) * | 2001-08-15 | 2008-09-30 | Advanced Semiconductor Engineering, Inc. | Method for cleaning and regenerating a mold |
-
1990
- 1990-11-02 JP JP29867890A patent/JPH04173117A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002011966A1 (en) * | 2000-08-04 | 2002-02-14 | Hitachi, Ltd. | Mold cleaning sheet and method of producing semiconductor devices using the same |
| US7384582B2 (en) | 2000-08-04 | 2008-06-10 | Renesas Technology Corp. | Mold cleaning sheet and method for producing semiconductor devices using the same |
| KR100847320B1 (en) * | 2000-08-04 | 2008-07-21 | 가부시키가이샤 히타치세이사쿠쇼 | Mold cleaning sheet and method of producing semiconductor devices using the same |
| KR100855048B1 (en) * | 2000-08-04 | 2008-08-29 | 가부시키가이샤 히타치세이사쿠쇼 | Mold cleaning sheet and method of producing semiconductor devices using the same |
| US7572398B2 (en) | 2000-08-04 | 2009-08-11 | Renesas Technology Corp. | Mold cleaning sheet and method of producing semiconductor devices using the same |
| US7837908B2 (en) | 2000-08-04 | 2010-11-23 | Renesas Electronics Corporation | Mold cleaning sheet and method of producing semiconductor devices using the same |
| US8070992B2 (en) | 2000-08-04 | 2011-12-06 | Renesas Electronics Corporation | Mold cleaning sheet and method of producing semiconductor devices using the same |
| JP2003033922A (en) * | 2001-05-18 | 2003-02-04 | Hitachi Ltd | Sheet for cleaning mold and method for manufacturing semiconductor device using the same |
| US7537967B2 (en) | 2001-05-18 | 2009-05-26 | Renesas Technology Corp. | Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
| US7943432B2 (en) | 2001-05-18 | 2011-05-17 | Renesas Electronics Corporation | Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
| US7429342B2 (en) * | 2001-08-15 | 2008-09-30 | Advanced Semiconductor Engineering, Inc. | Method for cleaning and regenerating a mold |
| US6682331B1 (en) * | 2002-09-20 | 2004-01-27 | Agilent Technologies, Inc. | Molding apparatus for molding light emitting diode lamps |
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